CN101583558B - 结构部件、其制造方法和包含其的器件 - Google Patents

结构部件、其制造方法和包含其的器件 Download PDF

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Publication number
CN101583558B
CN101583558B CN2008800025406A CN200880002540A CN101583558B CN 101583558 B CN101583558 B CN 101583558B CN 2008800025406 A CN2008800025406 A CN 2008800025406A CN 200880002540 A CN200880002540 A CN 200880002540A CN 101583558 B CN101583558 B CN 101583558B
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China
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substrate
electrode
movable
movable member
trenches
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CN2008800025406A
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Chinese (zh)
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CN101583558A (zh
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香取笃史
张建六
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Canon Inc
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Canon Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Gyroscopes (AREA)
CN2008800025406A 2007-01-19 2008-01-10 结构部件、其制造方法和包含其的器件 Expired - Fee Related CN101583558B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP009657/2007 2007-01-19
JP2007009657A JP5110885B2 (ja) 2007-01-19 2007-01-19 複数の導電性の領域を有する構造体
PCT/JP2008/050561 WO2008088032A1 (en) 2007-01-19 2008-01-10 Structural member having a plurality of conductive regions

Publications (2)

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CN101583558A CN101583558A (zh) 2009-11-18
CN101583558B true CN101583558B (zh) 2013-07-03

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US (1) US8596121B2 (enExample)
EP (1) EP2125604A1 (enExample)
JP (1) JP5110885B2 (enExample)
CN (1) CN101583558B (enExample)
RU (1) RU2445254C2 (enExample)
TW (1) TWI356037B (enExample)
WO (1) WO2008088032A1 (enExample)

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EP3161416A2 (en) * 2014-06-26 2017-05-03 Lumedyne Technologies Incorporated Systems and methods for extracting system parameters from nonlinear periodic signals from sensors
TWI676029B (zh) 2015-05-20 2019-11-01 美商路梅戴尼科技公司 用於決定慣性參數之方法及系統
JP2017009322A (ja) * 2015-06-17 2017-01-12 三菱電機株式会社 加速度センサおよびその製造方法
US10315915B2 (en) * 2015-07-02 2019-06-11 Kionix, Inc. Electronic systems with through-substrate interconnects and MEMS device
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JP6674397B2 (ja) * 2017-02-17 2020-04-01 株式会社日立製作所 加速度センサ
CN107582081B (zh) * 2017-10-31 2020-01-10 京东方科技集团股份有限公司 一种检测装置及一种疲劳检测系统
JP7464374B2 (ja) * 2019-10-23 2024-04-09 浜松ホトニクス株式会社 ミラーデバイスの製造方法
JP7467069B2 (ja) * 2019-10-23 2024-04-15 浜松ホトニクス株式会社 ミラーデバイスの製造方法
CN117192153B (zh) * 2023-08-17 2025-11-04 江苏细胞壁智能科技有限公司 一种加速度传感器敏感组件及加速度传感器芯片结构

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Also Published As

Publication number Publication date
WO2008088032A1 (en) 2008-07-24
US20100107758A1 (en) 2010-05-06
JP2008173719A (ja) 2008-07-31
RU2009131457A (ru) 2011-02-27
US8596121B2 (en) 2013-12-03
JP5110885B2 (ja) 2012-12-26
TW200844034A (en) 2008-11-16
RU2445254C2 (ru) 2012-03-20
CN101583558A (zh) 2009-11-18
TWI356037B (en) 2012-01-11
EP2125604A1 (en) 2009-12-02

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