JP4811905B2 - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
- Publication number
- JP4811905B2 JP4811905B2 JP2005050032A JP2005050032A JP4811905B2 JP 4811905 B2 JP4811905 B2 JP 4811905B2 JP 2005050032 A JP2005050032 A JP 2005050032A JP 2005050032 A JP2005050032 A JP 2005050032A JP 4811905 B2 JP4811905 B2 JP 4811905B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- light emitting
- emitting device
- lead
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
1A,1B 第1および第2のリード
2 LEDチップ(半導体発光素子)
3 リフレクタ
3a,3b 反射面
4 ワイヤ
5A 透明樹脂
5B 軟質樹脂
7 絶縁樹脂
8 絶縁層
11A 凹部
11B 凸部
12A,12B 端子
15 チップ(突出部)
15a 本体
15b 導体膜
31,32 区画壁
33 外枠
36 導体膜(AgメッキまたはAlメッキ)
Claims (7)
- 複数の半導体発光素子と、
上記複数の半導体発光素子が搭載された導通支持部材と、を備える半導体発光装置であって、
上記導通支持部材は、第1および第2のリードを含んでおり、
上記第1のリードには、平面視において少なくとも一方側に開口し、少なくとも他の二方側が閉じた凹部が形成されており、
上記第2のリードには、平面視において少なくとも上記二方側が囲まれるように上記凹部に進入する凸部が形成されており、
上記複数の半導体発光素子は、少なくとも上記二方から上記凹部を囲むようにいずれも上記第1のリードに搭載されており、
上記各半導体発光素子と上記第2のリードの上記凸部とは、上記複数の半導体発光素子すべてを囲む外枠よりも上記第1および第2のリードの厚さ方向寸法が小であるとともに上記第1のリードの上記凹部と上記第2のリードの上記凸部との間に位置する区画壁を跨ぐワイヤにより接続されており、
上記区画壁は、上記厚さ方向において上記第1および第2のリードよりも上記半導体発光素子側に突出していることを特徴とする、半導体発光装置。 - 上記第2のリードの上記凸部には、その厚さ方向に突出するチップが設けられており、かつ上記ワイヤは、上記チップに接続されている、請求項1に記載の半導体発光装置。
- 上記チップは、Si製の本体と、この本体を覆うAgまたはAl製の導体膜とからなる、請求項2に記載の半導体発光装置。
- 上記チップは、金属製である、請求項2に記載の半導体発光装置。
- 上記複数の半導体発光素子のそれぞれを囲うリフレクタをさらに備え、上記外枠および上記区画壁がこのリフレクタの一部によって構成されている、請求項1ないし4のいずれかに記載の半導体発光装置。
- 上記リフレクタの表面には、AgメッキまたはAlメッキが形成されている、請求項5に記載の半導体発光装置。
- 上記第1および第2のリードの間に介在する絶縁樹脂をさらに備えており、かつ
上記リフレクタの少なくとも一部は、上記絶縁樹脂の一部により形成されている、請求項5または6に記載の半導体発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005050032A JP4811905B2 (ja) | 2005-02-25 | 2005-02-25 | 半導体発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005050032A JP4811905B2 (ja) | 2005-02-25 | 2005-02-25 | 半導体発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006237285A JP2006237285A (ja) | 2006-09-07 |
JP4811905B2 true JP4811905B2 (ja) | 2011-11-09 |
Family
ID=37044610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005050032A Expired - Fee Related JP4811905B2 (ja) | 2005-02-25 | 2005-02-25 | 半導体発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4811905B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080290359A1 (en) | 2007-04-23 | 2008-11-27 | Samsung Electro-Mechanics Co., Ltd. | Light emitting device and manufacturing method of the same |
JP5349811B2 (ja) * | 2008-02-06 | 2013-11-20 | シャープ株式会社 | 半導体発光装置 |
KR101282829B1 (ko) | 2010-02-17 | 2013-07-26 | 일진엘이디(주) | 발광 다이오드 패키지 |
JP5377440B2 (ja) * | 2010-08-09 | 2013-12-25 | 株式会社東芝 | 発光装置 |
JP5396415B2 (ja) | 2011-02-23 | 2014-01-22 | 株式会社東芝 | 半導体装置 |
JP2016115710A (ja) * | 2014-12-11 | 2016-06-23 | シチズン電子株式会社 | Led照明装置 |
JP6144716B2 (ja) * | 2015-05-07 | 2017-06-07 | シチズン電子株式会社 | 発光ダイオード |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62110995A (ja) * | 1985-11-02 | 1987-05-22 | 株式会社 斎藤鉄工所 | 抄紙機の地合構成装置 |
JPH0653597A (ja) * | 1992-07-29 | 1994-02-25 | Sanyo Electric Co Ltd | 半導体レーザ装置 |
JPH10247748A (ja) * | 1997-03-03 | 1998-09-14 | Omron Corp | 発光素子及び当該発光素子を用いた面光源装置 |
JP2000031548A (ja) * | 1998-07-09 | 2000-01-28 | Stanley Electric Co Ltd | 面実装型発光ダイオードおよびその製造方法 |
JP2000174350A (ja) * | 1998-12-10 | 2000-06-23 | Toshiba Corp | 光半導体モジュール |
-
2005
- 2005-02-25 JP JP2005050032A patent/JP4811905B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2006237285A (ja) | 2006-09-07 |
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