CN101652867B - 光伏器件及其制造方法 - Google Patents
光伏器件及其制造方法 Download PDFInfo
- Publication number
- CN101652867B CN101652867B CN2008800113623A CN200880011362A CN101652867B CN 101652867 B CN101652867 B CN 101652867B CN 2008800113623 A CN2008800113623 A CN 2008800113623A CN 200880011362 A CN200880011362 A CN 200880011362A CN 101652867 B CN101652867 B CN 101652867B
- Authority
- CN
- China
- Prior art keywords
- substrate
- single crystalline
- semiconductor layer
- semiconductor substrate
- crystalline semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
- H10F71/1221—The active layers comprising only Group IV materials comprising polycrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/139—Manufacture or treatment of devices covered by this subclass using temporary substrates
- H10F71/1395—Manufacture or treatment of devices covered by this subclass using temporary substrates for thin-film devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/93—Interconnections
- H10F77/933—Interconnections for devices having potential barriers
- H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
- H10F77/937—Busbar structures for modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/215—Geometries of grid contacts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007101182 | 2007-04-06 | ||
| JP101182/2007 | 2007-04-06 | ||
| PCT/JP2008/056254 WO2008126706A1 (en) | 2007-04-06 | 2008-03-24 | Photovoltaic device and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101652867A CN101652867A (zh) | 2010-02-17 |
| CN101652867B true CN101652867B (zh) | 2012-08-08 |
Family
ID=39825900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800113623A Active CN101652867B (zh) | 2007-04-06 | 2008-03-24 | 光伏器件及其制造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20080245406A1 (enExample) |
| EP (1) | EP2135295A4 (enExample) |
| JP (1) | JP5070112B2 (enExample) |
| KR (1) | KR101503675B1 (enExample) |
| CN (1) | CN101652867B (enExample) |
| TW (1) | TWI485864B (enExample) |
| WO (1) | WO2008126706A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2143146A1 (en) * | 2007-04-13 | 2010-01-13 | Semiconductor Energy Laboratory Co, Ltd. | Photovoltaic device and method for manufacturing the same |
| US20090051046A1 (en) * | 2007-08-24 | 2009-02-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method for the same |
| TWI493609B (zh) * | 2007-10-23 | 2015-07-21 | Semiconductor Energy Lab | 半導體基板、顯示面板及顯示裝置的製造方法 |
| CN101842910B (zh) * | 2007-11-01 | 2013-03-27 | 株式会社半导体能源研究所 | 用于制造光电转换器件的方法 |
| KR101608953B1 (ko) * | 2007-11-09 | 2016-04-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 광전 변환 장치 및 그 제조 방법 |
| JP5469851B2 (ja) | 2007-11-27 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US20090139558A1 (en) * | 2007-11-29 | 2009-06-04 | Shunpei Yamazaki | Photoelectric conversion device and manufacturing method thereof |
| JP5248994B2 (ja) * | 2007-11-30 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| JP5248995B2 (ja) * | 2007-11-30 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| EP2075850A3 (en) * | 2007-12-28 | 2011-08-24 | Semiconductor Energy Laboratory Co, Ltd. | Photoelectric conversion device and manufacturing method thereof |
| JP5572307B2 (ja) | 2007-12-28 | 2014-08-13 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| US8017429B2 (en) | 2008-02-19 | 2011-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing photoelectric conversion device |
| SG159476A1 (en) * | 2008-08-28 | 2010-03-30 | Semiconductor Energy Lab | Method for manufacturing semiconductor layer and semiconductor device |
| EP2161760B1 (en) * | 2008-09-05 | 2017-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric Conversion Device |
| JP5611571B2 (ja) * | 2008-11-27 | 2014-10-22 | 株式会社半導体エネルギー研究所 | 半導体基板の作製方法及び半導体装置の作製方法 |
| TW201034207A (en) * | 2009-01-29 | 2010-09-16 | First Solar Inc | Photovoltaic device with improved crystal orientation |
| US7893349B2 (en) * | 2009-02-19 | 2011-02-22 | Suncore, Inc. | Photovoltaic multi-junction wavelength compensation system and method |
| JP2010283339A (ja) * | 2009-05-02 | 2010-12-16 | Semiconductor Energy Lab Co Ltd | 光電変換装置及びその作製方法 |
| TWI504002B (zh) * | 2009-06-05 | 2015-10-11 | Semiconductor Energy Lab | 光電轉換裝置 |
| JP5706670B2 (ja) | 2009-11-24 | 2015-04-22 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
| US8704083B2 (en) * | 2010-02-11 | 2014-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and fabrication method thereof |
| US8324084B2 (en) | 2010-03-31 | 2012-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor substrate and manufacturing method of semiconductor device |
| KR101705937B1 (ko) * | 2011-01-25 | 2017-02-10 | 에베 그룹 에. 탈너 게엠베하 | 웨이퍼들의 영구적 결합을 위한 방법 |
| JP2013058562A (ja) | 2011-09-07 | 2013-03-28 | Semiconductor Energy Lab Co Ltd | 光電変換装置 |
| US9640676B2 (en) * | 2012-06-29 | 2017-05-02 | Sunpower Corporation | Methods and structures for improving the structural integrity of solar cells |
| JP6082294B2 (ja) * | 2013-03-26 | 2017-02-15 | ローム株式会社 | 有機薄膜太陽電池およびその製造方法、および電子機器 |
| US10147747B2 (en) | 2014-08-21 | 2018-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and electronic device |
| CN107227451B (zh) * | 2017-06-26 | 2019-04-19 | 广东振华科技股份有限公司 | 一种贵金属防氧化膜的真空镀膜方法及贵金属镀膜制品 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01227307A (ja) | 1988-03-08 | 1989-09-11 | Asahi Glass Co Ltd | 透明導電体 |
| JP2000150940A (ja) * | 1998-11-18 | 2000-05-30 | Denso Corp | 半導体微粒子集合体及びその製造方法 |
| JP2004087667A (ja) * | 2002-08-26 | 2004-03-18 | Hitachi Cable Ltd | 結晶シリコン系薄膜半導体装置の製造方法 |
| CN1157766C (zh) * | 1999-09-22 | 2004-07-14 | 佳能株式会社 | 半导体衬底及太阳电池的制造方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4180618A (en) * | 1977-07-27 | 1979-12-25 | Corning Glass Works | Thin silicon film electronic device |
| US4633034A (en) * | 1985-02-08 | 1986-12-30 | Energy Conversion Devices, Inc. | Photovoltaic device and method |
| US4665277A (en) | 1986-03-11 | 1987-05-12 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Floating emitter solar cell |
| DE68911201T2 (de) * | 1988-05-24 | 1994-06-16 | Asahi Glass Co Ltd | Methode für die Herstellung eines Solarzellenglassubstrates. |
| DE69132358T2 (de) * | 1990-05-07 | 2000-12-28 | Canon K.K., Tokio/Tokyo | Solarzelle |
| JPH04276665A (ja) | 1991-03-04 | 1992-10-01 | Canon Inc | 集積型太陽電池 |
| JP3360919B2 (ja) | 1993-06-11 | 2003-01-07 | 三菱電機株式会社 | 薄膜太陽電池の製造方法,及び薄膜太陽電池 |
| JP3381443B2 (ja) | 1995-02-02 | 2003-02-24 | ソニー株式会社 | 基体から半導体層を分離する方法、半導体素子の製造方法およびsoi基板の製造方法 |
| JPH1093122A (ja) * | 1996-09-10 | 1998-04-10 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜太陽電池の製造方法 |
| CA2225131C (en) * | 1996-12-18 | 2002-01-01 | Canon Kabushiki Kaisha | Process for producing semiconductor article |
| US6033974A (en) | 1997-05-12 | 2000-03-07 | Silicon Genesis Corporation | Method for controlled cleaving process |
| JPH10335683A (ja) | 1997-05-28 | 1998-12-18 | Ion Kogaku Kenkyusho:Kk | タンデム型太陽電池およびその製造方法 |
| US6331208B1 (en) * | 1998-05-15 | 2001-12-18 | Canon Kabushiki Kaisha | Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor |
| JP2000223725A (ja) * | 1999-01-29 | 2000-08-11 | Canon Inc | 光電変換装置および半導体層の分離方法 |
| US6468923B1 (en) | 1999-03-26 | 2002-10-22 | Canon Kabushiki Kaisha | Method of producing semiconductor member |
| JP3619053B2 (ja) * | 1999-05-21 | 2005-02-09 | キヤノン株式会社 | 光電変換装置の製造方法 |
| JP3542521B2 (ja) * | 1999-06-08 | 2004-07-14 | キヤノン株式会社 | 半導体基体及び太陽電池の製造方法と陽極化成装置 |
| JP2001089291A (ja) * | 1999-09-20 | 2001-04-03 | Canon Inc | 液相成長法、半導体部材の製造方法、太陽電池の製造方法 |
| JP4450126B2 (ja) | 2000-01-21 | 2010-04-14 | 日新電機株式会社 | シリコン系結晶薄膜の形成方法 |
| JP3513592B2 (ja) | 2000-09-25 | 2004-03-31 | 独立行政法人産業技術総合研究所 | 太陽電池の製造方法 |
| CA2482258A1 (en) | 2001-04-17 | 2002-10-24 | California Institute Of Technology | A method of using a germanium layer transfer to si for photovoltaic applications and heterostructure made thereby |
| US7238622B2 (en) | 2001-04-17 | 2007-07-03 | California Institute Of Technology | Wafer bonded virtual substrate and method for forming the same |
| US20050026432A1 (en) | 2001-04-17 | 2005-02-03 | Atwater Harry A. | Wafer bonded epitaxial templates for silicon heterostructures |
| JP2002348198A (ja) * | 2001-05-28 | 2002-12-04 | Nissin Electric Co Ltd | 半導体素子エピタキシャル成長用基板及びその製造方法 |
| JP4103447B2 (ja) | 2002-04-30 | 2008-06-18 | 株式会社Ihi | 大面積単結晶シリコン基板の製造方法 |
| JP2004014958A (ja) | 2002-06-11 | 2004-01-15 | Fuji Electric Holdings Co Ltd | 薄膜多結晶太陽電池とその製造方法 |
| US6818529B2 (en) * | 2002-09-12 | 2004-11-16 | Applied Materials, Inc. | Apparatus and method for forming a silicon film across the surface of a glass substrate |
| JP4280490B2 (ja) * | 2002-12-18 | 2009-06-17 | 株式会社カネカ | 集積型薄膜光電変換装置とその製造方法 |
| JP4794810B2 (ja) * | 2003-03-20 | 2011-10-19 | シャープ株式会社 | 半導体装置の製造方法 |
| JP2004296599A (ja) * | 2003-03-26 | 2004-10-21 | Canon Inc | 薄膜多結晶シリコン太陽電池及びその製造方法 |
| JP5068946B2 (ja) | 2003-05-13 | 2012-11-07 | 旭硝子株式会社 | 太陽電池用透明導電性基板およびその製造方法 |
| EP1635361B1 (en) * | 2003-06-17 | 2016-08-17 | Nippon Sheet Glass Company, Limited | Method for producing a photoelectric converter comprising a transparent conductive substrate |
| JP2005036077A (ja) | 2003-07-18 | 2005-02-10 | Sumitomo Chemical Co Ltd | 接着性フィルム |
| JP2005050905A (ja) * | 2003-07-30 | 2005-02-24 | Sharp Corp | シリコン薄膜太陽電池の製造方法 |
| WO2005060723A2 (en) | 2003-12-02 | 2005-07-07 | California Institute Of Technology | Wafer bonded epitaxial templates for silicon heterostructures |
| JP2005268682A (ja) * | 2004-03-22 | 2005-09-29 | Canon Inc | 半導体基材及び太陽電池の製造方法 |
| EP2002484A4 (en) * | 2006-04-05 | 2016-06-08 | Silicon Genesis Corp | METHOD AND STRUCTURE FOR MANUFACTURING PHOTOVOLTAIC CELLS USING A LAYER TRANSFER PROCESS |
| EP2143146A1 (en) | 2007-04-13 | 2010-01-13 | Semiconductor Energy Laboratory Co, Ltd. | Photovoltaic device and method for manufacturing the same |
-
2008
- 2008-03-24 WO PCT/JP2008/056254 patent/WO2008126706A1/en not_active Ceased
- 2008-03-24 EP EP08739371.6A patent/EP2135295A4/en not_active Withdrawn
- 2008-03-24 KR KR1020097023159A patent/KR101503675B1/ko not_active Expired - Fee Related
- 2008-03-24 CN CN2008800113623A patent/CN101652867B/zh active Active
- 2008-03-27 TW TW097111071A patent/TWI485864B/zh not_active IP Right Cessation
- 2008-03-27 US US12/078,087 patent/US20080245406A1/en not_active Abandoned
- 2008-04-04 JP JP2008097805A patent/JP5070112B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-03 US US13/020,238 patent/US8828789B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01227307A (ja) | 1988-03-08 | 1989-09-11 | Asahi Glass Co Ltd | 透明導電体 |
| JP2000150940A (ja) * | 1998-11-18 | 2000-05-30 | Denso Corp | 半導体微粒子集合体及びその製造方法 |
| CN1157766C (zh) * | 1999-09-22 | 2004-07-14 | 佳能株式会社 | 半导体衬底及太阳电池的制造方法 |
| JP2004087667A (ja) * | 2002-08-26 | 2004-03-18 | Hitachi Cable Ltd | 結晶シリコン系薄膜半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080245406A1 (en) | 2008-10-09 |
| JP5070112B2 (ja) | 2012-11-07 |
| JP2008277805A (ja) | 2008-11-13 |
| WO2008126706A1 (en) | 2008-10-23 |
| CN101652867A (zh) | 2010-02-17 |
| TW200849617A (en) | 2008-12-16 |
| EP2135295A1 (en) | 2009-12-23 |
| US8828789B2 (en) | 2014-09-09 |
| KR101503675B1 (ko) | 2015-03-18 |
| EP2135295A4 (en) | 2014-05-21 |
| US20110124151A1 (en) | 2011-05-26 |
| KR20100016263A (ko) | 2010-02-12 |
| TWI485864B (zh) | 2015-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101652867B (zh) | 光伏器件及其制造方法 | |
| US8044296B2 (en) | Photovoltaic device and method for manufacturing the same | |
| US8071872B2 (en) | Thin film semi-conductor-on-glass solar cell devices | |
| US8921968B2 (en) | Selective emitter solar cells formed by a hybrid diffusion and ion implantation process | |
| US8227289B2 (en) | Method for producing single crystal silicon solar cell and single crystal silicon solar cell | |
| US20110041910A1 (en) | Photoelectric conversion device and manufacturing method thereof | |
| EP2609631A2 (en) | Back junction solar cell with selective front surface field | |
| US20100263717A1 (en) | Low Temperature Junction Growth Using Hot-Wire Chemical Vapor Deposition | |
| KR101129422B1 (ko) | 태양전지 제조방법 및 그로 인해 제조된 태양전지 | |
| JP3347747B2 (ja) | 光電変換装置の作製方法 | |
| WO2011102352A1 (ja) | 太陽電池及び太陽電池の製造方法 | |
| JPH0436448B2 (enExample) | ||
| Wang | Development of a high performance ultra-thin silicon solar cell on steel substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |