CN101855334B - 高负电动势多面体倍半硅氧烷组合物及无损坏半导体湿式清洁方法 - Google Patents

高负电动势多面体倍半硅氧烷组合物及无损坏半导体湿式清洁方法 Download PDF

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Publication number
CN101855334B
CN101855334B CN200880115634.4A CN200880115634A CN101855334B CN 101855334 B CN101855334 B CN 101855334B CN 200880115634 A CN200880115634 A CN 200880115634A CN 101855334 B CN101855334 B CN 101855334B
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composition
specific examples
polyhedral silsesquioxane
salt
metal ion
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CN200880115634.4A
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CN101855334A (zh
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郝建军
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Sachem Inc
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Sachem Inc
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/08—Silicates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/162—Organic compounds containing Si
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/395—Bleaching agents
    • C11D3/3956—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C11D7/14—Silicates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
CN200880115634.4A 2007-11-13 2008-11-12 高负电动势多面体倍半硅氧烷组合物及无损坏半导体湿式清洁方法 Expired - Fee Related CN101855334B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US98770607P 2007-11-13 2007-11-13
US60/987,706 2007-11-13
PCT/US2008/083161 WO2009064745A1 (en) 2007-11-13 2008-11-12 High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean

Publications (2)

Publication Number Publication Date
CN101855334A CN101855334A (zh) 2010-10-06
CN101855334B true CN101855334B (zh) 2013-03-27

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CN200880115634.4A Expired - Fee Related CN101855334B (zh) 2007-11-13 2008-11-12 高负电动势多面体倍半硅氧烷组合物及无损坏半导体湿式清洁方法

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Country Link
US (1) US7976638B2 (enExample)
EP (1) EP2215203B1 (enExample)
JP (1) JP5244916B2 (enExample)
KR (1) KR101569338B1 (enExample)
CN (1) CN101855334B (enExample)
ES (1) ES2386692T3 (enExample)
TW (1) TWI472579B (enExample)
WO (1) WO2009064745A1 (enExample)

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US7129199B2 (en) * 2002-08-12 2006-10-31 Air Products And Chemicals, Inc. Process solutions containing surfactants
US8518865B2 (en) * 2009-08-31 2013-08-27 Air Products And Chemicals, Inc. Water-rich stripping and cleaning formulation and method for using same
US9257270B2 (en) * 2011-08-15 2016-02-09 Ekc Technology Method and composition for removing resist, etch residue, and copper oxide from substrates having copper, metal hardmask and low-k dielectric material
KR101857807B1 (ko) * 2011-08-22 2018-06-19 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
KR101880300B1 (ko) * 2011-08-23 2018-08-17 동우 화인켐 주식회사 평판 디스플레이 제조에 필요한 세정액 조성물 및 이를 이용한 세정방법
KR101880305B1 (ko) * 2011-12-16 2018-07-20 동우 화인켐 주식회사 전자재료용 세정액 조성물
KR101880306B1 (ko) * 2011-12-19 2018-07-20 동우 화인켐 주식회사 전자재료용 세정액 조성물
KR101965904B1 (ko) * 2011-12-20 2019-08-14 동우 화인켐 주식회사 액정 표시장치용 어레이 기판 제조방법
KR101978521B1 (ko) * 2012-10-05 2019-05-15 동우 화인켐 주식회사 갈바닉 부식을 억제하는 포토레지스트 박리액 조성물
KR101957524B1 (ko) * 2012-12-31 2019-06-19 동우 화인켐 주식회사 포토레지스트 박리액 조성물
KR101957525B1 (ko) * 2012-12-31 2019-06-19 동우 화인켐 주식회사 포토레지스트 박리액 조성물
JP6460729B2 (ja) * 2014-10-31 2019-01-30 富士フイルム株式会社 基板処理方法、及び、半導体素子の製造方法
US11390829B2 (en) * 2018-01-16 2022-07-19 Tokuyama Corporation Treatment liquid for semiconductor wafers, which contains hypochlorite ions
JP6552676B2 (ja) * 2018-05-10 2019-07-31 富士フイルム株式会社 ルテニウム含有膜が形成された基板におけるルテニウム付着物除去用除去液
KR102002276B1 (ko) * 2019-05-03 2019-07-19 동우 화인켐 주식회사 갈바닉 부식을 억제하는 포토레지스트 박리액 조성물
JP2021042326A (ja) * 2019-09-12 2021-03-18 日華化学株式会社 電解洗浄剤及び金属の洗浄方法
KR102506715B1 (ko) * 2019-09-27 2023-03-06 가부시끼가이샤 도꾸야마 루테늄의 반도체용 처리액 및 그 제조 방법
CN114514598A (zh) 2019-09-27 2022-05-17 株式会社德山 RuO4气体的产生抑制剂以及RuO4气体的产生抑制方法
KR102345211B1 (ko) 2020-09-21 2022-01-03 주식회사 이엔에프테크놀로지 실리콘 질화막 식각 조성물 및 이를 이용한 방법
KR102273127B1 (ko) * 2020-09-21 2021-07-05 주식회사 이엔에프테크놀로지 실리콘 질화막 식각 조성물 및 이를 이용한 방법
US20240067878A1 (en) * 2022-08-30 2024-02-29 Tokuyama Corporation Silicon etching solution and method for producing silicon etching solution, method for treating substrate, and method for producing silicon device

Citations (1)

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Publication number Priority date Publication date Assignee Title
WO1999060448A1 (en) * 1998-05-18 1999-11-25 Mallinckrodt Inc. Silicate-containing alkaline compositions for cleaning microelectronic substrates

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Also Published As

Publication number Publication date
EP2215203A1 (en) 2010-08-11
HK1147279A1 (en) 2011-08-05
WO2009064745A1 (en) 2009-05-22
US7976638B2 (en) 2011-07-12
JP5244916B2 (ja) 2013-07-24
US20090120458A1 (en) 2009-05-14
JP2011503326A (ja) 2011-01-27
TWI472579B (zh) 2015-02-11
ES2386692T3 (es) 2012-08-27
EP2215203B1 (en) 2012-05-16
CN101855334A (zh) 2010-10-06
TW200932832A (en) 2009-08-01
KR101569338B1 (ko) 2015-11-17
KR20100091974A (ko) 2010-08-19

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