CN101936752A - 光学接近传感器封装 - Google Patents

光学接近传感器封装 Download PDF

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CN101936752A
CN101936752A CN2010102192563A CN201010219256A CN101936752A CN 101936752 A CN101936752 A CN 101936752A CN 2010102192563 A CN2010102192563 A CN 2010102192563A CN 201010219256 A CN201010219256 A CN 201010219256A CN 101936752 A CN101936752 A CN 101936752A
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CN101936752B (zh
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詹姆斯·卡斯特罗
兰尼·萨拉万南
谭维新
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Abstract

本发明提供了具有成型的红外光抑制阻挡和红外光透过组件的光学接近传感器封装。该光学接近传感器包括红外光发射器、红外光探测器、设置在光发射器上方并覆盖光发射器的第一成型的光学透射性红外光透过组件以及设置在光探测器上方并覆盖光探测器的第二成型的光学透射性红外光透过组件。基本光非透射性红外光阻挡组件位于光发射器和第一成型的光学透射性红外光透过组件与光探测器与第二成型的光学透射性红外光透过组件之间。红外光阻挡组件充分地削弱或阻挡光发射器与光探测器之间的不期望的直接、散射或折射光的透射，并由此使得光发射器与光探测器之间串扰和干涉最小。

Description

光学接近传感器封装
技术领域
这里描述的本发明的各种实施例涉及接近传感器的领域以及与其相关的组件、装置、系统和方法。
背景技术
光学接近传感器(诸如AVAGO TECHNOLOGIESTM HSDL-9100表面安装的接近传感器、AVAGO TECHNOLOGIES TM APDS-9101集成反射传感器、AVAGO TECHNOLOGIESTM APDS-9120集成光学接近传感器以及AVAGO TECHNOLOGIESTM APDS-9800集成环境光和接近传感器)是公知的。这种传感器通常包括集成的高效率红外发射器或光源以及相应的光电二极管或光探测器，并且用在大量的手持电子装置(诸如，手机、个人数据助理(PDA)、膝上或便携式计算机、便携式和手持式装置、投币式娱乐设备、工业自动机器和设备、不接触开关、卫生自动机器和设备等)中。
参照图1，示出了一种公知的现有技术光学接近传感器10，包括红外光发射器16、光发射器驱动电路51、光探测器或光电二极管12、光探测器传感电路53、具有孔55和57的金属壳体或屏蔽件18以及被传感的物体60。由光电二极管12对由发射器16发射并且从物体60作为反射光19而反射的光束15(其相对靠近于光学接近传感器10)进行探测，并由此提供物体60靠近或接近传感器10的指示。
如图1所示，光学接近传感器10还包括金属壳体或屏蔽件18，其由金属制成并且包括分别位于光发射器16和光探测器12上方的孔55和57，使得由光检测器12发射的光的至少第一部分15穿过孔55并且第一部分光的从接近传感器10的物体50反射的至少第二部分19穿过孔57，以由光探测器12进行探测。如图所示，金属壳体或屏蔽件18还可以包括其中分别设置光发射器16和光探测器12的第一和第二模块61和63。第一和第二模块61和63包括邻接的光学不透明金属内侧壁25，以在第一和第二模块61和63之间提供光学隔离。
许多光学接近传感器通常包括金属屏蔽件(诸如图1中示出的屏蔽件或壳体18)，以提供光发射器16与光检测器或光电二极管12之间的光学隔离，来使得发射器16与检测器12之间的不期望的光学串扰最小化。例如，参见对应于AVAGO TECHNOLOGIESTM APDS-9120Integrated OpticalSensors Preliminary Datasheet和AVAGO TECHNOLOGIESTM APDS-9800Integrated Ambient Light and Proximity S ensors Preliminary Datasheet的DataSheets，通过引用将其全部结合在这里。
图2示出了具有金属屏蔽件或壳体18的现有技术光学接近传感器10。图2中示出的光学接近传感器是AVAGO TECHNOLOGIESTMAPDS-9120Integrated Optical Proximity Sensor(集成光学接近传感器)，其包括其上安装有LED 16和光学探测器或光电二极管12的成型的塑料衬底11。单块金属屏蔽件18覆盖LED 16和光探测器或光电二极管12，并且含有设置在它们之间的向下伸出的光阻挡65(未在图2中示出)。电触点17提供了建立接近传感器10与外部装置之间的电连接的方式。在APDS-9120光学接近传感器中，形成金属屏蔽件18并且使用传统的金属冲压技术而使其变薄，并且通过粘贴将其固定到下层塑料衬底11。APDS-9120传感器具有仅4mm×4mm的占地面积，并且因此非常小。
图3示出了具有比图2更复杂的金属屏蔽件或壳体18的现有技术的光学接近传感器10。图3中示出的光学接近传感器是AVAGOTECHNOLOGIESTM APDS-9800Integrated Ambient Light and ProximitySensor(集成环境光和接近传感器)，其含有其上安装有LED 16、光探测器或光电二极管12和环境光传感器14的印刷电路板(“PCB”)衬底11。两块金属屏蔽件18覆盖LED 16、光探测器或光电二极管12以及环境光传感器14，并且含有设置在它们之间的向下突出的光阻挡65。在APDS-9800光学接近传感器中，形成具有比图2更复杂得多的形状和几何尺寸的金属屏蔽件18并使用更先进的金属冲压技术而使其变薄，并且必须手工安装并且通过粘合将其固定到下层PCB，以确保合适的对准和安装。
如现在可以看到的，至少一些现有技术的光学接近传感器依赖外部安装的金属屏蔽件18的使用，其中需要金属屏蔽件18来减小否则会发生在LED 16与光检测器12之间的串扰或干涉的量并且帮助增加装置的检测距离。然而，也需要金属屏蔽件18非常小，使得它们难以以大体积制造并且因此难以制造。这种金属屏蔽件18也通常需要昂贵的自动设备，来将其以大产量安装连接到传感器19。此外，金属屏蔽件18的质量通常不同，并且通常产生供应商不能满足这种小装置的光尺寸公差的问题。金属屏蔽件18也可能从传感器10分离，由此为传感器10增加另一个失效点。
所需要的是这样一种光学接近传感器设计，其能够消除包括金属屏蔽件18的需要，但是保持高串扰和干涉，使得光学接近传感器可以提供改善性能的特征、降低成本、增加可制作性并且改善可靠性。
发明内容
在一些实施例中，提供了一种光学接近传感器，包括：红外光发射器，其可操作地连接到光发射器驱动电路并由所述光发射器驱动电路驱动；光探测器，其可操作地连接到光探测器驱动电路并由所述光探测器驱动电路驱动；第一成型的光学透射性红外光透过组件，其设置在所述光发射器上方并覆盖所述光发射器；第二成型的光学透射性红外光透过组件，其设置在所述光探测器上方并覆盖所述光探测器；成型的基本光学非透射性红外光阻挡组件，其设置在所述第一成型的光学透射性红外光透过组件与所述第二成型的光学透射性红外光透过组件之间；其中，由所述光检测器发射的光的至少第一部分穿过所述第一组件，并且所述光的第一部分的、从接近所述传感器的所关注的物体反射回来的至少第二部分穿过所述第二组件，来由所述光探测器进行探测，并且所述红外光阻挡组件充分地削弱或阻挡所述光发射器与所述光探测器之间的不期望的直接、散射或折射光的透射，并由此使得所述光发射器与所述光探测器之间串扰和干涉最小。
在其他实施例中，提供了一种制造光学接近传感器的方法，包括：将红外光发射器安装到衬底上；将红外光探测器安装到所述衬底上，所述红外光探测器在所述衬底上与所述红外光发射器保持距离；在所述光发射器上方成型或铸造第一光学透射性红外光透过组件，并且覆盖所述光发射器；在所述光探测器上方成型或铸造第二光学透射性红外光透过组件，并且覆盖所述光探测器；以及在所述第一光学透射性红外光透过组件与所述第二光学透射性红外光透过组件之间成型或铸造基本光学非透射性红外光阻挡。
其他的实施例也在这里公开了，并且对于已经阅读并理解说明书和附图的本领域的技术人员，将会变得更加清楚。
附图说明
本发明的各种实施例的不同方面将会从以下的说明书、附图和权利要求而变得清楚，其中：
图1示出了现有技术的光学接近传感器；
图2示出了具有金属屏蔽件或壳体的现有技术的光学接近传感器；
图3示出了具有比图2更复杂的金属屏蔽件或壳体的现有技术的光学接近传感器；
图4示出了包括安装到衬底上并且通过光学透射性材料而与光探测器分开的光发射器的光学接近传感器；
图5示出了一种光学接近传感器，其包括安装到光发射器并且通过光学透射性材料而与光探测器分开的光发射器并且窗口设置在光学接近传感器上方；
图6示出了包括安装到衬底上并且通过光学透射性材料而与光发射器分开的光发射器的光学接近传感器；
图7示出了消除了对于设置在光发射器和光检测器之间的金属阻挡的需要的光学接近传感器。
图8(a)到图8(g)示出了根据本发明的一个实施例的制造光学接近传感器的方法；
图9(a)到图9(d)示出了根据本发明的另一个实施例的制造光学接近传感器的方法；
图10示出了根据一个实施例的制造光学接近传感器的另一个方法。
附图没有必要成比例。类似的附图标记可以用于表明相似的原件。
具体实施方式
现在参照图4，示出了包括光发射器16的光学接近传感器10，其中光发射器16安装到衬底11上并且通过光学透射性材料21与光探测器12分开，光学透射性材料21是单模子的两部分环氧树脂或转印成型的化合物。如图4所示，在光线15透射通过材料21的同时，其他的反射的、衍射的或折射的IR辐射19可能穿过单模子化合物21而泄漏到光探测器12并将其自身表现为光发射器16与光探测器12之间的不期望的串扰或干涉，由此降低接近传感器10的性能。
如图5所示，反射的、衍射的或折射的IR辐射19以及光发射器16与光探测器12之间的不期望的串扰或干涉的量通常由于窗口23的存在而加剧，其中窗口23在一些应用中设置为其中容纳并安装有接近传感器10的便携式或其他类型电子装置的一部分。
如图6所示，可以通过在光发射器16与光探测器12之间设置金属光阻挡25而减小从由反射的、衍射的或折射的IR辐射19所引起的不期望的串扰或干涉而产生的问题。然而，在接近传感器10中提供这种金属阻挡25存在关于增加制作成本和复杂度的问题。
图7示出了提供对于上述问题的解决办法的一个实施例，其中完全地消除了金属阻挡25。继续参照图7，示出了包括红外光发射器16(可操作地连接到光发射器驱动电路并由其驱动，该细节未在图7中示出)和光探测器12(可操作地连接到光探测器驱动电路并由其驱动，该细节未在图7中示出)的光学接近传感器10。第一成型的光学透射性红外光透过组件31设置在光探测器12上方并覆盖光探测器12。光学透镜27和29分别设置在光发射器16和光探测器12上方，其中光学透镜27和29优选地由相同材料制成并且在制作处理中与第一和第二成型的光学透射性红外光透过组件31和32同时形成。基本光学非透射性红外光阻挡组件33位于光发射器16和第一成型的光学透射性红外光透过组件31与光探测器12和第二成型的光学透射性红外光透过组件32之间。由光发射器15发出的光的至少第一部分15穿过第一组件31，并且光的第一部分15的、从接近接近传感器10的所关注的物体反射回来的至少第二部分19穿过第二组件32，以由光探测器12进行探测。红外光阻挡组件33充分地削弱或阻挡光发射器16与光探测器12之间的不期望的直接、散射或反射的光透射，并由此使得光发射器16与光探测器12之间的光学串扰或干涉最小。
根据一个实施例，使用红外透过并且光学透射性的转印成型化合物(诸如NITTO DENKOTM NT-8506透明转印成型化合物8506或PENCHEM TechnologiesTM OP 579红外透过光电子环氧树脂)来形成第一和第二成型的光学透射性红外光透过组件31和32。也可以采用其他合适的光学透射性环氧树脂、塑料、聚合物或其他材料。在一些实施例中，并且如下文中更详细地讨论的，光学透射性红外光透过组件31和32可以在相同的制作步骤中成型或者可以分别地成型。见题为“Clear TransferMolding Compound NT-8506”日期为2001年的Technical Data Sheet NT-8506以及日期为2009年四月的PENCHEM OP 579IR Pass OptoelectronicEpoxy Data Sheet，Revision 1，通过引用将这二者全部结合在这里。
在一个实施例中，使用红外阻挡、过滤或截止的转印成型化合物(诸如NITTO DENKOTM NT-MB-IRL3801两部分环氧树脂材料或PENCHEMTechnologiesTM OP 580红外过滤光电子环氧树脂，其中任何一者优选地含有以下的红外截止材料的量：在使得所使用的这种红外截止材料的量将成本保持在最小的同时，由使用者选择来实现可接受的红外光阻挡性能的量)来形成成型的光学非透射性红外光阻挡组件33。也可以采用其他合适的光学非透射性环氧树脂、塑料、聚合物或其他材料。见日期为2008年、由DENKOTM出版的Technical Data Sheet NT-MB-IRL3801以及日期为2009年四月的PENCHEM OP 580 IR Pass Optoelectronic Epoxy DataSheet，Revision 1，通过引用将这二者全部结合在这里。
如进一步参照图7所示，由光发射器或LED 16发射的红外光线15离开传感器10并且作为光线19而返回光探测器12，由此允许对要被探测的附近物体进行探测。通过成型的基本光学非透射性红外光阻挡组件33而将从成型组件31的表面反射的光线阻挡，使其不能够到达光探测器12。从窗口23反射的光线也由基本光学非透射性红外光阻挡组件33阻挡。组件31、32和33之间的全内反射有助于改善接近传感器10的性能。如现在可以看到的，由于不期望的反射、折射或衍射光线不能穿透并传输到达光探测器12，图7中示出的传感器10的实施例在通过减小串扰和干涉而改善传感器10的光学性能的同时，消除了对于提供图6的金属屏蔽件25的需要。
图8(a)到图8(g)示出了制造根据一个实施例的光学接近传感器10的方法。如图8(a)所示，首先提供裸露的衬底11(在一个实施例中为印刷电路板或PCB)。如图8(b)所示，光发射器管芯或LED16以及光探测器管芯12引线键合到衬底11。在图8(c)中，光发射器管芯或LED 16和光探测器管芯12引线键合到衬底11。之后，如图8(d)所示，使用合适的红外透过和光学透射性转印成型化合物将第一和第二光学透射性红外光透过组件31和32成型在光发射器16和探测器12上方。在图8(e)中，集成电路35附着到衬底11，其中集成电路35含有驱动光发射器16并且处理由光探测器12提供的输出信号的电子电路并且可选地含有环境光传感器14(在图8(a)到图8(g)中未示出)。在图8(f)，将集成电路35引线键合到衬底11。最后，在图8(g)中，基本光学非透射性红外光阻挡组件33成型在第一成型的光学透射性红外光透过组件31与第二成型的光学透射性红外光透过组件32之间，并且优选地关于成型的第一和第二光学透射性组件31和32构造并兼容，以结合到其上而在正常操作条件下不会分层。
现在参照图9(a)到图9(d)，示出了制造根据一个实施例的接近传感器的另一种方法。如图9(a)所示，多个PCB衬底11a到11f在光发射器管芯12a到12f和光探测器管芯16a到16f连接到其上并且之后与其引线键合的状态下，设置在面板41/42上。在图9(b)中，使用转印成型技术来采用合适的光学透射性材料对光发射器管芯12a到12f和光探测器管芯16a到16f外模成型，以形成第一和第二成型的光学透射性红外光透过组件31和32以及透镜27a到27f和29a到29f。如图9(b)到图9(d)所示，注意，设置模子浇道(mold runner)43以帮助将各种成型材料分配到PCB衬底11a到11f。如图9(c)所示，含有集成的环境光传感器14的光发射器驱动集成电路35a到35f固定到PCB衬底11a到11f上，并且之后与其引线键合。在图9(d)中，整个PCB面板41是使用合适的红外截止、过滤或阻挡材料铸造的片，以在第一和第二成型的光学透射性红外光透过组件31a到31f与32a到32f之间形成基本光学非透射性红外光阻挡组件33a到33f。最后(在图中未示出)，例如通过使用本领域公知的锯切技术对独立的接近传感器10a到10f进行分离，其中也移除了模子浇道43。
图10示出了制造根据一个实施例的光学接近传感器10的另一种方法。如图10所示，在处理输入100处，提供PCB面板，该PCB面板具有固定到安装在面板上的独立的衬底11上并与其引线键合的LED管芯16和光探测器管芯12。在步骤110处，将PCB面板放置在构造为允许铸造或转印成型的第一模子中。在步骤120处，将红外透过材料手动地或自动地注入第一模子中，以在每个接近传感器10上方形成第一和第二成型的光学透射性红外光透过组件31和32。之后，在步骤130处，将红外透过成型材料在所需温度下烤箱硬化必需的时间段。在步骤140处，将PCB从第一模子移除或脱模。之后，在步骤150处，为了步骤160而准备剩余的管芯固定到独立的PCB衬底并与其引线键合的外模成型的PCB面板，在步骤160中将PCB面板放置在第二模子中。在步骤170处，将红外截止材料手动地或自动地注入第二模子中，以为每个接近传感器10形成基本光学非透射性组件31和32。之后，在步骤180处，将红外截止阻挡成型材料在所需温度下烤箱硬化必需的时间段。在步骤190处，将PCB从第二模子移除或脱模。在步骤200处，对成品PCB面板进行处理，以对独立的阶接近传感器10从PCB面板进行分离。
这里描述的制作方法以及已经制造的各种组件、装置和系统包括在本发明的范围内。
除了这里公开的实施例之外，可以想到本发明的各种实施例。上述实施例应当被认为是本发明的示例，而不是本发明的限制。除了本发明的上述实施例之外，对于详细描述和附图的研究将会示出存在本发明的其他实施例。因此，这里没有明确地陈述的本发明的上述实施例的许多结合、置换、变化和修改将会仍然在本发明的范围内。

Claims (26)

1.一种光学接近传感器，包括：
红外光发射器，其可操作地连接到光发射器驱动电路并由所述光发射器驱动电路驱动；
光探测器，其可操作地连接到光探测器驱动电路并由所述光探测器驱动电路驱动；
第一成型的光学透射性红外光透过组件，其设置在所述光发射器上方并覆盖所述光发射器；
第二成型的光学透射性红外光透过组件，其设置在所述光探测器上方并覆盖所述光探测器；
成型的基本光学非透射性红外光阻挡组件，其设置在所述第一成型的光学透射性红外光透过组件与所述第二成型的光学透射性红外光透过组件之间；
其中，由所述光检测器发射的光的至少第一部分穿过所述第一组件，并且所述光的第一部分的、从接近所述传感器的所关注的物体反射回来的至少第二部分穿过所述第二组件，来由所述光探测器进行探测，并且所述红外光阻挡组件基本削弱或阻挡所述光发射器与所述光探测器之间的不期望的直接、散射或折射光的透射，并由此使得所述光发射器与所述光探测器之间串扰和干涉最小。
2.根据权利要求1所述的光学接近传感器，其中，所述第一和第二红外光透过组件中的至少一者包括光学透射性环氧树脂、聚合物或塑料。
3.根据权利要求1所述的光学接近传感器，其中，所述第一和第二红外光透过组件以及所述红外光阻挡组件构造为彼此结合，并且它们之间形成的结合在正常的操作条件下不会分层。
4.根据权利要求1所述的光学接近传感器，其中，所述红外光阻挡组件包括基本光学非透射性的可成型材料、环氧树脂、聚合物或塑料。
5.根据权利要求1所述的光学接近传感器，其中，所述红外光阻挡组件还包括红外截止或阻挡添加物。
6.根据权利要求1所述的光学接近传感器，还包括衬底，所述光发射器和所述光探测器可操作地安装到所述衬底上。
7.根据权利要求6所述的光学接近传感器，其中，所述衬底是印刷电路板(PCB)。
8.根据权利要求1所述的光学接近传感器，其中，所述光发射器和所述光探测器中的至少一者是半导体管芯。
9.根据权利要求1所述的光学接近传感器，还包括至少一个集成电路板，其可操作地连接到所述光发射器和所述光探测器并且构造为控制所述光发射器和所述光探测器的工作并处理由所述光探测器提供的输出信号。
10.根据权利要求9所述的光学接近传感器，其中，所述至少一个集成电路还包括接近传感器专用集成电路(ASIC)和主控制单元(MCU)。
11.根据权利要求1所述的光学接近传感器，还包括环境光传感器。
12.根据权利要求1所述的光学接近传感器，其中，所述光学接近传感器结合到便携式电子装置中。
13.根据权利要求11所述的光学接近传感器，其中，所述便携式电子装置是移动电话、个人数字助手(PDA)、膝上型计算机、笔记本型计算机或计算机。
14.根据权利要求1所述的光学接近传感器，其中，所述光发射器是LED。
15.根据权利要求1所述的光学接近传感器，其中，所述光探测器是正-本征-负(PIN)二极管。
16.根据权利要求1所述的光学接近传感器，其中，成型的光学透射性透镜形成在所述光发射器或所述光探测器上方。
17.一种制造光学接近传感器的方法，包括：
将红外光发射器安装到衬底上；
将红外光探测器安装到所述衬底上，所述红外光探测器在所述衬底上与所述红外光发射器保持距离；
在所述光发射器上方成型或铸造第一光学透射性红外光透过组件，并且覆盖所述光发射器；
在所述光探测器上方成型或铸造第二光学透射性红外光透过组件，并且覆盖所述光探测器；以及
在所述第一光学透射性红外光透过组件与所述第二光学透射性红外光透过组件之间成型或铸造基本光学非透射性红外光阻挡。
18.根据权利要求17所述的方法，其中，在相同的步骤中成型或铸造所述第一和第二光学透射性红外光透过组件。
19根据权利要求17所述的方法，其中，在成型或铸造所述第一和第二光学透射性红外光透过组件时，在所述光发射器和所述光探测器上方形成光学透射性透镜。
20.根据权利要求17所述的方法，其中，所述光发射器或所述光探测器模片固定到所述衬底。
21.根据权利要求17所述的方法，其中，所述光发射器或所述光探测器引线键合到所述衬底。
22.根据权利要求17所述的方法，其中，所述第一和第二光学透射性红外光透过组件是转印成型的。
23.根据权利要求17所述的方法，还包括在成型或铸造所述第一和第二光学透射性红外光透过组件时，形成光波导。
24.根据权利要求17所述的方法，还包括将包括环境光传感器的光发射器驱动集成电路固定到所述衬底。
25.根据权利要求17所述的方法，其中，成型或铸造所述基本光学非透射性红外光阻挡还包括片铸造所述光阻挡组件。
26.根据权利要求17所述的方法，其中，通过锯切对所得到的成型的光学接近传感器进行分割。
27.根据权利要求17所述的方法，其中，在面板上同时形成多个接近传感器。
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