CN102285626A - 电子器件和电子模块 - Google Patents

电子器件和电子模块 Download PDF

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Publication number
CN102285626A
CN102285626A CN201110213998XA CN201110213998A CN102285626A CN 102285626 A CN102285626 A CN 102285626A CN 201110213998X A CN201110213998X A CN 201110213998XA CN 201110213998 A CN201110213998 A CN 201110213998A CN 102285626 A CN102285626 A CN 102285626A
Authority
CN
China
Prior art keywords
substrate
electrode
electronic device
pads
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110213998XA
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English (en)
Chinese (zh)
Inventor
小野淳
小林祥宏
北村昇二郎
松永雅敬
原明稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN102285626A publication Critical patent/CN102285626A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN201110213998XA 2007-10-10 2008-10-10 电子器件和电子模块 Pending CN102285626A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007264443 2007-10-10
JP2007-264443 2007-10-10
JP2008-052277 2008-03-03
JP2008052277A JP2009109472A (ja) 2007-10-10 2008-03-03 電子デバイス及び電子モジュール並びにこれらの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2008101685852A Division CN101408556B (zh) 2007-10-10 2008-10-10 电子器件和电子模块以及它们的制造方法

Publications (1)

Publication Number Publication Date
CN102285626A true CN102285626A (zh) 2011-12-21

Family

ID=40571653

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201110213998XA Pending CN102285626A (zh) 2007-10-10 2008-10-10 电子器件和电子模块
CN2008101685852A Expired - Fee Related CN101408556B (zh) 2007-10-10 2008-10-10 电子器件和电子模块以及它们的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2008101685852A Expired - Fee Related CN101408556B (zh) 2007-10-10 2008-10-10 电子器件和电子模块以及它们的制造方法

Country Status (2)

Country Link
JP (2) JP2009109472A (ja)
CN (2) CN102285626A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5481634B2 (ja) * 2009-10-14 2014-04-23 多摩川精機株式会社 慣性センサを収容するモールド構造およびそれを用いたセンサシステム
JP2013115136A (ja) * 2011-11-25 2013-06-10 Ibiden Co Ltd 電子部品内蔵基板及びその製造方法
JP6699710B2 (ja) * 2018-11-21 2020-05-27 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋
JP6662437B2 (ja) * 2018-11-21 2020-03-11 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋
JP6852830B2 (ja) 2020-07-17 2021-03-31 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554806A (en) * 1994-06-15 1996-09-10 Nippondenso Co., Ltd. Physical-quantity detecting device
JP2877034B2 (ja) * 1994-06-15 1999-03-31 株式会社デンソー 加速度検出装置および加速度センサ
JPH0815302A (ja) * 1994-06-27 1996-01-19 Taiyo Yuden Co Ltd 加速度センサー
JPH0951199A (ja) * 1995-08-08 1997-02-18 Hitachi Ltd 半導体装置
JP3423855B2 (ja) * 1996-04-26 2003-07-07 株式会社デンソー 電子部品搭載用構造体および電子部品の実装方法
JPH11340366A (ja) * 1998-05-28 1999-12-10 Toshiba Corp 半導体装置
JP3391282B2 (ja) * 1998-07-02 2003-03-31 株式会社村田製作所 電子部品の製造方法
JP3589928B2 (ja) * 2000-02-22 2004-11-17 株式会社東芝 半導体装置
JP2002359320A (ja) * 2001-06-01 2002-12-13 Toyo Commun Equip Co Ltd 電子部品の外部電極パターン
JP2003060327A (ja) * 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品およびその製造方法
JP2004119661A (ja) * 2002-09-26 2004-04-15 Murata Mfg Co Ltd 積層型電子部品
JP2004327855A (ja) * 2003-04-25 2004-11-18 Nec Electronics Corp 半導体装置およびその製造方法
JP4511333B2 (ja) * 2004-12-22 2010-07-28 新光電気工業株式会社 センサ搭載のモジュール及び電子部品
JP2006229121A (ja) * 2005-02-21 2006-08-31 Seiko Epson Corp 圧電デバイス及び圧電装置並びに電子機器
JP2006337196A (ja) * 2005-06-02 2006-12-14 Kayaba Ind Co Ltd 多軸加速度検出装置
JP2007132687A (ja) * 2005-11-08 2007-05-31 Sensata Technologies Japan Ltd センサ用パッケージおよびこれを用いた検出装置
US20090115067A1 (en) * 2005-12-15 2009-05-07 Matsushita Electric Industrial Co., Ltd. Module having built-in electronic component and method for manufacturing such module
WO2007083351A1 (ja) * 2006-01-17 2007-07-26 Spansion Llc 半導体装置およびその製造方法
US7536909B2 (en) * 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
JP2007258635A (ja) * 2006-03-27 2007-10-04 Matsushita Electric Ind Co Ltd 部品内蔵基板の製造方法

Also Published As

Publication number Publication date
JP2009109472A (ja) 2009-05-21
JP2010166061A (ja) 2010-07-29
JP5494947B2 (ja) 2014-05-21
CN101408556B (zh) 2011-09-14
CN101408556A (zh) 2009-04-15

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20111221