CN101504910B - 处理装置 - Google Patents

处理装置 Download PDF

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Publication number
CN101504910B
CN101504910B CN2009100004923A CN200910000492A CN101504910B CN 101504910 B CN101504910 B CN 101504910B CN 2009100004923 A CN2009100004923 A CN 2009100004923A CN 200910000492 A CN200910000492 A CN 200910000492A CN 101504910 B CN101504910 B CN 101504910B
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CN
China
Prior art keywords
air
flow guiding
guiding parts
substrate
handled object
Prior art date
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Active
Application number
CN2009100004923A
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English (en)
Chinese (zh)
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CN101504910A (zh
Inventor
东条利洋
佐佐木和男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101504910A publication Critical patent/CN101504910A/zh
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Publication of CN101504910B publication Critical patent/CN101504910B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2009100004923A 2008-02-05 2009-02-05 处理装置 Active CN101504910B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008025588 2008-02-05
JP2008-025588 2008-02-05
JP2008025588 2008-02-05
JP2008-151000 2008-06-09
JP2008151000A JP5256866B2 (ja) 2008-02-05 2008-06-09 処理装置
JP2008151000 2008-06-09

Publications (2)

Publication Number Publication Date
CN101504910A CN101504910A (zh) 2009-08-12
CN101504910B true CN101504910B (zh) 2012-10-31

Family

ID=40977099

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009100004923A Active CN101504910B (zh) 2008-02-05 2009-02-05 处理装置

Country Status (4)

Country Link
JP (1) JP5256866B2 (ja)
KR (2) KR101057931B1 (ja)
CN (1) CN101504910B (ja)
TW (1) TW201001526A (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5067279B2 (ja) * 2008-06-25 2012-11-07 東京エレクトロン株式会社 処理装置
JP5141520B2 (ja) 2008-12-02 2013-02-13 東京エレクトロン株式会社 プラズマ処理装置
JP5951324B2 (ja) * 2012-04-05 2016-07-13 東京エレクトロン株式会社 プラズマ処理装置
GB201309583D0 (en) * 2013-05-29 2013-07-10 Spts Technologies Ltd Apparatus for processing a semiconductor workpiece
JP2015005634A (ja) * 2013-06-21 2015-01-08 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
WO2015116244A1 (en) * 2014-01-30 2015-08-06 Applied Materials, Inc. Corner spoiler for improving profile uniformity
JP6305825B2 (ja) * 2014-05-12 2018-04-04 東京エレクトロン株式会社 プラズマ処理装置およびそれに用いる排気構造
JP6684943B2 (ja) * 2014-07-24 2020-04-22 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6544902B2 (ja) * 2014-09-18 2019-07-17 東京エレクトロン株式会社 プラズマ処理装置
JP6548484B2 (ja) * 2015-07-01 2019-07-24 東京エレクトロン株式会社 プラズマ処理装置およびそれに用いる排気構造
JP6861570B2 (ja) * 2017-04-27 2021-04-21 東京エレクトロン株式会社 基板処理装置
KR101987577B1 (ko) * 2018-01-24 2019-06-10 주식회사 기가레인 승강하는 유도부와 연동하는 배기조절부를 포함하는 기판 처리 장치
JP7437985B2 (ja) * 2020-03-16 2024-02-26 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN112233962B (zh) * 2020-09-17 2023-08-18 北京北方华创微电子装备有限公司 套装于基座上的收集组件及半导体腔室
KR102275509B1 (ko) * 2020-12-16 2021-07-09 피에스케이 주식회사 지지 유닛 및 기판 처리 장치
CN115101400B (zh) * 2022-08-25 2022-11-15 拓荆科技(上海)有限公司 半导体加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2638443B2 (ja) * 1993-08-31 1997-08-06 日本電気株式会社 ドライエッチング方法およびドライエッチング装置
JPH0945495A (ja) * 1995-08-02 1997-02-14 Ulvac Japan Ltd プラズマ処理装置
JPH11149999A (ja) * 1997-11-18 1999-06-02 Tokyo Electron Ltd プラズマ処理装置
JP3724436B2 (ja) * 2002-02-15 2005-12-07 セイコーエプソン株式会社 整流ウォール及びドライエッチング装置並びに該装置を用いた電気光学装置の製造方法
JP4416601B2 (ja) * 2004-08-05 2010-02-17 シャープ株式会社 プラズマプロセス装置、及びそれを用いた液晶表示装置の製造方法
JP4707139B2 (ja) * 2005-06-28 2011-06-22 芝浦メカトロニクス株式会社 減圧処理装置及び減圧処理方法

Also Published As

Publication number Publication date
CN101504910A (zh) 2009-08-12
KR20110020879A (ko) 2011-03-03
KR101057931B1 (ko) 2011-08-18
JP2009212482A (ja) 2009-09-17
KR20090086043A (ko) 2009-08-10
JP5256866B2 (ja) 2013-08-07
TW201001526A (en) 2010-01-01

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