KR101331679B1 - 전기 전도성 감압 접착제 - Google Patents

전기 전도성 감압 접착제 Download PDF

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Publication number
KR101331679B1
KR101331679B1 KR1020097001593A KR20097001593A KR101331679B1 KR 101331679 B1 KR101331679 B1 KR 101331679B1 KR 1020097001593 A KR1020097001593 A KR 1020097001593A KR 20097001593 A KR20097001593 A KR 20097001593A KR 101331679 B1 KR101331679 B1 KR 101331679B1
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KR
South Korea
Prior art keywords
adhesive
electrically conductive
delete delete
pressure sensitive
flakes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020097001593A
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English (en)
Korean (ko)
Other versions
KR20090031923A (ko
Inventor
제프리 더블유. 맥커천
쟌느 엠. 브러스
존 디. 르
제니퍼 엘. 소이어
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20090031923A publication Critical patent/KR20090031923A/ko
Application granted granted Critical
Publication of KR101331679B1 publication Critical patent/KR101331679B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
KR1020097001593A 2006-07-24 2007-07-19 전기 전도성 감압 접착제 Expired - Fee Related KR101331679B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US82017406P 2006-07-24 2006-07-24
US60/820,174 2006-07-24
PCT/US2007/073838 WO2008014169A1 (en) 2006-07-24 2007-07-19 Electrically conductive pressure sensitive adhesives

Publications (2)

Publication Number Publication Date
KR20090031923A KR20090031923A (ko) 2009-03-30
KR101331679B1 true KR101331679B1 (ko) 2013-11-20

Family

ID=38981795

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097001593A Expired - Fee Related KR101331679B1 (ko) 2006-07-24 2007-07-19 전기 전도성 감압 접착제

Country Status (8)

Country Link
US (1) US20090311502A1 (https=)
EP (1) EP2044163B1 (https=)
JP (1) JP2009544815A (https=)
KR (1) KR101331679B1 (https=)
CN (1) CN101495587B (https=)
AT (1) ATE555177T1 (https=)
TW (1) TW200813185A (https=)
WO (1) WO2008014169A1 (https=)

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Publication number Priority date Publication date Assignee Title
CN102714071A (zh) 2009-11-20 2012-10-03 3M创新有限公司 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法
US20120288710A1 (en) * 2010-01-07 2012-11-15 Nitto Denko Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
EP2553688A1 (en) 2010-03-31 2013-02-06 3M Innovative Properties Company Electronic articles for displays and methods of making same
CN102477269A (zh) * 2010-11-26 2012-05-30 上海恩意材料科技有限公司 一种导电性胶黏剂组合物
JP2013014734A (ja) * 2011-07-06 2013-01-24 Nitto Denko Corp 導電性粘着テープ
DE102011080729A1 (de) * 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
DE102011080724A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
JP5660418B1 (ja) * 2013-04-19 2015-01-28 Dic株式会社 導電性粘着シート、その製造方法及びそれを用いて得た電子端末
EP3069353B1 (en) 2013-11-15 2019-10-30 3M Innovative Properties Company An electrically conductive article containing shaped particles and methods of making same
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
JP6486192B2 (ja) * 2015-05-19 2019-03-20 マクセルホールディングス株式会社 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器
JP2018053137A (ja) * 2016-09-29 2018-04-05 日東電工株式会社 導電性粘着テープ及び導電性粘着テープの製造方法
US11168235B2 (en) 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
KR102148860B1 (ko) 2018-11-26 2020-08-28 주식회사 엘엠에스 접착시트 및 이를 포함하는 투명 전극

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2000053733A (ja) * 1998-08-11 2000-02-22 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いた半導体装置
US20040127626A1 (en) * 2002-12-20 2004-07-01 Masachiko Yoshiko Conductive adhesive composition

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DE69126889T2 (de) * 1990-06-08 1998-01-08 Minnesota Mining & Mfg Wiederverarbeitbarer klebstoff für elektronische anwendungen
JPH05298913A (ja) * 1991-07-19 1993-11-12 Ajinomoto Co Inc 光硬化性導電性ペースト
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
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JP2000169474A (ja) * 1998-12-07 2000-06-20 Kotobuki Seiyaku Kk イソキヌクリジン誘導体及びその製造方法並びにこれを含有する高コレステロール血症治療剤
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
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DE10310722A1 (de) * 2003-03-10 2004-09-23 Tesa Ag Elektrisch erwärmbare Haftklebemasse
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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2000053733A (ja) * 1998-08-11 2000-02-22 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いた半導体装置
US20040127626A1 (en) * 2002-12-20 2004-07-01 Masachiko Yoshiko Conductive adhesive composition

Also Published As

Publication number Publication date
EP2044163A1 (en) 2009-04-08
WO2008014169A1 (en) 2008-01-31
EP2044163B1 (en) 2012-04-25
EP2044163A4 (en) 2010-11-24
JP2009544815A (ja) 2009-12-17
US20090311502A1 (en) 2009-12-17
ATE555177T1 (de) 2012-05-15
KR20090031923A (ko) 2009-03-30
TW200813185A (en) 2008-03-16
CN101495587A (zh) 2009-07-29
CN101495587B (zh) 2011-08-10

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