AR066272A1 - Aparato de interfaz electronica y su metodo y sistema de fabricacion - Google Patents
Aparato de interfaz electronica y su metodo y sistema de fabricacionInfo
- Publication number
- AR066272A1 AR066272A1 ARP080101717A ARP080101717A AR066272A1 AR 066272 A1 AR066272 A1 AR 066272A1 AR P080101717 A ARP080101717 A AR P080101717A AR P080101717 A ARP080101717 A AR P080101717A AR 066272 A1 AR066272 A1 AR 066272A1
- Authority
- AR
- Argentina
- Prior art keywords
- substrate layer
- electronic interface
- antenna
- manufacturing system
- layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/5317—Laminated device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
Abstract
Un método de fabricacion de una tarjeta de interfaz electronica que incluye definir un par de aperturas en la capa de substrato, asociar una antena con la capa de substrato tal que los extremos opuestos de la antena terminen en las aperturas, ubicarun elemento metálico en cada apertura, conectar los extremos de la antena a los elementos metálicos, laminar la capa de substrato con una capa superior y una capa inferior, formar un descanso en la capa superior y la capa de substrato, amarrarextremos de cables de conexion a los elementos metálicos, amarrar los extremos opuestos de los cables de conexion a un modulo de circuito integrado y sellar el modulo de circuito integrado en el descanso.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK07104374A HK1109708A2 (en) | 2007-04-24 | 2007-04-24 | Interface card and apparatus and process for the formation thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
AR066272A1 true AR066272A1 (es) | 2009-08-05 |
Family
ID=41129289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ARP080101717A AR066272A1 (es) | 2007-04-24 | 2008-04-23 | Aparato de interfaz electronica y su metodo y sistema de fabricacion |
Country Status (16)
Country | Link |
---|---|
US (4) | US9038913B2 (es) |
EP (2) | EP2143046B1 (es) |
JP (1) | JP5249341B2 (es) |
KR (2) | KR101285907B1 (es) |
CN (3) | CN101689249B (es) |
AR (1) | AR066272A1 (es) |
AT (1) | ATE540378T1 (es) |
BR (3) | BRPI0721672B1 (es) |
CL (1) | CL2008000113A1 (es) |
ES (1) | ES2377220T3 (es) |
HK (1) | HK1109708A2 (es) |
PL (1) | PL2143046T3 (es) |
PT (1) | PT2143046E (es) |
RU (1) | RU2461105C2 (es) |
TW (3) | TWI452523B (es) |
WO (2) | WO2008129526A2 (es) |
Families Citing this family (37)
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US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
EP2256672B1 (en) * | 2008-02-22 | 2016-04-13 | Toppan Printing Co., Ltd. | Transponder and book form |
FR2942561B1 (fr) * | 2009-02-20 | 2011-04-22 | Oberthur Technologies | Support pour carte a microcircuit, carte a microcircuit comprenant un tel support. |
FR2947392B1 (fr) | 2009-06-29 | 2019-05-10 | Idemia France | Procede de raccordement electrique de deux organes entre eux |
US8186603B2 (en) | 2009-09-22 | 2012-05-29 | On Track Innovation Ltd. | Contactless smart sticker |
US8195236B2 (en) | 2010-06-16 | 2012-06-05 | On Track Innovations Ltd. | Retrofit contactless smart SIM functionality in mobile communicators |
FR2963139B1 (fr) | 2010-07-20 | 2012-09-14 | Oberthur Technologies | Dispositif a microcircuit comprenant des moyens d'amplification du gain d'une antenne |
US8424757B2 (en) | 2010-12-06 | 2013-04-23 | On Track Innovations Ltd. | Contactless smart SIM functionality retrofit for mobile communication device |
DE102011114635A1 (de) * | 2011-10-04 | 2013-04-04 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
CN102426659B (zh) * | 2011-11-03 | 2014-12-10 | 北京德鑫泉物联网科技股份有限公司 | 同时具有两种读写模式基体的智能卡及其生产方法 |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
FR2986372B1 (fr) * | 2012-01-31 | 2014-02-28 | Commissariat Energie Atomique | Procede d'assemblage d'un element a puce micro-electronique sur un element filaire, installation permettant de realiser l'assemblage |
US9178265B2 (en) * | 2012-02-09 | 2015-11-03 | Hid Global Gmbh | Anti-crack means for wire antenna in transponder |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
CN103632186B (zh) * | 2012-08-23 | 2017-01-25 | 东莞市锐祥智能卡科技有限公司 | 双界面卡芯片碰焊及封装的方法及其装置 |
EP2711874B1 (en) | 2012-09-21 | 2015-04-15 | Oberthur Technologies | A chip module support and a method of incorporating such a chip module support in a data carrier card |
WO2014082401A1 (zh) * | 2012-11-30 | 2014-06-05 | Xue Yuan | 双界面智能卡及其制造方法 |
HK1193540A2 (en) * | 2013-07-26 | 2014-09-19 | Cardmatix Co Ltd | A method of manufacturing a smart card |
KR101762778B1 (ko) | 2014-03-04 | 2017-07-28 | 엘지이노텍 주식회사 | 무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치 |
FR3023419B1 (fr) * | 2014-07-01 | 2016-07-15 | Oberthur Technologies | Support d'antenne destine a etre integre dans un document electronique |
US10318852B2 (en) * | 2014-11-10 | 2019-06-11 | Golden Spring Internet Of Things Inc. | Smart card simultaneously having two read/write modes and method for producing same |
KR102251694B1 (ko) * | 2015-06-23 | 2021-05-13 | 랑셍 홀딩 | 정보의 무접촉 전송을 위한 적어도 하나의 인터페이스를 가진 스마트 카드 블랭크 |
US10622700B2 (en) * | 2016-05-18 | 2020-04-14 | X-Celeprint Limited | Antenna with micro-transfer-printed circuit element |
US10033901B1 (en) * | 2017-06-27 | 2018-07-24 | Xerox Corporation | System and method for using a mobile camera as a copier |
TWI634902B (zh) * | 2017-10-28 | 2018-09-11 | 醫療財團法人徐元智先生醫藥基金會亞東紀念醫院 | Use of glucosamine peptide compounds for the treatment of abnormal liver metabolism |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
FR3079645B1 (fr) * | 2018-04-03 | 2021-09-24 | Idemia France | Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay |
US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
JP2021144984A (ja) * | 2020-03-10 | 2021-09-24 | 富士電機株式会社 | 製造方法、製造装置、治具アセンブリ、半導体モジュールおよび車両 |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
CN115319416A (zh) * | 2022-08-19 | 2022-11-11 | 中国电子科技集团公司第三十八研究所 | 一种高效率毫米波多层天线低温钎焊方法 |
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FR2826153B1 (fr) * | 2001-06-14 | 2004-05-28 | A S K | Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact |
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-
2007
- 2007-04-24 HK HK07104374A patent/HK1109708A2/xx not_active IP Right Cessation
- 2007-11-08 US US12/596,893 patent/US9038913B2/en not_active Expired - Fee Related
- 2007-11-08 PT PT07827351T patent/PT2143046E/pt unknown
- 2007-11-08 ES ES07827351T patent/ES2377220T3/es active Active
- 2007-11-08 PL PL07827351T patent/PL2143046T3/pl unknown
- 2007-11-08 KR KR1020097024350A patent/KR101285907B1/ko active IP Right Grant
- 2007-11-08 CN CN2007800534702A patent/CN101689249B/zh active Active
- 2007-11-08 EP EP07827351A patent/EP2143046B1/en not_active Not-in-force
- 2007-11-08 BR BRPI0721672A patent/BRPI0721672B1/pt not_active IP Right Cessation
- 2007-11-08 AT AT07827351T patent/ATE540378T1/de active
- 2007-11-08 WO PCT/IL2007/001378 patent/WO2008129526A2/en active Application Filing
- 2007-11-09 TW TW096142616A patent/TWI452523B/zh not_active IP Right Cessation
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2008
- 2008-01-15 CL CL200800113A patent/CL2008000113A1/es unknown
- 2008-04-17 KR KR1020097024341A patent/KR20100017257A/ko not_active Application Discontinuation
- 2008-04-17 CN CN200880021562.7A patent/CN101816066B/zh not_active Expired - Fee Related
- 2008-04-17 WO PCT/IL2008/000538 patent/WO2008129547A2/en active Application Filing
- 2008-04-17 BR BRPI0811086-7A2A patent/BRPI0811086A2/pt not_active Application Discontinuation
- 2008-04-18 TW TW097114420A patent/TWI426836B/zh not_active IP Right Cessation
- 2008-04-23 AR ARP080101717A patent/AR066272A1/es not_active Application Discontinuation
- 2008-10-23 EP EP08847977A patent/EP2212975B1/en active Active
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- 2008-10-23 CN CN2008801152733A patent/CN101904060B/zh active Active
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