CN101960622B - 带有隧道结的光电子半导体本体及其制造方法 - Google Patents

带有隧道结的光电子半导体本体及其制造方法 Download PDF

Info

Publication number
CN101960622B
CN101960622B CN200980107061.5A CN200980107061A CN101960622B CN 101960622 B CN101960622 B CN 101960622B CN 200980107061 A CN200980107061 A CN 200980107061A CN 101960622 B CN101960622 B CN 101960622B
Authority
CN
China
Prior art keywords
layer
tunnel junction
semiconductor body
barrier layer
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980107061.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN101960622A (zh
Inventor
马丁·斯特拉斯伯格
卢茨·赫佩尔
马蒂亚斯·扎巴蒂尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN101960622A publication Critical patent/CN101960622A/zh
Application granted granted Critical
Publication of CN101960622B publication Critical patent/CN101960622B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0421Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/305Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • H01S5/3095Tunnel junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/70Tunnel-effect diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN

Landscapes

  • Led Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Photovoltaic Devices (AREA)
CN200980107061.5A 2008-02-29 2009-02-26 带有隧道结的光电子半导体本体及其制造方法 Expired - Fee Related CN101960622B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102008011849.4 2008-02-29
DE102008011849 2008-02-29
DE102008028036.4 2008-06-12
DE102008028036A DE102008028036A1 (de) 2008-02-29 2008-06-12 Optoelektronischer Halbleiterkörper mit Tunnelübergang und Verfahren zur Herstellung eines solchen
PCT/DE2009/000282 WO2009106070A1 (de) 2008-02-29 2009-02-26 Optoelektronischer halbleiterkörper mit tunnelübergang und verfahren zur herstellung eines solchen

Publications (2)

Publication Number Publication Date
CN101960622A CN101960622A (zh) 2011-01-26
CN101960622B true CN101960622B (zh) 2013-01-09

Family

ID=40911448

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980107061.5A Expired - Fee Related CN101960622B (zh) 2008-02-29 2009-02-26 带有隧道结的光电子半导体本体及其制造方法

Country Status (8)

Country Link
US (1) US20110012088A1 (https=)
EP (1) EP2248192A1 (https=)
JP (1) JP2011513960A (https=)
KR (1) KR20100126458A (https=)
CN (1) CN101960622B (https=)
DE (1) DE102008028036A1 (https=)
TW (1) TWI404232B (https=)
WO (1) WO2009106070A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009054564A1 (de) * 2009-12-11 2011-06-16 Osram Opto Semiconductors Gmbh Laserdiodenanordnung und Verfahren zum Herstellen einer Laserdiodenanordnung
JP5678806B2 (ja) * 2011-06-07 2015-03-04 株式会社デンソー 半導体レーザ及びその製造方法
DE102011116232B4 (de) 2011-10-17 2020-04-09 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
CN103579426B (zh) * 2012-07-19 2016-04-27 华夏光股份有限公司 半导体装置
DE102013104954A1 (de) * 2013-05-14 2014-11-20 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
TWI597862B (zh) * 2013-08-30 2017-09-01 晶元光電股份有限公司 具阻障層的光電半導體元件
CN103489975B (zh) * 2013-10-08 2016-09-07 东南大学 一种具有隧道结结构的氮极性面发光二极管
CN103855263A (zh) * 2014-02-25 2014-06-11 广东省工业技术研究院(广州有色金属研究院) 一种具有极化隧道结的GaN基LED外延片及其制备方法
DE102016103852A1 (de) * 2016-03-03 2017-09-07 Otto-Von-Guericke-Universität Magdeburg Bauelement im System AlGaInN mit einem Tunnelübergang
US9859470B2 (en) * 2016-03-10 2018-01-02 Epistar Corporation Light-emitting device with adjusting element
DE102016113274B4 (de) * 2016-07-19 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
US20180331255A1 (en) * 2017-05-12 2018-11-15 X Development Llc Fabrication of ultraviolet light emitting diode with tunnel junction
CN107230738B (zh) * 2017-07-31 2019-05-31 河北工业大学 具有超晶格隧穿结的发光二极管外延结构及其制备方法
JP6964875B2 (ja) * 2017-11-10 2021-11-10 学校法人 名城大学 窒化物半導体発光素子の製造方法
JP7155723B2 (ja) * 2018-08-02 2022-10-19 株式会社リコー 発光素子及びその製造方法
CN113257940B (zh) 2020-02-13 2023-12-29 隆基绿能科技股份有限公司 叠层光伏器件及生产方法
CN113066887B (zh) * 2021-03-19 2023-01-20 扬州乾照光电有限公司 一种太阳电池以及制作方法
CN114566573B (zh) * 2022-02-12 2025-07-04 江西兆驰半导体有限公司 一种AlGaN基深紫外发光二极管芯片及其制备方法
WO2025198675A1 (en) * 2023-12-04 2025-09-25 Ohio State Innovation Foundation Methods of modular construction of 0d-state tunnel junction devices and methods of use thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6369403B1 (en) * 1999-05-27 2002-04-09 The Board Of Trustees Of The University Of Illinois Semiconductor devices and methods with tunnel contact hole sources and non-continuous barrier layer
CN1917241A (zh) * 2005-08-15 2007-02-21 安华高科技Ecbuip(新加坡)私人有限公司 用于降低半导体器件中工作电压的结构
TW200717844A (en) * 2005-10-20 2007-05-01 Formosa Epitaxy Inc Light emitting diode chip

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07326727A (ja) * 1994-05-30 1995-12-12 Nippon Telegr & Teleph Corp <Ntt> 共鳴トンネル素子
JP3737175B2 (ja) * 1995-12-26 2006-01-18 富士通株式会社 光メモリ素子
JPH0992847A (ja) * 1995-09-21 1997-04-04 Hitachi Cable Ltd トンネル型半導体素子
US5684309A (en) 1996-07-11 1997-11-04 North Carolina State University Stacked quantum well aluminum indium gallium nitride light emitting diodes
KR100527349B1 (ko) 1997-01-09 2005-11-09 니치아 카가쿠 고교 가부시키가이샤 질화물반도체소자
US5831277A (en) 1997-03-19 1998-11-03 Northwestern University III-nitride superlattice structures
US6266355B1 (en) * 1997-09-12 2001-07-24 Sdl, Inc. Group III-V nitride laser devices with cladding layers to suppress defects such as cracking
US6841800B2 (en) * 1997-12-26 2005-01-11 Matsushita Electric Industrial Co., Ltd. Light-emitting device comprising a gallium-nitride-group compound-semiconductor
JP2000277757A (ja) * 1999-03-26 2000-10-06 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
DE19955747A1 (de) 1999-11-19 2001-05-23 Osram Opto Semiconductors Gmbh Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur
US6635907B1 (en) * 1999-11-17 2003-10-21 Hrl Laboratories, Llc Type II interband heterostructure backward diodes
JP4232334B2 (ja) * 2000-10-20 2009-03-04 日本電気株式会社 トンネル接合面発光レーザ
US6515308B1 (en) * 2001-12-21 2003-02-04 Xerox Corporation Nitride-based VCSEL or light emitting diode with p-n tunnel junction current injection
WO2004008551A1 (ja) * 2002-07-16 2004-01-22 Nitride Semiconductors Co.,Ltd. 窒化ガリウム系化合物半導体装置
KR100542720B1 (ko) * 2003-06-03 2006-01-11 삼성전기주식회사 GaN계 접합 구조
US7095052B2 (en) * 2004-10-22 2006-08-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and structure for improved LED light output
DE102005035722B9 (de) * 2005-07-29 2021-11-18 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
US8124957B2 (en) * 2006-02-22 2012-02-28 Cree, Inc. Low resistance tunnel junctions in wide band gap materials and method of making same
US7737451B2 (en) * 2006-02-23 2010-06-15 Cree, Inc. High efficiency LED with tunnel junction layer
JP4172505B2 (ja) * 2006-06-29 2008-10-29 住友電気工業株式会社 面発光型半導体素子及び面発光型半導体素子の製造方法
DE102007031926A1 (de) * 2007-07-09 2009-01-15 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterkörper

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6369403B1 (en) * 1999-05-27 2002-04-09 The Board Of Trustees Of The University Of Illinois Semiconductor devices and methods with tunnel contact hole sources and non-continuous barrier layer
CN1917241A (zh) * 2005-08-15 2007-02-21 安华高科技Ecbuip(新加坡)私人有限公司 用于降低半导体器件中工作电压的结构
TW200717844A (en) * 2005-10-20 2007-05-01 Formosa Epitaxy Inc Light emitting diode chip

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
F.Dross.《Optimization of Large Band-Gap barriers for Reducing Leakage in Bipolar Cascade Lasers》.《Journal of Quantum Electronics》.2004,第40卷(第8期),1003-1006. *

Also Published As

Publication number Publication date
DE102008028036A1 (de) 2009-09-03
JP2011513960A (ja) 2011-04-28
WO2009106070A1 (de) 2009-09-03
TW200945637A (en) 2009-11-01
KR20100126458A (ko) 2010-12-01
CN101960622A (zh) 2011-01-26
US20110012088A1 (en) 2011-01-20
TWI404232B (zh) 2013-08-01
EP2248192A1 (de) 2010-11-10

Similar Documents

Publication Publication Date Title
CN101960622B (zh) 带有隧道结的光电子半导体本体及其制造方法
CN101689594B (zh) 发射辐射的半导体本体
US8569738B2 (en) Semiconductor light emitting device, wafer, method for manufacturing semiconductor light emitting device, and method for manufacturing wafer
US8623683B2 (en) Method of fabricating a nitride semiconductor light emitting device
EP2472605A1 (en) Nitride semiconductor element and process for production thereof
KR100879414B1 (ko) 저저항 옴 접촉을 구비한 ⅲα족 질화물 반도체
JP2008218746A (ja) Iii族窒化物系半導体発光素子
KR101559210B1 (ko) 반도체 발광 소자 및 그 제조 방법
US10297714B1 (en) Heterogeneous tunneling junctions for hole injection in nitride based light-emitting devices
US7417258B2 (en) Semiconductor light-emitting device, and a method of manufacture of a semiconductor device
US9806223B2 (en) Optoelectronic semiconductor chip and method for the production thereof
US20120286237A1 (en) Semiconductor light emitting device and wafer
JP2015106627A (ja) 半導体積層基板
JP2015115433A (ja) Iii族窒化物半導体素子
JPH09326508A (ja) 半導体光素子
US9768349B2 (en) Superlattice structure
US7642565B2 (en) Radiation-emitting semiconductor component based on gallium nitride, and method for fabricating the semiconductor component
US12249628B2 (en) Method of forming p-type nitride semiconductor layer
JP2009289826A (ja) へテロ接合を有する半導体装置とその製造方法
JP2025098661A (ja) 紫外半導体発光素子及びその製造方法
JP2011023398A (ja) 半導体発光素子
JP2007088170A (ja) Iii−v族化合物半導体素子

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130109

Termination date: 20160226