CN101408556B - 电子器件和电子模块以及它们的制造方法 - Google Patents

电子器件和电子模块以及它们的制造方法 Download PDF

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Publication number
CN101408556B
CN101408556B CN2008101685852A CN200810168585A CN101408556B CN 101408556 B CN101408556 B CN 101408556B CN 2008101685852 A CN2008101685852 A CN 2008101685852A CN 200810168585 A CN200810168585 A CN 200810168585A CN 101408556 B CN101408556 B CN 101408556B
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CN
China
Prior art keywords
electrode
substrate
electron device
cut
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101685852A
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English (en)
Chinese (zh)
Other versions
CN101408556A (zh
Inventor
小野淳
小林祥宏
北村昇二郎
松永雅敬
原明稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Miyazaki Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyazaki Epson Corp filed Critical Miyazaki Epson Corp
Publication of CN101408556A publication Critical patent/CN101408556A/zh
Application granted granted Critical
Publication of CN101408556B publication Critical patent/CN101408556B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
CN2008101685852A 2007-10-10 2008-10-10 电子器件和电子模块以及它们的制造方法 Expired - Fee Related CN101408556B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007264443 2007-10-10
JP2007264443 2007-10-10
JP2007-264443 2007-10-10
JP2008-052277 2008-03-03
JP2008052277A JP2009109472A (ja) 2007-10-10 2008-03-03 電子デバイス及び電子モジュール並びにこれらの製造方法
JP2008052277 2008-03-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201110213998XA Division CN102285626A (zh) 2007-10-10 2008-10-10 电子器件和电子模块

Publications (2)

Publication Number Publication Date
CN101408556A CN101408556A (zh) 2009-04-15
CN101408556B true CN101408556B (zh) 2011-09-14

Family

ID=40571653

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201110213998XA Pending CN102285626A (zh) 2007-10-10 2008-10-10 电子器件和电子模块
CN2008101685852A Expired - Fee Related CN101408556B (zh) 2007-10-10 2008-10-10 电子器件和电子模块以及它们的制造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201110213998XA Pending CN102285626A (zh) 2007-10-10 2008-10-10 电子器件和电子模块

Country Status (2)

Country Link
JP (2) JP2009109472A (ja)
CN (2) CN102285626A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5481634B2 (ja) * 2009-10-14 2014-04-23 多摩川精機株式会社 慣性センサを収容するモールド構造およびそれを用いたセンサシステム
JP2013115136A (ja) * 2011-11-25 2013-06-10 Ibiden Co Ltd 電子部品内蔵基板及びその製造方法
JP6699710B2 (ja) * 2018-11-21 2020-05-27 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋
JP6662437B2 (ja) * 2018-11-21 2020-03-11 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋
JP6852830B2 (ja) 2020-07-17 2021-03-31 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554806A (en) * 1994-06-15 1996-09-10 Nippondenso Co., Ltd. Physical-quantity detecting device
US5898218A (en) * 1996-04-26 1999-04-27 Denso Corporation Structure for mounting electronic components and method for mounting the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2877034B2 (ja) * 1994-06-15 1999-03-31 株式会社デンソー 加速度検出装置および加速度センサ
JPH0815302A (ja) * 1994-06-27 1996-01-19 Taiyo Yuden Co Ltd 加速度センサー
JPH0951199A (ja) * 1995-08-08 1997-02-18 Hitachi Ltd 半導体装置
JPH11340366A (ja) * 1998-05-28 1999-12-10 Toshiba Corp 半導体装置
JP3391282B2 (ja) * 1998-07-02 2003-03-31 株式会社村田製作所 電子部品の製造方法
JP3589928B2 (ja) * 2000-02-22 2004-11-17 株式会社東芝 半導体装置
JP2002359320A (ja) * 2001-06-01 2002-12-13 Toyo Commun Equip Co Ltd 電子部品の外部電極パターン
JP2003060327A (ja) * 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品およびその製造方法
JP2004119661A (ja) * 2002-09-26 2004-04-15 Murata Mfg Co Ltd 積層型電子部品
JP2004327855A (ja) * 2003-04-25 2004-11-18 Nec Electronics Corp 半導体装置およびその製造方法
JP4511333B2 (ja) * 2004-12-22 2010-07-28 新光電気工業株式会社 センサ搭載のモジュール及び電子部品
JP2006229121A (ja) * 2005-02-21 2006-08-31 Seiko Epson Corp 圧電デバイス及び圧電装置並びに電子機器
JP2006337196A (ja) * 2005-06-02 2006-12-14 Kayaba Ind Co Ltd 多軸加速度検出装置
JP2007132687A (ja) * 2005-11-08 2007-05-31 Sensata Technologies Japan Ltd センサ用パッケージおよびこれを用いた検出装置
CN101331605A (zh) * 2005-12-15 2008-12-24 松下电器产业株式会社 电子部件内置模块和其制造方法
JP5192825B2 (ja) * 2006-01-17 2013-05-08 スパンション エルエルシー 半導体装置およびその製造方法、ならびに積層半導体装置の製造方法
US7536909B2 (en) * 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
JP2007258635A (ja) * 2006-03-27 2007-10-04 Matsushita Electric Ind Co Ltd 部品内蔵基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554806A (en) * 1994-06-15 1996-09-10 Nippondenso Co., Ltd. Physical-quantity detecting device
US5898218A (en) * 1996-04-26 1999-04-27 Denso Corporation Structure for mounting electronic components and method for mounting the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开平10-253652A 1998.09.25 *
JP特开平7-72167A 1995.03.17 *

Also Published As

Publication number Publication date
CN102285626A (zh) 2011-12-21
JP2009109472A (ja) 2009-05-21
CN101408556A (zh) 2009-04-15
JP2010166061A (ja) 2010-07-29
JP5494947B2 (ja) 2014-05-21

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SEIKO EPSON CORP.

Free format text: FORMER OWNER: EPSON TOYOCOM CORP.

Effective date: 20111014

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20111014

Address after: Tokyo, Japan

Patentee after: Seiko Epson Corp.

Address before: Japan Tokyo Hino Hino 421-8

Patentee before: Epson Toyocom Corp.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110914

Termination date: 20181010