CN101460404A - 球状烧结铁氧体粒子、使用该粒子的半导体封装用树脂组合物以及用该树脂组合物获得的半导体器件 - Google Patents
球状烧结铁氧体粒子、使用该粒子的半导体封装用树脂组合物以及用该树脂组合物获得的半导体器件 Download PDFInfo
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- CN101460404A CN101460404A CNA2006800548912A CN200680054891A CN101460404A CN 101460404 A CN101460404 A CN 101460404A CN A2006800548912 A CNA2006800548912 A CN A2006800548912A CN 200680054891 A CN200680054891 A CN 200680054891A CN 101460404 A CN101460404 A CN 101460404A
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- sintered body
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- ferrite sintered
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- spherical ferrite
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
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Abstract
Description
Claims (15)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/311342 WO2007141843A1 (ja) | 2006-06-06 | 2006-06-06 | 球状焼結フェライト粒子およびそれを用いた半導体封止用樹脂組成物ならびにそれを用いて得られる半導体装置 |
Publications (2)
Publication Number | Publication Date |
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CN101460404A true CN101460404A (zh) | 2009-06-17 |
CN101460404B CN101460404B (zh) | 2011-10-05 |
Family
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Application Number | Title | Priority Date | Filing Date |
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CN2006800548912A Expired - Fee Related CN101460404B (zh) | 2006-06-06 | 2006-06-06 | 球状烧结铁氧体粒子、包括该粒子的半导体封装用树脂组合物以及通过使用该组合物制备的半导体器件 |
Country Status (5)
Country | Link |
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US (1) | US20100193972A1 (zh) |
EP (1) | EP2036860B1 (zh) |
KR (1) | KR101344644B1 (zh) |
CN (1) | CN101460404B (zh) |
WO (1) | WO2007141843A1 (zh) |
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CN102181129A (zh) * | 2011-03-31 | 2011-09-14 | 广州友益电子科技有限公司 | 半导体封装用环氧树脂组合物 |
CN105280570A (zh) * | 2014-06-06 | 2016-01-27 | 矽品精密工业股份有限公司 | 半导体封装件及其制法 |
CN106715334A (zh) * | 2014-09-19 | 2017-05-24 | 保德科技股份有限公司 | 纳米尺寸的圆球状铁氧体粒子以及其制造方法 |
CN106715335A (zh) * | 2014-09-19 | 2017-05-24 | 保德科技股份有限公司 | 球形铁氧体粉、含该球形铁氧体粉的树脂组合物、以及使用该树脂组合物的成型体 |
TWI588223B (zh) * | 2016-02-19 | 2017-06-21 | 遠東科技大學 | 以回收原料製備電磁波屏蔽材之方法 |
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CN109315083A (zh) * | 2016-06-07 | 2019-02-05 | 保德科技股份有限公司 | 铁氧体粒子、树脂组合物及电磁波屏蔽材料 |
TWI709535B (zh) * | 2016-03-31 | 2020-11-11 | 日商保德科技股份有限公司 | 鐵氧體粒子、樹脂組合物及樹脂薄膜 |
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JPS6441248A (en) | 1987-08-07 | 1989-02-13 | Hitachi Ltd | Hermetically sealed type semiconductor device |
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JPH06151626A (ja) | 1992-11-09 | 1994-05-31 | Sumitomo Electric Ind Ltd | 半導体パッケージ |
JP3638659B2 (ja) * | 1995-04-27 | 2005-04-13 | 株式会社 テツゲン | ソフトフェライト用複合酸化物粉末の製造方法 |
JPH1140708A (ja) | 1997-07-18 | 1999-02-12 | Hitachi Ltd | 半導体装置 |
JP3740307B2 (ja) * | 1999-01-27 | 2006-02-01 | キヤノン株式会社 | 帯電用磁性粒子及び画像形成装置 |
JP3310655B2 (ja) * | 2000-09-28 | 2002-08-05 | 株式会社環境電磁技術研究所 | 半導体デバイス用パッケージ |
JP3916889B2 (ja) | 2001-06-08 | 2007-05-23 | ソニー株式会社 | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
JP3645197B2 (ja) * | 2001-06-12 | 2005-05-11 | 日東電工株式会社 | 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物 |
JP2003128880A (ja) | 2001-10-26 | 2003-05-08 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物および電子装置 |
JP2004224826A (ja) | 2003-01-20 | 2004-08-12 | Murata Mfg Co Ltd | 接着剤樹脂組成物およびチップ型コイル部品 |
JP2005109181A (ja) * | 2003-09-30 | 2005-04-21 | Tdk Corp | 巻線型電子部品 |
JP4831282B2 (ja) * | 2003-11-10 | 2011-12-07 | 戸田工業株式会社 | フェライト磁性粉体及びフェライト磁性粉体を含有する半導体封止用樹脂組成物 |
JP2005194431A (ja) * | 2004-01-08 | 2005-07-21 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
KR100774798B1 (ko) * | 2004-05-13 | 2007-11-07 | 닛토덴코 가부시키가이샤 | 반도체 캡슐화용 에폭시 수지 조성물 및 이것을 이용한 반도체 장치 |
-
2006
- 2006-06-06 EP EP06757080.4A patent/EP2036860B1/en not_active Expired - Fee Related
- 2006-06-06 WO PCT/JP2006/311342 patent/WO2007141843A1/ja active Application Filing
- 2006-06-06 CN CN2006800548912A patent/CN101460404B/zh not_active Expired - Fee Related
- 2006-06-06 KR KR1020097000071A patent/KR101344644B1/ko active IP Right Grant
- 2006-06-06 US US12/303,856 patent/US20100193972A1/en not_active Abandoned
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TWI588223B (zh) * | 2016-02-19 | 2017-06-21 | 遠東科技大學 | 以回收原料製備電磁波屏蔽材之方法 |
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CN109315083B (zh) * | 2016-06-07 | 2021-05-11 | 保德科技股份有限公司 | 铁氧体粒子、树脂组合物及电磁波屏蔽材料 |
CN108054148A (zh) * | 2017-12-08 | 2018-05-18 | 广东美的制冷设备有限公司 | 智能功率模块及其制造方法、空调器 |
CN108091619A (zh) * | 2017-12-08 | 2018-05-29 | 广东美的制冷设备有限公司 | 智能功率模块及其制造方法、空调器 |
Also Published As
Publication number | Publication date |
---|---|
KR20090040283A (ko) | 2009-04-23 |
KR101344644B1 (ko) | 2013-12-26 |
EP2036860A4 (en) | 2011-03-09 |
EP2036860B1 (en) | 2016-03-02 |
CN101460404B (zh) | 2011-10-05 |
WO2007141843A1 (ja) | 2007-12-13 |
EP2036860A1 (en) | 2009-03-18 |
US20100193972A1 (en) | 2010-08-05 |
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Correction item: Inventor Correct: Yamamoto Kazuya|Abe Masaharu|Yamamoto Yukihisa|Nishimoto Kazushi|Ekishi Tomohiro|Five Arashi Kazuya|Ikemura Kazuhiro|Emoto Takuya|Tada Masataka|Okayama Katsumi|Kobayashi Mamoru False: Yamamoto Kazumi|Abe Masaharu|Yamamoto Yukihisa|Nishimoto Kazushi|Ekishi Tomohiro|Five Economic Alumni|Fujita Takuya|Tada Masataka|Okayama Katsumi|Kobayashi Mamoru Number: 40 Volume: 27 |
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