CN100561801C - 一种板对板的连接结构 - Google Patents

一种板对板的连接结构 Download PDF

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CN100561801C
CN100561801C CNB2006100332572A CN200610033257A CN100561801C CN 100561801 C CN100561801 C CN 100561801C CN B2006100332572 A CNB2006100332572 A CN B2006100332572A CN 200610033257 A CN200610033257 A CN 200610033257A CN 100561801 C CN100561801 C CN 100561801C
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circuit board
flexible circuit
plate
brace
weld pad
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CN101005170A (zh
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王渊博
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Nantong Tianmu Insulating Composite Materials Co ltd
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Yangxin Technology Co ltd
Hongfujin Precision Industry Shenzhen Co Ltd
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Priority to US11/309,754 priority patent/US20070173084A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

一种板对板的连接结构，包括一软性电路板和一与该软性电路板相固接的刚性电路板，该刚性电路板底部设置有若干个第一焊垫，该软性电路板上设置有若干个第二焊垫，该第二焊垫与第一焊垫相固接且相电连接，刚性电路板底部还设置有若干个第一连接片，所述第一连接片设置于刚性电路板底部的四角或所述第一焊垫所围成区域的四周，该软性电路板上还设置有与所述第一连接片对应的第二连接片，该第二连接片与第一连接片相固接，能提高软性电路板和刚性电路板之间的接合强度。

Description

一种板对板的连接结构
【技术领域】
本发明涉及一种板对板的连接结构，尤其是一种刚性电路板与软性电路板的连接结构。
【背景技术】
目前，越来越多的功能被赋予移动电话等便携式电子装置以满足消费者的多种需求，照相功能便是其中之一。通常，具有照相功能的移动电话等便携式电子装置包括一用于照相的数码相机模组，该数码相机模组安装在一软性电路板上，其通过软性电路板与便携式电子装置的主电路板的电连接实现与便携式电子装置的主电路板的电信号的传输。该数码相机模组通常包括一用于承载影像感测芯片的基板，该基板底部设置有若干个用于传输影像感测信号的焊垫。通常，用于安装数码相机模组的软性电路板，其具有一安装区，该安装区内设置有若干个与基板的焊垫相对应的焊垫。该软性电路板的焊垫通过表面安装技术(Surface Mounted Technology，SMT)与基板的焊垫相对应地电连接。
由于便携式电子装置日趋轻薄短小，相应的，其所需要的数码相机模组也需满足轻薄短小的要求，而与数码相机模组的基板相结合的软性电路板的安装区也须与基板的尺寸大致相同。由于大多数的数码相机模组的基板底部是呈矩形的，其底部的四角处并不与软性电路板相连接，因此在生产及使用过程中，很可能有异常的作用力施加在软性电路板的四个角上，从而会导致软性电路板由基板底部的四角处开始剥离，甚至影响软性电路板的焊垫与基板的焊垫的电连接，由此而导致数码相机模组不能正常工作。
一般现有技术的解决方法有两种，一种是将硬性材料，如塑料、金属等，设置在软性电路板下用作衬材以加强此区域的强度，然而这样会让软性电路板失去易曲性；另一种是在软性电路板与基板接合处涂布粘胶以加固软性电路板与基板的粘接强度，然而这样需要额外的点胶工艺流程。
【发明内容】
有鉴于此，有必要提供一种既能提高接合强度又不致损害软性电路板易曲性的板对板的连接结构。
一种板对板的连接结构，包括一软性电路板和一与该软性电路板相固接的刚性电路板，该刚性电路板底部设置有若干个第一焊垫，该软性电路板上设置有若干个第二焊垫，该第二焊垫与第一焊垫相固接且相电连接，刚性电路板底部还设置有若干个第一连接片，所述第一连接片设置于刚性电路板底部的四角或所述第一焊垫所围成区域的四周，该软性电路板上还设置有与所述第一连接片对应的第二连接片，该第二连接片与第一连接片相固接。
与现有技术相比，所述板对板的连接结构是通过设置于刚性电路板底部的若干个连接片和设置于软性电路板的若干个连接片的相互接合，提高软性电路板与刚性电路板的接合强度，并且不损害软性电路板的易曲性。
【附图说明】
图1是本发明一种板对板的连接结构的一较佳实施方式的分解立体示意图；
图2是本发明一种板对板的连接结构的一较佳实施方式的组装立体示意图；
图3是本发明一种板对板的连接结构的一较佳实施方式的影像感测芯片封装的立体示意图。
【具体实施方式】
请一并参照图1、图2和图3所示，本发明的板对板的连接结构的较佳实施方式以一软性电路板10与一数码相机模组20的基板210的连接为例。
数码相机模组20包括一影像感测芯片封装21、一镜座23及一镜头模组25，其中镜头模组25螺接于镜座23内，该镜座23固设于影像感测芯片封装21上。
该影像感测芯片封装21包括一基板210、若干个第一焊垫212及若干个第一连接片214。该基板210的底部呈矩形，在本较佳实施方式中，该若干个第一焊垫212设置于基板210底部四周，其用于与软性电路板10相电连接以将该影像感测芯片封装21的信号输出或者输入其他电路传输的电信号。该若干个第一连接片214分别设置于该基板210底部的四角。
该软性电路板10包括一与基板210的底部的尺寸大致相同的安装区11和一用于与其他电子元件相电连接的连接器12。该安装区11上设置有若干个第二焊垫112及若干个第二连接片114。该软性电路板10的第二焊垫112与基板210的第一焊垫212相对应的设置于该安装区11的四周，且该第二焊垫112通过该软性电路板10的内部电路(图未示)与该软性电路板10的连接器12相电连接。该软性电路板10的第二连接片114与基板210的第一连接片214相对应地设置于该软性电路板10的安装区11的四角。
安装该数位相机模组20于软性电路板10上时，先提供一影像感测芯片封装21；再提供一软性电路板10，烘烤该软性电路板10，并在软性电路板10的第二焊垫112和第二连接片114上印刷锡膏；将该影像感测芯片封装21的基板210的第一焊垫212和第一连接片214分别与软性电路板10的第二焊垫112及第二连接片114对齐接触放置；确认放置无误后过回焊炉将基板210和软性电路板10接合；在出回焊炉冷却后再进行基板210和软性电路板10的放置量测，量测合格后即完成影像感测芯片封装21和软性电路板10的安装；然后，将镜座23固设于影像感测芯片封装21上；最后，将镜头25螺接于镜座23上。如此，便完成该数位相机模组20与该软性电路板10的安装。
可以理解，所述基板的第一焊垫也可以按其他方式布设在基板底部，如双排方式或球状方式，相应的，软性电路板的第二焊垫也作相应的设置。
可以理解，所述基板的第一连接片也可以随基板的第一焊垫布设方式的变化而进行不同方式的布设，如基板的第一焊垫以球状方式紧密地布设在基板底部的中心，基板的第一连接片可以布设在第一焊垫所围成区域的四周，相应的，软性电路板的第二连接片也作相应的设置，如此，通过若干个第一连接片和第二连接片的相互接合，能提高软性电路板与基板封装的接合强度，并且不损害软性电路板的易曲性。

Claims (5)

1.一种板对板的连接结构，包括一软性电路板和一与该软性电路板相固接的刚性电路板，该刚性电路板底部设置有若干个第一焊垫，该软性电路板上设置有若干个第二焊垫，该第二焊垫与第一焊垫相固接且相电连接，其特征在于：所述刚性电路板底部还设置有若干个第一连接片，所述第一连接片设置于刚性电路板底部的四角或所述第一焊垫所围成区域的四周，该软性电路板上还设置有与所述第一连接片对应的第二连接片，该第二连接片与第一连接片相固接。
2.如权利要求1所述的板对板的连接结构，其特征在于：所述若干个第一焊垫设置在刚性电路板的底部四周，所述若干个第一连接片设置在刚性电路板的底部四角。
3.如权利要求2所述的板对板的连接结构，其特征在于：所述第二焊垫和第二连接片与刚性电路板的第一焊垫和第一连接片分别相对应地设置在软性电路板上。
4.如权利要求1所述的板对板的连接结构，其特征在于：所述刚性电路板为一数码相机模组的基板。
5.如权利要求1所述的板对板的连接结构，其特征在于：所述软性电路板还包括一连接器和内部电路，软性电路板的第二焊垫通过内部电路与软性电路板的连接器相电连接。
CNB2006100332572A 2006-01-21 2006-01-21 一种板对板的连接结构 Expired - Fee Related CN100561801C (zh)

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US11/309,754 US20070173084A1 (en) 2006-01-21 2006-09-22 Board-to-board connecting structure

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JP5173298B2 (ja) * 2007-07-25 2013-04-03 キヤノン株式会社 プリント配線板およびそれを用いた電子機器
US8489458B2 (en) 2009-02-24 2013-07-16 Google Inc. Rebroadcasting of advertisements in a social network
KR102244153B1 (ko) * 2013-09-13 2021-04-23 엘지이노텍 주식회사 카메라 모듈
WO2020066054A1 (ja) * 2018-09-27 2020-04-02 株式会社ケーヒン 電子制御装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118666A (en) * 1998-01-12 2000-09-12 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed wiring board and connecting structure thereof
CN2497511Y (zh) * 2001-08-10 2002-06-26 英群企业股份有限公司 软性电路板与pc板连结构造
CN2733635Y (zh) * 2004-07-27 2005-10-12 美国莫列斯股份有限公司 电连接器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6654064B2 (en) * 1997-05-23 2003-11-25 Canon Kabushiki Kaisha Image pickup device incorporating a position defining member
US7122787B2 (en) * 2003-05-09 2006-10-17 Matsushita Electric Industrial Co., Ltd. Imaging apparatus with three dimensional circuit board
US20060049492A1 (en) * 2004-09-08 2006-03-09 Holloway Jeffrey G Reduced foot print lead-less package with tolerance for thermal and mechanical stresses and method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118666A (en) * 1998-01-12 2000-09-12 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed wiring board and connecting structure thereof
CN2497511Y (zh) * 2001-08-10 2002-06-26 英群企业股份有限公司 软性电路板与pc板连结构造
CN2733635Y (zh) * 2004-07-27 2005-10-12 美国莫列斯股份有限公司 电连接器

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Granted publication date: 20091118

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