CN104332524A - 电子装置、光学模块及其制造方法 - Google Patents

电子装置、光学模块及其制造方法 Download PDF

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Publication number
CN104332524A
CN104332524A CN201410423978.9A CN201410423978A CN104332524A CN 104332524 A CN104332524 A CN 104332524A CN 201410423978 A CN201410423978 A CN 201410423978A CN 104332524 A CN104332524 A CN 104332524A
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China
Prior art keywords
light
emitting component
edge
encapsulating material
optical module
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CN201410423978.9A
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CN104332524B (zh
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张容瑄
陈盈仲
施兆麟
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Advanced Semiconductor Engineering Inc
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Advanced Semiconductor Engineering Inc
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Priority to CN201410423978.9A priority Critical patent/CN104332524B/zh
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Priority to US14/835,280 priority patent/US11264367B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
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Abstract

本发明涉及一种光学模块，包含：载体、发光元件、光学传感器以及封装材料。所述载体具有第一表面。所述发光元件位于所述第一表面上方。所述光学传感器位于所述第一表面上方。所述封装材料位于所述第一表面上方且包覆或至少侧向包围所述发光元件，并暴露出至少一部分的发光元件。

Description

电子装置、光学模块及其制造方法
技术领域
本发明涉及一种光学模块以及包括所述光学模块的电子装置以及光学模块的制造方法。
背景技术
光学模块，例如接近传感器(Proximity Sensor)，可用来感测位于光学模块附近的物体。光学模块具有发光源以及光学传感器，光学传感器可接收或感测由发光源发出并经由外部或附近的物体反射后的光线，例如红外线，而检测到外部接近物体的存在。
串音干扰(cross talk)是由发光源发出而直接或经由其它不同于上述物体的介质反射到达光学传感器的光线，此也是导致传感器误动作的噪声。
图11A所示的光学感应模块，除了以透光材料15包覆发光元件11和光学传感器12以提供所述光电元件以及电性连接的相关保护外，还须在发光元件11上方形成透镜部151以增加发光聚光等发光效率。并使用盖体16以防止由发光元件11所发出的光线直接到达光学传感器12的感光区123、同时还具保护其内部的光学光电元件以及相关导线及连接点的功能。
虽然盖体16可防止由发光元件11所发射的光线直接到达感光区123，但是从图11A的光线分布范围可得知，感光区123除了接收到D1和D2范围内的光线(即C1和C2范围内的光线经物体140反射后的光线)外，还会接收到由第一表面201和第二表面202所反射的光线。故在图11A所示的光学模块中，从发光元件11发出的光线，有占接收功率约80％的光线会成为串音干扰信号。
为更清楚地显示串音干扰的现象，以图11B为例，图中标示出从发光元件11发出的串音干扰光线分布范围边界为C3和C4，分别经由第二表面202反射后到达感光区的光线范围分布边界为D3和D4。换句话说，从发光元件发出，且介于C3和C4间范围的光线可能经由第二表面202反射而到达感光区123，形成串音干扰主要来源的一部分。另外第一表面201也会发生类似串音干扰的反射，原理相似故不再赘述。
图11C所示的光学模块类似于图11A所示的光学模块，不同之处在于第二介质20在第一表面201上另包括红外线吸收层203用来吸收会成为串音干扰的反射光线(例如红外线)。在图11C中，从发光元件11发出的光线，相较于图11A所示的光学模块，红外线吸收层203虽可相对大幅地减少串音干扰，但为避免影响反射物可检测范围，红外线吸收层203的涂布仍有范围限制，故仍有约检测到的总功率的4.5％的光线(例如：光线C2')会成为串音干扰信号。另外，因使用丝网印刷等技术形成红外线吸收层203，然而丝网印刷技术相对来说较容易产生污染以及制程步骤增加、成本提高。
此外，盖体16会增加光学模块的尺寸以及制程的复杂度，因此增加制造光学模块的成本及所占空间。
发明内容
本发明的实施例关于一种光学模块，包含：载体、发光元件、光学传感器以及封装材料。载体具有第一表面。发光元件位于第一表面上方。光学传感器位于所述第一表面上方。封装材料位于所述第一表面上方且包覆或至少侧向包围发光元件，并暴露出至少一部分的发光元件。
本发明的另一实施例涉及一种电子装置，包括：光学模块及透光板。光学模块包括载体、发光元件、光学传感器以及封装材料。载体具有第一表面。发光元件位于所述第一表面上方。光学传感器位于所述第一表面上方。封装材料位于所述第一表面上方且包覆或至少侧向包围所述发光元件，并暴露出至少一部分的发光元件。透光板位于所述光学模块上方。
本发明的另一实施例涉及一种光学模块的制造方法，包括：(a)提供载体，所述载体具有第一表面；(b)将发光元件固定于所述第一表面上方；(c)将光学传感器固定于所述第一表面上方；以及(d)使用封装材料包覆或至少侧向包围所述发光元件，并暴露出至少一部分的发光元件。
附图说明
图1及图2为根据本发明实施例的光学模块的制造方法的剖面示意图。
图3为根据本发明另一实施例的光学模块的剖面示意图。
图4为根据本发明另一实施例的光学模块的剖面示意图。
图5为图2或图3的光学模块的操作示意图。
图6为图2或图3的光学模块的操作示意图。
图7为图2或图3的光学模块的操作示意图。
图8为图2或图3的光学模块的操作示意图。
图9为根据本发明另一实施例的光学模块的剖面示意图。
图10为包括图2到4及图9的光学模块的电子装置的示意图。
图11A为常规光学模块的操作示意图。
图11B为常规光学模块的操作示意图。
图11C为常规光学模块的操作示意图。
图11D为根据本发明另一实施例的光学模块的操作示意图。
具体实施方式
图1及图2为根据本发明实施例的光学模块的制造方法的示意图。参考图1，在图1中，提供载体10，载体10具有第一表面101。载体10可以是或可以包括，但不限于例如印刷电路板一类的衬底(substrate)。载体10内或载体10上可包括迹线(trace)、导线接合焊垫(wire-bonding pad)及/或导通孔(via)。载体10可由所属领域的技术人员所知可作为载体的材料组成。例如，载体10可以包括，但不限于有机材料、高分子材料、硅、二氧化硅或其它硅化物。并且通常地载体10具有从(50)μm到(1100)μm的厚度。
可使用但不限于导电或不导电的黏胶将发光元件11及光学传感器12固定在载体10的第一表面101上。可使用导线接合13分别将发光元件11及光学传感器12电连接到位于载体10的第一表面101上的导线接合焊垫(未图示)。载体10可进一步包括驱动发光元件11及光学传感器12的电路(未图示)。位于第一表面101的导线接合焊垫可电性连接载体10的驱动电路。
发光元件11可以是但不限于红外线发光二极管裸片(light emitting diode die，LEDdie)。
光学传感器12可以是但不限于感测红外线的光电二极管(photodiode)。
参考图2，在图2中，可在载体10的第一表面101上形成封装材料14以至少侧向包围发光元件11及光学传感器12，以形成光学模块1。封装材料14也可进一步包覆部分发光元件11、部分光学传感器12以及导线接合13以形成光学模块1。
封装材料14可以是但不限于例如包括黑色环氧树脂(Epoxy)的不透光IC封装材料(molding compound)。如图2所示，在本发明的实施例中，以剖面视图观之，封装材料14可包括第一部分封装材料141、第二部分封装材料142以及第三部分封装材料143。封装材料14并可提供结合类似图11A、11B或11C中盖体16以及透光材料15的保护功能外，在光学上的功效则于下面说明。
第一部分封装材料141可包覆或包围部分发光元件111。第二部分封装材料142可包覆或包围部分发光元件111以及部分光学传感器121。第三部分封装材料143可包覆或包围部分光学传感器121。封装材料14暴露未被其所包覆或包围的部分发光元件112以及部分光学传感器122。
第二部分封装材料142在未被包覆或包围的发光元件112的边缘处具有最小厚度hmin。第二部分封装材料142的侧剖面可以是但不限于图2所示的矩形，因此第二部分封装材料142在未被包覆或包围的发光元件112的边缘处的最小厚度hmin可以是但不限于例如第二部分封装材料142上表面与载体10的第一表面101之间的最小距离，或例如是图2所示点A与点B之间的距离。第二部分封装材料142在未被包覆或包围的发光元件112的边缘处的最小厚度hmin将于下文中详细说明。
图3为根据本发明另一实施例的光学模块的示意图。参考图3，图3所示的光学模块1a类似于图2所示的光学模块1，其不同之处在于封装材料14a所包括的第一部分封装材料141a、第二部分封装材料142a以及第三部分封装材料143a可能因为制程中使用模具制造而分别具有倒角(chamfering)，因而不同于图2中第一部分封装材料141、第二部分封装材料142以及第三部分封装材料143的剖面所示的直角。第二部分封装材料142a在未被包围的发光元件112的边缘处具有最小厚度hmin。第二部分封装材料142在未被包覆或包围的发光元件112的边缘处的最小厚度hmin可以是例如图3所示点A'与点B'之间的距离。第二部分封装材料142a在未被包覆或包围的发光元件112的边缘处的最小厚度hmin将于下文中详细说明。
图4为根据本发明另一实施例的光学模块的示意图。参考图4，图4所示的光学模块2类似于图2所示的光学模块1，其不同之处在于图4的光学模块2中，发光元件11'及透光封装材料15分别取代图2所示的光学模块1中的发光元件11及封装材料14。透光封装材料15可包覆形成在载体10的第一表面101上的发光元件11'、光学传感器12以及导线接合13。发光元件11'可以是但不限于例如由truelight所贩售的垂直腔面发射激光器(vertical-cavity surface-emitting laser，VCSEL)，商品型号：TSD-8B12-000，其典型光束发散角(beam divergence)为16度，最大光束发散角为25度。
图5为图2或图3的光学模块的操作原理示意图。参考图5，图5所示为图2或图3中，位于载体10第一表面101上，且未被封装材料14或14a所包覆或包围的发光元件112的一部分以及光学传感器122的一部分或全部，所述封装材料例如是不透光的材料。
未被封装材料14或14a包覆或包围的发光元件112的一部分具有第一边缘112a及第二边缘112b。第二边缘112b相对于第一边缘112a且第二边缘112b与光学传感器12间的距离小于第一边缘112a与光学传感器12间的距离。
未被封装材料14或14a包覆或包围的光学传感器122的一部分或全部进一步包含感光区123。感光区123具有第三边缘123a及第四边缘123b。第四边缘123b相对于第三边缘123a且第四边缘123b与发光元件11间的距离大于第三边缘132a与发光元件间的距离。
第二介质20位于第一表面101上方。第二介质20可以是但不限于玻璃板或其它由透光材料组成的薄板，例如：智能手机的显示屏幕的表面玻璃。第二介质具有第一表面201及第二表面202。第二表面202平行且相对于第一表面201，且第二表面202与载体10的距离大于第一表面201与载体10的距离。第二介质20的第一表面201实质上平行于载体10的第一表面101。
物体30位于第二介质20上方。物体30可以是但不限于可以反射光线的物体，例如：用户人脸表面。
未被封装材料14或14a包覆或包围的发光元件112的上表面与第二介质20的第一表面201之间间隔第二距离heg。
感光区123的上表面与第二介质20的第一表面201之间间隔第三距离hdg。
第二介质的第一表面201与第二表面202之间间隔第一厚度hg。
物体30的下表面与第二介质20的第二表面202之间间隔距离hog。
感光区123可接收或感测未被封装材料14或14a包覆或包围的发光元件112所发出并经过物体30反射的光线。例如，未被封装材料14或14a包覆或包围的发光元件112的部分的第一边缘112a可发出具有不同发射角的光线B1及B2。
光线B1及B2在穿过第二介质20后到达物体30下表面，再经由物体30反射而分别到达感光区123的第三边缘123a和第四边缘123b。
图6为图2或图3的光学模块的操作原理示意图。图6中的光学模块、第二介质20以及物体30的配置与图5类似，不同之处在于，图6显示未被封装材料14或14a包覆或包围的发光元件112的部分的第一边缘112a可发出发射角不同于光线B1及B2的光线B3及B4，且光线B3的发射角不同于光线B4的发射角。
由于光线B3及B4离开未被封装材料14或14a包覆或包围的发光元件112的角度不同于光线B1跟B2离开发光元件112的角度(例如光线B3及B4的发射角皆大于光线B1及B2的发射角)，光线B3及B4可能经由第二介质的第一表面201反射而分别到达感光区123的第三边缘123a及第四边缘123b而形成串音干扰。而图2或图3的光学模块所包括的第二部分封装材料142或142a可用以防止串音干扰，例如阻止图6所示光线B3及B4到达第二介质20的第一表面201。
图7为图2或图3的光学模块的操作原理示意图。图7中的光学模块、第二介质20以及物体30的配置与图6类似，不同之处在于图7显示未被封装材料14或14a包覆或包围的发光元件112的部分的第一边缘112a可发出发射角不同于光线B3及B4的光线B5及B6，且光线B5的发射角不同于光线B6的发射角。
虽由于光线B5及B6离开未被封装材料14或14a包覆或包围的发光元件112的部分的角度不同于光线B3跟B4离开发光元件112的角度，但光线B5及B6可能经由第二介质的第二表面202反射而分别到达感光区123的第三边缘123a及第四边缘123b而形成串音干扰。然而，图2或图3的光学模块所包括的第二部分封装材料142或142a可用以防止串音干扰，例如阻止图7所示光线B5及B6到达第二介质20。
从图7可看出，图2或图3中的封装材料14或14a在未被包覆或包围的发光元件112的部分的第二边缘112b处的最小厚度hmin只要达到可以阻止光线B5的高度时，即可避免感光区123接收到从发光元件112发出而经由第二介质20的第二表面202所反射的光线，同时还可以避免在图6中感光区123接收到从发光元件112发出而经由第二介质20的第一表面201所反射的光线，因光线B3、B4的发射角皆大于B5。换句话说，如果光线B5的发射角为θ1，只要封装材料14或14a在未被包覆或包围的发光元件112的部分的第二边缘112b处的最小厚度hmin可以阻挡发射角为θ1的光线B5，其它发射角大于θ1的光线(例如：B3、B4或B6)也同样都会被封装材料14或14a所阻挡，而无法到达感光区123，而不致发生串音干扰。
图8为图2或图3的光学模块中的操作原理示意图。图8中的光学模块、第二介质20以及物体30的配置与图7类似，不同之处在于仅显示光线B5而省略光线B6以利进行分析运算。
为避免感光区123接收到从发光元件112发出而经由第二介质20的第一表面201及第二表面202所反射的光线，因此需要决定图2或图3中的封装材料14或14a在未被包围或包覆的发光元件112的部分的第二边缘112b处的最小厚度hmin，使得第二边缘112b处的封装材料14或14a可以阻止发射角大于或等于θth的光线到达第二介质20，而在第一表面201或第二表面202发生反射而致生串音干扰的光线。
图2或图3中的封装材料14或14a在未被包围或包覆的发光元件112的部分的第二边缘112b处的最小厚度hmin可为但不限于例如图8中点A与点B间的距离或是点A'与点B'间的距离。点A及点A'可在图8中位于同一位置，其可分别为图2及图3中的点A及点A'。图8中的点B及点B'可在图8中位于同一位置，其可分别为图2及图3中的点B及点B'。
如图8所示，发光元件112具有第一厚度h1。未被包围或包覆的发光元件112的部分的第一边缘112a与第二边缘112b相隔第一距离W。发光元件112上表面与点A或点A'间的垂直距离为h2。第一边缘112a与感光区123的所述第三边缘123a相隔第四距离D。
图2或图3中的封装材料14或14a在未被包围或包覆的发光元件112的第二边缘112b处的最小厚度hmin等于发光元件112的第一厚度h1加上发光元件112上表面与点A或点A'间的垂直距离h2，即满足下列方程式：
hmin＝h1+h2          方程式(1)
如图8所示，自发光元件112的第一边缘112a射出的第一光线B5进入第一介质(图未标示)。第一介质可以是但不限于空气且第一介质具有第一折射率n1。
不同于第一介质的第二介质20位于载体10上方且面对载体10的第一表面101，且第二介质具有第二折射率n2。
第一介质位于载体10的第一表面101与第二介质20之间且邻接第二介质20。
当第一光线B5由发光元件112的第一边缘112a以发射角θ1射出后，会以第一入射角θ1的角度从第一介质进入第二介质20的第一表面201。第一光线B5从第一介质进入第二介质20的第一表面201时会产生第一折射角θ2。如果不阻挡第一光线B5从第一介质进入第二介质20，那么第一光线B5会经由第二介质20的第二表面202反射后到达感光区123的第三边缘123a。依据司乃尔定律(Snell's Law)，第一入射角θ1与第一折射角θ2之间应具有下列关系：
n1sinθ1＝n2sinθ2          方程式(2)
如图8所示，未被包围或包覆的发光元件112的部分的第一边缘112a与感光区123第三边缘123a间的第四距离D等于发光元件112上表面与第二介质20的第一表面201之间的第二距离heg与感光区123的上表面与第二介质20的第一表面201之间的第三距离hdg的总和与第一入射角θ1正切值的乘积，再加上两倍第二介质的第一厚度hg与第一折射角θ2正切值乘积，即满足下列方程式：
D＝(heg+hdg)tanθ1+2hgtanθ2          方程式(3)
也就是说，使用第四距离D减掉两倍第一厚度hg与第一折射角θ2正切值乘积的所得的差值，再除以第二距离heg与第三距离hdg的总和，可得到第一入射角θ1的正切值。
而发光元件112上表面与点A或点A'间的垂直距离h2为第一距离W乘以所述第一入射角θ1的余切值所得的积，即满足下列方程式：
h2＝Wcotθ1          方程式(4)
可利用但不限于迭代法(Iterative Method)得到可能满足方程式(2)的第一入射角θ1及第一折射角θ2。也就是说，可依序(由小到大或由大到小)将第一入射角θ1套入方程式(2)，例如将从0度到90度的多个可能的第一入射角θ1套入方程式(2)以获得多个满足方程式(2)的对应第一折射角θ2。换句话说，每一个第一入射角θ1会有相对应的第一折射角θ2。再以方程式(3)检验上述多对(pair)相对应的第一入射角θ1及第一折射角θ2，如果所述对第一入射角θ1及第一折射角θ2满足方程式(3)，那么可根据方程式(3)得到第一入射角θ1的正切值(tanθ1)。有了第一入射角θ1的正切值，就可以根据方程式(4)求得发光元件112上表面与点A或点A'间的垂直距离h2，再根据方程式(1)加上发光元件112的第一厚度h1便可决定封装材料14或14a在未被包围或包覆的发光元件112的部分的第二边缘112b处的最小厚度hmin。
图9为根据本发明另一实施例的光学模块的剖面示意图。参考图9，图9所示的光学模块1b类似于图2所示的光学模块1，其不同之处在于倒装芯片(flip-chip)的发光元件11及倒装芯片的光学传感器12取代了光学模块1中的导线接合型(wire-bonded)的发光元件11及光学传感器12，并且移除了导线接合13。
如此一来可选择将封装材料14至少侧向包围而无需包覆发光元件11及光学传感器12，以形成光学模块1b，而与前述实施例中使用导线接合型(wire-bonded)的发光元件11及光学传感器12时，可能需要将封装材料14至少包覆导线接合13以保护接合点及导线接合的实施情况有所不同。但为了避免光学传感器12接收到从发光元件11发出而经由第二介质20的第一表面201及第二表面202所反射的光线，所需要的封装材料14未被包覆的发光元件12的部分的第二边缘处的最小厚度hmin(即A、B两点距离)，其计算原理则与图8并无明显差异，故在此不再赘述。
图10为包括图2到4及图9的光学模块的电子装置的示意图。参考图10，电子装置3例如是但不限于智能手机、平板计算机等。电子装置3可包括但不限于图2到4或图9所示的光学模块1、1a、2或1b以及图5到8所示的透光面板20。
参考图8，图8所示的第二介质20可以是但不限于如图10所示的电子装置3的透光面板20，例如：智能手机的显示屏幕的表面玻璃。在本实施例中的光学模块各尺寸采用常见组合为例，第二介质20的第一厚度hg例如是0.7毫米(mm)。未被包围或包覆的发光元件112的部分的第一边缘112a与第二边缘间的第一距离W例如是0.25mm。第一边缘112b与感光区123第三边缘123间的第四距离D例如是1.575mm。发光元件112上表面与第二介质20的第一表面201间的第二距离heg例如是1.4mm。感光区123的上表面与第二介质20的第一表面201之间的第三距离hdg例如是1.4mm。发光元件112的第一厚度h1例如是0.15mm。第一介质(空气)的折射率n1可视为1，且第二介质20的折射率n2可以是但不限于1.5。根据方程式(2)得出sinθ1＝1.5sinθ2的关系式，再根据方程式(3)得到第一入射角θ1约为25.7度且第一折射角θ2约为16.8度。再根据方程式(4)求得发光元件112上表面与点A或点A'间的垂直距离h2＝0.519mm。根据方程式(1)可得到封装材料14或14a在未被包围或包覆的发光元件112的部分的第二边缘112b处的最小厚度hmin＝h1+h2＝0.15+0.519＝0.669mm。
换句话说，在如图8所示的光学模块以及相关环境条件下，发射角或第一入射角θ1的临界值例如是但不限于25.7度。因此可利用不透光的封装材料14阻挡发射角大于或等于25.7的光线，即阻挡发射角大于或等于25.7度的光线到达第二介质20，便可防止串音干扰。
在如图4的本发明另一实施例中，发光元件112可以是垂直腔面发射激光器(VCSEL)，例如由truelight所贩售的商品型号：TSD-8B12-000，其典型光束发散角为16度，最大光束发散角为25度、则所述发光元件112的光发射角将介于8度～12.5度之间，换句话说，在本实施例中，可采用光发射角远小于25.7度的发光元件以期能避免发射角大于或等于25.7度的光线到达第二介质20，同样可达到防止串音干扰的功效、而不必然须采用以封装材料14或14a为不透光材质以阻挡发射角大于或等于25.7的光线的方式，此时封装材料14或14a的材质，可以是透光材质，在本发明另一实施例中(未图示)也可为不透光材质，封装材料14或14a在暴露出发光元件112处附近最小厚度也无须受前述hmin的限制，其分布范围及尺寸只要能达到保护发光元件的功效即可。
根据图1至2的制程，仅需单个模制(molding)步骤，例如使用封装材料14包围或包覆位于载体10上的部分发光元件11、部分光学传感器12以及导线接合13以形成光学模块1。
可通过上述方法设计出封装材料14的最小厚度以防止串音干扰，因此不需要盖体(lid)或其它防止串音干扰的结构，也能达到常规技术中盖体及透光材料所具有的保护发光元件、光学传感器及相关电性连接的效果，不但缩小光学模块体积，同时也降低制造成本。
常规技术的图11A中，透光封装材料15除了需包覆发光元件11及光学传感器12外，还需在发光元件11上方形成透镜部151以增加发光聚光等发光效率。此外，图11A中的光学模块还需进一步包括盖体16以防止由发光元件11所发出的光线直接到达光学传感器12的感光区123、并提供光学元件等的保护。而图11C所示光学模块类似于图11A所示的光学模块，不同之处在于第二介质20在第一表面201上另包括红外线吸收层203。在图11C中，从发光元件11发出的光线相较于图11A所示的光学模块，红外线吸收层203虽可相对大幅地减少串音干扰，仍有约检测到的总功率的4.5％的光线(例如：光线C2')会成为串音干扰信号。另外，虽可使用丝网印刷技术形成红外线吸收层203，然而丝网印刷技术相对来说较容易产生污染以及制程步骤增加、成本提高。图11D为应用本发明图8所示的操作原理的光学模块的操作示意图。图11D所示光学模块与图11A到C所示的光学模块不同之处在于，图11D中标示出未被包围或包覆的发光元件112所发出的光线受到封装材料14的限制。由于封装材料14可阻挡发射角大于或等于25.7度的光线到达第二介质20，因此不需要如图11A到C所示的盖体16即可避免或消除串音干扰、封装材料14同时可以在某种程度上仍提供对其包覆或包围的部分的发光元件、光学传感器以及连接导线或连接点等的保护功能。另外，由于减少盖体16以及透镜部的使用，可减少光学模块的厚度尺寸，在图11D的光学结构中，封装材料14的最小厚度与载体10厚度的总和为0.82mm。也就是说，相较于图11A到C所示的光学模块，图11D的光学模块不但几乎不会有串音干扰产生(几为0％)，而且尺寸也大幅缩小。此外，图11D所示的光学模块不需要盖体、红外线吸收层以及透镜部，成本也相对便宜且较不会产生污染。
惟上述实施例仅为说明本发明的原理及其功效，而非用以限制本发明。因此，所属领域的技术人员对上述实施例进行修改及变化仍不偏离本发明的精神。本发明的权利范围应如随附的权利要求书所列。

Claims (20)

1.一种光学模块，包含：
载体，所述载体具有第一表面；
发光元件，所述发光元件位于所述第一表面上方；
光学传感器，所述光学传感器位于所述第一表面上方；以及
封装材料，所述封装材料位于所述第一表面上方且包覆或至少侧向包围所述发光元件，并暴露出至少一部分的发光元件。
2.根据权利要求1所述的光学模块，其中所述封装材料包覆或至少侧向包围所述光学传感器，并暴露出至少一部分的光学传感器。
3.根据权利要求1所述的光学模块，其中所述封装材料为不透光。
4.根据权利要求3所述的光学模块，进一步包含至少一个导线接合，所述导线接合电性连接所述发光元件与所述载体，其中所述封装材料包覆部分所述发光元件以及所述导线接合。
5.根据权利要求4所述的光学模块，其中所述封装材料进一步包覆部分所述光学传感器。
6.根据权利要求3所述的光学模块，其中所述封装材料具有至少一个倒角。
7.根据权利要求3所述的光学模块，其中所述发光元件为倒装芯片。
8.根据权利要求1所述的光学模块，其中所述发光元件为垂直腔面发射激光器。
9.一种电子装置，包括：
光学模块，包括：
载体，所述载体具有第一表面；
发光元件，所述发光元件位于所述第一表面上方；
光学传感器，所述光学传感器位于所述第一表面上方；以及
封装材料，所述封装材料位于所述第一表面上方且包覆或至少侧向包围所述发光元件，并暴露出至少一部分的发光元件；以及
透光板，所述透光板位于所述光学模块上方。
10.根据权利要求9所述的电子装置，其中所述封装材料包覆或至少侧向包围部分所述光学传感器，并暴露出至少一部分的光学传感器。
11.根据权利要求9所述的电子装置，其中所述被暴露出的发光元件的至少一部分具有第一边缘及第二边缘，所述第二边缘相对于所述第一边缘且所述第二边缘与所述光学传感器间的距离小于所述第一边缘与所述光学传感器间的距离；
其中所述被暴露出的光学传感器的至少一部分进一步包含感光区，所述感光区具有第三边缘及第四边缘，所述第四边缘相对于所述第三边缘且所述第四边缘与所述发光元件间的距离大于所述第三边缘与所述发光元件间的距离；
其中所述透光板具有第三表面及第四表面，且所述第四表面与所述载体的距离大于所述第三表面与所述载体的距离；
其中所述发光模块可发射第一光线以入射角θ1入射所述透光板，所述入射角θ1的最大值为临界值θth，所述临界值θth并同时满足第一方程式：n1sinθth＝n2sinθ2与第二方程式：D＝(heg+hdg)tanθth+2hgtanθ2，n1为可于所述电子装置运作时位于所述第一表面与所述透光板间的第一介质的折射率，n2为所述透光板的折射率，θ2为所述第一光线以所述临界值θth的入射角进入所述透光板而产生的第一折射角，D为所述第一边缘与所述第三边缘的距离，heg为所述发光元件的上表面与所述透光板的第三表面的距离，hdg为所述感光区的上表面与所述透光板的第三表面的距离，hg为所述透光板的第三表面与第四表面之间厚度。
12.根据权利要求11所述的电子装置，其中所述封装材料可阻挡从所述发光元件射出且入射角大于或等于所述临界值θth的第一光线入射所述透光板。
13.根据权利要求11所述的电子装置，其中所述临界值θth为25.7度。
14.根据权利要求9所述的电子装置，其中所述封装材料为不透光。
15.根据权利要求9所述的电子装置，其中所述封装材料为可透光。
16.根据权利要求11所述的电子装置，其中所述发光元件为垂直腔面发射激光器。
17.根据权利要求12所述的电子装置，其中，所述发光元件具有第一厚度h1，所述第一边缘与所述第二边缘相隔第一距离W，且邻接所述第二边缘的封装材料在所述第二边缘处具有第二厚度，所述第二厚度大于最小厚度值hmin，所述最小厚度hmin与所述发光元件的第一厚度h1的差值为h2，h2满足下列方程式：h2＝Wcotθth。
18.一种光学模块的制造方法，包括：
(a)提供载体，所述载体具有第一表面；
(b)将发光元件固定于所述第一表面上方；
(c)将光学传感器固定于所述第一表面上方；以及
(d)使用封装材料包覆或至少侧向包围所述发光元件，并暴露出至少一部分的发光元件。
19.根据权利要求18所述的光学模块制造方法，进一步包括使用所述封装材料包覆或至少侧向包围所述光学传感器，并暴露出至少一部分的光学传感器。
20.根据权利要求18所述的光学模块制造方法，进一步包括使用至少一个导线接合电性连接所述发光元件与所述载体，其中使用所述封装材料包覆所述发光元件时并包覆所述导线接合。
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