CN101421648B - 光电混载薄膜以及收放了它的电子设备 - Google Patents

光电混载薄膜以及收放了它的电子设备 Download PDF

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Publication number
CN101421648B
CN101421648B CN2007800131449A CN200780013144A CN101421648B CN 101421648 B CN101421648 B CN 101421648B CN 2007800131449 A CN2007800131449 A CN 2007800131449A CN 200780013144 A CN200780013144 A CN 200780013144A CN 101421648 B CN101421648 B CN 101421648B
Authority
CN
China
Prior art keywords
film
optical waveguide
conductive wiring
photoelectric hybrid
hybrid film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800131449A
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English (en)
Chinese (zh)
Other versions
CN101421648A (zh
Inventor
盐田刚史
山田一博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of CN101421648A publication Critical patent/CN101421648A/zh
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Publication of CN101421648B publication Critical patent/CN101421648B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
CN2007800131449A 2006-05-12 2007-05-11 光电混载薄膜以及收放了它的电子设备 Expired - Fee Related CN101421648B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006134495 2006-05-12
JP134495/2006 2006-05-12
PCT/JP2007/059710 WO2007132751A1 (ja) 2006-05-12 2007-05-11 光電気混載フィルムおよびそれを収納した電子機器

Publications (2)

Publication Number Publication Date
CN101421648A CN101421648A (zh) 2009-04-29
CN101421648B true CN101421648B (zh) 2010-12-15

Family

ID=38693845

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800131449A Expired - Fee Related CN101421648B (zh) 2006-05-12 2007-05-11 光电混载薄膜以及收放了它的电子设备

Country Status (7)

Country Link
US (1) US7844143B2 (enExample)
EP (1) EP2019327A4 (enExample)
JP (1) JP4418508B2 (enExample)
KR (1) KR101027206B1 (enExample)
CN (1) CN101421648B (enExample)
TW (1) TW200806145A (enExample)
WO (1) WO2007132751A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009096067A1 (ja) * 2008-02-01 2009-08-06 Hitachi Chemical Company, Ltd. 光電気混載基板及び電子機器
WO2009151045A1 (ja) * 2008-06-10 2009-12-17 住友ベークライト株式会社 電子機器、携帯電話機、フレキシブルケーブル、光導波路形成体の製造方法
JP5109934B2 (ja) * 2008-11-07 2012-12-26 日立化成工業株式会社 フレキシブル光電気混載基板及び電子機器
KR20110089408A (ko) 2008-11-21 2011-08-08 히다치 가세고교 가부시끼가이샤 광전기 혼재기판 및 전자기기
JP5321077B2 (ja) * 2009-01-19 2013-10-23 住友ベークライト株式会社 光導波路および光導波路モジュール
JP2010204609A (ja) * 2009-03-06 2010-09-16 Mitsumi Electric Co Ltd フィルム光導波路
JP5262977B2 (ja) * 2009-05-14 2013-08-14 住友ベークライト株式会社 光導波路組立体および電子機器
JP5278225B2 (ja) * 2009-07-29 2013-09-04 住友ベークライト株式会社 光導波路、光配線、光電気混載基板および電子機器
JP5558905B2 (ja) * 2010-05-07 2014-07-23 日本電信電話株式会社 光導波路フィルム
JP2013228467A (ja) * 2012-04-24 2013-11-07 Nippon Mektron Ltd 光電気混載フレキシブルプリント配線板、及びその製造方法
JP5574001B2 (ja) * 2013-03-22 2014-08-20 住友ベークライト株式会社 光導波路
KR102355459B1 (ko) 2015-08-11 2022-01-26 삼성전자주식회사 스타일러스 펜 및 이를 포함하는 전자장치
JP7101454B2 (ja) 2016-12-28 2022-07-15 日東電工株式会社 光電気混載基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2813713B2 (ja) 1990-04-27 1998-10-22 日本電信電話株式会社 ポリイミド系光導波路
JPH05335696A (ja) * 1992-05-29 1993-12-17 Nippon Mektron Ltd 折曲げ容易な可撓性回路基板及びその製造法
JP2001201670A (ja) 2000-01-18 2001-07-27 Sony Corp 光モジュール
EP1286194A3 (en) * 2001-08-21 2004-05-19 Canon Kabushiki Kaisha Optical waveguide apparatus
JP2003258390A (ja) * 2002-03-06 2003-09-12 Sumitomo Electric Printed Circuit Inc フレキシブルプリント配線板
JP4243456B2 (ja) 2002-06-13 2009-03-25 京セラ株式会社 半導体装置
JP2004118117A (ja) * 2002-09-27 2004-04-15 Toshiba Corp 光導波路アレイフィルム
JP3990389B2 (ja) 2003-07-24 2007-10-10 Ｎｅｃアクセステクニカ株式会社 フレキシブル基板および電子装置
JP4112448B2 (ja) * 2003-07-28 2008-07-02 株式会社東芝 電気光配線基板及び半導体装置
US7184617B2 (en) * 2004-03-12 2007-02-27 Matsushita Electric Industrial Co., Ltd. Portable device
JP4252022B2 (ja) 2004-09-14 2009-04-08 三井化学株式会社 光導波路基板、および光電気混載基板
JP4214406B2 (ja) * 2004-09-27 2009-01-28 日本電気株式会社 光信号入出力機構を有する半導体装置
JP2006134495A (ja) 2004-11-08 2006-05-25 Matsushita Electric Ind Co Ltd 属性情報管理システム
JP2006171625A (ja) * 2004-12-20 2006-06-29 Japan Aviation Electronics Industry Ltd 光導波路及び電気配線混載回路、及びその製造方法

Also Published As

Publication number Publication date
US7844143B2 (en) 2010-11-30
WO2007132751A1 (ja) 2007-11-22
EP2019327A1 (en) 2009-01-28
KR20090007746A (ko) 2009-01-20
US20090317048A1 (en) 2009-12-24
JPWO2007132751A1 (ja) 2009-09-24
JP4418508B2 (ja) 2010-02-17
EP2019327A4 (en) 2012-09-05
TWI326571B (enExample) 2010-06-21
KR101027206B1 (ko) 2011-04-06
CN101421648A (zh) 2009-04-29
TW200806145A (en) 2008-01-16

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Granted publication date: 20101215

Termination date: 20170511