CN101495587B - 导电压敏粘合剂 - Google Patents

导电压敏粘合剂 Download PDF

Info

Publication number
CN101495587B
CN101495587B CN2007800284001A CN200780028400A CN101495587B CN 101495587 B CN101495587 B CN 101495587B CN 2007800284001 A CN2007800284001 A CN 2007800284001A CN 200780028400 A CN200780028400 A CN 200780028400A CN 101495587 B CN101495587 B CN 101495587B
Authority
CN
China
Prior art keywords
adhesive
conductive
flakes
thickness
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2007800284001A
Other languages
English (en)
Chinese (zh)
Other versions
CN101495587A (zh
Inventor
杰弗里·W·麦卡琴
珍妮·M·布鲁索
约翰·D·黎
珍妮弗·L·索耶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101495587A publication Critical patent/CN101495587A/zh
Application granted granted Critical
Publication of CN101495587B publication Critical patent/CN101495587B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
CN2007800284001A 2006-07-24 2007-07-19 导电压敏粘合剂 Active CN101495587B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US82017406P 2006-07-24 2006-07-24
US60/820,174 2006-07-24
PCT/US2007/073838 WO2008014169A1 (en) 2006-07-24 2007-07-19 Electrically conductive pressure sensitive adhesives

Publications (2)

Publication Number Publication Date
CN101495587A CN101495587A (zh) 2009-07-29
CN101495587B true CN101495587B (zh) 2011-08-10

Family

ID=38981795

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800284001A Active CN101495587B (zh) 2006-07-24 2007-07-19 导电压敏粘合剂

Country Status (8)

Country Link
US (1) US20090311502A1 (https=)
EP (1) EP2044163B1 (https=)
JP (1) JP2009544815A (https=)
KR (1) KR101331679B1 (https=)
CN (1) CN101495587B (https=)
AT (1) ATE555177T1 (https=)
TW (1) TW200813185A (https=)
WO (1) WO2008014169A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714071A (zh) 2009-11-20 2012-10-03 3M创新有限公司 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法
US20120288710A1 (en) * 2010-01-07 2012-11-15 Nitto Denko Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
EP2553688A1 (en) 2010-03-31 2013-02-06 3M Innovative Properties Company Electronic articles for displays and methods of making same
CN102477269A (zh) * 2010-11-26 2012-05-30 上海恩意材料科技有限公司 一种导电性胶黏剂组合物
JP2013014734A (ja) * 2011-07-06 2013-01-24 Nitto Denko Corp 導電性粘着テープ
DE102011080729A1 (de) * 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
DE102011080724A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
JP5660418B1 (ja) * 2013-04-19 2015-01-28 Dic株式会社 導電性粘着シート、その製造方法及びそれを用いて得た電子端末
EP3069353B1 (en) 2013-11-15 2019-10-30 3M Innovative Properties Company An electrically conductive article containing shaped particles and methods of making same
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
JP6486192B2 (ja) * 2015-05-19 2019-03-20 マクセルホールディングス株式会社 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器
JP2018053137A (ja) * 2016-09-29 2018-04-05 日東電工株式会社 導電性粘着テープ及び導電性粘着テープの製造方法
US11168235B2 (en) 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
KR102148860B1 (ko) 2018-11-26 2020-08-28 주식회사 엘엠에스 접착시트 및 이를 포함하는 투명 전극

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997043352A1 (en) * 1996-05-16 1997-11-20 Minnesota Mining And Manufacturing Company Adhesive compositions and methods of use
CN1190423A (zh) * 1995-07-10 1998-08-12 美国3M公司 含导电剂的粘合剂
JP2000053733A (ja) * 1998-08-11 2000-02-22 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いた半導体装置
US6124460A (en) * 1998-12-07 2000-09-26 Kotobuki Pharmaceutical Co. Ltd. Isoquinuclidine derivatives, method of manufacturing the same and therapeutic agents for hypercholesterolemia containing these compounds
JP2005126593A (ja) * 2003-10-24 2005-05-19 Hitachi Chem Co Ltd バインダ樹脂組成物および導電ペースト
CN1699492A (zh) * 2005-07-11 2005-11-23 大连轻工业学院 一种光固化导电胶及其制法
CN1759158A (zh) * 2003-03-10 2006-04-12 蒂萨股份公司 可电加热的压敏粘结化合物

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153595A (ja) * 1974-09-17 1976-05-12 Haarmann & Reimer Gmbh Noboratsukujushinoseizohoho
JPS61285608A (ja) * 1985-06-12 1986-12-16 岩井　謙治 貴金属被覆微粒体およびその製造方法
US5070161A (en) * 1988-05-27 1991-12-03 Nippon Paint Co., Ltd. Heat-latent, cationic polymerization initiator and resin compositions containing same
US4942201A (en) * 1988-08-29 1990-07-17 Illinois Tool Works, Inc. Adhesive for low temperature applications
DE69126889T2 (de) * 1990-06-08 1998-01-08 Minnesota Mining & Mfg Wiederverarbeitbarer klebstoff für elektronische anwendungen
JPH05298913A (ja) * 1991-07-19 1993-11-12 Ajinomoto Co Inc 光硬化性導電性ペースト
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
WO1997003143A1 (en) * 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
JPH09296158A (ja) * 1996-05-01 1997-11-18 Nippon Handa Kk 導電性接着剤
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
US6699351B2 (en) * 2000-03-24 2004-03-02 3M Innovative Properties Company Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
JP4499889B2 (ja) * 2000-08-10 2010-07-07 株式会社スリオンテック 無基材導電性粘着テープ・シート及びその製造方法
JP2003031028A (ja) * 2001-07-17 2003-01-31 Shin Etsu Chem Co Ltd 導電性組成物
US20040266913A1 (en) * 2001-09-13 2004-12-30 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US20050256230A1 (en) * 2002-04-01 2005-11-17 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US6773474B2 (en) * 2002-04-19 2004-08-10 3M Innovative Properties Company Coated abrasive article
JP2004189938A (ja) * 2002-12-12 2004-07-08 Nippon Sheet Glass Co Ltd 導電性樹脂成形部品
JP3991218B2 (ja) * 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
US7166491B2 (en) * 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US20060110600A1 (en) * 2004-11-19 2006-05-25 3M Innovative Properties Company Anisotropic conductive adhesive composition
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1190423A (zh) * 1995-07-10 1998-08-12 美国3M公司 含导电剂的粘合剂
WO1997043352A1 (en) * 1996-05-16 1997-11-20 Minnesota Mining And Manufacturing Company Adhesive compositions and methods of use
JP2000053733A (ja) * 1998-08-11 2000-02-22 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いた半導体装置
US6124460A (en) * 1998-12-07 2000-09-26 Kotobuki Pharmaceutical Co. Ltd. Isoquinuclidine derivatives, method of manufacturing the same and therapeutic agents for hypercholesterolemia containing these compounds
CN1759158A (zh) * 2003-03-10 2006-04-12 蒂萨股份公司 可电加热的压敏粘结化合物
JP2005126593A (ja) * 2003-10-24 2005-05-19 Hitachi Chem Co Ltd バインダ樹脂組成物および導電ペースト
CN1699492A (zh) * 2005-07-11 2005-11-23 大连轻工业学院 一种光固化导电胶及其制法

Also Published As

Publication number Publication date
EP2044163A1 (en) 2009-04-08
WO2008014169A1 (en) 2008-01-31
EP2044163B1 (en) 2012-04-25
EP2044163A4 (en) 2010-11-24
JP2009544815A (ja) 2009-12-17
US20090311502A1 (en) 2009-12-17
KR101331679B1 (ko) 2013-11-20
ATE555177T1 (de) 2012-05-15
KR20090031923A (ko) 2009-03-30
TW200813185A (en) 2008-03-16
CN101495587A (zh) 2009-07-29

Similar Documents

Publication Publication Date Title
CN101495587B (zh) 导电压敏粘合剂
KR101523332B1 (ko) 점착 시트, 전자파 쉴드 시트 및 전자 기기
EP3069353B1 (en) An electrically conductive article containing shaped particles and methods of making same
US20090169852A1 (en) Conductive adhesive tape having different adhesion on both surfaces and method for manufacturing the same
AU7734096A (en) Adhesive compositions and methods of use
JP2011502203A (ja) 熱伝導性接着剤及びこれを使用した接着テープ
CN109233684B (zh) 导电粘合剂
JP2004263030A (ja) 導電性粘着シート
EP2235130A2 (en) Adhesive tape and method for preparing the same
US8975004B2 (en) Electrically conductive polymer resin and method for making same
CN102712834B (zh) 粘接材料卷轴
KR20140068950A (ko) 전기 전도성 접착제 화합물 및 접착 테이프
CN104449484A (zh) 压敏胶、导电胶组合物及由其制得的胶带和用途
WO2009120376A2 (en) Thermally enhanced electrically insulative adhesive paste
KR101077687B1 (ko) 열 전도성 물질의 열 성형 가능한 가교성 전구체
WO2015183896A1 (en) Enhanced pressure sensitive adhesive for thermal management applications
KR102530373B1 (ko) 도전성 점착 시트
JP6505380B2 (ja) 粘着シート、その製造方法及び物品
JP6300004B2 (ja) 熱伝導シート、物品及び電子部材
CN117487481A (zh) 一种导电胶黏剂及其制备方法和应用
KR100733975B1 (ko) 실리콘 중간체를 포함하는 이방성 도전성 필름
CN115368845B (zh) 含有纳米粒子添加剂的导电压敏粘合剂
JP6303345B2 (ja) 熱伝導シート、物品及び電子部材
CN109996851B (zh) 导电性粘合带
CN119220207A (zh) 抗氧化导电散热铜浆黏着剂及其制备方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant