CN102285626A - 电子器件和电子模块 - Google Patents
电子器件和电子模块 Download PDFInfo
- Publication number
- CN102285626A CN102285626A CN201110213998XA CN201110213998A CN102285626A CN 102285626 A CN102285626 A CN 102285626A CN 201110213998X A CN201110213998X A CN 201110213998XA CN 201110213998 A CN201110213998 A CN 201110213998A CN 102285626 A CN102285626 A CN 102285626A
- Authority
- CN
- China
- Prior art keywords
- substrate
- electrode
- electronic device
- pads
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-264443 | 2007-10-10 | ||
JP2007264443 | 2007-10-10 | ||
JP2008052277A JP2009109472A (ja) | 2007-10-10 | 2008-03-03 | 電子デバイス及び電子モジュール並びにこれらの製造方法 |
JP2008-052277 | 2008-03-03 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101685852A Division CN101408556B (zh) | 2007-10-10 | 2008-10-10 | 电子器件和电子模块以及它们的制造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102285626A true CN102285626A (zh) | 2011-12-21 |
Family
ID=40571653
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101685852A Expired - Fee Related CN101408556B (zh) | 2007-10-10 | 2008-10-10 | 电子器件和电子模块以及它们的制造方法 |
CN201110213998XA Pending CN102285626A (zh) | 2007-10-10 | 2008-10-10 | 电子器件和电子模块 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101685852A Expired - Fee Related CN101408556B (zh) | 2007-10-10 | 2008-10-10 | 电子器件和电子模块以及它们的制造方法 |
Country Status (2)
Country | Link |
---|---|
JP (2) | JP2009109472A (ja) |
CN (2) | CN101408556B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5481634B2 (ja) * | 2009-10-14 | 2014-04-23 | 多摩川精機株式会社 | 慣性センサを収容するモールド構造およびそれを用いたセンサシステム |
JP2013115136A (ja) * | 2011-11-25 | 2013-06-10 | Ibiden Co Ltd | 電子部品内蔵基板及びその製造方法 |
JP6662437B2 (ja) * | 2018-11-21 | 2020-03-11 | 大日本印刷株式会社 | 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋 |
JP6699710B2 (ja) * | 2018-11-21 | 2020-05-27 | 大日本印刷株式会社 | 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋 |
JP6852830B2 (ja) | 2020-07-17 | 2021-03-31 | 大日本印刷株式会社 | 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2877034B2 (ja) * | 1994-06-15 | 1999-03-31 | 株式会社デンソー | 加速度検出装置および加速度センサ |
US5554806A (en) * | 1994-06-15 | 1996-09-10 | Nippondenso Co., Ltd. | Physical-quantity detecting device |
JPH0815302A (ja) * | 1994-06-27 | 1996-01-19 | Taiyo Yuden Co Ltd | 加速度センサー |
JPH0951199A (ja) * | 1995-08-08 | 1997-02-18 | Hitachi Ltd | 半導体装置 |
JP3423855B2 (ja) * | 1996-04-26 | 2003-07-07 | 株式会社デンソー | 電子部品搭載用構造体および電子部品の実装方法 |
JPH11340366A (ja) * | 1998-05-28 | 1999-12-10 | Toshiba Corp | 半導体装置 |
JP3391282B2 (ja) * | 1998-07-02 | 2003-03-31 | 株式会社村田製作所 | 電子部品の製造方法 |
JP3589928B2 (ja) * | 2000-02-22 | 2004-11-17 | 株式会社東芝 | 半導体装置 |
JP2002359320A (ja) * | 2001-06-01 | 2002-12-13 | Toyo Commun Equip Co Ltd | 電子部品の外部電極パターン |
JP2003060327A (ja) * | 2001-08-08 | 2003-02-28 | Matsushita Electric Ind Co Ltd | 電子部品およびその製造方法 |
JP2004119661A (ja) * | 2002-09-26 | 2004-04-15 | Murata Mfg Co Ltd | 積層型電子部品 |
JP2004327855A (ja) * | 2003-04-25 | 2004-11-18 | Nec Electronics Corp | 半導体装置およびその製造方法 |
JP4511333B2 (ja) * | 2004-12-22 | 2010-07-28 | 新光電気工業株式会社 | センサ搭載のモジュール及び電子部品 |
JP2006229121A (ja) * | 2005-02-21 | 2006-08-31 | Seiko Epson Corp | 圧電デバイス及び圧電装置並びに電子機器 |
JP2006337196A (ja) * | 2005-06-02 | 2006-12-14 | Kayaba Ind Co Ltd | 多軸加速度検出装置 |
JP2007132687A (ja) * | 2005-11-08 | 2007-05-31 | Sensata Technologies Japan Ltd | センサ用パッケージおよびこれを用いた検出装置 |
US20090115067A1 (en) * | 2005-12-15 | 2009-05-07 | Matsushita Electric Industrial Co., Ltd. | Module having built-in electronic component and method for manufacturing such module |
JP5192825B2 (ja) * | 2006-01-17 | 2013-05-08 | スパンション エルエルシー | 半導体装置およびその製造方法、ならびに積層半導体装置の製造方法 |
US7536909B2 (en) * | 2006-01-20 | 2009-05-26 | Memsic, Inc. | Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same |
JP2007258635A (ja) * | 2006-03-27 | 2007-10-04 | Matsushita Electric Ind Co Ltd | 部品内蔵基板の製造方法 |
-
2008
- 2008-03-03 JP JP2008052277A patent/JP2009109472A/ja active Pending
- 2008-10-10 CN CN2008101685852A patent/CN101408556B/zh not_active Expired - Fee Related
- 2008-10-10 CN CN201110213998XA patent/CN102285626A/zh active Pending
-
2010
- 2010-01-29 JP JP2010018334A patent/JP5494947B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101408556A (zh) | 2009-04-15 |
JP2010166061A (ja) | 2010-07-29 |
CN101408556B (zh) | 2011-09-14 |
JP2009109472A (ja) | 2009-05-21 |
JP5494947B2 (ja) | 2014-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111221 |