CN101884019B - 基于接触线移动跟踪控制的高吞吐量刻印 - Google Patents

基于接触线移动跟踪控制的高吞吐量刻印 Download PDF

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Publication number
CN101884019B
CN101884019B CN2008801196572A CN200880119657A CN101884019B CN 101884019 B CN101884019 B CN 101884019B CN 2008801196572 A CN2008801196572 A CN 2008801196572A CN 200880119657 A CN200880119657 A CN 200880119657A CN 101884019 B CN101884019 B CN 101884019B
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China
Prior art keywords
template
substrate
power
pressure
chuck
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English (en)
Chinese (zh)
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CN101884019A (zh
Inventor
吕晓明
P·D·苏马克
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Canon Nanotechnologies Inc
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Molecular Imprints Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5808—Measuring, controlling or regulating pressure or compressing force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • B29C2043/5841—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating for accommodating variation in mould spacing or cavity volume during moulding

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
CN2008801196572A 2007-12-04 2008-12-04 基于接触线移动跟踪控制的高吞吐量刻印 Active CN101884019B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US529707P 2007-12-04 2007-12-04
US61/005,297 2007-12-04
US12/327,618 2008-12-03
US12/327,618 US8945444B2 (en) 2007-12-04 2008-12-03 High throughput imprint based on contact line motion tracking control
PCT/US2008/013362 WO2009073200A1 (en) 2007-12-04 2008-12-04 High throughput imprint based on contact line motion tracking control

Publications (2)

Publication Number Publication Date
CN101884019A CN101884019A (zh) 2010-11-10
CN101884019B true CN101884019B (zh) 2012-12-26

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CN2008801196572A Active CN101884019B (zh) 2007-12-04 2008-12-04 基于接触线移动跟踪控制的高吞吐量刻印

Country Status (7)

Country Link
US (2) US8945444B2 (enExample)
EP (1) EP2227720B1 (enExample)
JP (1) JP5433584B2 (enExample)
KR (1) KR101519017B1 (enExample)
CN (1) CN101884019B (enExample)
TW (1) TWI391257B (enExample)
WO (1) WO2009073200A1 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4940262B2 (ja) * 2009-03-25 2012-05-30 株式会社東芝 インプリントパターン形成方法
JP5563243B2 (ja) * 2009-06-01 2014-07-30 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP5284212B2 (ja) * 2009-07-29 2013-09-11 株式会社東芝 半導体装置の製造方法
NL2005265A (en) * 2009-10-07 2011-04-11 Asml Netherlands Bv Imprint lithography apparatus and method.
JP5419634B2 (ja) * 2009-10-26 2014-02-19 株式会社東芝 パターン形成方法
JP6004738B2 (ja) * 2011-09-07 2016-10-12 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5893303B2 (ja) 2011-09-07 2016-03-23 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6166516B2 (ja) * 2012-07-17 2017-07-19 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
US10108086B2 (en) 2013-03-15 2018-10-23 Nanonex Corporation System and methods of mold/substrate separation for imprint lithography
WO2014145360A1 (en) * 2013-03-15 2014-09-18 Nanonex Corporation Imprint lithography system and method for manufacturing
JP6221461B2 (ja) * 2013-07-25 2017-11-01 大日本印刷株式会社 欠陥解析方法、凹凸パターン構造体の製造方法及びインプリントシステム
JP6282069B2 (ja) * 2013-09-13 2018-02-21 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
CN106462054B (zh) * 2014-03-31 2020-07-07 皇家飞利浦有限公司 压印方法、用于压印方法的计算机程序产品和装置
JP6472189B2 (ja) * 2014-08-14 2019-02-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
US10620532B2 (en) * 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP6659104B2 (ja) * 2014-11-11 2020-03-04 キヤノン株式会社 インプリント方法、インプリント装置、型、および物品の製造方法
US10747106B2 (en) * 2014-12-09 2020-08-18 Canon Kabushiki Kaisha Imprint apparatus
JP6674218B2 (ja) * 2014-12-09 2020-04-01 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6478635B2 (ja) * 2015-01-05 2019-03-06 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
US10248018B2 (en) * 2015-03-30 2019-04-02 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
JP6403627B2 (ja) 2015-04-14 2018-10-10 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6585521B2 (ja) * 2016-02-16 2019-10-02 東芝メモリ株式会社 テンプレート、インプリント方法およびインプリント装置
JP6706983B2 (ja) * 2016-07-12 2020-06-10 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6784108B2 (ja) * 2016-09-12 2020-11-11 大日本印刷株式会社 レプリカモールドの製造方法及びインプリント装置
JP6954436B2 (ja) * 2016-09-12 2021-10-27 大日本印刷株式会社 レプリカモールドの製造方法及びインプリント装置
JP6801349B2 (ja) * 2016-10-04 2020-12-16 大日本印刷株式会社 パターン構造体の製造方法およびインプリント用モールドの製造方法
US10578984B2 (en) * 2016-12-20 2020-03-03 Canon Kabushiki Kaisha Adaptive chucking system
US10534259B2 (en) * 2017-03-28 2020-01-14 Canon Kabushiki Kaisha Method and system for imprint force control
US10866510B2 (en) * 2017-07-31 2020-12-15 Canon Kabushiki Kaisha Overlay improvement in nanoimprint lithography
CN111247623B (zh) * 2017-10-17 2024-03-08 佳能株式会社 压印装置和物品制造方法
US10996561B2 (en) * 2017-12-26 2021-05-04 Canon Kabushiki Kaisha Nanoimprint lithography with a six degrees-of-freedom imprint head module
JP7233174B2 (ja) * 2018-05-17 2023-03-06 キヤノン株式会社 インプリント装置、物品製造方法、平坦化層形成装置、情報処理装置、及び、決定方法
JP7305430B2 (ja) * 2018-06-29 2023-07-10 キヤノン株式会社 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法
JP7134055B2 (ja) * 2018-10-09 2022-09-09 キヤノン株式会社 成形装置、および物品の製造方法
US11243466B2 (en) 2019-01-31 2022-02-08 Canon Kabushiki Kaisha Template with mass velocity variation features, nanoimprint lithography apparatus that uses the template, and methods that use the template
US11442359B2 (en) 2019-03-11 2022-09-13 Canon Kabushiki Kaisha Method of separating a template from a shaped film on a substrate
US11759994B2 (en) 2019-07-24 2023-09-19 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and article manufacturing method
US11480871B2 (en) 2020-03-30 2022-10-25 Canon Kabushiki Kaisha Apparatus and method for improving accuracy of imprint force application in imprint lithography
US11590687B2 (en) 2020-06-30 2023-02-28 Canon Kabushiki Kaisha Systems and methods for reducing pressure while shaping a film
JP7507641B2 (ja) * 2020-09-08 2024-06-28 キヤノン株式会社 成形装置及び物品の製造方法
US11587795B2 (en) 2020-09-28 2023-02-21 Canon Kabushiki Kaisha Planarization apparatus including superstrate chuck with bendable periphery
US11728203B2 (en) * 2020-10-13 2023-08-15 Canon Kabushiki Kaisha Chuck assembly, planarization process, apparatus and method of manufacturing an article
US11994797B2 (en) 2020-10-28 2024-05-28 Canon Kabushiki Kaisha System and method for shaping a film with a scaled calibration measurement parameter
US11869813B2 (en) * 2020-12-15 2024-01-09 Canon Kabushiki Kaisha Planarization apparatus, planarization process, and method of manufacturing an article
US11776833B2 (en) 2020-12-22 2023-10-03 Canon Kabushiki Kaisha Method for improving accuracy of imprint force application in imprint lithography
US20220197134A1 (en) * 2020-12-23 2022-06-23 Canon Kabushiki Kaisha System and Method of Determining Shaping Parameters Based on Contact Line Motion
US12366800B2 (en) 2021-11-12 2025-07-22 Canon Kabushiki Kaisha Method for improving accuracy of imprint force application in imprint lithography
CN118315325B (zh) * 2024-06-11 2024-09-20 华芯(嘉兴)智能装备有限公司 一种晶圆吸附控制方法与系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1726429A (zh) * 2002-11-13 2006-01-25 分子制模股份有限公司 调整基底形状的卡盘系统和方法

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5926690A (en) * 1997-05-28 1999-07-20 Advanced Micro Devices, Inc. Run-to-run control process for controlling critical dimensions
US6424407B1 (en) * 1998-03-09 2002-07-23 Otm Technologies Ltd. Optical translation measurement
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US7796801B2 (en) * 1999-08-26 2010-09-14 Nanogeometry Research Inc. Pattern inspection apparatus and method
US7432634B2 (en) 2000-10-27 2008-10-07 Board Of Regents, University Of Texas System Remote center compliant flexure device
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
IL133352A (en) * 1999-12-07 2004-02-08 Eci Telecom Ltd Method for routing in loaded telecommunication networks
WO2002008835A2 (en) 2000-07-16 2002-01-31 Board Of Regents, The University Of Texas System High-resolution overlay alignment methods and systems for imprint lithography
EP2270592B1 (en) 2000-07-17 2015-09-02 Board of Regents, The University of Texas System Method of forming a pattern on a substrate
US8016277B2 (en) 2000-08-21 2011-09-13 Board Of Regents, The University Of Texas System Flexure based macro motion translation stage
AU2000275480A1 (en) 2000-10-05 2002-04-15 Khalil Michel Feghali Low-cost and rapid production of molds
US20050274219A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
EP2306242A3 (en) 2000-10-12 2011-11-02 Board of Regents, The University of Texas System Method of forming a pattern on a substrate
US7387508B2 (en) 2004-06-01 2008-06-17 Molecular Imprints Inc. Compliant device for nano-scale manufacturing
US20060005657A1 (en) 2004-06-01 2006-01-12 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
AU2003217184A1 (en) 2002-01-11 2003-09-02 Massachusetts Institute Of Technology Microcontact printing
US6926929B2 (en) 2002-07-09 2005-08-09 Molecular Imprints, Inc. System and method for dispensing liquids
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7442336B2 (en) 2003-08-21 2008-10-28 Molecular Imprints, Inc. Capillary imprinting technique
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6900881B2 (en) 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
US6908861B2 (en) * 2002-07-11 2005-06-21 Molecular Imprints, Inc. Method for imprint lithography using an electric field
US7071088B2 (en) 2002-08-23 2006-07-04 Molecular Imprints, Inc. Method for fabricating bulbous-shaped vias
US6936194B2 (en) 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
US20040065252A1 (en) 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US8349241B2 (en) 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US6980282B2 (en) * 2002-12-11 2005-12-27 Molecular Imprints, Inc. Method for modulating shapes of substrates
US6929762B2 (en) 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US7365103B2 (en) 2002-12-12 2008-04-29 Board Of Regents, The University Of Texas System Compositions for dark-field polymerization and method of using the same for imprint lithography processes
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
US7150622B2 (en) 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
US8211214B2 (en) 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US7090716B2 (en) 2003-10-02 2006-08-15 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
US20050189676A1 (en) 2004-02-27 2005-09-01 Molecular Imprints, Inc. Full-wafer or large area imprinting with multiple separated sub-fields for high throughput lithography
US20050275311A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Compliant device for nano-scale manufacturing
ATE477515T1 (de) 2004-06-03 2010-08-15 Molecular Imprints Inc Fluidausgabe und tropfenausgabe nach bedarf für die herstellung im nanobereich
US7768624B2 (en) 2004-06-03 2010-08-03 Board Of Regents, The University Of Texas System Method for obtaining force combinations for template deformation using nullspace and methods optimization techniques
JP4574240B2 (ja) 2004-06-11 2010-11-04 キヤノン株式会社 加工装置、加工方法、デバイス製造方法
US7126674B2 (en) * 2004-06-14 2006-10-24 Asml Netherlands B.V. Positioning device and device manufacturing method
US20060062922A1 (en) 2004-09-23 2006-03-23 Molecular Imprints, Inc. Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor
JP5198071B2 (ja) 2004-12-01 2013-05-15 モレキュラー・インプリンツ・インコーポレーテッド インプリントリソグラフィ・プロセスにおける熱管理のための露光方法
US7635263B2 (en) * 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers
US7636999B2 (en) * 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
JP4773729B2 (ja) * 2005-02-28 2011-09-14 キヤノン株式会社 転写装置およびデバイス製造方法
US7708924B2 (en) 2005-07-21 2010-05-04 Asml Netherlands B.V. Imprint lithography
JP4533358B2 (ja) 2005-10-18 2010-09-01 キヤノン株式会社 インプリント方法、インプリント装置およびチップの製造方法
JP4923924B2 (ja) * 2005-11-22 2012-04-25 コニカミノルタホールディングス株式会社 インプリント装置及びインプリント方法
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
US7649613B2 (en) * 2006-03-03 2010-01-19 Asml Netherlands B.V. Lithographic apparatus, method of controlling a component of a lithographic apparatus and device manufacturing method
WO2007124007A2 (en) 2006-04-21 2007-11-01 Molecular Imprints, Inc. Method for detecting a particle in a nanoimprint lithography system
JP4854383B2 (ja) 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
CN101547748B (zh) * 2006-12-04 2012-10-31 皇家飞利浦电子股份有限公司 用于将薄片应用到基板的方法和设备
KR101238137B1 (ko) * 2007-02-06 2013-02-28 캐논 가부시끼가이샤 임프린트 방법 및 임프린트 장치
US7837907B2 (en) 2007-07-20 2010-11-23 Molecular Imprints, Inc. Alignment system and method for a substrate in a nano-imprint process
JP4940262B2 (ja) * 2009-03-25 2012-05-30 株式会社東芝 インプリントパターン形成方法
JP5411557B2 (ja) * 2009-04-03 2014-02-12 株式会社日立ハイテクノロジーズ 微細構造転写装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1726429A (zh) * 2002-11-13 2006-01-25 分子制模股份有限公司 调整基底形状的卡盘系统和方法

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US9090014B2 (en) 2015-07-28
CN101884019A (zh) 2010-11-10
US8945444B2 (en) 2015-02-03
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US20150140149A1 (en) 2015-05-21
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