CN102522485B - 半导体发光装置 - Google Patents

半导体发光装置 Download PDF

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Publication number
CN102522485B
CN102522485B CN201110427212.4A CN201110427212A CN102522485B CN 102522485 B CN102522485 B CN 102522485B CN 201110427212 A CN201110427212 A CN 201110427212A CN 102522485 B CN102522485 B CN 102522485B
Authority
CN
China
Prior art keywords
light
semiconductor light
metallic plate
emitting
emitting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110427212.4A
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English (en)
Chinese (zh)
Other versions
CN102522485A (zh
Inventor
幡俊雄
筱原久幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
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Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN102522485A publication Critical patent/CN102522485A/zh
Application granted granted Critical
Publication of CN102522485B publication Critical patent/CN102522485B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN201110427212.4A 2008-02-06 2009-02-05 半导体发光装置 Expired - Fee Related CN102522485B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008026694A JP5349811B2 (ja) 2008-02-06 2008-02-06 半導体発光装置
JP2008-026694 2008-02-06

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2009101307410A Division CN101515627B (zh) 2008-02-06 2009-02-05 半导体发光装置

Publications (2)

Publication Number Publication Date
CN102522485A CN102522485A (zh) 2012-06-27
CN102522485B true CN102522485B (zh) 2015-04-15

Family

ID=40930795

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201110427212.4A Expired - Fee Related CN102522485B (zh) 2008-02-06 2009-02-05 半导体发光装置
CN2009101307410A Expired - Fee Related CN101515627B (zh) 2008-02-06 2009-02-05 半导体发光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2009101307410A Expired - Fee Related CN101515627B (zh) 2008-02-06 2009-02-05 半导体发光装置

Country Status (3)

Country Link
US (1) US7759692B2 (enExample)
JP (1) JP5349811B2 (enExample)
CN (2) CN102522485B (enExample)

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JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
JP5322805B2 (ja) * 2009-06-26 2013-10-23 三菱電機株式会社 画像表示素子及びその製造方法
JP5613400B2 (ja) * 2009-11-18 2014-10-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
USD630172S1 (en) * 2010-04-26 2011-01-04 Everlight Electronics Co., Ltd. Light emitting diode
USD632658S1 (en) * 2010-04-26 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode
KR101039994B1 (ko) 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
JP2012028743A (ja) * 2010-06-22 2012-02-09 Panasonic Corp 半導体装置用パッケージおよびその製造方法ならびに半導体装置
JP2012033884A (ja) * 2010-06-29 2012-02-16 Panasonic Corp 半導体装置用パッケージおよびその製造方法ならびに半導体装置
KR101705700B1 (ko) * 2010-07-01 2017-02-10 엘지이노텍 주식회사 발광 소자
WO2012063704A1 (ja) 2010-11-11 2012-05-18 日亜化学工業株式会社 発光装置と、回路基板の製造方法
JP2012186450A (ja) 2011-02-16 2012-09-27 Rohm Co Ltd Ｌｅｄモジュール
KR20140038553A (ko) 2011-07-21 2014-03-28 크리,인코포레이티드 향상된 화학적 내성을 위한 발광 장치 패키지들, 부품들 및 방법들 그리고 관련된 방법들
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
EP2786429A4 (en) * 2011-12-01 2015-07-29 Cree Inc LIGHT-EMITTING DEVICES AND COMPONENTS WITH IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
JP6291800B2 (ja) * 2012-12-26 2018-03-14 日亜化学工業株式会社 半導体装置およびその製造方法
US10026875B2 (en) 2013-06-18 2018-07-17 Sharp Kabushiki Kaisha Light-source device and light-emitting device
US8999737B2 (en) 2013-08-27 2015-04-07 Glo Ab Method of making molded LED package
WO2015031179A1 (en) 2013-08-27 2015-03-05 Glo Ab Molded led package and method of making same
US9142745B2 (en) * 2013-08-27 2015-09-22 Glo Ab Packaged LED device with castellations
KR101476217B1 (ko) * 2014-05-28 2014-12-24 엘지전자 주식회사 황색 발광 형광체 및 이를 이용한 발광 소자 패키지
JP6576094B2 (ja) * 2014-06-16 2019-09-18 シチズン電子株式会社 Ｌｅｄ発光装置
JP6314968B2 (ja) 2015-12-25 2018-04-25 日亜化学工業株式会社 発光装置
CN105742461A (zh) * 2016-02-25 2016-07-06 深圳市丽晶光电科技股份有限公司 一种封装led及其制造方法
JP6399057B2 (ja) * 2016-08-22 2018-10-03 日亜化学工業株式会社 発光装置
CN113285003B (zh) * 2021-04-30 2023-07-25 深圳市得润光学有限公司 一种制造led支架的方法以及led支架

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1292154A (zh) * 1998-06-30 2001-04-18 奥斯兰姆奥普托半导体股份有限两合公司 辐射发送和/或接收元件
CN1523681A (zh) * 2003-02-18 2004-08-25 ������������ʽ���� 半导体发光装置及其制造方法和电子图像拾取装置

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* Cited by examiner, † Cited by third party
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JPS6126230A (ja) * 1984-07-16 1986-02-05 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPS6247156A (ja) 1985-08-26 1987-02-28 Toshiba Corp 絶縁ゲ−ト型半導体装置
JP3707024B2 (ja) * 1997-04-17 2005-10-19 松下電器産業株式会社 電子部品
JP4239509B2 (ja) * 2002-08-02 2009-03-18 日亜化学工業株式会社 発光ダイオード
JP2005158958A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4667803B2 (ja) * 2004-09-14 2011-04-13 日亜化学工業株式会社 発光装置
US20060125716A1 (en) * 2004-12-10 2006-06-15 Wong Lye Y Light-emitting diode display with compartment
JP4811905B2 (ja) * 2005-02-25 2011-11-09 ローム株式会社 半導体発光装置
JP4548166B2 (ja) * 2005-03-22 2010-09-22 パナソニック株式会社 線状光源装置
JP2007201361A (ja) * 2006-01-30 2007-08-09 Shinko Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法
JP2007227693A (ja) * 2006-02-24 2007-09-06 Ngk Spark Plug Co Ltd 発光素子収納用パッケージ及びその製造方法
JP5119621B2 (ja) * 2006-04-21 2013-01-16 日亜化学工業株式会社 発光装置
JP2007027801A (ja) * 2006-11-01 2007-02-01 Sanyo Electric Co Ltd Ｌｅｄ表示器及びその製造方法
JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1292154A (zh) * 1998-06-30 2001-04-18 奥斯兰姆奥普托半导体股份有限两合公司 辐射发送和/或接收元件
CN1523681A (zh) * 2003-02-18 2004-08-25 ������������ʽ���� 半导体发光装置及其制造方法和电子图像拾取装置

Also Published As

Publication number Publication date
CN101515627A (zh) 2009-08-26
US7759692B2 (en) 2010-07-20
CN102522485A (zh) 2012-06-27
US20090194782A1 (en) 2009-08-06
CN101515627B (zh) 2012-02-08
JP5349811B2 (ja) 2013-11-20
JP2009188201A (ja) 2009-08-20

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