CN102522485B - 半导体发光装置 - Google Patents

半导体发光装置 Download PDF

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Publication number
CN102522485B
CN102522485B CN201110427212.4A CN201110427212A CN102522485B CN 102522485 B CN102522485 B CN 102522485B CN 201110427212 A CN201110427212 A CN 201110427212A CN 102522485 B CN102522485 B CN 102522485B
Authority
CN
China
Prior art keywords
light
semiconductor light
metallic plate
emitting
emitting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110427212.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN102522485A (zh
Inventor
幡俊雄
筱原久幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN102522485A publication Critical patent/CN102522485A/zh
Application granted granted Critical
Publication of CN102522485B publication Critical patent/CN102522485B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN201110427212.4A 2008-02-06 2009-02-05 半导体发光装置 Expired - Fee Related CN102522485B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-026694 2008-02-06
JP2008026694A JP5349811B2 (ja) 2008-02-06 2008-02-06 半導体発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2009101307410A Division CN101515627B (zh) 2008-02-06 2009-02-05 半导体发光装置

Publications (2)

Publication Number Publication Date
CN102522485A CN102522485A (zh) 2012-06-27
CN102522485B true CN102522485B (zh) 2015-04-15

Family

ID=40930795

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201110427212.4A Expired - Fee Related CN102522485B (zh) 2008-02-06 2009-02-05 半导体发光装置
CN2009101307410A Expired - Fee Related CN101515627B (zh) 2008-02-06 2009-02-05 半导体发光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2009101307410A Expired - Fee Related CN101515627B (zh) 2008-02-06 2009-02-05 半导体发光装置

Country Status (3)

Country Link
US (1) US7759692B2 (enExample)
JP (1) JP5349811B2 (enExample)
CN (2) CN102522485B (enExample)

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JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
JP5322805B2 (ja) * 2009-06-26 2013-10-23 三菱電機株式会社 画像表示素子及びその製造方法
JP5613400B2 (ja) * 2009-11-18 2014-10-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
USD630172S1 (en) * 2010-04-26 2011-01-04 Everlight Electronics Co., Ltd. Light emitting diode
USD632658S1 (en) * 2010-04-26 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode
KR101039994B1 (ko) * 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
JP2012028743A (ja) * 2010-06-22 2012-02-09 Panasonic Corp 半導体装置用パッケージおよびその製造方法ならびに半導体装置
JP2012033884A (ja) * 2010-06-29 2012-02-16 Panasonic Corp 半導体装置用パッケージおよびその製造方法ならびに半導体装置
KR101705700B1 (ko) * 2010-07-01 2017-02-10 엘지이노텍 주식회사 발광 소자
WO2012063704A1 (ja) 2010-11-11 2012-05-18 日亜化学工業株式会社 発光装置と、回路基板の製造方法
JP2012186450A (ja) * 2011-02-16 2012-09-27 Rohm Co Ltd Ｌｅｄモジュール
KR20140038553A (ko) 2011-07-21 2014-03-28 크리,인코포레이티드 향상된 화학적 내성을 위한 발광 장치 패키지들, 부품들 및 방법들 그리고 관련된 방법들
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
EP2786429A4 (en) * 2011-12-01 2015-07-29 Cree Inc LIGHT-EMITTING DEVICES AND COMPONENTS WITH IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
JP6291800B2 (ja) * 2012-12-26 2018-03-14 日亜化学工業株式会社 半導体装置およびその製造方法
CN105324859B (zh) * 2013-06-18 2019-06-04 夏普株式会社 光源装置以及发光装置
US9257616B2 (en) 2013-08-27 2016-02-09 Glo Ab Molded LED package and method of making same
US9142745B2 (en) * 2013-08-27 2015-09-22 Glo Ab Packaged LED device with castellations
US8999737B2 (en) 2013-08-27 2015-04-07 Glo Ab Method of making molded LED package
KR101476217B1 (ko) * 2014-05-28 2014-12-24 엘지전자 주식회사 황색 발광 형광체 및 이를 이용한 발광 소자 패키지
JP6576094B2 (ja) * 2014-06-16 2019-09-18 シチズン電子株式会社 Ｌｅｄ発光装置
JP6314968B2 (ja) 2015-12-25 2018-04-25 日亜化学工業株式会社 発光装置
CN105742461A (zh) * 2016-02-25 2016-07-06 深圳市丽晶光电科技股份有限公司 一种封装led及其制造方法
JP6399057B2 (ja) * 2016-08-22 2018-10-03 日亜化学工業株式会社 発光装置
CN113285003B (zh) * 2021-04-30 2023-07-25 深圳市得润光学有限公司 一种制造led支架的方法以及led支架

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CN1292154A (zh) * 1998-06-30 2001-04-18 奥斯兰姆奥普托半导体股份有限两合公司 辐射发送和/或接收元件
CN1523681A (zh) * 2003-02-18 2004-08-25 ������������ʽ���� 半导体发光装置及其制造方法和电子图像拾取装置

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JPS6247156A (ja) 1985-08-26 1987-02-28 Toshiba Corp 絶縁ゲ−ト型半導体装置
JP3707024B2 (ja) * 1997-04-17 2005-10-19 松下電器産業株式会社 電子部品
JP4239509B2 (ja) * 2002-08-02 2009-03-18 日亜化学工業株式会社 発光ダイオード
JP2005158958A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4667803B2 (ja) * 2004-09-14 2011-04-13 日亜化学工業株式会社 発光装置
US20060125716A1 (en) * 2004-12-10 2006-06-15 Wong Lye Y Light-emitting diode display with compartment
JP4811905B2 (ja) * 2005-02-25 2011-11-09 ローム株式会社 半導体発光装置
JP4548166B2 (ja) * 2005-03-22 2010-09-22 パナソニック株式会社 線状光源装置
JP2007201361A (ja) * 2006-01-30 2007-08-09 Shinko Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法
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JP5119621B2 (ja) * 2006-04-21 2013-01-16 日亜化学工業株式会社 発光装置
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CN1292154A (zh) * 1998-06-30 2001-04-18 奥斯兰姆奥普托半导体股份有限两合公司 辐射发送和/或接收元件
CN1523681A (zh) * 2003-02-18 2004-08-25 ������������ʽ���� 半导体发光装置及其制造方法和电子图像拾取装置

Also Published As

Publication number Publication date
CN101515627A (zh) 2009-08-26
JP2009188201A (ja) 2009-08-20
CN101515627B (zh) 2012-02-08
CN102522485A (zh) 2012-06-27
US20090194782A1 (en) 2009-08-06
JP5349811B2 (ja) 2013-11-20
US7759692B2 (en) 2010-07-20

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SE01 Entry into force of request for substantive examination
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Granted publication date: 20150415

Termination date: 20220205