CN101441991B - 液体处理装置 - Google Patents

液体处理装置 Download PDF

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Publication number
CN101441991B
CN101441991B CN2008101795797A CN200810179579A CN101441991B CN 101441991 B CN101441991 B CN 101441991B CN 2008101795797 A CN2008101795797 A CN 2008101795797A CN 200810179579 A CN200810179579 A CN 200810179579A CN 101441991 B CN101441991 B CN 101441991B
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CN
China
Prior art keywords
substrate
liquid
cup
drain
wafer
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Active
Application number
CN2008101795797A
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English (en)
Chinese (zh)
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CN101441991A (zh
Inventor
金子聪
松本和久
伊藤规宏
饱本正巳
户岛孝之
难波宏光
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN101441991A publication Critical patent/CN101441991A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CN2008101795797A 2006-04-18 2007-04-18 液体处理装置 Active CN101441991B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-114960 2006-04-18
JP2006114960 2006-04-18
JP2006114960 2006-04-18

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2007100961916A Division CN101060070B (zh) 2006-04-18 2007-04-18 液体处理装置

Publications (2)

Publication Number Publication Date
CN101441991A CN101441991A (zh) 2009-05-27
CN101441991B true CN101441991B (zh) 2010-11-03

Family

ID=38120656

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008101795797A Active CN101441991B (zh) 2006-04-18 2007-04-18 液体处理装置
CN2007100961916A Active CN101060070B (zh) 2006-04-18 2007-04-18 液体处理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2007100961916A Active CN101060070B (zh) 2006-04-18 2007-04-18 液体处理装置

Country Status (7)

Country Link
US (1) US7998308B2 (https=)
EP (1) EP1848025B1 (https=)
KR (1) KR101019445B1 (https=)
CN (2) CN101441991B (https=)
AT (1) ATE450885T1 (https=)
DE (1) DE602007003506D1 (https=)
TW (1) TW200802579A (https=)

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US8580042B2 (en) 2007-12-10 2013-11-12 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers
JP5005770B2 (ja) * 2007-12-27 2012-08-22 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
KR100969604B1 (ko) * 2008-06-26 2010-07-12 주식회사 에이앤디코퍼레이션 기판 처리장치 및 방법
JP5156661B2 (ja) * 2009-02-12 2013-03-06 東京エレクトロン株式会社 液処理装置および液処理方法
JP5310693B2 (ja) * 2010-10-07 2013-10-09 東京エレクトロン株式会社 液処理装置
US9799537B2 (en) * 2010-12-03 2017-10-24 Applied Materials, Inc. Processing assembly for semiconductor workpiece and methods of processing same
US20120286481A1 (en) * 2011-05-13 2012-11-15 Lam Research Ag Device and process for liquid treatment of wafer shaped articles
US20120305036A1 (en) * 2011-06-01 2012-12-06 Lam Research Ag Device for treating surfaces of wafer-shaped articles
JP5645796B2 (ja) * 2011-11-21 2014-12-24 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5913937B2 (ja) * 2011-11-30 2016-05-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ カップおよび基板処理装置
JP6148475B2 (ja) * 2013-01-25 2017-06-14 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP6057334B2 (ja) * 2013-03-15 2017-01-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI569349B (zh) * 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
JP6229933B2 (ja) * 2013-09-27 2017-11-15 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
JP6281161B2 (ja) * 2013-09-27 2018-02-21 東京エレクトロン株式会社 液処理装置
JP6090113B2 (ja) * 2013-10-30 2017-03-08 東京エレクトロン株式会社 液処理装置
JP6134673B2 (ja) 2014-03-13 2017-05-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10576604B2 (en) * 2014-04-30 2020-03-03 Ebara Corporation Substrate polishing apparatus
JP6267141B2 (ja) * 2014-06-04 2018-01-24 東京エレクトロン株式会社 液塗布方法、液塗布装置、及びコンピュータ読み取り可能な記録媒体
KR101621482B1 (ko) * 2014-09-30 2016-05-17 세메스 주식회사 기판 처리 장치 및 방법
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
US10276425B2 (en) * 2014-11-21 2019-04-30 Tokyo Electron Limited Substrate processing system
WO2017062141A1 (en) * 2015-10-04 2017-04-13 Applied Materials, Inc. Substrate support and baffle apparatus
CN105244304B (zh) * 2015-11-11 2018-12-18 北京七星华创电子股份有限公司 一种带静电液雾清洗装置和清洗方法
CN110021535A (zh) * 2018-01-10 2019-07-16 弘塑科技股份有限公司 基板处理装置及其旋转台
EP3543795A1 (fr) * 2018-03-20 2019-09-25 Patek Philippe SA Genève Procede de fabrication de composants horlogers en silicium
CN109411402B (zh) * 2018-08-08 2021-03-30 中芯集成电路（宁波）有限公司 湿法清洗设备
JP7037459B2 (ja) * 2018-09-10 2022-03-16 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JP7192756B2 (ja) * 2019-12-19 2022-12-20 株式会社Sumco 気相成長装置及び気相成長方法
JP7438015B2 (ja) * 2020-05-01 2024-02-26 東京エレクトロン株式会社 基板処理装置
KR102732711B1 (ko) 2020-09-16 2024-11-20 삼성전자주식회사 웨이퍼 클리닝 장치 및 이를 이용한 웨이퍼 클리닝 방법
GB202018030D0 (en) * 2020-11-17 2020-12-30 Spts Technologies Ltd Spin rinse dryer with improved drying characteristics
CN112670207B (zh) * 2020-12-21 2023-10-31 长江存储科技有限责任公司 晶边处理设备及待处理晶圆结构的处理方法
CN112992733B (zh) * 2021-02-08 2022-03-11 江苏亚电科技有限公司 一种用于晶圆加工的刷洗装置
JP7731250B2 (ja) * 2021-09-22 2025-08-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102629496B1 (ko) * 2021-12-24 2024-01-29 세메스 주식회사 홈 포트 및 기판 처리 장치

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US5997653A (en) * 1996-10-07 1999-12-07 Tokyo Electron Limited Method for washing and drying substrates
CN1357907A (zh) * 2000-12-05 2002-07-10 S.E.S.株式会社 叶片式基片清洗方法及其装置
US20040180141A1 (en) * 2003-03-10 2004-09-16 Shinji Kobayashi Coating and processing apparatus and method

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JPH0878368A (ja) 1994-09-07 1996-03-22 Hitachi Ltd ワークの処理方法および装置
US6350319B1 (en) * 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
KR100726015B1 (ko) 1999-10-06 2007-06-08 가부시키가이샤 에바라 세이사꾸쇼 기판세정방법 및 그 장치
US6827814B2 (en) * 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
JP3837017B2 (ja) 2000-12-04 2006-10-25 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法ならびに基板処理装置の洗浄方法
JP3958539B2 (ja) * 2001-08-02 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4018958B2 (ja) * 2001-10-30 2007-12-05 大日本スクリーン製造株式会社 基板処理装置
JP4074814B2 (ja) 2002-01-30 2008-04-16 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
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KR100979979B1 (ko) * 2006-07-26 2010-09-03 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법

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US5997653A (en) * 1996-10-07 1999-12-07 Tokyo Electron Limited Method for washing and drying substrates
CN1357907A (zh) * 2000-12-05 2002-07-10 S.E.S.株式会社 叶片式基片清洗方法及其装置
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Also Published As

Publication number Publication date
EP1848025B1 (en) 2009-12-02
US20070240824A1 (en) 2007-10-18
CN101060070B (zh) 2010-10-27
US7998308B2 (en) 2011-08-16
TWI362068B (https=) 2012-04-11
CN101441991A (zh) 2009-05-27
TW200802579A (en) 2008-01-01
DE602007003506D1 (de) 2010-01-14
KR20070103314A (ko) 2007-10-23
CN101060070A (zh) 2007-10-24
ATE450885T1 (de) 2009-12-15
EP1848025A1 (en) 2007-10-24
KR101019445B1 (ko) 2011-03-07

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