CN101419398B - 掩模坯板的制造方法及光掩模的制造方法 - Google Patents

掩模坯板的制造方法及光掩模的制造方法 Download PDF

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Publication number
CN101419398B
CN101419398B CN2008101778611A CN200810177861A CN101419398B CN 101419398 B CN101419398 B CN 101419398B CN 2008101778611 A CN2008101778611 A CN 2008101778611A CN 200810177861 A CN200810177861 A CN 200810177861A CN 101419398 B CN101419398 B CN 101419398B
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China
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liquid
substrate
film
resist
interval
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CN2008101778611A
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Chinese (zh)
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CN101419398A (zh
Inventor
浅川敬司
宫田凉司
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Hoya Corp
Hoya Electronics Malaysia Sdn Bhd
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Hoya Corp
Hoya Electronics Malaysia Sdn Bhd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
CN2008101778611A 2007-06-13 2008-06-12 掩模坯板的制造方法及光掩模的制造方法 Active CN101419398B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-155937 2007-06-13
JP2007155937 2007-06-13
JP2007155937A JP5073375B2 (ja) 2007-06-13 2007-06-13 マスクブランクの製造方法及びフォトマスクの製造方法

Publications (2)

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CN101419398A CN101419398A (zh) 2009-04-29
CN101419398B true CN101419398B (zh) 2012-06-20

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CN2008101778611A Active CN101419398B (zh) 2007-06-13 2008-06-12 掩模坯板的制造方法及光掩模的制造方法

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JP (1) JP5073375B2 (enExample)
KR (1) KR101487550B1 (enExample)
CN (1) CN101419398B (enExample)
MY (1) MY150117A (enExample)
TW (1) TWI439803B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5086714B2 (ja) * 2007-07-13 2012-11-28 Hoya株式会社 マスクブランクの製造方法及びフォトマスクの製造方法
JP2011013321A (ja) * 2009-06-30 2011-01-20 Hoya Corp フォトマスクブランクの製造方法、フォトマスクの製造方法及び塗布装置
JP6659422B2 (ja) * 2016-03-29 2020-03-04 アルバック成膜株式会社 塗布装置、マスクブランクの製造方法
CN114082602A (zh) * 2021-11-30 2022-02-25 Tcl华星光电技术有限公司 涂胶机构以及涂胶装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4445985A1 (de) * 1994-12-22 1996-06-27 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur Belackung oder Beschichtung eines Substrats
JP2000343015A (ja) * 1999-06-08 2000-12-12 Dainippon Screen Mfg Co Ltd 塗布装置
JP3252325B2 (ja) * 1999-10-29 2002-02-04 株式会社ヒラノテクシード 塗工方法及び塗工装置
JP3808741B2 (ja) * 2001-10-01 2006-08-16 東京エレクトロン株式会社 処理装置
JP2005051220A (ja) * 2003-07-17 2005-02-24 Hoya Corp レジスト膜付基板の製造方法
KR20070017228A (ko) * 2003-07-17 2007-02-08 호야 가부시키가이샤 레지스트막 부착 기판의 제조방법
JP2005246274A (ja) * 2004-03-05 2005-09-15 Nidek Co Ltd 塗工方法及び塗工装置
JP4169719B2 (ja) * 2004-03-30 2008-10-22 Hoya株式会社 レジスト膜付基板の製造方法
JP4410063B2 (ja) * 2004-09-06 2010-02-03 東京エレクトロン株式会社 基板処理装置
JP4673157B2 (ja) * 2004-10-01 2011-04-20 株式会社ヒラノテクシード 塗工装置
JP2006269599A (ja) * 2005-03-23 2006-10-05 Sony Corp パターン形成方法、有機電界効果型トランジスタの製造方法、及び、フレキシブルプリント回路板の製造方法

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Publication number Publication date
JP5073375B2 (ja) 2012-11-14
TWI439803B (zh) 2014-06-01
CN101419398A (zh) 2009-04-29
TW200912518A (en) 2009-03-16
JP2008311327A (ja) 2008-12-25
KR20080109650A (ko) 2008-12-17
KR101487550B1 (ko) 2015-02-26
MY150117A (en) 2013-11-29

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