CN102001834B - 基板的处理装置及处理方法 - Google Patents

基板的处理装置及处理方法 Download PDF

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Publication number
CN102001834B
CN102001834B CN2010102706711A CN201010270671A CN102001834B CN 102001834 B CN102001834 B CN 102001834B CN 2010102706711 A CN2010102706711 A CN 2010102706711A CN 201010270671 A CN201010270671 A CN 201010270671A CN 102001834 B CN102001834 B CN 102001834B
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China
Prior art keywords
substrate
mentioned
supplied
nozzle body
treatment solution
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CN2010102706711A
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Chinese (zh)
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CN102001834A (zh
Inventor
大森圭悟
矶明典
今冈裕一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of CN102001834A publication Critical patent/CN102001834A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Spray Control Apparatus (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2010102706711A 2009-09-02 2010-09-01 基板的处理装置及处理方法 Active CN102001834B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP202843/2009 2009-09-02
JP2009202843A JP5352388B2 (ja) 2009-09-02 2009-09-02 基板の処理装置及び処理方法

Publications (2)

Publication Number Publication Date
CN102001834A CN102001834A (zh) 2011-04-06
CN102001834B true CN102001834B (zh) 2013-03-27

Family

ID=43809579

Family Applications (1)

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CN2010102706711A Active CN102001834B (zh) 2009-09-02 2010-09-01 基板的处理装置及处理方法

Country Status (4)

Country Link
JP (1) JP5352388B2 (https=)
KR (1) KR101153050B1 (https=)
CN (1) CN102001834B (https=)
TW (1) TWI431676B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317304B2 (ja) * 2012-01-31 2013-10-16 株式会社Ｎｓｃ 化学研磨装置
JP2014110592A (ja) * 2012-12-04 2014-06-12 Toshiba Corp 画像処理装置
CN105967529A (zh) * 2016-05-13 2016-09-28 多氟多化工股份有限公司 一种ag玻璃加工流水线及其玻璃输送设备
JP7312738B2 (ja) * 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 基板処理装置
CN113292246B (zh) * 2021-06-02 2022-05-17 中建材玻璃新材料研究院集团有限公司 一种用于玻璃减薄的连续生产装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1676231A (zh) * 2004-03-29 2005-10-05 芝浦机械电子株式会社 基板的处理装置以及处理方法
CN101114573A (zh) * 2006-07-27 2008-01-30 芝浦机械电子株式会社 基板的处理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3978065B2 (ja) * 2002-03-28 2007-09-19 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP3689390B2 (ja) * 2002-06-25 2005-08-31 松下電工株式会社 基材の液処理方法
JP2004055711A (ja) * 2002-07-18 2004-02-19 Tokyo Kakoki Kk 基板処理装置
JP2004275989A (ja) * 2003-03-19 2004-10-07 Sumitomo Precision Prod Co Ltd 基板処理装置
JP2006135162A (ja) * 2004-11-08 2006-05-25 Fuji Photo Film Co Ltd 噴霧方法および装置
JP2007088289A (ja) 2005-09-22 2007-04-05 Sharp Corp 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1676231A (zh) * 2004-03-29 2005-10-05 芝浦机械电子株式会社 基板的处理装置以及处理方法
CN101114573A (zh) * 2006-07-27 2008-01-30 芝浦机械电子株式会社 基板的处理装置

Also Published As

Publication number Publication date
KR101153050B1 (ko) 2012-06-04
TW201137955A (en) 2011-11-01
CN102001834A (zh) 2011-04-06
TWI431676B (zh) 2014-03-21
JP2011054790A (ja) 2011-03-17
KR20110025137A (ko) 2011-03-09
JP5352388B2 (ja) 2013-11-27

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