CN101904060A - 电子接口装置及其制造方法和制造系统 - Google Patents

电子接口装置及其制造方法和制造系统 Download PDF

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CN101904060A
CN101904060A CN2008801152733A CN200880115273A CN101904060A CN 101904060 A CN101904060 A CN 101904060A CN 2008801152733 A CN2008801152733 A CN 2008801152733A CN 200880115273 A CN200880115273 A CN 200880115273A CN 101904060 A CN101904060 A CN 101904060A
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CN101904060B (zh
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乌迪德·巴尚
盖伊·沙弗兰
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Linxens Holding SAS
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Abstract

一种电子接口卡的制造方法，包括：在基板层中限定一对孔；使天线与基板层关联，从而使天线的相对末端终止于该孔处；在每个孔中放置导体；使天线连接到导体；在基板层中形成凹陷部；使连续连接导线附着到多个芯片模块；使连续连接导线附着到相应的多个基板层上的多个导体；切割连续连接导线，以便于保持该导线的将每个芯片模块连接到相应导体对的部分；以及，将芯片模块密封在凹陷部中。

Description

电子接口装置及其制造方法和制造系统
技术领域
本发明涉及电子接口卡，其通常还被称为“智能卡”，更具体地，本发明涉及具有接触和/或非接触功能的电子接口卡。
背景技术
下述美国专利被认为代表现有技术：
7,278,580；7,271,039；7,269,021；7,243,840；7,240,847；7,204,427和6,881,605。
发明内容
本发明寻求提供改进的电子接口卡以及其制造方法。
因此，根据本发明的优选实施例，提供了一种电子接口卡的制造方法，包括：在基板层中限定一对孔；使天线与基板层关联，从而使天线的相对末端终止于该孔处；在每个孔中放置导体；使天线连接到导体；在基板层中形成凹陷部；使连续连接导线附着到多个芯片模块；使连续连接导线附着到相应的多个基板层上的多个导体；切割连续连接导线，以便于保持该导线的将每个芯片模块连接到相应导体对的部分；以及，将芯片模块密封在凹陷部中。
优选地，该方法还包括：使基板层与至少一个顶层层叠在一起，以及，在叠置在基板层中的凹陷部之上的顶层中形成凹陷部。此外，顶层包括第一顶基板层和第二顶基板层。
根据本发明的优选实施例，密封包括：在芯片模块的底面上放置粘合剂，以及，将芯片模块插入凹陷部中，从而使底面与凹陷的表面接合。
优选地，该方法还包括使导线在芯片模块下面折叠。
根据本发明的优选实施例，该方法是自动化的，以及，在使连续连接导线附着到多个导体之前，使芯片模块中相邻的芯片模块沿连接导线隔开预定间距，以及，使卡中的相邻的卡的导体相互隔开预定间距。此外或可替选地，使连续连接导线附着到导体包括激光接合。可替选地或此外，使连续连接导线附着到芯片模块包括焊接。
优选地，导线的长度基本上大于其在电子接口卡中的各相对末端之间的距离。
根据本发明的另一优选实施例，还提供了一种电子接口卡的制造方法，包括：形成具有至少一个层的基板；在至少一个层中形成天线；通过如下方式连接芯片模块和天线之间的导线：使连续连接导线附着到多个芯片模块；使连续连接导线附着到多个天线；以及，切割连续连接导线，以便于保持该导线的将每个芯片模块连接到相应天线的部分；以及，将芯片模块安装在基板上。
优选地，在使连续连接导线附着到多个天线之前，使芯片模块中的相邻的芯片模块沿连接导线隔开预定间距，以及，使基板中的相邻的基板的天线相互隔开预定间距。
根据本发明的优选实施例，导线的长度基本上大于其在电子接口卡中的各相对末端之间的距离。此外或可替选地，安装包括使导线在芯片模块下面折叠。
优选地，该方法是自动化的。
根据本发明的又一优选实施例，进一步提供了一种用于基于电子接口组件制造电子接口卡的系统，该电子接口组件包括：具有至少一个层的基板、位于该至少一个层中的至少两个导体和与基板关联并电耦合到至少两个导体的导线天线，该系统包括：凹陷部形成器，操作用于形成基板层中的凹陷部；导线附着功能，操作用于：使连续连接导线附着到多个芯片模块；使连续连接导线附着到相应的多个基板层上的多个导体；以及，切割连续连接导线，以便于保持该导线的将每个芯片模块连接到相应导体对的部分；以及，密封器，操作用于将芯片模块密封在凹陷部中。
优选地，该系统还包括：层合器，操作用于使基板层与顶层和底层层叠在一起。
根据本发明的再一优选实施例，更进一步地提供了一种电子接口组件的制造方法，包括：提供具有至少一个基板层的基板；使天线与该至少一个基板层关联；将天线连接到与该至少一个基板层关联的导体；通过如下方式使芯片模块附着到导体：使连续连接导线附着到多个芯片模块；使连续连接导线附着到相应的多个基板层上的多个导体；以及，切割连续连接导线，以便于保持该导线的将每个芯片模块连接到相应的导体对的部分；以及，将芯片模块密封至基板。
优选地，该方法还包括：在基板层中限定一对孔，从而使天线的相对末端终止于该孔处，以及，在连接之前在每个孔中放置导体。此外或可替选地，该方法还包括使基板层与顶层和底层层叠在一起。
附图说明
通过结合附图参照以下详细描述，将更全面地理解和认识本发明，在附图中：
图1是根据本发明的优选实施例构造和操作的、具有接触和非接触功能的电子接口卡的简化示意图和剖面图；
图2是图1的电子接口卡的制造中的初始步骤的简化示意图；
图3A和图3B分别是图1的电子接口卡的制造中的另一步骤的简化示意图和剖面图；
图4A和图4B分别是图1的电子接口卡的制造中的另一步骤的简化示意图和剖面图；
图5A和图5B分别是图1的电子接口卡的制造中的另一步骤的简化示意图和剖面图；
图6A和图6B分别是图1的电子接口卡的制造中的另一步骤的简化示意图和剖面图；
图7A和图7B分别是图1的电子接口卡的制造中的另一步骤的简化示意图和剖面图；
图8A和图8B分别是图1的电子接口卡的制造中的另一步骤的简化示意图和剖面图；
图9是图1的电子接口卡的制造中的另一步骤的简化示意图；
图10是图1的电子接口卡的制造中的另一步骤的简化示意图；
图11是图1的电子接口卡的制造中的另一步骤的简化示意图；以及
图12A和图12B分别是图1的电子接口卡的制造中的最终步骤的简化示意图和剖面图。
具体实施方式
现在参照图1，其示出了根据本发明的优选实施例构造和操作的、具有接触和/或非接触功能的电子接口卡100。如图1中所见，电子接口卡100优选地包括多层基板，该多层基板包括顶和底保护层102和104，这些保护层典型地由聚氯乙烯(PVC)形成，每个保护层典型地具有0.05mm的厚度。可替选地，保护层102和104可以由诸如聚对苯二甲酸乙二酯醇(PET-G)、聚对苯二甲酸乙二酯薄膜(PET-F)、聚碳酸酯或丙烯腈-丁二烯-苯乙烯共聚物(ABS)的任何其他适当的材料形成。
在保护层102和104的内侧优选地安置原图层106和108，这些原图层典型地由PVC形成，每个原图层典型地具有0.15mm的厚度，典型地承载通过各保护层102和104可看到的原图。可替选地，原图层106和108可以由诸如
Figure GPA00001135081900042
PET-G、PET-F、聚碳酸酯或ABS的任何适当的材料形成。可替选地，原图层106和108可以被消除。
在原图层106和108内侧优选地提供包括导线天线112的嵌体部110，该导线天线112优选地具有0.1mm的导线直径，嵌入在第一嵌体层114中，该第一嵌体层114典型地由PVC形成，优选地具有0.15mm的厚度。嵌体部110还包括第二和第三嵌体层116和118，这些嵌体层也优选地由PVC形成，分别具有0.1mm和0.15mm的厚度。可替选地，第一、第二和第三嵌体层114、116和118可以由诸如
Figure GPA00001135081900043
PET-G、PET-F、聚碳酸酯或ABS的任何其他适当的材料形成。
芯片模块120优选地被安装在电子接口卡100中形成的凹陷部122中。芯片模块优选地包括具有焊盘126和接触部的阵列128的已封装的智能卡芯片124，接触部优选地具有0.06mm的厚度。可替选地，接触部128可以被消除并且智能卡芯片124可以提供非接触功能。
芯片模块120和嵌入的天线112之间的电连接由导线130提供，该导线130优选地具有0.1mm的厚度，优选地在其第一末端处被焊接到焊盘126，并且在其相对末端处被激光接合到金属元件132，该金属元件132接合到导线天线112的各个末端。应认识到，在适当的情况中，可以可互换地使用激光接合和传统焊接。本发明特别的特征在于，焊盘126和相应的金属元件132之间的导线130的长度充分地长于组件卡中的焊盘126和金属元件132之间的距离。该特征提供了增强的可靠性。
被安置在接触部的阵列128的底面的外围的热熔粘合剂的层134，通过接合层106的相应的凹陷的周围衬面136，将芯片模块120保持在凹陷部122中。
现在参照图2，其是图1的电子接口卡的制造中的初始步骤的简化示意图，其中层114被冲孔以限定一对孔150。如图3A和3B中所见，如通过已知的嵌入技术，典型地使用来自PCK Technology，Inc.(艾斯利普，纽约，美国)的市售的超声头，使天线112与层114关联。如图3A和3B中所见，天线112的相对末端152终止于孔150处。
可替选地，天线112可以是通过适当印刷技术在基板114上形成的印刷天线，或者可以是通过任何适当的附着方法附着到基板114的天线。
现在转向图4A和4B，可以看到，在孔150的相应边缘156处粘合垫154被安装到层114上。如图5A和5B中所见，金属元件132被放置在孔150中，并且通过粘合垫154保持在孔中适当的位置。优选地，天线112的末端152通过热压接合或任何其他适当的技术连接到金属元件132。在此连接步骤之后，不再需要粘合垫154将金属元件132保持在适当位置，并且移除垫154。应认识到，可替选地，不需要移除粘合垫154。
在此阶段，如图6A和6B中所见，层116和118被提供到层114的底面上，并且层102、104、106和108均与其层叠在一起，所得到的层叠结构如图7A和7B中所示。
现在转向图8A和图8B，可以看到，在层102、106和114中形成凹陷部122，并且优选地通过铣削使金属元件132和层106的凹陷的周围衬面136暴露。应认识到，可替选地，该凹陷部可以在卡的相反表面上形成。
现在参照图9，其示出了图8B的部分组装的卡，这些卡按相邻的卡的金属元件132之间的精确间距(这里被标为“L”)被配置和保持为沿传送带160的并排隔开的配置。该精确间距优选地通过传送带160上形成的直立元件162来维持。传送带160在箭头I指示的方向上使图8B的部分组装的卡移位。
现在参照图10，其示出了芯片模块120(图1)，这些芯片模块按精确间距(其之间的间距为“L”)被配置为沿传送带170的并排隔开的配置，该间距与相邻的卡的金属元件132之间的间距“L”(图9)相同。该精确间距可以通过例如传送带170上形成的直立元件171来维持。
如图10中所见，使一对连续导线172从各自的线轴174在心轴176上展开，以便于在芯片模块120的各个焊盘126上延伸，这些导线接近或接触焊盘126，如图10中的放大图A和剖面A-A中清楚地示出的。优选地，导线172沿其各自的长度维持于张紧状态。
例如，通过一对加热的焊接销178(其分别使导线172和焊盘126接合)，将导线172焊接到焊盘126。应认识到，在适当的情况中，可以可互换地使用激光接合和传统焊接。优选地，在此阶段，如放大图B和剖面图B-B中所见，导线172沿其各自的长度方向以及向下对靠焊盘126都维持张紧状态，以便于在焊接销178使其中的焊料熔化时至少部分地嵌入焊盘126，并且在焊接销的接合之后保持在嵌入位置，如放大图C和剖面图C-C中所见。在此点，在焊盘126中的焊料凝固之后，芯片模块120由导线172支撑并且在箭头II指示的方向上移位。
现在参照图11，其示出了将如图10中所示的所制备的已安装导线的芯片模块组装到如图9中所示的所配置的部分组装的卡上。应认识到，图9的部分组装的卡以及导线172所支撑的芯片模块120的移位方向I和II优选地是相同的。在连续操作期间，传输带160在方向I上的移动操作(使部分组装的卡100接合到如下文描述的焊接导线172)用于张紧导线172。
如图11的放大图A和剖面图A-A中所见，通过一对加热的焊接销180将芯片模块120前方的导线172焊接到部分组装的卡100的金属元件132。应认识到，在适当的情况中，可以可互换地使用激光接合和传统焊接。在部分组装的卡100的金属元件132和芯片模块120的各个焊盘126之间延伸的导线172的长度由图11中的“F”指示。随后通过如放大图B中所见的紧邻焊盘126后方的切割头182以及如放大图C中所见的紧邻金属元件132前方的切割头184，切割导线172，因此留下具有长度F的导线130(图1)，其使每个芯片模块120的各个焊盘126与每个部分组装的卡的相应的金属元件132互连。如附图标记186所指示的，导线172的剩余长度被丢弃。随后从传送带160卸下如放大图D中所见的均连接到芯片模块120的部分组装的卡。
现在转向图12A和12B，可以看到，在使导线130附着到芯片模块120的相应焊盘126，并且将热熔粘合剂134放置在阵列128的底面的外围之后，将芯片模块120插入到凹陷部122中，从而使阵列128的周围与层106的凹陷的周围衬面136密封地接合。如图1中所见，该插入方法使导线130在芯片模块120下面折叠。
应认识到，上文针对图1至12B描述的方法优选地是高度自动化的。
应认识到，尽管此处描述的图示实施例包括基板层102、104、106、108、114、116和118，但是电子接口卡100的多层基板也可以包括任何适当数量的具有任何适当厚度的层。
应认识到，电子接口卡100的多层基板的任何或所有层可以由上文描述的材料中的任何材料形成或者由诸如复合材料的任何其他适当的材料形成。此外，电子接口卡100的多层基板的各层不需要由同一材料形成，并且每个层可以由不同的材料形成。
本领域的技术人员应认识到，本发明的范围不限于上文具体示出和描述的内容。相反，本发明应包括本领域的技术人员在阅读以上描述和附图时将想到的并且并非是现有技术的、上述各种特征的组合和子组合以及其修改和变化。

Claims (19)

1.一种电子接口卡的制造方法，包括：
在基板层中限定一对孔；
使天线与所述基板层关联，从而使所述天线的相对末端终止于所述孔处；
在每个所述孔中放置导体；
使所述天线连接到所述导体；
在所述基板层中形成凹陷部；
使连续连接导线附着到多个芯片模块；
使所述连续连接导线附着到相应的多个所述基板层上的多个导体；
切割所述连续连接导线，以便于保持所述连续连接导线的将每个芯片模块连接到相应导体对的部分；以及
将所述芯片模块密封在所述凹陷部中。
2.如权利要求1所述的方法，还包括：
使所述基板层与至少一个顶层层叠在一起；以及
在叠置在所述基板层中的所述凹陷部之上的所述顶层中形成凹陷部。
3.如权利要求2所述的方法，其中，所述顶层包括第一顶基板层和第二顶基板层。
4.如权利要求3所述的方法，其中，所述密封包括：
在所述芯片模块的底面上放置粘合剂；以及
将所述芯片模块插入所述凹陷部中，从而使所述底面与所述凹陷的表面接合。
5.如权利要求1至4中任一权利要求所述的方法，还包括使所述导线在所述芯片模块下面折叠。
6.如权利要求1至5中任一权利要求所述的方法，其中，所述方法是自动化的，以及其中，在所述的使所述连续连接导线附着到所述多个导体之前，使所述芯片模块中的相邻的芯片模块沿所述连接导线隔开预定间距，以及使所述卡中的相邻的卡的所述导体相互隔开所述预定间距。
7.如权利要求1至6中任一权利要求所述的方法，其中，所述的使所述连续连接导线附着到所述导体包括激光接合。
8.如权利要求1至7中任一权利要求所述的方法，其中，所述的使所述连续连接导线附着到芯片模块包括焊接。
9.如权利要求1至8中任一权利要求所述的电子接口卡的制造方法，其中，所述导线的长度充分地大于其在所述电子接口卡中的各相对末端之间的距离。
10.一种电子接口卡的制造方法，包括：
形成具有至少一个层的基板；
在所述至少一个层中形成天线；
通过如下方式连接芯片模块和所述天线之间的导线：
使连续连接导线附着到多个芯片模块；
使所述连续连接导线附着到多个所述天线；以及
切割所述连续连接导线，以便于保持所述连续连接导线的将每个芯片模块连接到相应天线的部分；以及
将所述芯片模块安装在所述基板上。
11.如权利要求10所述的电子接口卡的制造方法，其中，在所述的使所述连续连接导线附着到所述多个天线之前，使所述芯片模块中的相邻的芯片模块沿所述连接导线隔开预定间距，以及使所述基板中的相邻的基板的所述天线相互隔开所述预定间距。
12.如权利要求10至11中任一权利要求所述的电子接口卡的制造方法，其中，所述导线的长度充分地大于其在所述电子接口卡中的各相对末端之间的距离。
13.如权利要求10至12中任一权利要求所述的方法，其中，所述安装包括使所述导线在所述芯片模块下面折叠。
14.如权利要求10至13中任一权利要求所述的方法，其中，所述该方法是自动化的。
15.一种用于基于电子接口组件制造电子接口卡的系统，所述电子接口组件包括：具有至少一个层的基板、位于所述至少一个层中的至少两个导体和与所述基板关联并电耦合到所述至少两个导体的导线天线，所述系统包括：
凹陷部形成器，操作用于形成所述基板层中的凹陷部；
导线附着功能，操作用于：
使连续连接导线附着到多个芯片模块；
使所述连续连接导线附着到相应的多个所述基板层上的多个导体；以及
切割所述连续连接导线，以便于保持所述连续连接导线的将每个芯片模块连接到相应导体对的部分；以及
密封器，操作用于将所述芯片模块密封在所述凹陷部中。
16.如权利要求15所述的系统，还包括：层合器，操作用于使所述基板层与顶层和底层层叠在一起。
17.一种电子接口组件的制造方法，包括：
提供具有至少一个基板层的基板；
使天线与所述至少一个基板层关联；
将所述天线连接到与所述至少一个基板层关联的导体；
通过如下方式使芯片模块附着到所述导体：
使连续连接导线附着到多个芯片模块；
使所述连续连接导线附着到相应的多个所述基板层上的多个所述导体；以及
切割所述连续连接导线，以便于保持所述连续连接导线的将每个芯片模块连接到相应的导体对的部分；以及
将所述芯片模块密封至所述基板。
18.如权利要求17所述的电子接口组件的制造方法，还包括：
在基板层中限定一对孔，从而使所述天线的相对末端终止于所述孔处；以及
在所述连接之前在每个所述孔中放置所述导体。
19.如权利要求17或18所述的电子接口组件的制造方法，还包括使所述基板层与顶层和底层层叠在一起。
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