JP2009544815A - 導電性感圧性接着剤 - Google Patents

導電性感圧性接着剤 Download PDF

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Publication number
JP2009544815A
JP2009544815A JP2009521906A JP2009521906A JP2009544815A JP 2009544815 A JP2009544815 A JP 2009544815A JP 2009521906 A JP2009521906 A JP 2009521906A JP 2009521906 A JP2009521906 A JP 2009521906A JP 2009544815 A JP2009544815 A JP 2009544815A
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JP
Japan
Prior art keywords
adhesive
conductive
flakes
thickness
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009521906A
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English (en)
Japanese (ja)
Other versions
JP2009544815A5 (https=
Inventor
ダブリュ． マカッション，ジェフリー
エム． ブラス，ジーン
ディー． ル，ジョン
エル． ソーヤー，ジェニファー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009544815A publication Critical patent/JP2009544815A/ja
Publication of JP2009544815A5 publication Critical patent/JP2009544815A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
JP2009521906A 2006-07-24 2007-07-19 導電性感圧性接着剤 Pending JP2009544815A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82017406P 2006-07-24 2006-07-24
PCT/US2007/073838 WO2008014169A1 (en) 2006-07-24 2007-07-19 Electrically conductive pressure sensitive adhesives

Publications (2)

Publication Number Publication Date
JP2009544815A true JP2009544815A (ja) 2009-12-17
JP2009544815A5 JP2009544815A5 (https=) 2010-08-26

Family

ID=38981795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009521906A Pending JP2009544815A (ja) 2006-07-24 2007-07-19 導電性感圧性接着剤

Country Status (8)

Country Link
US (1) US20090311502A1 (https=)
EP (1) EP2044163B1 (https=)
JP (1) JP2009544815A (https=)
KR (1) KR101331679B1 (https=)
CN (1) CN101495587B (https=)
AT (1) ATE555177T1 (https=)
TW (1) TW200813185A (https=)
WO (1) WO2008014169A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011083828A1 (ja) * 2010-01-07 2011-07-14 日東電工株式会社 粘着剤組成物および粘着シート
JP2013014734A (ja) * 2011-07-06 2013-01-24 Nitto Denko Corp 導電性粘着テープ
JP2016216587A (ja) * 2015-05-19 2016-12-22 日立マクセル株式会社 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器
JP2018053137A (ja) * 2016-09-29 2018-04-05 日東電工株式会社 導電性粘着テープ及び導電性粘着テープの製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714071A (zh) 2009-11-20 2012-10-03 3M创新有限公司 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法
EP2553688A1 (en) 2010-03-31 2013-02-06 3M Innovative Properties Company Electronic articles for displays and methods of making same
CN102477269A (zh) * 2010-11-26 2012-05-30 上海恩意材料科技有限公司 一种导电性胶黏剂组合物
DE102011080729A1 (de) * 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
DE102011080724A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
JP5660418B1 (ja) * 2013-04-19 2015-01-28 Dic株式会社 導電性粘着シート、その製造方法及びそれを用いて得た電子端末
EP3069353B1 (en) 2013-11-15 2019-10-30 3M Innovative Properties Company An electrically conductive article containing shaped particles and methods of making same
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
US11168235B2 (en) 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
KR102148860B1 (ko) 2018-11-26 2020-08-28 주식회사 엘엠에스 접착시트 및 이를 포함하는 투명 전극

Citations (9)

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Publication number Priority date Publication date Assignee Title
JPS5153595A (ja) * 1974-09-17 1976-05-12 Haarmann & Reimer Gmbh Noboratsukujushinoseizohoho
JPS61285608A (ja) * 1985-06-12 1986-12-16 岩井　謙治 貴金属被覆微粒体およびその製造方法
JPH05298913A (ja) * 1991-07-19 1993-11-12 Ajinomoto Co Inc 光硬化性導電性ペースト
JPH09296158A (ja) * 1996-05-01 1997-11-18 Nippon Handa Kk 導電性接着剤
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2002053827A (ja) * 2000-08-10 2002-02-19 Sliontec Corp 無基材導電性粘着テープ・シート及びその製造方法
JP2003031028A (ja) * 2001-07-17 2003-01-31 Shin Etsu Chem Co Ltd 導電性組成物
JP2004189938A (ja) * 2002-12-12 2004-07-08 Nippon Sheet Glass Co Ltd 導電性樹脂成形部品
JP2004197030A (ja) * 2002-12-20 2004-07-15 Shin Etsu Chem Co Ltd 導電性接着剤

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US5070161A (en) * 1988-05-27 1991-12-03 Nippon Paint Co., Ltd. Heat-latent, cationic polymerization initiator and resin compositions containing same
US4942201A (en) * 1988-08-29 1990-07-17 Illinois Tool Works, Inc. Adhesive for low temperature applications
DE69126889T2 (de) * 1990-06-08 1998-01-08 Minnesota Mining & Mfg Wiederverarbeitbarer klebstoff für elektronische anwendungen
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
WO1997003143A1 (en) * 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
CA2254883A1 (en) * 1996-05-16 1997-11-20 Christopher A. Haak Adhesive compositions and methods of use
JP3747995B2 (ja) * 1998-08-11 2006-02-22 住友ベークライト株式会社 導電性樹脂ペースト及びこれを用いた半導体装置
JP2000169474A (ja) * 1998-12-07 2000-06-20 Kotobuki Seiyaku Kk イソキヌクリジン誘導体及びその製造方法並びにこれを含有する高コレステロール血症治療剤
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
US6699351B2 (en) * 2000-03-24 2004-03-02 3M Innovative Properties Company Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
US20040266913A1 (en) * 2001-09-13 2004-12-30 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US20050256230A1 (en) * 2002-04-01 2005-11-17 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US6773474B2 (en) * 2002-04-19 2004-08-10 3M Innovative Properties Company Coated abrasive article
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
DE10310722A1 (de) * 2003-03-10 2004-09-23 Tesa Ag Elektrisch erwärmbare Haftklebemasse
US7166491B2 (en) * 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
JP2005126593A (ja) * 2003-10-24 2005-05-19 Hitachi Chem Co Ltd バインダ樹脂組成物および導電ペースト
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US20060110600A1 (en) * 2004-11-19 2006-05-25 3M Innovative Properties Company Anisotropic conductive adhesive composition
CN1277893C (zh) * 2005-07-11 2006-10-04 大连轻工业学院 一种光固化导电胶及其制法
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153595A (ja) * 1974-09-17 1976-05-12 Haarmann & Reimer Gmbh Noboratsukujushinoseizohoho
JPS61285608A (ja) * 1985-06-12 1986-12-16 岩井　謙治 貴金属被覆微粒体およびその製造方法
JPH05298913A (ja) * 1991-07-19 1993-11-12 Ajinomoto Co Inc 光硬化性導電性ペースト
JPH09296158A (ja) * 1996-05-01 1997-11-18 Nippon Handa Kk 導電性接着剤
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2002053827A (ja) * 2000-08-10 2002-02-19 Sliontec Corp 無基材導電性粘着テープ・シート及びその製造方法
JP2003031028A (ja) * 2001-07-17 2003-01-31 Shin Etsu Chem Co Ltd 導電性組成物
JP2004189938A (ja) * 2002-12-12 2004-07-08 Nippon Sheet Glass Co Ltd 導電性樹脂成形部品
JP2004197030A (ja) * 2002-12-20 2004-07-15 Shin Etsu Chem Co Ltd 導電性接着剤

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011083828A1 (ja) * 2010-01-07 2011-07-14 日東電工株式会社 粘着剤組成物および粘着シート
JP2011140571A (ja) * 2010-01-07 2011-07-21 Nitto Denko Corp 粘着剤組成物および粘着シート
JP2013014734A (ja) * 2011-07-06 2013-01-24 Nitto Denko Corp 導電性粘着テープ
JP2016216587A (ja) * 2015-05-19 2016-12-22 日立マクセル株式会社 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器
JP2018053137A (ja) * 2016-09-29 2018-04-05 日東電工株式会社 導電性粘着テープ及び導電性粘着テープの製造方法

Also Published As

Publication number Publication date
EP2044163A1 (en) 2009-04-08
WO2008014169A1 (en) 2008-01-31
EP2044163B1 (en) 2012-04-25
EP2044163A4 (en) 2010-11-24
US20090311502A1 (en) 2009-12-17
KR101331679B1 (ko) 2013-11-20
ATE555177T1 (de) 2012-05-15
KR20090031923A (ko) 2009-03-30
TW200813185A (en) 2008-03-16
CN101495587A (zh) 2009-07-29
CN101495587B (zh) 2011-08-10

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