CN101809773B - 包括光电子器件的装置 - Google Patents

包括光电子器件的装置 Download PDF

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Publication number
CN101809773B
CN101809773B CN2008801093434A CN200880109343A CN101809773B CN 101809773 B CN101809773 B CN 101809773B CN 2008801093434 A CN2008801093434 A CN 2008801093434A CN 200880109343 A CN200880109343 A CN 200880109343A CN 101809773 B CN101809773 B CN 101809773B
Authority
CN
China
Prior art keywords
component
optoelectronic
contact
optoelectronic component
webs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801093434A
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English (en)
Chinese (zh)
Other versions
CN101809773A (zh
Inventor
迪特尔·艾斯勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN101809773A publication Critical patent/CN101809773A/zh
Application granted granted Critical
Publication of CN101809773B publication Critical patent/CN101809773B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Photovoltaic Devices (AREA)
CN2008801093434A 2007-09-28 2008-09-09 包括光电子器件的装置 Expired - Fee Related CN101809773B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102007046720 2007-09-28
DE102007046720.8 2007-09-28
DE102007053849.0 2007-11-12
DE102007053849A DE102007053849A1 (de) 2007-09-28 2007-11-12 Anordnung umfassend ein optoelektronisches Bauelement
PCT/DE2008/001513 WO2009039825A1 (de) 2007-09-28 2008-09-09 Anordnung umfassend ein optoelektronisches bauelement

Publications (2)

Publication Number Publication Date
CN101809773A CN101809773A (zh) 2010-08-18
CN101809773B true CN101809773B (zh) 2013-07-17

Family

ID=40384467

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801093434A Expired - Fee Related CN101809773B (zh) 2007-09-28 2008-09-09 包括光电子器件的装置

Country Status (8)

Country Link
US (1) US8427839B2 (enExample)
EP (1) EP2193551B1 (enExample)
JP (1) JP5389034B2 (enExample)
KR (1) KR101475978B1 (enExample)
CN (1) CN101809773B (enExample)
DE (1) DE102007053849A1 (enExample)
TW (1) TWI447943B (enExample)
WO (1) WO2009039825A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2635338C2 (ru) * 2012-05-23 2017-11-10 Конинклейке Филипс Н.В. Полупроводниковый прибор для поверхностного монтажа
DE102014100773A1 (de) 2014-01-23 2015-07-23 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
WO2017095385A1 (en) * 2015-11-30 2017-06-08 Intel Corporation Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material
DE102016103862A1 (de) * 2016-03-03 2017-09-07 Osram Opto Semiconductors Gmbh Optoelektronische Leuchtvorrichtung, Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Leuchtsystem
CN107464873A (zh) * 2017-05-03 2017-12-12 合肥彩虹蓝光科技有限公司 一种避免倒装芯片固晶漏电的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1461498A (zh) * 2001-04-23 2003-12-10 松下电工株式会社 使用led芯片的发光装置
EP1469516A1 (en) * 2003-04-14 2004-10-20 Epitech Corporation, Ltd. White-light emitting semiconductor device using a plurality of light emitting diode chips

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831507B1 (enExample) * 1969-07-10 1973-09-29
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
DE4020048A1 (de) * 1990-06-23 1992-01-02 Ant Nachrichtentech Anordnung aus substrat und bauelement und verfahren zur herstellung
JP3138343B2 (ja) * 1992-09-30 2001-02-26 日本電信電話株式会社 光モジュールの製造方法
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
DE69410168T2 (de) * 1993-06-24 1998-11-05 Toshiba Kawasaki Shi Kk Elektronische Schaltungsanordnung
JPH07209559A (ja) * 1994-01-24 1995-08-11 Oki Electric Ind Co Ltd 光モジュールとその組立て方法
JPH08191141A (ja) * 1995-01-09 1996-07-23 Sony Corp 固体撮像素子
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
CN1191394A (zh) * 1997-02-20 1998-08-26 杨泰和 藉前置光－电转换元件驱动的绝缘栅双极晶体管
JP3011232B2 (ja) * 1997-02-25 2000-02-21 日本電気株式会社 固体撮像素子及びその製造方法
EP1122567A1 (en) * 2000-02-02 2001-08-08 Corning Incorporated Passive alignement using slanted wall pedestal
JP3786128B2 (ja) 2001-03-06 2006-06-14 ソニー株式会社 表示装置の製造方法
JP2002319705A (ja) 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Ｌｅｄ装置
JP4122784B2 (ja) * 2001-09-19 2008-07-23 松下電工株式会社 発光装置
DE10157205A1 (de) * 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
JP4348894B2 (ja) * 2002-03-22 2009-10-21 日亜化学工業株式会社 発光装置
JP4139634B2 (ja) * 2002-06-28 2008-08-27 松下電器産業株式会社 Ｌｅｄ照明装置およびその製造方法
WO2004068592A1 (ja) * 2003-01-27 2004-08-12 Ngk Insulators, Ltd. 光デバイス
JP3947481B2 (ja) 2003-02-19 2007-07-18 浜松ホトニクス株式会社 光モジュール及びその製造方法
JP4123105B2 (ja) 2003-05-26 2008-07-23 松下電工株式会社 発光装置
WO2004105142A1 (en) 2003-05-26 2004-12-02 Matsushita Electric Works, Ltd. Light-emitting device
JP2005158957A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4980718B2 (ja) * 2003-11-12 2012-07-18 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 電子デバイス用の封入アセンブリ
EP1714327A1 (en) * 2004-01-12 2006-10-25 Asetronics AG Arrangement with a light emitting device on a substrate
JP2006066519A (ja) * 2004-08-25 2006-03-09 Kyocera Corp 発光素子用配線基板ならびに発光装置
KR100867515B1 (ko) * 2004-12-06 2008-11-07 삼성전기주식회사 발광소자 패키지
DE202005014073U1 (de) 2005-09-06 2007-01-18 Ic-Haus Gmbh Chipträgerbaugruppe
JP4789671B2 (ja) * 2006-03-28 2011-10-12 京セラ株式会社 発光素子用配線基板ならびに発光装置
JP4967548B2 (ja) 2006-09-06 2012-07-04 株式会社ニコン 発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1461498A (zh) * 2001-04-23 2003-12-10 松下电工株式会社 使用led芯片的发光装置
EP1469516A1 (en) * 2003-04-14 2004-10-20 Epitech Corporation, Ltd. White-light emitting semiconductor device using a plurality of light emitting diode chips

Also Published As

Publication number Publication date
TWI447943B (zh) 2014-08-01
WO2009039825A1 (de) 2009-04-02
TW200926458A (en) 2009-06-16
JP5389034B2 (ja) 2014-01-15
EP2193551A1 (de) 2010-06-09
DE102007053849A1 (de) 2009-04-02
KR20100080603A (ko) 2010-07-09
US20100214727A1 (en) 2010-08-26
KR101475978B1 (ko) 2014-12-24
US8427839B2 (en) 2013-04-23
JP2010541219A (ja) 2010-12-24
CN101809773A (zh) 2010-08-18
EP2193551B1 (de) 2015-06-03
WO2009039825A4 (de) 2009-05-28

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Granted publication date: 20130717

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CF01 Termination of patent right due to non-payment of annual fee