CN104966724B - 配置摄像头模组于终端主板的方法及终端设备 - Google Patents
配置摄像头模组于终端主板的方法及终端设备 Download PDFInfo
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Abstract
本发明提供一种配置摄像头模组于终端主板的方法及终端设备。该配置摄像头模组于终端主板的方法至少包括如下步骤:提供摄像头模组、终端主板;将金属导线的第一端键合于所述摄像头模组的图像传感器芯片的焊盘,所述金属导线悬空;焊接或键合所述金属导线的第二端于所述终端主板的焊盘。通过本发明的方法及终端设备,摄像头模组的图像传感器芯片无需通过辅助基板,而直接经由金属导线焊接或键合于终端主板,从而减小了摄像头模组的厚度,降低了摄像头模组的成本,进而降低了整个终端设备的体积和成本,同时减小了电流路径和电路损失,提高了图像传感器的综合性能和图像质量。
Description
技术领域
本发明涉及半导体制造领域,具体涉及一种配置摄像头模组于终端主板的方法及终端设备。
背景技术
便携式终端设备的摄像头模组主要由镜头、滤光片、图像传感器芯片等部件组成。因其小型化、低功耗、低成本及高影像品质等优点而广泛地应用于各种便携式终端设备中。
其中,图像传感器芯片用于感受光学图像信息并将其转换成可用输出信号。图像传感器芯片在工作过程中容易受到外界环境的污染,所以需要对图像传感器芯片进行封装,使图像传感器芯片处于密封环境下,从而避免外界环境对图像传感器芯片的影响,从而提高图像传感器芯片的性能和使用寿命。
如图1所示,在采用金属导线键合方式的图像传感器芯片封装工艺中,通常先将图像传感器芯片10固晶(例如粘接或焊接)到辅助基板40上,辅助基板可以为柔性电路板(Flexible Printed Circuit board,FPC),例如具有金手指的FPC,然后进行键合焊线,将金属导线20的第一端连接于图像传感器芯片10的焊盘上,第二端连接于辅助基板40上,由此实现图像传感器芯片10和辅助基板40的电气连接,然后再将封装后的图像传感器芯片10通过辅助基板40上的连接器41与终端主板30相连。辅助基板40的连接器41包括塑胶本体及接触端子,终端主板30上配置相应的连接器31才能导通信号,而这样会导致整个摄像头模组的厚度增加,摄像头模组的成本也会增加,进而造成整个终端设备体积大,成本高,并且由于辅助基板及连接器的转接,进一步增加了电流路径和电路损失,影响图像传感器的信号传输和综合性能,不利于图像质量的提高。
发明内容
本发明的目的在于提供一种配置摄像头模组于终端主板的方法及终端设备,以减小摄像头模组的厚度,降低摄像头模组的成本,进而降低整个终端设备的体积和成本,同时提高图像传感器性能和图像质量。
为实现上述目的,本发明采用如下技术方案:
本发明的一个方面提供一种配置摄像头模组于终端主板的方法,至少包括如下步骤:提供摄像头模组、终端主板;将金属导线的第一端键合于所述摄像头模组的图像传感器芯片的焊盘,所述金属导线悬空;焊接或键合所述金属导线的第二端于所述终端主板的焊盘。
其中,所述摄像头模组未通过辅助基板,直接经由所述金属导线焊接或键合于所述终端主板。
其中,采用快速焊接方式将所述图像传感器芯片焊接至所述终端主板。
其中,所述快速焊接方式为:利用热气流焊、激光焊、热压焊或超声波焊,将所述图像传感器芯片快速焊接至所述终端主板。
其中,所述图像传感器芯片包括图像感应区与环绕所述图像感应区的焊盘,将所述焊盘电性连接于延伸出所述图像传感器芯片外部的金属导线。
其中,于图像传感器芯片的周围未连接有金属导线的区域配置支撑板,适于为图像传感器芯片放置于终端主板提供支撑。
本发明的另一方面提供一种终端设备,包括终端主板和摄像头模组,还包括悬空的金属导线,所述金属导线的第一端键合于所述摄像头模组的图像传感器芯片的焊盘,所述金属导线的第二端焊接或键合于所述终端主板的焊盘。
其中,所述图像传感器芯片包括图像感应区与环绕所述图像感应区的焊盘,所述焊盘电性连接于延伸出所述图像传感器芯片外部的金属导线。
其中,所述终端设备还包括支撑板,所述支撑板配置于所述图像传感器芯片的周围未连接有金属导线的区域,适于为图像传感器芯片放置于终端主板提供支撑。
其中,所述终端主板具有凹槽或镂空区域,所述摄像头模组至少部分地容纳于所述终端主板的凹槽或镂空区域中。
与现有技术相比,本发明具有如下技术效果:
通过本发明的方法及终端设备,摄像头模组的图像传感器芯片无需通过辅助基板,而直接经由金属导线焊接或键合于终端主板,从而减小了摄像头模组的厚度,降低了摄像头模组的成本,进而降低了整个终端设备的体积和成本,同时减小了电流路径和电路损失,提高了图像传感器的综合性能和图像质量。
附图说明
通过说明书附图以及随后与说明书附图一起用于说明本发明某些原理的具体实施方式,本发明所具有的其它特征和优点将变得清楚或得以更为具体地阐明。
图1为现有摄像头模组与终端主板的连接示意图;
图2为本发明配置摄像头模组于终端主板的方法流程图;
图3为根据本发明实施例1的摄像头模组与终端主板的连接示意图;
图4为根据本发明实施例2的摄像头模组与终端主板的连接示意图;
图5为本发明实施例2中支撑板的一个实施方式的结构示意图;
图6为本发明实施例2中支撑板的另一实施方式的结构示意图。
具体实施方式
下面结合本发明的说明书附图及如下若干实施例对本发明进行具体阐述。
正如本发明背景技术所述,现有的图像传感器芯片封装工艺中,通常先通过金属导线实现图像传感器芯片和辅助基板的电气连接,再通过辅助基板将图像传感器芯片与终端主板相连,这样会导致整个摄像头模组的厚度增加,摄像头模组的成本也会增加,进而造成整个终端设备体积大,成本高,并且由于辅助基板及连接器的转接,进一步增加了电流路径和电路损失,影响图像传感器的信号传输和综合性能,不利于图像质量的提高。
为此,本发明的一方面提供一种配置摄像头模组于终端主板的方法,如图2所示,该方法至少包括如下步骤:
S1:提供摄像头模组、终端主板;
S2:将金属导线的第一端键合于所述摄像头模组的图像传感器芯片的焊盘,所述金属导线悬空;
S3:焊接或键合所述金属导线的第二端于所述终端主板的焊盘。
通过上述方法,摄像头模组的图像传感器芯片无需通过辅助基板,而直接经由金属导线焊接或键合于终端主板,从而减小了摄像头模组的厚度,降低了摄像头模组的成本,进而降低了整个终端设备的体积和成本,同时减小了电流路径和电路损失,提高了图像传感器的综合性能和图像质量。
实施例1
图3为根据本发明实施例1的摄像头模组与终端主板的连接示意图。
首先,提供摄像头模组100、终端主板130。其中,摄像头模组100包括图像传感器芯片110,滤光片101以及镜头102;图像传感器芯片110包括图像感应区111以及环绕图像感应区111的焊盘112。
优选地,终端主板130具有凹槽132,所述摄像头模组100至少部分地容纳于所述终端主板130的凹槽132中,以进一步减小摄像头模组100配置于终端主板130后的整体厚度。
然后,将金属导线120的第一端键合于所述摄像头模组100的图像传感器芯片110的焊盘112,并保持所述金属导线120悬空,也就是说,将所述焊盘112电性连接于延伸出所述图像传感器芯片110外部的金属导线120。
接下来,焊接或键合所述金属导线120的第二端于所述终端主板130的焊盘133,在本实施例中,焊盘133设置于终端主板130的上表面。于是,所述摄像头模组100未通过辅助基板,直接经由所述金属导线120焊接或键合于所述终端主板130,从而减小了摄像头模组的厚度,降低了摄像头模组的成本,进而降低了整个终端设备的体积和成本,同时减小了电流路径和电路损失,提高了图像传感器的综合性能和图像质量。
优选地,采用快速焊接方式将所述图像传感器芯片110焊接至所述终端主板130,也就是说,采用快速焊接方式分别将所述金属导线120的第一端焊接至图像传感器芯片110的焊盘112,将所述金属导线120的第二端焊接至终端主板130的焊盘133。
进一步优选地,所述快速焊接方式可以为:利用热气流焊、激光焊、热压焊或超声波焊。
本实施例还提供了由上述方法形成的终端设备,如图3所示,该终端设备包括终端主板130,摄像头模组100,以及悬空的金属导线120,所述金属导线120的第一端键合于所述摄像头模组100的图像传感器芯片110的焊盘112,所述金属导线120的第二端焊接或键合于所述终端主板130的焊盘133。
其中,图像传感器芯片110包括图像感应区111以及环绕图像感应区111的焊盘112,所述焊盘112电性连接于延伸出所述图像传感器芯片110外部的金属导线120。
优选地,所述终端主板130具有凹槽132,所述摄像头模组100至少部分地容纳于所述终端主板130的凹槽132中,以进一步减小摄像头模组100配置于终端主板130后的整体厚度。
实施例2
图4为根据本发明实施例2的摄像头模组与终端主板的连接示意图。
首先,提供摄像头模组200、终端主板230。其中,摄像头模组200包括图像传感器芯片210,滤光片201以及镜头202;图像传感器芯片210包括图像感应区211以及环绕图像感应区211的焊盘212。
优选地,终端主板230具有镂空区域232,所述摄像头模组200至少部分地容纳于所述终端主板230的镂空区域232中,以进一步减小摄像头模组200配置于终端主板230后的整体厚度。
然后,将金属导线220的第一端键合于所述摄像头模组200的图像传感器芯片210的焊盘212,并保持所述金属导线220悬空,也就是说,将所述焊盘212电性连接于延伸出所述图像传感器芯片210外部的金属导线220。
接下来,焊接或键合所述金属导线220的第二端于所述终端主板230的焊盘233,在本实施例中,焊盘233设置于终端主板230的下表面。于是,所述摄像头模组200未通过辅助基板,直接经由所述金属导线220焊接或键合于所述终端主板230,从而减小了摄像头模组的厚度,降低了摄像头模组的成本,进而降低了整个终端设备的体积和成本,同时减小了电流路径和电路损失,提高了图像传感器的综合性能和图像质量。
优选地,采用快速焊接方式将所述图像传感器芯片210焊接至所述终端主板230,也就是说,采用快速焊接方式分别将所述金属导线220的第一端焊接至图像传感器芯片210的焊盘212,将所述金属导线220的第二端焊接至终端主板230的焊盘233。
进一步优选地,所述快速焊接方式可以为:利用热气流焊、激光焊、热压焊或超声波焊。
此外,在本实施例中,该方法还包括于图像传感器芯片210的周围未连接有金属导线220的区域配置支撑板250,该支撑板250可以通过粘接或者焊接方式与图像传感器芯片210、终端主板230分别相连,适于为图像传感器芯片210放置于终端主板230提供支撑。
图5示出支撑板250的一个实施方式。针对金属导线220对称分布于图像传感器芯片210两侧的情况,支撑板250呈垂直于金属导线220延伸的长方形设置(如图中虚线包围区域所示),以使其避开图像传感器芯片210的周围连接有金属导线220的区域,而仅仅位于图像传感器芯片210的周围未连接有金属导线220的区域,从而既能为图像传感器芯片210放置于终端主板230提供支撑,又能避免影响金属导线220的强度及信号传输。
图6示出支撑板250的另一实施方式。针对金属导线220分别分布于图像传感器芯片210四周的情况,支撑板250呈不规则形状设置(如图中虚线包围区域所示),以使其避开图像传感器芯片210的周围连接有金属导线220的区域,而仅仅位于图像传感器芯片210的周围未连接有金属导线220的区域,从而既能为图像传感器芯片210放置于终端主板230提供支撑,又能避免影响金属导线220的强度及信号传输。
本实施例还提供了由上述方法形成的终端设备,该终端设备包括终端主板230,摄像头模组200,以及悬空的金属导线220,所述金属导线220的第一端键合于所述摄像头模组200的图像传感器芯片210的焊盘212,所述金属导线220的第二端焊接或键合于所述终端主板230的焊盘233。
其中,图像传感器芯片210包括图像感应区211以及环绕图像感应区211的焊盘212,所述焊盘212电性连接于延伸出所述图像传感器芯片210外部的金属导线220。
优选地,所述终端主板230具有镂空区域232,所述摄像头模组200至少部分地容纳于所述终端主板230的镂空区域232中,以进一步减小摄像头模组200配置于终端主板230后的整体厚度。
优选地,所述终端设备还包括支撑板250,所述支撑板250配置于所述图像传感器芯片210的周围未连接有金属导线220的区域,适于为图像传感器芯片210放置于终端主板230提供支撑。
通过本发明的方法及终端设备,摄像头模组的图像传感器芯片无需通过辅助基板,而直接经由金属导线焊接或键合于终端主板,从而减小了摄像头模组的厚度,降低了摄像头模组的成本,进而降低了整个终端设备的体积和成本,同时减小了电流路径和电路损失,提高了图像传感器的综合性能和图像质量。
虽然本发明披露如上,但本发明并非限定于此。任何本领域技术人员,在不脱离本发明的精神和范围内,均可作各种更动与修改,因此本发明的保护范围应当以权利要求所限定的范围为准。
Claims (5)
1.一种配置摄像头模组于终端主板的方法,其特征在于,至少包括如下步骤:
提供摄像头模组、终端主板, 所述摄像头模组包括图像传感器芯片,滤光片以及镜头,所述终端主板具有凹槽或镂空区域,所述摄像头模组至少部分地容纳于所述终端主板的凹槽或镂空区域中;
将金属导线的第一端键合于所述摄像头模组的图像传感器芯片的焊盘,所述金属导线悬空;
焊接或键合所述金属导线的第二端于所述终端主板的焊盘;
于图像传感器芯片的周围未连接有金属导线的区域配置支撑板,适于为图像传感器芯片放置于终端主板提供支撑;针对金属导线对称分布于图像传感器芯片两侧的情况,支撑板呈垂直于金属导线延伸的长方形设置;针对金属导线分别分布于图像传感器芯片四周的情况,支撑板呈不规则形状设置。
2.根据权利要求1所述的配置摄像头模组于终端主板的方法,其特征在于,所述摄像头模组未通过辅助基板,直接经由所述金属导线焊接或键合于所述终端主板。
3.根据权利要求1所述的配置摄像头模组于终端主板的方法,其特征在于:采用快速焊接方式将所述图像传感器芯片焊接至所述终端主板。
4.根据权利要求3所述的配置摄像头模组于终端主板的方法,其特征在于,所述快速焊接方式为:利用热气流焊、激光焊、热压焊或超声波焊,将所述图像传感器芯片快速焊接至所述终端主板。
5.根据权利要求1所述的配置摄像头模组于终端主板的方法,其特征在于,所述图像传感器芯片包括图像感应区与环绕所述图像感应区的焊盘,将所述焊盘电性连接于延伸出所述图像传感器芯片外部的金属导线。
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