CN102285626A - Electronic device and electronic module - Google Patents
Electronic device and electronic module Download PDFInfo
- Publication number
- CN102285626A CN102285626A CN201110213998XA CN201110213998A CN102285626A CN 102285626 A CN102285626 A CN 102285626A CN 201110213998X A CN201110213998X A CN 201110213998XA CN 201110213998 A CN201110213998 A CN 201110213998A CN 102285626 A CN102285626 A CN 102285626A
- Authority
- CN
- China
- Prior art keywords
- substrate
- electrode
- electronic device
- pads
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention relates to an electronic device and an electronic module. The electronic device includes: a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin, wherein the first substrate, the second substrate and the resin are formed in one piece and comprise mutually opposite first, second surfaces; an outline configuration of a mounting surface connected with the first, second surfaces. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element. The first electrode does not project from the side surface of the first substrate and the second electrode does not project from the side surface of the second substrate.
Description
The application is to be on October 10th, 2008 applying date, and application number is 200810168585.2, and denomination of invention is divided an application for the application for a patent for invention of " electronic device and electronic module and their manufacture method ".
Technical field
The present invention relates to electronic device and electronic module and their manufacture method.
Background technology
In the such sensor element of acceleration transducer, gyro sensor or inertial sensor, have the axle that carries out sensing, thus even also having, horizontal element must indulge the situation of putting, and, element is correctly erect.In patent documentation 1, disclose and used lead frame with putting, but in crooked easily lead-in wire, not only be difficult to precision element is erect the vertical technology that encapsulates of horizontal element, and after the connection wire-bonded with bending lead, so connection reliability is poor.In patent documentation 2, disclose on circuit substrate the technology of inserting terminal and carrying out soldering by infusion process, but be difficult to make components accuracy to be erect well.This type of problem is not limited to produce in sensor element, all might produce in requiring all electronic devices that element is erect.
Patent documentation 1: Japanese kokai publication hei 10-253652 communique
Patent documentation 2: TOHKEMY 2004-361175 communique
Summary of the invention
The objective of the invention is to, a kind of electronic device and electronic module and their manufacture method that element is erect is provided.
(1) a kind of electronic device, this electronic device has:
The 1st substrate, it has the 1st electrode;
The 2nd substrate, it has the 2nd electrode;
Resin, it is configured between described the 1st substrate and the 2nd substrate; And
Electrical equipment, it is had polyhedral outer shape and is configured to the wideest the side in described the 1st substrate and the 2nd substrate by described resin-sealed,
Described the 1st substrate, described the 2nd substrate and described resin-shaped become one, and have the outer shape that comprises the 1st surface respect to one another and the 2nd surface and and the 2nd surperficial loading side that be connected surperficial with the described the 1st,
Described the 1st surface is described the 1st substrate and face described resin opposition side,
Described the 2nd surface is described the 2nd substrate and face described resin opposition side,
What described loading side comprised described resin exposes face and described the 1st substrate and the 2nd substrate and described side of exposing the face adjacency between described the 1st substrate and the 2nd substrate,
Described the 1st electrode is configured in the end side with described loading side adjacency on described the 1st surface, is electrically connected with described electrical equipment,
Described the 2nd electrode is configured in the end side with described loading side adjacency on described the 2nd surface, described the 1st electrode is not outstanding from the described side of described the 1st substrate,
Described the 2nd electrode is not outstanding from the described side of described the 2nd substrate.
According to the present invention, the 1st and the 2nd surface of electronic device is provided with the 1st and the 2nd electrode, but the described the 1st and the 2nd electrode is configured in and loads on the end of side adjacency, even if therefore make load the side below be configured, also can be electrically connected.Thus, by make load the side below, can erect installations (vertical put installation) and be configured the wideest electrical equipment of (horizontal) one-tenth towards the 1st or the 2nd substrate.
(2) in this electronic device, can be:
Described the 1st electrode and the 2nd electrode have the part of a part that constitutes described loading side respectively.
(3) in this electronic device, can be:
Described the 1st electrode and the 2nd electrode have the side electrode portion on the described side that arrives described the 1st substrate and the 2nd substrate respectively.
(4) in this electronic device, can be:
Described the 1st electrode disposes from the periphery devices spaced apart ground on described the 1st surface,
Described the 2nd electrode is from the periphery devices spaced apart ground configuration on described the 2nd surface.
(5) in this electronic device, can be:
Described the 1st electrode and the 2nd electrode are avoided the described side of described the 1st substrate and the 2nd substrate respectively and only are configured on described the 1st surface and the 2nd surface.
(6) in this electronic device, can be:
Described the 1st surface is parallel with the 2nd surface,
Described the 1st electrode and described the 2nd electrode are datum level with the face parallel with described the 1st surface and the 2nd surface of the centre that is in described the 1st surface and the 2nd surface, are in the position of facing title.
(7) in this electronic device, can be:
Described the 1st electrode has identical surface configuration with described the 2nd electrode.
(8) in this electronic device, can be:
Described the 2nd electrode and described electrical equipment electric insulation.
(9) in this electronic device, can be:
Described the 2nd electrode is electrically connected with described electrical equipment.
(10) in this electronic device, can be:
Described electrical equipment is the inertial sensor element.
(11) a kind of electronic module, this electronic module comprises:
Above-mentioned (1) described electronic device; And
Circuit substrate with the 1st wiring and the 2nd wiring,
Described electronic device is loaded on the described circuit substrate in the mode of described loading side towards described circuit substrate,
Described the 1st electrode and the 2nd electrode are respectively by solder and described the 1st wiring and the 2nd wire-bonded.
(12) a kind of electronic module, this electronic module comprises:
Above-mentioned (1) described electronic device; And
Circuit substrate with a plurality of the 1st wirings and a plurality of the 2nd wirings,
A plurality of described electronic devices are loaded on the described circuit substrate in the mode of described loading side towards described circuit substrate,
A plurality of described the 1st electrodes are by solder and a plurality of described the 1st wire-bonded,
A plurality of described the 2nd electrodes are by solder and a plurality of described the 2nd wire-bonded.
(13) a kind of electronic module, this electronic module comprises:
Above-mentioned (1) described electronic device, this electronic device have a plurality of described the 1st electrodes and a plurality of described the 2nd electrode;
Circuit substrate, this circuit substrate have the 1st group a plurality of the 1st pads and the 1st group a plurality of the 2nd pads and a plurality of the 1st pads of the 2nd group and a plurality of the 2nd pads of the 2nd group,
Described the 1st group a plurality of the 1st pads and described the 1st group a plurality of the 2nd pads are that base platoon is listed on the position of line symmetry with the 1st straight line,
Described the 2nd group a plurality of the 1st pads and described the 2nd group a plurality of the 2nd pads are that base platoon is listed on the position of line symmetry with the 2nd straight line,
Described the 1st straight line and described the 2nd straight line are configured to the right angle,
A plurality of described electronic devices are loaded on the described circuit substrate in the mode of described loading side towards described circuit substrate,
In the 1st electronic device in a plurality of described electronic devices:
A plurality of described the 1st electrodes engage with described the 1st group a plurality of the 1st pads by solder,
A plurality of described the 2nd electrodes engage with described the 1st group a plurality of the 2nd pads by solder,
In the 2nd electronic device in a plurality of described electronic devices:
A plurality of described the 1st electrodes engage with described the 2nd group a plurality of the 1st pads by solder,
A plurality of described the 2nd electrodes engage with described the 2nd group a plurality of the 2nd pads by solder.
Description of drawings
Fig. 1 is the cutaway view of the I-I line of the electronic device shown in Fig. 3 (A).
Fig. 2 is the cutaway view of the II-II line of the electronic device shown in Fig. 3 (A).
(A)～(C) of Fig. 3 is respectively vertical view, side view and the upward view of the electronic device that relates to of embodiment of the present invention.
Fig. 4 is the amplification stereogram that the 1st electrode and its peripheral detailed structure are shown.
Fig. 5 is the amplification stereogram that the variation of the 1st electrode and its peripheral detailed structure is shown.
Fig. 6 is the cutaway view that the loading example of the electronic device that embodiment of the present invention relates to is shown.
Fig. 7 is the cutaway view of the electronic module that relates to of embodiment of the present invention.
Fig. 8 is the figure that the manufacture method to the electronic device that the present invention relates to describes.
Fig. 9 is the figure that the 1st variation of cutting off operation is described.
Figure 10 is the figure that the 2nd variation of cutting off operation is described.
Figure 11 is the side view that the 1st variation of electronic device is shown.
(A) of Figure 12 is the cutaway view of electronic device shown in Figure 11, and (B) of Figure 12 is the cutaway view of the variation of electronic device shown in Figure 11.
(A) of Figure 13 and (B) of Figure 13 are the figure that the manufacture method of electronic module that embodiment of the present invention is related to describes.
Figure 14 is the figure that the 1st variation of the manufacture method of electronic device that embodiment of the present invention is related to describes.
Figure 15 is the figure that the 1st variation of the manufacture method of electronic device that embodiment of the present invention is related to describes.
Figure 16 is the figure that the 2nd variation of the manufacture method of electronic device that embodiment of the present invention is related to describes.
Figure 17 is the figure that the 2nd variation of the manufacture method of electronic device that embodiment of the present invention is related to describes.
Figure 18 is the figure that the 2nd variation of the manufacture method of electronic device that embodiment of the present invention is related to describes.
Symbol description
1 electronic device; 10 the 1st substrates; 12 surfaces; 14 sides; 16 the 1st electrodes; 18 surface electrode portions; 20 otch; 22 side electrode portions; 24 wiring patterns; 26 the 2nd substrates; 28 the 2nd electrodes; 30 electrical equipments; 32 sheet of elements; 34 encapsulation; 36 pedestals; 38 lids; 40 resins; 42 expose face; 44 the 1st surfaces; 46 the 2nd surfaces; 48 load the side; 50 circuit substrates; 52 the 1st wirings; 54 the 2nd wirings; 56 wirings; 58 solders.
The specific embodiment
Fig. 1 and Fig. 2 are respectively the cutaway views of the electronic device 1 that relates to of embodiment of the present invention.Fig. 3 (A)～Fig. 3 (C) is respectively vertical view, side view and the upward view of the electronic device 1 that relates to of embodiment of the present invention.In addition, Fig. 1 is the cutaway view of the I-I line of the electronic device 1 shown in Fig. 3 (A).Fig. 2 is the cutaway view of the II-II line of the electronic device 1 shown in Fig. 3 (A).
The 1st substrate 10 has one or more the 1st electrodes 16.Fig. 4 is the amplification stereogram that the 1st electrode 16 and its peripheral detailed structure are shown.The 1st electrode 16 has the surface electrode portion 18 on the face (being lower surface in Fig. 1) that is formed on the 1st substrate 10, by the surface (being lower surface in Fig. 4) of this surface electrode portion 18 and the face formation ladder of side (face of definition thickness) and the 1st substrate 10.As variation, also can be the surface of the 1st electrode 16 and the 1st substrate 10 face at grade.In the edge portion of the 1st substrate 10, be formed with otch 20 (14 being viewed as recess from the side).The inner surface of otch 20 can be curved surface (part (less than semicircle) that for example runs through the internal face of circular hole), also can be formed by a plurality of planes.The 1st electrode 16 forms and arrives side 14 (inner surface of otch 20).That is, the 1st electrode 16 has side electrode portion 22 on the inner surface of otch 20.Side electrode portion 22 is outstanding from the side 14 (with the part of otch 20 adjacency) of the 1st substrate 10, has and side 14 part and 14 parts that cave in from the side at grade.The 1st substrate 10 has wiring pattern 24.Wiring pattern 24 is formed on the 1st substrate 10 and the faces the 1st electrode 16 opposition sides.Wiring pattern 24 and the 1st electrode 16 are electrically connected by side electrode portion 22.
As variation, as shown in Figure 5, also can be the integral body of side electrode portion 122 of the 1st electrode 116 and the 1st substrate 110 side 114 (with the part of otch 120 adjacency) at grade.
Electronic device 1 has the 2nd substrate 26.The 2nd substrate 26 has the 2nd electrode 28.On the 2nd substrate 26 and the 2nd electrode 28, can use the 1st above-mentioned substrate 10 and the content of the 1st electrode 16.But the 2nd electrode 28 can be the dummy electrodes of the insulation that is not electrically connected with electrical equipment 30, and this point is different with the 1st electrode 16.The 1st substrate 10 with the 1st electrode 16 also can have identical structure with the 2nd substrate 26 with the 2nd electrode 28.It is opposed that the 1st and the 2nd substrate 10,26 is configured to devices spaced apart, becomes in the face of claiming so that the 1st and the 2nd electrode 16,28, also can be configured to the 1st and the 2nd substrate 10,26 towards rightabout.In this case, in addition, as long as will for example shown in Fig. 3 (C), also can on the 1st substrate 10, have electrode along being configured in the face of on the position that claims of the 1st substrate 10 while a plurality of the 1st electrodes 16 of arranging with along a plurality of the 2nd electrodes 28 of arranging of the 2nd substrate 26.In addition, the 1st becomes identical surface configuration (identical in surface electrode portion 18 at least) with the 2nd electrode 16,28.
Electronic device 1 has electrical equipment 30.Electrical equipment 30 comprises sheet of elements 32 (for example piezoelectric vibration piece) and to its encapsulation that seals 34 (for example being made of pottery), also can be that IC35 is sealed in addition.In the example of Fig. 1, encapsulation 34 comprises pedestal 36 and lid 38, and pedestal 36 is fixed on the 1st substrate 10.Electrical equipment 30 is inertial sensor (for example, measuring the acceleration transducer of linear acceleration or the gyro sensor of measured angular speed etc.).Inertial sensor has the orientation dependence.For example, detect in acceleration transducer along the acceleration of the direction that detects axle, detecting with the rotating shaft in gyro sensor is the angular speed at center.In order suitably to bring into play function, need make these dispose electrical equipment 30 towards correct direction.Therefore, electrical equipment 30 is configured to have polyhedral outer shape and the wideest towards the 1st or the 2nd substrate 10,26.In addition, the profile of sheet of elements 32 relative electrical equipments 30 (profile of encapsulation 34) is correctly disposed.For example, detection axle and electrical equipment 30 the wideest of sheet of elements 32 who is configured to acceleration transducer is parallel, perhaps is configured to the detection rotating shaft of sheet of elements 32 of gyro sensor and the wideest quadrature of electrical equipment 30.Electrical equipment 30 is electrically connected with the 1st electrode 16.The terminal of electrical equipment 30 is electrically connected with the wiring pattern 24 of the 1st substrate 10.As shown in Figure 1, can be that the terminal and the wiring pattern 24 of electrical equipment 30 is opposed, also can be the form of both not opposed (towards equidirectional), under latter event, also can be electrically connected by wire.The 2nd electrode 28 can not be electrically connected with electrical equipment 30 and insulate, and can be electrically connected with electrical equipment 30 yet.
The 1st electrode 16 (adjacency) on the 1st surface 44 is configured in and loads on the end of side 48 adjacency, and the 2nd electrode 28 (adjacency) on the 2nd surface 46 is configured in and loads on the end of side 48 adjacency.The the 1st and the 2nd electrode 16,28 has the part (side electrode portion 22) that constitutes a part of loading side 48 respectively.The 1st is parallel with the 2nd surface 44,46.At least one the 1st electrode 16 and at least one the 2nd electrode 28 are configured in the position in the face of claiming about the 1st or the 2nd surface 44,46 (to be datum level with the 1st face (not shown) parallel with the 2nd surface 44,46).
Fig. 6 is the cutaway view that the loading example of the electronic device that embodiment of the present invention relates to is shown.In addition, the cross section of electronic device 1 shown in Figure 6 is corresponding with the cross section of electronic device 1 shown in Figure 1.Above-mentioned electronic device 1 also can be loaded on the circuit substrate 50 with wiring 56.In this case, make the 1st electrode 16 be loaded in (horizontal) on the circuit substrate 50 towards circuit substrate 50 ground.The 1st electrode 16 engages with wiring 56 by solder 58.
Fig. 7 is the cutaway view of the electronic module that relates to of embodiment of the present invention.In addition, the cross section of the electronic device 1 that comprises in the electronic module shown in Figure 7 is corresponding with the cross section of electronic device 1 shown in Figure 2.
Electronic module comprises above-mentioned electronic device 1 and has the circuit substrate 50 of the 1st and the 2nd wiring 52,54.Also can make and load side 48, make and load upper surface 49 up, on circuit substrate 50, load electronic device 1 (vertical putting) towards circuit substrate 50.In this case, load upper surface 49 and flatten when smooth, can use the absorption erector to load.The the 1st and the 2nd electrode 16,28 engages (and electrical connection) by solder 58 with the 1st and the 2nd wiring 52,54 respectively.Specifically, the side electrode portion 22 of the 1st and the 2nd electrode 16,28 is 52,54 opposed with the 1st and the 2nd wiring respectively, carries out the engaging of opposed direction (for example gravity direction) of electronic device 1 and circuit substrate 50 by solder 58.In addition, the surface electrode portion 18 of the 1st and the 2nd electrode 16,28 erects in the 1st and the 2nd wiring 52,54 respectively.In addition, the side 14 of exposing face 42 and the 1st and the 2nd electrode 16,28 of resin 40 be supported to the direction of circuit substrate 50 levels of electronic device 1 direction of gravity direction quadrature (for example with) on do not move.This is bearing on the two sides (the 1st and the 2nd surface 44,46) of electronic device 1 and carries out, and therefore can realize stable supporting.The the 1st and the 2nd electrode the 16, the 28th, when facing the configuration that claims, this effect further improves.
According to present embodiment, the 1st and the 2nd surface 44,46 of electronic device 1 is provided with the 1st and the 2nd electrode 16,28, and these electrodes and loading side 48 adjacency also can be electrically connected even if loading side 48 is disposed down.Thus, load side 48 down, as shown in Figure 7, can erect installation (indulge and put installation) and be configured the wideest electrical equipment 30 of (horizontal) one-tenth towards the 1st or the 2nd substrate 10,26 by making.
Fig. 8 is the figure that the manufacture method of electronic device 1 that embodiment of the present invention is related to describes.
Shown in Fig. 8 (A), on the 1st substrate 10, load electrical equipment 30.Herein, electrical equipment 30 is configured to the wideest towards the 1st substrate 10.In addition, the 1st electrode 16 is electrically connected with electrical equipment 30.
Shown in Fig. 8 (B), devices spaced apart ground configuration the 2nd substrate 26 above the 1st substrate 10 and electrical equipment 30.For devices spaced apart, also can between the 1st and the 2nd substrate 10,26, dispose pad (not shown).
By above operation, at the 1st substrate 10 with have between the 2nd substrate 26 of the 2nd electrode 28 with the 1st electrode 16, the configuration have polyhedral outer shape electrical equipment 30 so that the wideest towards the 1st or the 2nd substrate 10,26, the 1st electrode 16 is electrically connected with electrical equipment 30.
Shown in Fig. 8 (C), between the 1st and the 2nd substrate 10,26, electrical equipment 30 is sealed by resin 40 (this is resin precursor constantly strictly speaking).Sealing also can be used transfer modling, but is not limited to this.
Shown in Fig. 8 (D), cut off the 1st and the 2nd substrate 10,26 and resin 40 integratedly.In order to cut off cutters such as to use cutting machine.Cut off the 1st substrate 10 so that the 1st electrode 16 disposes with loading side 48 adjacency on the 1st surface 44.Cut off the 2nd substrate 26 so that the 2nd electrode 28 disposes with loading side 48 adjacency on the 2nd surface 46.Cut off the 1st and the 2nd substrate 10,26 and resin 40 so that the cross section flattens smoothly, two surfaces 12 of cross section and the 1st substrate 10 (or the 2nd substrate 26) are met at right angles.
By cutting off, can under the opposed state of the section of the electronic device between adjacent 1, obtain a plurality of electronic devices 1.Opposed section can be to load side 48 and load upper surface 49 (with reference to Fig. 3 (A)～Fig. 3 (C)), also can be to load between the side 48, can also be to load between the upper surface 49.No matter be any situation, as long as a side of opposed section is smooth, then the opposing party also flattens smooth.
Fig. 9 is the figure that the 1st variation of cutting off operation is described.In this embodiment, cut off the 1st substrate 200 and the 1st electrode 202 and not shown the 2nd substrate, the 2nd electrode and resin integratedly, obtain a plurality of electronic devices 204.Thus, cut off the 1st electrode 202 and the 2nd electrode (not shown), so become the shape till each electrode is configured to these cut-out ends.Thus, make and load that the relative circuit substrate in side is vertical to be put when installing down, become the 1st electrode 202 and the 2nd electrode respectively with the very approaching state of pad (land) of circuit substrate.Therefore, for example, in the joint by soldering, with respect to the 1st electrode 202 and the 2nd electrode, soldering erects easily, installs to become convenient.
Figure 10 is the figure that the 2nd variation of cutting off operation is described.In this embodiment, cut off the 1st substrate 210 and not shown the 2nd substrate and resin integratedly, obtain a plurality of electronic devices 212, but do not cut off the 1st electrode 214 and the 2nd electrode (not shown).Thus, on section, do not produce the overlap of the 1st electrode 214 and the 2nd electrode (not shown).
The 1st surface 44 of electronic device 1 is formed by the part with faces resin 40 opposition sides the 1st substrate 10.The 2nd surface 46 of electronic device 1 is formed by the part with faces resin 40 opposition sides the 2nd substrate 26.The loading side 48 of electronic device 1 is formed by the side 14 that face 42 and the cut-out by the 1st and the 2nd substrate 10,26 produce of exposing that the cut-out by resin 40 produces.
The manufacture method of the electronic device 1 that the present invention relates to comprises above-mentioned operation, in addition, can use the method for obviously knowing by the structure of above-mentioned electronic device 1.
Figure 11 is the side view that the 1st variation of electronic device is shown.In this embodiment, electronic device does not have side electrode portion 22 shown in Figure 4.That is, the 1st and the 2nd electrode 222,224 is avoided the side 230,232 of the 1st and the 2nd substrate 226,228 respectively and only is configured on the 1st and the 2nd surface 234,236.
Figure 12 (A) is the cutaway view of electronic device shown in Figure 11.In this embodiment, the side 238,240 of the 1st and the 2nd electrode 222,224 respectively with the side 230,232 of the 1st and the 2nd substrate 226,228 at grade.Specifically, the 1st electrode 222 disposes with loading side 242 adjacency on the 1st surface 234, and the 2nd electrode 224 disposes with loading side 242 adjacency on the 2nd surface 236.Its shape can obtain by cut-out operation shown in Figure 9.
Figure 12 (B) is the cutaway view of the variation of electronic device shown in Figure 11.In this embodiment, the 1st and the 2nd electrode 252,254 disposes from the devices spaced apart ground, end of the 1st and the 2nd substrate 226,228 respectively.Specifically, the 1st electrode 252 is from the periphery devices spaced apart ground configuration on the 1st surface 234, and the 2nd electrode 254 is from the periphery devices spaced apart ground configuration on the 2nd surface 236.Its shape can obtain by cut-out operation shown in Figure 10.
Figure 13 (A) and Figure 13 (B) are the figure that the manufacture method of electronic module that embodiment of the present invention is related to describes.
In the present embodiment, shown in Figure 13 (A), prepare to have the circuit substrate 300 of a plurality of the 1st pads 302 and a plurality of the 2nd pads 304.On the position of a plurality of the 1st pads 302 and the online symmetry of a plurality of the 2nd pad 304 arrangements (for example being arranged in parallel).Specifically, a plurality of the 2nd pads 314 of a plurality of the 1st pads 312 of the 1st group and the 1st group are with line L
1Be listed in for base platoon on the position of line symmetry.A plurality of the 1st pads 322 of the 2nd group and a plurality of the 2nd pads 324 of the 2nd group are with line L
2Be listed in for base platoon on the position of line symmetry.Line L
1With line L
2Be configured to the right angle.
In the present embodiment, shown in Figure 13 (B), prepare to have respectively the 1st and the 2nd electronic device 342,344 of a plurality of the 1st electrodes 332 and a plurality of the 2nd electrodes 334.In the 1st and the 2nd electronic device 342,344, the 1st is parallel with the 2nd surface 352,354, a plurality of the 1st electrodes 332 and a plurality of the 2nd electrodes 334 be in the 1st with the centre on the 2nd surface 352,354 (comprise line L with the 1st face parallel with the 2nd surface 352,354
1, L
2Face S
1, S
2) be datum level, be in position in the face of claiming.In addition, the 1st electrode 332 and the 2nd electrode 334 have identical shaped surface.
Shown in Figure 13 (B), loading side (rear side of figure) is installed in the 1st and the 2nd electronic device 342,344 on the circuit substrate 300 towards circuit substrate 300 ground, and a plurality of the 1st electrodes 332 and a plurality of the 2nd electrode 334 engage with a plurality of the 1st pads 302 and a plurality of the 2nd pad 304 by soldered joint.According to present embodiment, the self alignment effect during by soldered joint can be carried out 342,344 contrapositions with respect to circuit substrate 300 of the 1st and the 2nd electronic device.In addition, at the L along the line of the 1st pad 302 and the 1st electrode 332
1The width of direction is identical, the L along the line of the 2nd pad 304 and the 2nd electrode 334
2When the width of direction was identical, self alignment effect was strong.
Next, the 1st variation of the manufacture method of the electronic device that embodiment of the present invention is related to describes.Shown in Figure 14 (A), in this embodiment, use patrix 410 and counterdie 412.On patrix 410, by air absorption the 2nd substrate 416 is adsorbed via adsorption orifice 414.The pin 420 that inserts patrix 410 in the hole 418 of the 2nd substrate 416 carries out the contraposition of the 2nd substrate 416.Configuration molding thin plate 422 in counterdie 412.Shown in Figure 14 (B), configuration the 1st substrate 424 on molding thin plate 422.The pin 420 that inserts counterdie 412 in the hole 418 of the 1st substrate 424 carries out the contraposition of the 1st substrate 424.The a plurality of electrical equipments 30 of configuration on the 1st substrate 424.Shown in Figure 14 (C), clamp patrix 410 and counterdie 412, so that electrical equipment 30 is configured between the 1st and the 2nd substrate 424,416, carry out the exhaust of cavity via passage 426.Shown in Figure 14 (D), to cavity, inject moulding resin 430 from inlet 428, shown in Figure 15 (A), moulding resin 430 is cured.Shown in Figure 15 (B), open patrix 410 and counterdie 412, shown in Figure 15 (C), between the 1st and the 2nd substrate 424,416, take out the seal 432 of a plurality of electrical equipments 30 of sealing.Shown in Figure 15 (D), remove and seal 432 incorporate unwanted resin parts 434 (watering a destruction or cross gate destroys).After this, shown in Figure 15 (E), cut.The content that illustrates in other details and the above-mentioned manufacture method is suitable.
Next, the 2nd variation of the manufacture method of the electronic device that embodiment of the present invention is related to describes.Shown in Figure 16 (A), molding thin plate 522 is set on counterdie 512, the 1st substrate 524 is set thereon.The pin 520 that inserts counterdie 512 in the hole 518 of the 1st substrate 524 carries out the contraposition of the 1st substrate 524.The a plurality of electrical equipments 30 of configuration on the 1st substrate 524.Shown in Figure 16 (B), clamp patrix 510 and counterdie 512, carry out the exhaust of cavity via passage 526.Shown in Figure 16 (C), in cavity, inject moulding resin 530 via inlet 528, shown in Figure 16 (D), moulding resin 530 is cured.Shown in Figure 17 (A), open patrix 510 and counterdie 512, shown in Figure 17 (B), take out the seal 532 of a plurality of electrical equipments 30 of sealing.Shown in Figure 17 (C), remove and seal 532 incorporate unwanted resin parts 534 (watering a destruction or cross gate destroys).Shown in Figure 17 (D), on the stamping die 536 seal 532 is being set down.The pin 521 of stamping die 536 carries out the contraposition of the 1st substrate 524 under the part of seal 532 is promptly inserted in the hole 518 of the 1st substrate 524.Shown in Figure 18 (A), configuration is fitted with thin plate 538 on seal 532.Fitting with thin plate 538 is thermoplastic resins (epoxy resin etc.) for example, in the moment that is configured on the seal 532, also can not manifest cohesive force or adhesion strength.Across fitting with thin plate 538 configuration the 2nd substrate 516 on seal 532.The pin 521 of stamping die 536 carries out the contraposition of the 2nd substrate 516 under inserting in the hole 518 of the 2nd substrate 516.Shown in Figure 18 (B), by last stamping die 540 and following stamping die 536,, between the 2nd substrate 516 and seal 532, exert pressure, simultaneously heating across fitting with thin plate 538.Like this, making fits manifests cohesive force with thin plate 538, and 516 hot pressing of the 2nd substrate are received on the seal 532.Shown in Figure 18 (C), between the 1st and the 2nd substrate 524,516, take out the seal 542 of a plurality of electrical equipments 30 of sealing, shown in Figure 18 (D), cut.The content that illustrates in other details and the above-mentioned manufacture method is suitable.
The present invention is not limited to above-mentioned embodiment, can carry out various distortion.For example, the present invention includes with embodiment in the identical in fact structure of the structure that illustrates (for example, function, method and the structure that comes to the same thing, or purpose and the structure that comes to the same thing).In addition, the present invention includes the structure of the non-intrinsically safe part of the structure that illustrates in the displacement embodiment.In addition, the present invention includes the structure that can play the structure of same function effect with the structure that illustrates in the embodiment or reach identical purpose.In addition, present invention resides in the structure of having added known technology on the structure that illustrates in the embodiment.
Claims (13)
1. electronic device, this electronic device has:
The 1st substrate, it has the 1st electrode;
The 2nd substrate, it has the 2nd electrode;
Resin, it is configured between described the 1st substrate and the 2nd substrate; And
Electrical equipment, it is had polyhedral outer shape and is configured to the wideest the side in described the 1st substrate and the 2nd substrate by described resin-sealed,
Described the 1st substrate, described the 2nd substrate and described resin-shaped become one, and have the outer shape that comprises the 1st surface respect to one another and the 2nd surface and and the 2nd surperficial loading side that be connected surperficial with the described the 1st,
Described the 1st surface is described the 1st substrate and face described resin opposition side,
Described the 2nd surface is described the 2nd substrate and face described resin opposition side,
What described loading side comprised described resin exposes face and described the 1st substrate and the 2nd substrate and described side of exposing the face adjacency between described the 1st substrate and the 2nd substrate,
Described the 1st electrode is configured in the end side with described loading side adjacency on described the 1st surface, is electrically connected with described electrical equipment,
Described the 2nd electrode is configured in the end side with described loading side adjacency on described the 2nd surface, described the 1st electrode is not outstanding from the described side of described the 1st substrate,
Described the 2nd electrode is not outstanding from the described side of described the 2nd substrate.
2. electronic device according to claim 1, wherein,
Described the 1st electrode and the 2nd electrode have the part of a part that constitutes described loading side respectively.
3. electronic device according to claim 1 and 2, wherein,
Described the 1st electrode and the 2nd electrode have the side electrode portion on the described side that arrives described the 1st substrate and the 2nd substrate respectively.
4. electronic device according to claim 1, wherein,
Described the 1st electrode disposes from the periphery devices spaced apart ground on described the 1st surface,
Described the 2nd electrode is from the periphery devices spaced apart ground configuration on described the 2nd surface.
5. according to claim 1 or 4 described electronic devices, wherein,
Described the 1st electrode and the 2nd electrode are avoided the described side of described the 1st substrate and the 2nd substrate respectively and only are configured on described the 1st surface and the 2nd surface.
6. electronic device according to claim 1, wherein,
Described the 1st surface is parallel with the 2nd surface,
Described the 1st electrode and described the 2nd electrode are datum level with the face parallel with described the 1st surface and the 2nd surface of the centre that is in described the 1st surface and the 2nd surface, are in the position of facing title.
7. electronic device according to claim 1, wherein,
Described the 1st electrode has identical surface configuration with described the 2nd electrode.
8. electronic device according to claim 1, wherein,
Described the 2nd electrode and described electrical equipment electric insulation.
9. electronic device according to claim 1, wherein,
Described the 2nd electrode is electrically connected with described electrical equipment.
10. electronic device according to claim 1, wherein,
Described electrical equipment is the inertial sensor element.
11. an electronic module, this electronic module comprises:
The described electronic device of claim 1; And
Circuit substrate with the 1st wiring and the 2nd wiring,
Described electronic device is loaded on the described circuit substrate in the mode of described loading side towards described circuit substrate,
Described the 1st electrode and the 2nd electrode are respectively by solder and described the 1st wiring and the 2nd wire-bonded.
12. an electronic module, this electronic module comprises:
The described electronic device of claim 1; And
Circuit substrate with a plurality of the 1st wirings and a plurality of the 2nd wirings,
A plurality of described electronic devices are loaded on the described circuit substrate in the mode of described loading side towards described circuit substrate,
A plurality of described the 1st electrodes are by solder and a plurality of described the 1st wire-bonded,
A plurality of described the 2nd electrodes are by solder and a plurality of described the 2nd wire-bonded.
13. an electronic module, this electronic module comprises:
The described electronic device of claim 1, this electronic device have a plurality of described the 1st electrodes and a plurality of described the 2nd electrode;
Circuit substrate, this circuit substrate have the 1st group a plurality of the 1st pads and the 1st group a plurality of the 2nd pads and a plurality of the 1st pads of the 2nd group and a plurality of the 2nd pads of the 2nd group,
Described the 1st group a plurality of the 1st pads and described the 1st group a plurality of the 2nd pads are that base platoon is listed on the position of line symmetry with the 1st straight line,
Described the 2nd group a plurality of the 1st pads and described the 2nd group a plurality of the 2nd pads are that base platoon is listed on the position of line symmetry with the 2nd straight line,
Described the 1st straight line and described the 2nd straight line are configured to the right angle,
A plurality of described electronic devices are loaded on the described circuit substrate in the mode of described loading side towards described circuit substrate,
In the 1st electronic device in a plurality of described electronic devices:
A plurality of described the 1st electrodes engage with described the 1st group a plurality of the 1st pads by solder,
A plurality of described the 2nd electrodes engage with described the 1st group a plurality of the 2nd pads by solder,
In the 2nd electronic device in a plurality of described electronic devices:
A plurality of described the 1st electrodes engage with described the 2nd group a plurality of the 1st pads by solder,
A plurality of described the 2nd electrodes engage with described the 2nd group a plurality of the 2nd pads by solder.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007264443 | 2007-10-10 | ||
| JP2007-264443 | 2007-10-10 | ||
| JP2008052277A JP2009109472A (en) | 2007-10-10 | 2008-03-03 | Electronic device, electronic module, and method for manufacturing same |
| JP2008-052277 | 2008-03-03 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101685852A Division CN101408556B (en) | 2007-10-10 | 2008-10-10 | Electronic device, electronic module, and methods for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102285626A true CN102285626A (en) | 2011-12-21 |
Family
ID=40571653
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110213998XA Pending CN102285626A (en) | 2007-10-10 | 2008-10-10 | Electronic device and electronic module |
| CN2008101685852A Expired - Fee Related CN101408556B (en) | 2007-10-10 | 2008-10-10 | Electronic device, electronic module, and methods for manufacturing the same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101685852A Expired - Fee Related CN101408556B (en) | 2007-10-10 | 2008-10-10 | Electronic device, electronic module, and methods for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP2009109472A (en) |
| CN (2) | CN102285626A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5481634B2 (en) * | 2009-10-14 | 2014-04-23 | 多摩川精機株式会社 | Mold structure for accommodating inertial sensor and sensor system using the same |
| JP2013115136A (en) * | 2011-11-25 | 2013-06-10 | Ibiden Co Ltd | Substrate with built-in electronic components and manufacturing method of the same |
| JP6662437B2 (en) * | 2018-11-21 | 2020-03-11 | 大日本印刷株式会社 | Sealant film for packaging material using plant-derived polyethylene, laminated film for packaging material, and packaging bag |
| JP6699710B2 (en) * | 2018-11-21 | 2020-05-27 | 大日本印刷株式会社 | Sealant film for packaging material using plant-derived polyethylene, laminated film for packaging material, and packaging bag |
| JP6852830B2 (en) | 2020-07-17 | 2021-03-31 | 大日本印刷株式会社 | Sealant film for packaging materials using plant-derived polyethylene, laminated film for packaging materials, and packaging bags |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2877034B2 (en) * | 1994-06-15 | 1999-03-31 | 株式会社デンソー | Acceleration detection device and acceleration sensor |
| US5554806A (en) * | 1994-06-15 | 1996-09-10 | Nippondenso Co., Ltd. | Physical-quantity detecting device |
| JPH0815302A (en) * | 1994-06-27 | 1996-01-19 | Taiyo Yuden Co Ltd | Acceleration sensor |
| JPH0951199A (en) * | 1995-08-08 | 1997-02-18 | Hitachi Ltd | Semiconductor device |
| JP3423855B2 (en) * | 1996-04-26 | 2003-07-07 | 株式会社デンソー | Electronic component mounting structure and electronic component mounting method |
| JPH11340366A (en) * | 1998-05-28 | 1999-12-10 | Toshiba Corp | Semiconductor device |
| JP3391282B2 (en) * | 1998-07-02 | 2003-03-31 | 株式会社村田製作所 | Electronic component manufacturing method |
| JP3589928B2 (en) * | 2000-02-22 | 2004-11-17 | 株式会社東芝 | Semiconductor device |
| JP2002359320A (en) * | 2001-06-01 | 2002-12-13 | Toyo Commun Equip Co Ltd | Outer electrode pattern of electronic component |
| JP2003060327A (en) * | 2001-08-08 | 2003-02-28 | Matsushita Electric Ind Co Ltd | Electronic component and manufacturing method therefor |
| JP2004119661A (en) * | 2002-09-26 | 2004-04-15 | Murata Mfg Co Ltd | Laminated electronic component |
| JP2004327855A (en) * | 2003-04-25 | 2004-11-18 | Nec Electronics Corp | Semiconductor device and its manufacturing method |
| JP4511333B2 (en) * | 2004-12-22 | 2010-07-28 | 新光電気工業株式会社 | Sensor-equipped modules and electronic components |
| JP2006229121A (en) * | 2005-02-21 | 2006-08-31 | Seiko Epson Corp | Piezoelectric device, piezoelectric equipment and electronic apparatus |
| JP2006337196A (en) * | 2005-06-02 | 2006-12-14 | Kayaba Ind Co Ltd | Multiaxial acceleration detector |
| JP2007132687A (en) * | 2005-11-08 | 2007-05-31 | Sensata Technologies Japan Ltd | Package for sensor, and detector using the same |
| WO2007069427A1 (en) * | 2005-12-15 | 2007-06-21 | Matsushita Electric Industrial Co., Ltd. | Module having built-in electronic component and method for manufacturing such module |
| WO2007083351A1 (en) * | 2006-01-17 | 2007-07-26 | Spansion Llc | Semiconductor device and method for manufacturing same |
| US7536909B2 (en) * | 2006-01-20 | 2009-05-26 | Memsic, Inc. | Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same |
| JP2007258635A (en) * | 2006-03-27 | 2007-10-04 | Matsushita Electric Ind Co Ltd | Method for manufacturing built-in component substrate |
-
2008
- 2008-03-03 JP JP2008052277A patent/JP2009109472A/en active Pending
- 2008-10-10 CN CN201110213998XA patent/CN102285626A/en active Pending
- 2008-10-10 CN CN2008101685852A patent/CN101408556B/en not_active Expired - Fee Related
-
2010
- 2010-01-29 JP JP2010018334A patent/JP5494947B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101408556B (en) | 2011-09-14 |
| CN101408556A (en) | 2009-04-15 |
| JP5494947B2 (en) | 2014-05-21 |
| JP2010166061A (en) | 2010-07-29 |
| JP2009109472A (en) | 2009-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8248813B2 (en) | Electronic device, electronic module, and methods for manufacturing the same | |
| CN101408556B (en) | Electronic device, electronic module, and methods for manufacturing the same | |
| CN100376868C (en) | Inertia transducer | |
| AU649139B2 (en) | Arrangement for encasing a functional device, and a process for the production of same | |
| US7352058B2 (en) | Methods for a multiple die integrated circuit package | |
| US8087296B2 (en) | Angular velocity sensor | |
| US20070028685A1 (en) | Physical quantity sensor and manufacturing method therefor | |
| CN103824835B (en) | For the surface mount package of semiconductor integrated device, associated component and manufacturing process | |
| CN103633052A (en) | Electronic assembly with three dimensional inkjet printed traces | |
| CN104422553A (en) | Micromechanical sensor device and corresponding manufacturing method | |
| CN102458054A (en) | Method for producing an electrical circuit and electrical circuit | |
| CN111627884B (en) | 3D flexible foil package | |
| US20200053483A1 (en) | Sensor devices and methods for manufacturing the same | |
| CN104883816B (en) | Circuit board and hydraulic brake controlling device for vehicle | |
| CN101849446B (en) | Support element arrangement and method for producing a support element arrangement | |
| CN107006126A (en) | Utilize the electronic apparatus module particularly for automotive drive control device of face contact sandwich building block technique | |
| CN100586253C (en) | Package, package carrier and its manufacture method, diagosis equipment and its manufacture method | |
| US20100282507A1 (en) | Molded housing used in force fit method | |
| CN109696215B (en) | Sensor assembly for determining a parameter of a fluid medium of a measuring channel and method for producing the same | |
| CN111422817A (en) | Sensor unit and method for interconnecting a substrate and a carrier | |
| JP3381447B2 (en) | Semiconductor device | |
| CN107631819A (en) | Low cost cladding molded lead frame booster sensor with multiple installation sites | |
| CN104220365A (en) | Cavity package design | |
| CN208443926U (en) | Electric-field sensor package assembling | |
| EP2349915B1 (en) | Electrical contact configuration of micro-electromechanical component and fabrication method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111221 |