TW200813185A - Electrically conductive pressure sensitive adhesives - Google Patents

Electrically conductive pressure sensitive adhesives Download PDF

Info

Publication number
TW200813185A
TW200813185A TW096126795A TW96126795A TW200813185A TW 200813185 A TW200813185 A TW 200813185A TW 096126795 A TW096126795 A TW 096126795A TW 96126795 A TW96126795 A TW 96126795A TW 200813185 A TW200813185 A TW 200813185A
Authority
TW
Taiwan
Prior art keywords
adhesive
conductive
acrylate
binder
less
Prior art date
Application number
TW096126795A
Other languages
English (en)
Chinese (zh)
Inventor
Jeffrey William Mccutcheon
John D Le
Jeanne M Bruss
Jennifer L Sawyer
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200813185A publication Critical patent/TW200813185A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
TW096126795A 2006-07-24 2007-07-23 Electrically conductive pressure sensitive adhesives TW200813185A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82017406P 2006-07-24 2006-07-24

Publications (1)

Publication Number Publication Date
TW200813185A true TW200813185A (en) 2008-03-16

Family

ID=38981795

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096126795A TW200813185A (en) 2006-07-24 2007-07-23 Electrically conductive pressure sensitive adhesives

Country Status (8)

Country Link
US (1) US20090311502A1 (https=)
EP (1) EP2044163B1 (https=)
JP (1) JP2009544815A (https=)
KR (1) KR101331679B1 (https=)
CN (1) CN101495587B (https=)
AT (1) ATE555177T1 (https=)
TW (1) TW200813185A (https=)
WO (1) WO2008014169A1 (https=)

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US20120288710A1 (en) * 2010-01-07 2012-11-15 Nitto Denko Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
EP2553688A1 (en) 2010-03-31 2013-02-06 3M Innovative Properties Company Electronic articles for displays and methods of making same
CN102477269A (zh) * 2010-11-26 2012-05-30 上海恩意材料科技有限公司 一种导电性胶黏剂组合物
JP2013014734A (ja) * 2011-07-06 2013-01-24 Nitto Denko Corp 導電性粘着テープ
DE102011080729A1 (de) * 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
DE102011080724A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
JP5660418B1 (ja) * 2013-04-19 2015-01-28 Dic株式会社 導電性粘着シート、その製造方法及びそれを用いて得た電子端末
EP3069353B1 (en) 2013-11-15 2019-10-30 3M Innovative Properties Company An electrically conductive article containing shaped particles and methods of making same
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
JP6486192B2 (ja) * 2015-05-19 2019-03-20 マクセルホールディングス株式会社 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器
JP2018053137A (ja) * 2016-09-29 2018-04-05 日東電工株式会社 導電性粘着テープ及び導電性粘着テープの製造方法
US11168235B2 (en) 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
KR102148860B1 (ko) 2018-11-26 2020-08-28 주식회사 엘엠에스 접착시트 및 이를 포함하는 투명 전극

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Also Published As

Publication number Publication date
EP2044163A1 (en) 2009-04-08
WO2008014169A1 (en) 2008-01-31
EP2044163B1 (en) 2012-04-25
EP2044163A4 (en) 2010-11-24
JP2009544815A (ja) 2009-12-17
US20090311502A1 (en) 2009-12-17
KR101331679B1 (ko) 2013-11-20
ATE555177T1 (de) 2012-05-15
KR20090031923A (ko) 2009-03-30
CN101495587A (zh) 2009-07-29
CN101495587B (zh) 2011-08-10

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