KR20100126458A - 터널 접합을 구비한 광전 반도체 몸체 및 그러한 반도체 몸체의 제조 방법 - Google Patents

터널 접합을 구비한 광전 반도체 몸체 및 그러한 반도체 몸체의 제조 방법 Download PDF

Info

Publication number
KR20100126458A
KR20100126458A KR1020107021815A KR20107021815A KR20100126458A KR 20100126458 A KR20100126458 A KR 20100126458A KR 1020107021815 A KR1020107021815 A KR 1020107021815A KR 20107021815 A KR20107021815 A KR 20107021815A KR 20100126458 A KR20100126458 A KR 20100126458A
Authority
KR
South Korea
Prior art keywords
layer
type
tunnel junction
semiconductor body
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020107021815A
Other languages
English (en)
Korean (ko)
Inventor
마틴 스트라스부르그
루츠 호펠
마티아스 사바틸
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20100126458A publication Critical patent/KR20100126458A/ko
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0421Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/305Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • H01S5/3095Tunnel junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/70Tunnel-effect diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN

Landscapes

  • Led Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Photovoltaic Devices (AREA)
KR1020107021815A 2008-02-29 2009-02-26 터널 접합을 구비한 광전 반도체 몸체 및 그러한 반도체 몸체의 제조 방법 Abandoned KR20100126458A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102008011849.4 2008-02-29
DE102008011849 2008-02-29
DE102008028036.4 2008-06-12
DE102008028036A DE102008028036A1 (de) 2008-02-29 2008-06-12 Optoelektronischer Halbleiterkörper mit Tunnelübergang und Verfahren zur Herstellung eines solchen

Publications (1)

Publication Number Publication Date
KR20100126458A true KR20100126458A (ko) 2010-12-01

Family

ID=40911448

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107021815A Abandoned KR20100126458A (ko) 2008-02-29 2009-02-26 터널 접합을 구비한 광전 반도체 몸체 및 그러한 반도체 몸체의 제조 방법

Country Status (8)

Country Link
US (1) US20110012088A1 (https=)
EP (1) EP2248192A1 (https=)
JP (1) JP2011513960A (https=)
KR (1) KR20100126458A (https=)
CN (1) CN101960622B (https=)
DE (1) DE102008028036A1 (https=)
TW (1) TWI404232B (https=)
WO (1) WO2009106070A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009054564A1 (de) * 2009-12-11 2011-06-16 Osram Opto Semiconductors Gmbh Laserdiodenanordnung und Verfahren zum Herstellen einer Laserdiodenanordnung
JP5678806B2 (ja) * 2011-06-07 2015-03-04 株式会社デンソー 半導体レーザ及びその製造方法
DE102011116232B4 (de) 2011-10-17 2020-04-09 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
CN103579426B (zh) * 2012-07-19 2016-04-27 华夏光股份有限公司 半导体装置
DE102013104954A1 (de) * 2013-05-14 2014-11-20 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
TWI597862B (zh) * 2013-08-30 2017-09-01 晶元光電股份有限公司 具阻障層的光電半導體元件
CN103489975B (zh) * 2013-10-08 2016-09-07 东南大学 一种具有隧道结结构的氮极性面发光二极管
CN103855263A (zh) * 2014-02-25 2014-06-11 广东省工业技术研究院(广州有色金属研究院) 一种具有极化隧道结的GaN基LED外延片及其制备方法
DE102016103852A1 (de) * 2016-03-03 2017-09-07 Otto-Von-Guericke-Universität Magdeburg Bauelement im System AlGaInN mit einem Tunnelübergang
US9859470B2 (en) * 2016-03-10 2018-01-02 Epistar Corporation Light-emitting device with adjusting element
DE102016113274B4 (de) * 2016-07-19 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
US20180331255A1 (en) * 2017-05-12 2018-11-15 X Development Llc Fabrication of ultraviolet light emitting diode with tunnel junction
CN107230738B (zh) * 2017-07-31 2019-05-31 河北工业大学 具有超晶格隧穿结的发光二极管外延结构及其制备方法
JP6964875B2 (ja) * 2017-11-10 2021-11-10 学校法人 名城大学 窒化物半導体発光素子の製造方法
JP7155723B2 (ja) * 2018-08-02 2022-10-19 株式会社リコー 発光素子及びその製造方法
CN113257940B (zh) 2020-02-13 2023-12-29 隆基绿能科技股份有限公司 叠层光伏器件及生产方法
CN113066887B (zh) * 2021-03-19 2023-01-20 扬州乾照光电有限公司 一种太阳电池以及制作方法
CN114566573B (zh) * 2022-02-12 2025-07-04 江西兆驰半导体有限公司 一种AlGaN基深紫外发光二极管芯片及其制备方法
WO2025198675A1 (en) * 2023-12-04 2025-09-25 Ohio State Innovation Foundation Methods of modular construction of 0d-state tunnel junction devices and methods of use thereof

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07326727A (ja) * 1994-05-30 1995-12-12 Nippon Telegr & Teleph Corp <Ntt> 共鳴トンネル素子
JP3737175B2 (ja) * 1995-12-26 2006-01-18 富士通株式会社 光メモリ素子
JPH0992847A (ja) * 1995-09-21 1997-04-04 Hitachi Cable Ltd トンネル型半導体素子
US5684309A (en) 1996-07-11 1997-11-04 North Carolina State University Stacked quantum well aluminum indium gallium nitride light emitting diodes
KR100527349B1 (ko) 1997-01-09 2005-11-09 니치아 카가쿠 고교 가부시키가이샤 질화물반도체소자
US5831277A (en) 1997-03-19 1998-11-03 Northwestern University III-nitride superlattice structures
US6266355B1 (en) * 1997-09-12 2001-07-24 Sdl, Inc. Group III-V nitride laser devices with cladding layers to suppress defects such as cracking
US6841800B2 (en) * 1997-12-26 2005-01-11 Matsushita Electric Industrial Co., Ltd. Light-emitting device comprising a gallium-nitride-group compound-semiconductor
JP2000277757A (ja) * 1999-03-26 2000-10-06 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US6369403B1 (en) * 1999-05-27 2002-04-09 The Board Of Trustees Of The University Of Illinois Semiconductor devices and methods with tunnel contact hole sources and non-continuous barrier layer
DE19955747A1 (de) 1999-11-19 2001-05-23 Osram Opto Semiconductors Gmbh Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur
US6635907B1 (en) * 1999-11-17 2003-10-21 Hrl Laboratories, Llc Type II interband heterostructure backward diodes
JP4232334B2 (ja) * 2000-10-20 2009-03-04 日本電気株式会社 トンネル接合面発光レーザ
US6515308B1 (en) * 2001-12-21 2003-02-04 Xerox Corporation Nitride-based VCSEL or light emitting diode with p-n tunnel junction current injection
WO2004008551A1 (ja) * 2002-07-16 2004-01-22 Nitride Semiconductors Co.,Ltd. 窒化ガリウム系化合物半導体装置
KR100542720B1 (ko) * 2003-06-03 2006-01-11 삼성전기주식회사 GaN계 접합 구조
US7095052B2 (en) * 2004-10-22 2006-08-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and structure for improved LED light output
DE102005035722B9 (de) * 2005-07-29 2021-11-18 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
US7473941B2 (en) * 2005-08-15 2009-01-06 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Structures for reducing operating voltage in a semiconductor device
TWI266440B (en) * 2005-10-20 2006-11-11 Formosa Epitaxy Inc Light emitting diode chip
US8124957B2 (en) * 2006-02-22 2012-02-28 Cree, Inc. Low resistance tunnel junctions in wide band gap materials and method of making same
US7737451B2 (en) * 2006-02-23 2010-06-15 Cree, Inc. High efficiency LED with tunnel junction layer
JP4172505B2 (ja) * 2006-06-29 2008-10-29 住友電気工業株式会社 面発光型半導体素子及び面発光型半導体素子の製造方法
DE102007031926A1 (de) * 2007-07-09 2009-01-15 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterkörper

Also Published As

Publication number Publication date
DE102008028036A1 (de) 2009-09-03
JP2011513960A (ja) 2011-04-28
CN101960622B (zh) 2013-01-09
WO2009106070A1 (de) 2009-09-03
TW200945637A (en) 2009-11-01
CN101960622A (zh) 2011-01-26
US20110012088A1 (en) 2011-01-20
TWI404232B (zh) 2013-08-01
EP2248192A1 (de) 2010-11-10

Similar Documents

Publication Publication Date Title
KR20100126458A (ko) 터널 접합을 구비한 광전 반도체 몸체 및 그러한 반도체 몸체의 제조 방법
US8314415B2 (en) Radiation-emitting semiconductor body
EP2362437B1 (en) High efficiency light emitters with reduced polarization-induced charges
US20130270514A1 (en) Low resistance bidirectional junctions in wide bandgap semiconductor materials
US6586774B2 (en) Method for fabricating nitride semiconductor, method for fabricating nitride semiconductor device, and nitride semiconductor device
CN100517773C (zh) 氮化物系半导体发光元件
KR20100064383A (ko) 패터닝 된 기판 상의 (Al,In,GA,B)N 장치구조
CN106537617A (zh) 使用半导体结构和超晶格的高级电子装置结构
TWI518945B (zh) 漏電阻斷效果優秀的氮化物半導體發光器件及其製備方法
CN115188808A (zh) 外延ⅲ族氮化物中的掺杂阻挡层
US7417258B2 (en) Semiconductor light-emitting device, and a method of manufacture of a semiconductor device
US9806223B2 (en) Optoelectronic semiconductor chip and method for the production thereof
KR100330228B1 (ko) 2차원 전자가스층을 갖는 양자구조의 질화물 반도체 발광소자의제작방법
JP2015115433A (ja) Iii族窒化物半導体素子
JPH09326508A (ja) 半導体光素子
US7642565B2 (en) Radiation-emitting semiconductor component based on gallium nitride, and method for fabricating the semiconductor component
Kwon et al. Effect of GaAs y P 1− y (0⩽ y< 1) interlayers on the structural, optical, and electrical characteristics of GaAs/InGaP heterojunction
JP2003037290A (ja) 発光素子
KR20150085950A (ko) 다중양자우물 구조 활성층을 포함하는 발광다이오드 및 이의 제조방법
JP2003086532A (ja) 窒化物半導体素子および半導体装置
JPH09283856A (ja) 半導体レーザ
Fujikura et al. Identification and removal of deep levels in InGaP/GaAs heterostructures grown by TBP-based GSMBE
KR20070092037A (ko) 레이저 다이오드 및 그 제조방법

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20100929

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20131224

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20150202

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20150723

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee