FR3079645B1 - Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay - Google Patents
Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay Download PDFInfo
- Publication number
- FR3079645B1 FR3079645B1 FR1852867A FR1852867A FR3079645B1 FR 3079645 B1 FR3079645 B1 FR 3079645B1 FR 1852867 A FR1852867 A FR 1852867A FR 1852867 A FR1852867 A FR 1852867A FR 3079645 B1 FR3079645 B1 FR 3079645B1
- Authority
- FR
- France
- Prior art keywords
- inlay
- electronic document
- electrical contact
- established via
- contact range
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 101100060007 Caenorhabditis elegans mig-22 gene Proteins 0.000 abstract 3
- 101150104494 CAV1 gene Proteins 0.000 abstract 2
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
La présente demande concerne un document électronique dont un corps comporte un inlay (Yc, Yd), dont une partie forme un lamage (Cav1) d'une cavité, et qui comporte une plage de connexion (PFc, PCc, PFc1, PFc2, PCc1, PCc2) réalisée sur la partie formant le lamage (Cav1), et dont un module comporte un circuit électrique qui comporte d'une part un premier sous-circuit configuré pour connecter électriquement un port (IO) d'une puce (MP) à la plage de connexion (PFc, PCc, PFc1, PFc2, PCc1, PCc2) et d'autre part un deuxième sous-circuit configuré pour connecter électriquement la plage de connexion (PFc, PCc, PFc1, PFc2, PCc1, PCc2) à une plage externe de contact électrique (C7) d'un support (S) du module (Modc, Modd).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1852867A FR3079645B1 (fr) | 2018-04-03 | 2018-04-03 | Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay |
US16/373,077 US10719754B2 (en) | 2018-04-03 | 2019-04-02 | Electronic document having an electrical connection between a chip port and an external electrical connection land that is established via an inlay |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1852867 | 2018-04-03 | ||
FR1852867A FR3079645B1 (fr) | 2018-04-03 | 2018-04-03 | Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3079645A1 FR3079645A1 (fr) | 2019-10-04 |
FR3079645B1 true FR3079645B1 (fr) | 2021-09-24 |
Family
ID=63407296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1852867A Active FR3079645B1 (fr) | 2018-04-03 | 2018-04-03 | Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay |
Country Status (2)
Country | Link |
---|---|
US (1) | US10719754B2 (fr) |
FR (1) | FR3079645B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
FR3136871A1 (fr) * | 2022-06-16 | 2023-12-22 | Idemia France | Inlay pour document électronique, procédé de fabrication d’un document électronique comportant un tel inlay, et document électronique obtenu |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
FR2857483B1 (fr) | 2003-07-11 | 2005-10-07 | Oberthur Card Syst Sa | Carte a puce anti-intrusion |
FR2872945B1 (fr) * | 2004-07-07 | 2007-01-12 | Oberthur Card Syst Sa | Entite electronique comportant une antenne, inlay et module pour une telle entite |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
FR2937448B1 (fr) * | 2008-10-17 | 2012-11-16 | Oberthur Technologies | Module, carte a microcircuit et procede de fabrication correspondant. |
CN102426659B (zh) * | 2011-11-03 | 2014-12-10 | 北京德鑫泉物联网科技股份有限公司 | 同时具有两种读写模式基体的智能卡及其生产方法 |
DE102012211546B4 (de) * | 2012-07-03 | 2017-02-16 | Morpho Cards Gmbh | Chipkarte mit bei Raumtemperatur pastenförmiger oder flüssiger Kontaktierung |
EP2722795A1 (fr) * | 2012-10-19 | 2014-04-23 | Gemalto SA | Procédé de fabrication d'un dispositif multi-composants comprenant un module électrique et/ou électronique |
US10318852B2 (en) * | 2014-11-10 | 2019-06-11 | Golden Spring Internet Of Things Inc. | Smart card simultaneously having two read/write modes and method for producing same |
EP3151167B1 (fr) * | 2015-09-30 | 2020-05-20 | Nxp B.V. | Module de carte à circuit intégré double interface |
-
2018
- 2018-04-03 FR FR1852867A patent/FR3079645B1/fr active Active
-
2019
- 2019-04-02 US US16/373,077 patent/US10719754B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20190303738A1 (en) | 2019-10-03 |
FR3079645A1 (fr) | 2019-10-04 |
US10719754B2 (en) | 2020-07-21 |
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