CN101515627B - 半导体发光装置 - Google Patents

半导体发光装置 Download PDF

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Publication number
CN101515627B
CN101515627B CN2009101307410A CN200910130741A CN101515627B CN 101515627 B CN101515627 B CN 101515627B CN 2009101307410 A CN2009101307410 A CN 2009101307410A CN 200910130741 A CN200910130741 A CN 200910130741A CN 101515627 B CN101515627 B CN 101515627B
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CN
China
Prior art keywords
resin
light emitting
emitting device
semiconductor light
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101307410A
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English (en)
Chinese (zh)
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CN101515627A (zh
Inventor
幡俊雄
筱原久幸
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Sharp Corp
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Sharp Corp
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Publication date
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Publication of CN101515627A publication Critical patent/CN101515627A/zh
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Publication of CN101515627B publication Critical patent/CN101515627B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN2009101307410A 2008-02-06 2009-02-05 半导体发光装置 Expired - Fee Related CN101515627B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008026694A JP5349811B2 (ja) 2008-02-06 2008-02-06 半導体発光装置
JP2008-026694 2008-02-06
JP2008026694 2008-02-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201110427212.4A Division CN102522485B (zh) 2008-02-06 2009-02-05 半导体发光装置

Publications (2)

Publication Number Publication Date
CN101515627A CN101515627A (zh) 2009-08-26
CN101515627B true CN101515627B (zh) 2012-02-08

Family

ID=40930795

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2009101307410A Expired - Fee Related CN101515627B (zh) 2008-02-06 2009-02-05 半导体发光装置
CN201110427212.4A Expired - Fee Related CN102522485B (zh) 2008-02-06 2009-02-05 半导体发光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201110427212.4A Expired - Fee Related CN102522485B (zh) 2008-02-06 2009-02-05 半导体发光装置

Country Status (3)

Country Link
US (1) US7759692B2 (enExample)
JP (1) JP5349811B2 (enExample)
CN (2) CN101515627B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105221940A (zh) * 2014-06-16 2016-01-06 西铁城电子株式会社 Led发光装置

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JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
JP5322805B2 (ja) * 2009-06-26 2013-10-23 三菱電機株式会社 画像表示素子及びその製造方法
JP5613400B2 (ja) * 2009-11-18 2014-10-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
USD632658S1 (en) * 2010-04-26 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode
USD630172S1 (en) * 2010-04-26 2011-01-04 Everlight Electronics Co., Ltd. Light emitting diode
KR101039994B1 (ko) 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
JP2012028743A (ja) * 2010-06-22 2012-02-09 Panasonic Corp 半導体装置用パッケージおよびその製造方法ならびに半導体装置
JP2012033884A (ja) * 2010-06-29 2012-02-16 Panasonic Corp 半導体装置用パッケージおよびその製造方法ならびに半導体装置
KR101705700B1 (ko) * 2010-07-01 2017-02-10 엘지이노텍 주식회사 발광 소자
WO2012063704A1 (ja) 2010-11-11 2012-05-18 日亜化学工業株式会社 発光装置と、回路基板の製造方法
JP2012186450A (ja) 2011-02-16 2012-09-27 Rohm Co Ltd Ｌｅｄモジュール
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US10490712B2 (en) 2011-07-21 2019-11-26 Cree, Inc. Light emitter device packages, components, and methods for improved chemical resistance and related methods
EP2786429A4 (en) * 2011-12-01 2015-07-29 Cree Inc LIGHT-EMITTING DEVICES AND COMPONENTS WITH IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
JP6291800B2 (ja) * 2012-12-26 2018-03-14 日亜化学工業株式会社 半導体装置およびその製造方法
JP6396295B2 (ja) 2013-06-18 2018-09-26 シャープ株式会社 光源装置および発光装置
US9142745B2 (en) * 2013-08-27 2015-09-22 Glo Ab Packaged LED device with castellations
US9257616B2 (en) 2013-08-27 2016-02-09 Glo Ab Molded LED package and method of making same
US8999737B2 (en) 2013-08-27 2015-04-07 Glo Ab Method of making molded LED package
KR101476217B1 (ko) * 2014-05-28 2014-12-24 엘지전자 주식회사 황색 발광 형광체 및 이를 이용한 발광 소자 패키지
JP6314968B2 (ja) 2015-12-25 2018-04-25 日亜化学工業株式会社 発光装置
CN105742461A (zh) * 2016-02-25 2016-07-06 深圳市丽晶光电科技股份有限公司 一种封装led及其制造方法
JP6399057B2 (ja) * 2016-08-22 2018-10-03 日亜化学工業株式会社 発光装置
CN113285003B (zh) * 2021-04-30 2023-07-25 深圳市得润光学有限公司 一种制造led支架的方法以及led支架

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JP3910171B2 (ja) 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
JP2005158958A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
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US20060125716A1 (en) * 2004-12-10 2006-06-15 Wong Lye Y Light-emitting diode display with compartment
JP4811905B2 (ja) * 2005-02-25 2011-11-09 ローム株式会社 半導体発光装置
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JP2007201361A (ja) * 2006-01-30 2007-08-09 Shinko Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法
JP2007227693A (ja) * 2006-02-24 2007-09-06 Ngk Spark Plug Co Ltd 発光素子収納用パッケージ及びその製造方法
JP5119621B2 (ja) 2006-04-21 2013-01-16 日亜化学工業株式会社 発光装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105221940A (zh) * 2014-06-16 2016-01-06 西铁城电子株式会社 Led发光装置

Also Published As

Publication number Publication date
CN102522485A (zh) 2012-06-27
CN102522485B (zh) 2015-04-15
JP2009188201A (ja) 2009-08-20
JP5349811B2 (ja) 2013-11-20
US20090194782A1 (en) 2009-08-06
US7759692B2 (en) 2010-07-20
CN101515627A (zh) 2009-08-26

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Granted publication date: 20120208

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