CN101581733B - 探针装置和接触位置的修正方法 - Google Patents
探针装置和接触位置的修正方法 Download PDFInfo
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- CN101581733B CN101581733B CN2009101407989A CN200910140798A CN101581733B CN 101581733 B CN101581733 B CN 101581733B CN 2009101407989 A CN2009101407989 A CN 2009101407989A CN 200910140798 A CN200910140798 A CN 200910140798A CN 101581733 B CN101581733 B CN 101581733B
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- 239000000523 sample Substances 0.000 title claims abstract description 120
- 238000000034 method Methods 0.000 title description 8
- 238000007689 inspection Methods 0.000 claims description 16
- 238000002715 modification method Methods 0.000 claims description 16
- 230000000052 comparative effect Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 abstract description 72
- 238000012360 testing method Methods 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract 3
- 230000007246 mechanism Effects 0.000 description 20
- 238000005516 engineering process Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000009183 running Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-128145 | 2008-05-15 | ||
| JP2008128145A JP2009276215A (ja) | 2008-05-15 | 2008-05-15 | プローブ装置及びコンタクト位置の補正方法 |
| JP2008128145 | 2008-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101581733A CN101581733A (zh) | 2009-11-18 |
| CN101581733B true CN101581733B (zh) | 2011-12-21 |
Family
ID=41315591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101407989A Active CN101581733B (zh) | 2008-05-15 | 2009-05-15 | 探针装置和接触位置的修正方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US8130004B2 (enExample) |
| JP (1) | JP2009276215A (enExample) |
| KR (1) | KR101059603B1 (enExample) |
| CN (1) | CN101581733B (enExample) |
| TW (1) | TWI437236B (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5308948B2 (ja) * | 2009-07-23 | 2013-10-09 | ルネサスエレクトロニクス株式会社 | 半導体デバイスの検査装置及び方法 |
| KR101083346B1 (ko) * | 2010-12-09 | 2011-11-15 | 주식회사 이노비즈 | 엘이디 칩 검사장치 |
| JP5687172B2 (ja) * | 2011-11-01 | 2015-03-18 | 三菱電機株式会社 | 半導体テスト治具およびそれを用いた耐圧測定方法 |
| JP6031292B2 (ja) * | 2012-07-31 | 2016-11-24 | 東京エレクトロン株式会社 | プローブカードへの基板当接方法 |
| JP5993649B2 (ja) * | 2012-07-31 | 2016-09-14 | 東京エレクトロン株式会社 | プローブカードへの基板当接装置、基板当接装置を備えた基板検査装置、及びプローブカードへの基板当接方法 |
| CN104793118B (zh) * | 2014-01-17 | 2017-11-03 | 中芯国际集成电路制造(上海)有限公司 | 设定测试针压的方法 |
| CN103792483B (zh) * | 2014-01-24 | 2016-04-06 | 苏州高新区世纪福科技有限公司 | 手机pcb板测试装置 |
| US10281518B2 (en) * | 2014-02-25 | 2019-05-07 | Formfactor Beaverton, Inc. | Systems and methods for on-wafer dynamic testing of electronic devices |
| JP6423660B2 (ja) * | 2014-09-09 | 2018-11-14 | 東京エレクトロン株式会社 | ウエハ検査装置における検査用圧力設定値決定方法 |
| KR102396428B1 (ko) | 2014-11-11 | 2022-05-11 | 삼성전자주식회사 | 반도체 테스트 장치 및 방법 |
| CN104459230A (zh) * | 2014-11-26 | 2015-03-25 | 上海华力微电子有限公司 | 一种探针保护装置 |
| JP6890921B2 (ja) * | 2015-10-21 | 2021-06-18 | 株式会社日本マイクロニクス | プローブカード及び接触検査装置 |
| US10372121B2 (en) * | 2016-04-26 | 2019-08-06 | Ford Global Technologies, Llc | Determination of continuous user interaction and intent through measurement of force variability |
| DE112016007382T5 (de) * | 2016-10-26 | 2019-09-26 | Mitsubishi Electric Corporation | Inspektionsvorrichtung und Inspektionsverfahren |
| JP6745197B2 (ja) * | 2016-11-04 | 2020-08-26 | 浜松ホトニクス株式会社 | 超音波検査装置及び超音波検査方法 |
| US10509071B2 (en) * | 2016-11-18 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for aligning probe card in semiconductor device testing |
| KR102654604B1 (ko) * | 2016-11-22 | 2024-04-03 | 세메스 주식회사 | 프로브 스테이션 |
| US10388579B2 (en) * | 2017-09-21 | 2019-08-20 | Texas Instruments Incorporated | Multi-plate semiconductor wafer testing systems |
| WO2019130952A1 (ja) * | 2017-12-28 | 2019-07-04 | 日本電産リード株式会社 | 検査装置及び検査方法 |
| CN111239448B (zh) * | 2018-11-28 | 2024-05-03 | 长鑫存储技术有限公司 | 测试机以及用于校准探针卡与待测器件的方法 |
| WO2020108352A1 (en) * | 2018-11-28 | 2020-06-04 | Changxin Memory Technologies, Inc. | Tester and method for calibrating probe card and device under testing (dut) |
| CN109633273B (zh) * | 2018-11-30 | 2021-06-04 | 上海无线电设备研究所 | 一种用于开孔式负载阻抗测试系统及其方法 |
| US11656181B2 (en) | 2018-12-21 | 2023-05-23 | Industrial Technology Research Institute | Inspection apparatus and inspection method for inspecting light-emitting diodes |
| CN110187255B (zh) * | 2019-04-15 | 2021-10-15 | 上海华力集成电路制造有限公司 | 一种建立探针测试程式时确定过驱动量的方法 |
| CN110045269A (zh) * | 2019-05-09 | 2019-07-23 | 肇庆学院 | 一种芯片测试装置及方法 |
| JP7374682B2 (ja) * | 2019-09-17 | 2023-11-07 | 株式会社国際電気セミコンダクターサービス | 抵抗率測定器、半導体装置の製造方法および抵抗率測定方法 |
| JP7421990B2 (ja) * | 2020-04-08 | 2024-01-25 | 株式会社日本マイクロニクス | 電気的接続装置および検査方法 |
| US20240094261A1 (en) * | 2020-08-12 | 2024-03-21 | Microfabrica Inc. | Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms |
| KR102721104B1 (ko) * | 2020-09-22 | 2024-10-23 | 세메스 주식회사 | 프로브 스테이션 |
| WO2023106150A1 (ja) * | 2021-12-08 | 2023-06-15 | 東京エレクトロン株式会社 | 検査方法、補正量算出方法および検査装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3208734B2 (ja) * | 1990-08-20 | 2001-09-17 | 東京エレクトロン株式会社 | プローブ装置 |
| US7382142B2 (en) * | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
| JP2002313857A (ja) * | 2001-04-12 | 2002-10-25 | Ando Electric Co Ltd | 距離変化出力装置及び方法 |
| JP4782953B2 (ja) | 2001-08-06 | 2011-09-28 | 東京エレクトロン株式会社 | プローブカード特性測定装置、プローブ装置及びプローブ方法 |
| JP2003168707A (ja) | 2001-11-30 | 2003-06-13 | Tokyo Electron Ltd | プローブ装置 |
| JP2004265895A (ja) * | 2003-01-20 | 2004-09-24 | Tokyo Electron Ltd | 光学的測長器を備えたプローブ装置及びプローブ検査方法 |
| JP4246010B2 (ja) | 2003-07-30 | 2009-04-02 | 東京エレクトロン株式会社 | 検査装置 |
| JP2006186130A (ja) | 2004-12-28 | 2006-07-13 | Matsushita Electric Ind Co Ltd | 半導体検査装置 |
| JP4817830B2 (ja) * | 2005-12-14 | 2011-11-16 | 株式会社東京精密 | プローバ、プローブ接触方法及びそのためのプログラム |
| JP2007183193A (ja) * | 2006-01-10 | 2007-07-19 | Micronics Japan Co Ltd | プロービング装置 |
| JP2007218850A (ja) * | 2006-02-20 | 2007-08-30 | Sumitomo Electric Ind Ltd | プローブピン、プローブカード、検査装置および検査装置の制御方法 |
| JP2008028103A (ja) | 2006-07-20 | 2008-02-07 | Fujifilm Corp | ウエハプローバ |
| JP2008243861A (ja) | 2007-03-23 | 2008-10-09 | Tokyo Electron Ltd | 検査装置及び検査方法 |
-
2008
- 2008-05-15 JP JP2008128145A patent/JP2009276215A/ja active Pending
-
2009
- 2009-05-13 KR KR1020090041659A patent/KR101059603B1/ko active Active
- 2009-05-14 US US12/466,107 patent/US8130004B2/en active Active
- 2009-05-14 TW TW098116016A patent/TWI437236B/zh active
- 2009-05-15 CN CN2009101407989A patent/CN101581733B/zh active Active
-
2012
- 2012-01-26 US US13/358,669 patent/US20120119766A1/en not_active Abandoned
- 2012-01-26 US US13/358,635 patent/US20120126841A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| KR101059603B1 (ko) | 2011-08-25 |
| CN101581733A (zh) | 2009-11-18 |
| US20120126841A1 (en) | 2012-05-24 |
| US20090284277A1 (en) | 2009-11-19 |
| TW201007172A (en) | 2010-02-16 |
| US20120119766A1 (en) | 2012-05-17 |
| US8130004B2 (en) | 2012-03-06 |
| TWI437236B (zh) | 2014-05-11 |
| KR20090119715A (ko) | 2009-11-19 |
| JP2009276215A (ja) | 2009-11-26 |
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| C14 | Grant of patent or utility model | ||
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