WO2013032177A3 - 색 온도 제어가 가능한 발광 소자 패키지 - Google Patents

색 온도 제어가 가능한 발광 소자 패키지 Download PDF

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Publication number
WO2013032177A3
WO2013032177A3 PCT/KR2012/006731 KR2012006731W WO2013032177A3 WO 2013032177 A3 WO2013032177 A3 WO 2013032177A3 KR 2012006731 W KR2012006731 W KR 2012006731W WO 2013032177 A3 WO2013032177 A3 WO 2013032177A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting device
device package
color temperature
package capable
Prior art date
Application number
PCT/KR2012/006731
Other languages
English (en)
French (fr)
Other versions
WO2013032177A2 (ko
Inventor
손원진
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Publication of WO2013032177A2 publication Critical patent/WO2013032177A2/ko
Publication of WO2013032177A3 publication Critical patent/WO2013032177A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

실시 예는, 적어도 일부에 함몰된 형태의 제1 캐비티 및 제2 캐비티를 갖는 패키지 바디; 상기 제1 캐비티 및 제2 캐비티에 각각 배치되는 제1 발광 소자 및 제2 발광 소자; 및 상기 제1 캐비티 및 제2 캐비티에 각각 충진되는 제1 형광체 및 제2 형광체를 포함하는, 발광 소자 패키지를 제공한다.
PCT/KR2012/006731 2011-08-30 2012-08-23 색 온도 제어가 가능한 발광 소자 패키지 WO2013032177A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110086885A KR20130023841A (ko) 2011-08-30 2011-08-30 색 온도 제어가 가능한 발광 소자 패키지
KR10-2011-0086885 2011-08-30

Publications (2)

Publication Number Publication Date
WO2013032177A2 WO2013032177A2 (ko) 2013-03-07
WO2013032177A3 true WO2013032177A3 (ko) 2013-04-25

Family

ID=47742374

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/006731 WO2013032177A2 (ko) 2011-08-30 2012-08-23 색 온도 제어가 가능한 발광 소자 패키지

Country Status (3)

Country Link
US (1) US8952407B2 (ko)
KR (1) KR20130023841A (ko)
WO (1) WO2013032177A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101492018B1 (ko) * 2013-05-29 2015-02-11 (주)이노셈코리아 쿨·웜용 스마트 led 패키지 모듈 및 그 제조방법
KR102374266B1 (ko) 2015-10-02 2022-03-18 삼성전자주식회사 백색 발광 모듈 및 led 조명 장치
KR20170077679A (ko) 2015-12-28 2017-07-06 서울반도체 주식회사 광색역 발광소자
DE102016212138A1 (de) * 2016-07-04 2018-01-04 Osram Gmbh Licht-emittierendes Modul, Licht-emittierende Vorrichtung und Verfahren zum Herstellen und zum Betreiben desselben
DE102017102619B4 (de) * 2017-02-09 2022-10-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung LED-Einheit und LED-Modul

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310613A (ja) * 2005-04-28 2006-11-09 Sharp Corp 半導体発光装置
KR20090002284A (ko) * 2007-06-26 2009-01-09 엘지이노텍 주식회사 발광 장치
KR100982994B1 (ko) * 2008-10-15 2010-09-17 삼성엘이디 주식회사 Ｌｅｄ 패키지 모듈
US20100252842A1 (en) * 2007-06-13 2010-10-07 Advanced Optoelectronic Technology Inc. Package structure of light emitting diode for backlight
US20110024773A1 (en) * 2009-08-03 2011-02-03 Fu-Cai Lu Light emitting diode package structure and lead frame structure thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101241528B1 (ko) * 2006-09-25 2013-03-08 엘지이노텍 주식회사 발광 장치
JP2010129583A (ja) * 2008-11-25 2010-06-10 Citizen Electronics Co Ltd 照明装置
US8541802B2 (en) * 2012-01-31 2013-09-24 Bridgelux, Inc. Phosphor placement in white light emitting diode assemblies

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310613A (ja) * 2005-04-28 2006-11-09 Sharp Corp 半導体発光装置
US20100252842A1 (en) * 2007-06-13 2010-10-07 Advanced Optoelectronic Technology Inc. Package structure of light emitting diode for backlight
KR20090002284A (ko) * 2007-06-26 2009-01-09 엘지이노텍 주식회사 발광 장치
KR100982994B1 (ko) * 2008-10-15 2010-09-17 삼성엘이디 주식회사 Ｌｅｄ 패키지 모듈
US20110024773A1 (en) * 2009-08-03 2011-02-03 Fu-Cai Lu Light emitting diode package structure and lead frame structure thereof

Also Published As

Publication number Publication date
KR20130023841A (ko) 2013-03-08
US8952407B2 (en) 2015-02-10
US20130049052A1 (en) 2013-02-28
WO2013032177A2 (ko) 2013-03-07

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