CN101932629B - 高粘合剂的聚酰亚胺覆铜层压板及其制备方法 - Google Patents

高粘合剂的聚酰亚胺覆铜层压板及其制备方法 Download PDF

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Publication number
CN101932629B
CN101932629B CN2009801039862A CN200980103986A CN101932629B CN 101932629 B CN101932629 B CN 101932629B CN 2009801039862 A CN2009801039862 A CN 2009801039862A CN 200980103986 A CN200980103986 A CN 200980103986A CN 101932629 B CN101932629 B CN 101932629B
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CN
China
Prior art keywords
polyimide
group
coupling agent
silane coupling
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009801039862A
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English (en)
Chinese (zh)
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CN101932629A (zh
Inventor
B·C·奥曼
武藤勉
陈禹蓁
叶育志
黄胜裕
魏明德
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EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN2009801039862A 2008-02-05 2009-01-30 高粘合剂的聚酰亚胺覆铜层压板及其制备方法 Expired - Fee Related CN101932629B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW97104940A TWI398350B (zh) 2008-02-05 2008-02-05 高黏著性聚醯亞胺銅箔積層板及其製造方法
US12/117,026 2008-05-08
US12/117,026 US20090197104A1 (en) 2008-02-05 2008-05-08 Highly adhesive polyimide copper clad laminate and method of making the same
PCT/US2009/032550 WO2009099918A1 (en) 2008-02-05 2009-01-30 Highly adhesive polyimide copper clad laminate and method of making the same

Publications (2)

Publication Number Publication Date
CN101932629A CN101932629A (zh) 2010-12-29
CN101932629B true CN101932629B (zh) 2013-02-13

Family

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CN2009801039862A Expired - Fee Related CN101932629B (zh) 2008-02-05 2009-01-30 高粘合剂的聚酰亚胺覆铜层压板及其制备方法

Country Status (5)

Country Link
US (2) US20090197104A1 (https=)
JP (1) JP2011514266A (https=)
CN (1) CN101932629B (https=)
TW (1) TWI398350B (https=)
WO (1) WO2009099918A1 (https=)

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WO2011063204A1 (en) * 2009-11-20 2011-05-26 E. I. Du Pont De Nemours And Company Thermally and dimensionally stable polyimide films and methods relating thereto
JP5347980B2 (ja) * 2010-01-14 2013-11-20 住友金属鉱山株式会社 金属化ポリイミドフィルム、及びそれを用いたフレキシブル配線板
CN102855975B (zh) * 2011-06-30 2017-06-06 日立金属株式会社 绝缘电线及使用该绝缘电线的线圈
CN103050616B (zh) * 2011-10-13 2015-10-28 昆山雅森电子材料科技有限公司 复合式导热铜箔基板
CN102532543B (zh) * 2011-12-20 2014-01-29 中国科学院化学研究所 共聚型可热封接聚酰亚胺及其制备方法与应用
JP2013131424A (ja) * 2011-12-22 2013-07-04 Hitachi Cable Ltd 絶縁電線及びそれを用いたコイル
JP6024738B2 (ja) * 2012-02-23 2016-11-16 日立化成デュポンマイクロシステムズ株式会社 ディスプレイ基板の製造方法
JP5362921B1 (ja) * 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
KR101441344B1 (ko) * 2013-01-15 2014-09-18 애경유화주식회사 고투과 고선택성 공중합체 폴리이미드 소재 및 그의 합성 방법
CN104968709B (zh) * 2013-02-07 2017-08-11 株式会社钟化 烷氧基硅烷改性聚酰胺酸溶液、使用其的层叠体及柔性器件、以及层叠体的制造方法
CN103680700B (zh) * 2013-12-18 2019-05-24 南昌大学 含聚酰亚胺改性的硅烷偶联剂涂层的漆包线
KR102294065B1 (ko) * 2014-08-12 2021-08-26 가부시키가이샤 가네카 알콕시실란 변성 폴리아미드산 용액, 그것을 사용한 적층체 및 플렉시블 디바이스, 그리고 적층체의 제조 방법
CN105238338A (zh) * 2015-11-12 2016-01-13 烟台德邦科技有限公司 一种晶圆减薄高温临时粘结剂及其制备方法
CN106085338B (zh) * 2016-06-20 2019-07-12 新黎明科技股份有限公司 一种玻璃灯罩修补液
RU2019107357A (ru) * 2016-08-16 2020-09-22 Коммонвелт Сайентифик Энд Индастриал Рисерч Организейшн Химический состав для закрепления тонких частиц и контроля воды
CN107134542A (zh) * 2017-04-10 2017-09-05 珠海亚泰电子科技有限公司 透明单面覆铜板制作工艺
KR101959807B1 (ko) * 2018-08-22 2019-03-20 에스케이씨코오롱피아이 주식회사 방향족 카르복실산을 포함하는 도체 피복용 폴리이미드 바니쉬 및 이의 제조방법
CN109852330B (zh) * 2018-12-21 2022-01-11 东华大学 一种3,5-二氨基苯甲酸型含硅胶粘剂及其制备方法
CN110572933A (zh) * 2019-08-23 2019-12-13 李龙凯 一种高频线路板新型材料层结构的制备方法及其制品
CN110868799A (zh) * 2019-11-15 2020-03-06 江苏上达电子有限公司 一种透明cof设计方法
CN111040156B (zh) * 2019-11-28 2022-05-31 李南文 一种耐溶剂且高尺寸稳定性的交联型聚酰亚胺薄膜
US12031013B2 (en) 2021-07-19 2024-07-09 Momentive Performance Materials Inc. Silane coupling agents to improve resin adhesion
KR102564595B1 (ko) * 2021-07-20 2023-08-09 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 피복물
CN113619224B (zh) * 2021-07-23 2024-02-02 中山新高电子材料股份有限公司 一种低吸水率氟材柔性覆铜板及其制备方法
CN116332526A (zh) * 2023-01-16 2023-06-27 江西沃格光电股份有限公司 柔性盖板及其制备方法与应用

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TW200743658A (en) * 2006-05-25 2007-12-01 Ind Tech Res Inst Thermoplastic polyimide composition and method of making double-sided flexible copper clad laminate using the same

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TW200743658A (en) * 2006-05-25 2007-12-01 Ind Tech Res Inst Thermoplastic polyimide composition and method of making double-sided flexible copper clad laminate using the same

Also Published As

Publication number Publication date
US20100323161A1 (en) 2010-12-23
TWI398350B (zh) 2013-06-11
TW200934654A (en) 2009-08-16
JP2011514266A (ja) 2011-05-06
US20090197104A1 (en) 2009-08-06
WO2009099918A1 (en) 2009-08-13
CN101932629A (zh) 2010-12-29

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