CN101606444B - 印刷电路板及使用该印刷电路板的电子装置 - Google Patents

印刷电路板及使用该印刷电路板的电子装置 Download PDF

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Publication number
CN101606444B
CN101606444B CN2008800047759A CN200880004775A CN101606444B CN 101606444 B CN101606444 B CN 101606444B CN 2008800047759 A CN2008800047759 A CN 2008800047759A CN 200880004775 A CN200880004775 A CN 200880004775A CN 101606444 B CN101606444 B CN 101606444B
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CN
China
Prior art keywords
pattern
layer
circuit board
printed circuit
conversion element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008800047759A
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English (en)
Chinese (zh)
Other versions
CN101606444A (zh
Inventor
石川幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN101606444A publication Critical patent/CN101606444A/zh
Application granted granted Critical
Publication of CN101606444B publication Critical patent/CN101606444B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2008800047759A 2007-07-25 2008-06-27 印刷电路板及使用该印刷电路板的电子装置 Expired - Fee Related CN101606444B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007192906A JP5173298B2 (ja) 2007-07-25 2007-07-25 プリント配線板およびそれを用いた電子機器
JP192906/2007 2007-07-25
PCT/JP2008/062116 WO2009013988A1 (en) 2007-07-25 2008-06-27 Print circuit board and electronic device using the same

Publications (2)

Publication Number Publication Date
CN101606444A CN101606444A (zh) 2009-12-16
CN101606444B true CN101606444B (zh) 2011-02-16

Family

ID=40281246

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800047759A Expired - Fee Related CN101606444B (zh) 2007-07-25 2008-06-27 印刷电路板及使用该印刷电路板的电子装置

Country Status (5)

Country Link
US (1) US9426881B2 (enExample)
JP (1) JP5173298B2 (enExample)
KR (1) KR101187225B1 (enExample)
CN (1) CN101606444B (enExample)
WO (1) WO2009013988A1 (enExample)

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DK3782612T3 (da) 2008-05-15 2024-01-15 Celgene Corp Orale formuleringer af cytidinanaloger og fremgangsmåder til anvendelse deraf
JP5434167B2 (ja) * 2009-03-17 2014-03-05 株式会社村田製作所 回路基板
WO2011018934A1 (ja) * 2009-08-11 2011-02-17 株式会社村田製作所 信号線路
CN102577646B (zh) * 2009-09-30 2015-03-04 株式会社村田制作所 电路基板及其制造方法
KR101050876B1 (ko) * 2010-01-06 2011-07-20 (주)인터플렉스 연성인쇄회로기판의 제조방법 및 그 연성인쇄회로기판
JP2011239040A (ja) * 2010-05-06 2011-11-24 Canon Inc 撮像装置
JP5126286B2 (ja) * 2010-05-20 2013-01-23 株式会社村田製作所 積層型高周波モジュール
JP5696391B2 (ja) * 2010-07-29 2015-04-08 カシオ計算機株式会社 基板の接着方法、集合部品、電子機器、及び基板
USD673515S1 (en) 2011-02-18 2013-01-01 Apple Inc. Component of an electronic device
JP5269157B2 (ja) * 2011-07-22 2013-08-21 キヤノン株式会社 撮像装置
USD765084S1 (en) 2013-09-10 2016-08-30 Apple Inc. Input for an electronic device
USD769833S1 (en) 2014-08-29 2016-10-25 Apple Inc. Component for electronic device
KR102622767B1 (ko) * 2016-02-11 2024-01-09 주식회사 기가레인 연성회로기판
US10602608B2 (en) * 2017-08-22 2020-03-24 Taiyo Yuden Co., Ltd. Circuit board
JP6745770B2 (ja) 2017-08-22 2020-08-26 太陽誘電株式会社 回路基板
KR102551188B1 (ko) * 2018-06-26 2023-07-04 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 광학 기기
USD886739S1 (en) * 2019-01-04 2020-06-09 Libest Inc. Electrode plate
JP7596211B2 (ja) * 2021-05-17 2024-12-09 メクテック株式会社 フレキシブル回路基板およびその製造方法、ならびに電子機器
CN113411956A (zh) * 2021-06-28 2021-09-17 江西晶浩光学有限公司 柔性电路板、摄像头模组以及电子设备
JP7840675B2 (ja) 2021-12-13 2026-04-06 キヤノン株式会社 電子モジュール及び電子機器
CN114422681B (zh) * 2022-01-27 2023-06-23 苏州昀冢电子科技股份有限公司 驱动机构、驱动机构组合、摄像头模组及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299878A (ja) 1992-04-17 1993-11-12 Nippondenso Co Ltd 多層配線基板
JPH06274246A (ja) 1993-03-05 1994-09-30 Internatl Business Mach Corp <Ibm> コンピュータ、プリント回路基板、動作方法及び製造方法
JPH1140906A (ja) 1997-07-23 1999-02-12 Olympus Optical Co Ltd 電気回路基板
JPH11163539A (ja) 1997-11-25 1999-06-18 Kyocera Corp 多層配線基板
JP2002176231A (ja) * 2000-12-05 2002-06-21 Nippon Mektron Ltd 両面可撓性回路基板

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* Cited by examiner, † Cited by third party
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JPH07170029A (ja) * 1993-12-15 1995-07-04 Nippon Avionics Co Ltd フレキシブル・プリント配線板およびその製造方法
JPH09102896A (ja) * 1995-10-04 1997-04-15 Fuji Photo Optical Co Ltd 電子内視鏡の撮像素子組付け体
JPH09298626A (ja) 1996-05-07 1997-11-18 Fuji Photo Film Co Ltd イメージセンサ用フレキシブルプリント配線基板
JPH10313178A (ja) 1997-05-13 1998-11-24 Fuji Photo Film Co Ltd 多層回路基板
US6654064B2 (en) 1997-05-23 2003-11-25 Canon Kabushiki Kaisha Image pickup device incorporating a position defining member
JP4046837B2 (ja) * 1998-03-11 2008-02-13 キヤノン株式会社 撮像装置
TW572526U (en) * 2003-05-08 2004-01-11 Guo-Liang You Standard module of visual image sensing with a universal connecting function
TWM246829U (en) * 2003-10-21 2004-10-11 Tai Sol Electronics Co Ltd Card adapter with card insertion and adaptation function
KR100635060B1 (ko) * 2004-03-09 2006-10-17 삼성에스디아이 주식회사 유기전계발광표시장치의 구동장치
JP2006115160A (ja) 2004-10-14 2006-04-27 Matsushita Electric Ind Co Ltd 画像入力装置及び画像入力手段
US7312401B2 (en) * 2004-09-21 2007-12-25 Ibiden Co., Ltd. Flexible printed wiring board
JP2006121151A (ja) 2004-10-19 2006-05-11 Sony Corp 信号処理方法および信号処理装置並びに物理情報取得装置
JP2006203547A (ja) 2005-01-20 2006-08-03 Fuji Photo Film Co Ltd 画像蓄積装置
US7558473B2 (en) * 2005-07-28 2009-07-07 Samsung Electronics Co., Ltd. Optical image stabilizer for camera lens assembly
CN100561801C (zh) * 2006-01-21 2009-11-18 鸿富锦精密工业（深圳）有限公司 一种板对板的连接结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299878A (ja) 1992-04-17 1993-11-12 Nippondenso Co Ltd 多層配線基板
JPH06274246A (ja) 1993-03-05 1994-09-30 Internatl Business Mach Corp <Ibm> コンピュータ、プリント回路基板、動作方法及び製造方法
JPH1140906A (ja) 1997-07-23 1999-02-12 Olympus Optical Co Ltd 電気回路基板
JPH11163539A (ja) 1997-11-25 1999-06-18 Kyocera Corp 多層配線基板
JP2002176231A (ja) * 2000-12-05 2002-06-21 Nippon Mektron Ltd 両面可撓性回路基板

Also Published As

Publication number Publication date
US9426881B2 (en) 2016-08-23
WO2009013988A1 (en) 2009-01-29
US20100126760A1 (en) 2010-05-27
CN101606444A (zh) 2009-12-16
KR20100018619A (ko) 2010-02-17
KR101187225B1 (ko) 2012-10-05
JP5173298B2 (ja) 2013-04-03
JP2009032765A (ja) 2009-02-12

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20110216

Termination date: 20200627