KR20100126458A - 터널 접합을 구비한 광전 반도체 몸체 및 그러한 반도체 몸체의 제조 방법 - Google Patents
터널 접합을 구비한 광전 반도체 몸체 및 그러한 반도체 몸체의 제조 방법 Download PDFInfo
- Publication number
- KR20100126458A KR20100126458A KR1020107021815A KR20107021815A KR20100126458A KR 20100126458 A KR20100126458 A KR 20100126458A KR 1020107021815 A KR1020107021815 A KR 1020107021815A KR 20107021815 A KR20107021815 A KR 20107021815A KR 20100126458 A KR20100126458 A KR 20100126458A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- type
- tunnel junction
- semiconductor body
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3095—Tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/70—Tunnel-effect diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
Landscapes
- Led Devices (AREA)
- Recrystallisation Techniques (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008011849.4 | 2008-02-29 | ||
| DE102008011849 | 2008-02-29 | ||
| DE102008028036.4 | 2008-06-12 | ||
| DE102008028036A DE102008028036A1 (de) | 2008-02-29 | 2008-06-12 | Optoelektronischer Halbleiterkörper mit Tunnelübergang und Verfahren zur Herstellung eines solchen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100126458A true KR20100126458A (ko) | 2010-12-01 |
Family
ID=40911448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107021815A Abandoned KR20100126458A (ko) | 2008-02-29 | 2009-02-26 | 터널 접합을 구비한 광전 반도체 몸체 및 그러한 반도체 몸체의 제조 방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20110012088A1 (https=) |
| EP (1) | EP2248192A1 (https=) |
| JP (1) | JP2011513960A (https=) |
| KR (1) | KR20100126458A (https=) |
| CN (1) | CN101960622B (https=) |
| DE (1) | DE102008028036A1 (https=) |
| TW (1) | TWI404232B (https=) |
| WO (1) | WO2009106070A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009054564A1 (de) * | 2009-12-11 | 2011-06-16 | Osram Opto Semiconductors Gmbh | Laserdiodenanordnung und Verfahren zum Herstellen einer Laserdiodenanordnung |
| JP5678806B2 (ja) * | 2011-06-07 | 2015-03-04 | 株式会社デンソー | 半導体レーザ及びその製造方法 |
| DE102011116232B4 (de) | 2011-10-17 | 2020-04-09 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| CN103579426B (zh) * | 2012-07-19 | 2016-04-27 | 华夏光股份有限公司 | 半导体装置 |
| DE102013104954A1 (de) * | 2013-05-14 | 2014-11-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| TWI597862B (zh) * | 2013-08-30 | 2017-09-01 | 晶元光電股份有限公司 | 具阻障層的光電半導體元件 |
| CN103489975B (zh) * | 2013-10-08 | 2016-09-07 | 东南大学 | 一种具有隧道结结构的氮极性面发光二极管 |
| CN103855263A (zh) * | 2014-02-25 | 2014-06-11 | 广东省工业技术研究院(广州有色金属研究院) | 一种具有极化隧道结的GaN基LED外延片及其制备方法 |
| DE102016103852A1 (de) * | 2016-03-03 | 2017-09-07 | Otto-Von-Guericke-Universität Magdeburg | Bauelement im System AlGaInN mit einem Tunnelübergang |
| US9859470B2 (en) * | 2016-03-10 | 2018-01-02 | Epistar Corporation | Light-emitting device with adjusting element |
| DE102016113274B4 (de) * | 2016-07-19 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| US20180331255A1 (en) * | 2017-05-12 | 2018-11-15 | X Development Llc | Fabrication of ultraviolet light emitting diode with tunnel junction |
| CN107230738B (zh) * | 2017-07-31 | 2019-05-31 | 河北工业大学 | 具有超晶格隧穿结的发光二极管外延结构及其制备方法 |
| JP6964875B2 (ja) * | 2017-11-10 | 2021-11-10 | 学校法人 名城大学 | 窒化物半導体発光素子の製造方法 |
| JP7155723B2 (ja) * | 2018-08-02 | 2022-10-19 | 株式会社リコー | 発光素子及びその製造方法 |
| CN113257940B (zh) | 2020-02-13 | 2023-12-29 | 隆基绿能科技股份有限公司 | 叠层光伏器件及生产方法 |
| CN113066887B (zh) * | 2021-03-19 | 2023-01-20 | 扬州乾照光电有限公司 | 一种太阳电池以及制作方法 |
| CN114566573B (zh) * | 2022-02-12 | 2025-07-04 | 江西兆驰半导体有限公司 | 一种AlGaN基深紫外发光二极管芯片及其制备方法 |
| WO2025198675A1 (en) * | 2023-12-04 | 2025-09-25 | Ohio State Innovation Foundation | Methods of modular construction of 0d-state tunnel junction devices and methods of use thereof |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07326727A (ja) * | 1994-05-30 | 1995-12-12 | Nippon Telegr & Teleph Corp <Ntt> | 共鳴トンネル素子 |
| JP3737175B2 (ja) * | 1995-12-26 | 2006-01-18 | 富士通株式会社 | 光メモリ素子 |
| JPH0992847A (ja) * | 1995-09-21 | 1997-04-04 | Hitachi Cable Ltd | トンネル型半導体素子 |
| US5684309A (en) | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
| KR100527349B1 (ko) | 1997-01-09 | 2005-11-09 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물반도체소자 |
| US5831277A (en) | 1997-03-19 | 1998-11-03 | Northwestern University | III-nitride superlattice structures |
| US6266355B1 (en) * | 1997-09-12 | 2001-07-24 | Sdl, Inc. | Group III-V nitride laser devices with cladding layers to suppress defects such as cracking |
| US6841800B2 (en) * | 1997-12-26 | 2005-01-11 | Matsushita Electric Industrial Co., Ltd. | Light-emitting device comprising a gallium-nitride-group compound-semiconductor |
| JP2000277757A (ja) * | 1999-03-26 | 2000-10-06 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| US6369403B1 (en) * | 1999-05-27 | 2002-04-09 | The Board Of Trustees Of The University Of Illinois | Semiconductor devices and methods with tunnel contact hole sources and non-continuous barrier layer |
| DE19955747A1 (de) | 1999-11-19 | 2001-05-23 | Osram Opto Semiconductors Gmbh | Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur |
| US6635907B1 (en) * | 1999-11-17 | 2003-10-21 | Hrl Laboratories, Llc | Type II interband heterostructure backward diodes |
| JP4232334B2 (ja) * | 2000-10-20 | 2009-03-04 | 日本電気株式会社 | トンネル接合面発光レーザ |
| US6515308B1 (en) * | 2001-12-21 | 2003-02-04 | Xerox Corporation | Nitride-based VCSEL or light emitting diode with p-n tunnel junction current injection |
| WO2004008551A1 (ja) * | 2002-07-16 | 2004-01-22 | Nitride Semiconductors Co.,Ltd. | 窒化ガリウム系化合物半導体装置 |
| KR100542720B1 (ko) * | 2003-06-03 | 2006-01-11 | 삼성전기주식회사 | GaN계 접합 구조 |
| US7095052B2 (en) * | 2004-10-22 | 2006-08-22 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Method and structure for improved LED light output |
| DE102005035722B9 (de) * | 2005-07-29 | 2021-11-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| US7473941B2 (en) * | 2005-08-15 | 2009-01-06 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Structures for reducing operating voltage in a semiconductor device |
| TWI266440B (en) * | 2005-10-20 | 2006-11-11 | Formosa Epitaxy Inc | Light emitting diode chip |
| US8124957B2 (en) * | 2006-02-22 | 2012-02-28 | Cree, Inc. | Low resistance tunnel junctions in wide band gap materials and method of making same |
| US7737451B2 (en) * | 2006-02-23 | 2010-06-15 | Cree, Inc. | High efficiency LED with tunnel junction layer |
| JP4172505B2 (ja) * | 2006-06-29 | 2008-10-29 | 住友電気工業株式会社 | 面発光型半導体素子及び面発光型半導体素子の製造方法 |
| DE102007031926A1 (de) * | 2007-07-09 | 2009-01-15 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterkörper |
-
2008
- 2008-06-12 DE DE102008028036A patent/DE102008028036A1/de not_active Withdrawn
-
2009
- 2009-02-26 WO PCT/DE2009/000282 patent/WO2009106070A1/de not_active Ceased
- 2009-02-26 JP JP2010547955A patent/JP2011513960A/ja active Pending
- 2009-02-26 EP EP09715687A patent/EP2248192A1/de not_active Withdrawn
- 2009-02-26 US US12/919,532 patent/US20110012088A1/en not_active Abandoned
- 2009-02-26 KR KR1020107021815A patent/KR20100126458A/ko not_active Abandoned
- 2009-02-26 CN CN200980107061.5A patent/CN101960622B/zh not_active Expired - Fee Related
- 2009-02-27 TW TW098106280A patent/TWI404232B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008028036A1 (de) | 2009-09-03 |
| JP2011513960A (ja) | 2011-04-28 |
| CN101960622B (zh) | 2013-01-09 |
| WO2009106070A1 (de) | 2009-09-03 |
| TW200945637A (en) | 2009-11-01 |
| CN101960622A (zh) | 2011-01-26 |
| US20110012088A1 (en) | 2011-01-20 |
| TWI404232B (zh) | 2013-08-01 |
| EP2248192A1 (de) | 2010-11-10 |
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Legal Events
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Patent event date: 20100929 Patent event code: PA01051R01D Comment text: International Patent Application |
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Patent event code: PA02012R01D Patent event date: 20131224 Comment text: Request for Examination of Application |
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Comment text: Notification of reason for refusal Patent event date: 20150202 Patent event code: PE09021S01D |
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| NORF | Unpaid initial registration fee | ||
| PC1904 | Unpaid initial registration fee |