CN101401499A - 屏蔽装置及其制造方法 - Google Patents

屏蔽装置及其制造方法 Download PDF

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CN101401499A
CN101401499A CNA2006800538639A CN200680053863A CN101401499A CN 101401499 A CN101401499 A CN 101401499A CN A2006800538639 A CNA2006800538639 A CN A2006800538639A CN 200680053863 A CN200680053863 A CN 200680053863A CN 101401499 A CN101401499 A CN 101401499A
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layer
conductor layer
screening arrangement
substrate
moulding layer
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CN101401499B (zh
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李寄珉
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明提供一种屏蔽装置。所述屏蔽装置包括：其上安装有电子器件的基板，在所述基板上的模制层，在所述模制层表面上的导体层，和将所述基板的接地端子与所述导体层电连接的接地元件。

Description

屏蔽装置及其制造方法
技术领域
本发明涉及屏蔽装置及其制造方法。
背景技术
移动通信终端诸如手机、个人数字助理(PDA)以及智能电话，各种通讯设备及媒体播放器中具有不同种类的电子器件。电子器件形成为印刷电路板(PCB)中的集成模块。
特别地，射频(RF)集成模块受到严重的电磁干扰。电磁干扰(EMI)对构成集成模块的电子器件的性能具有不利影响。
EMI表示来自电子器件的电磁信号的不希望的辐射发射(RE)或不希望的传导发射(CE)。
EMI在相邻电子器件的性能中引起问题从而劣化集成模块并且导致其中包括电子器件的设备出现故障。
当主要具有低于30MHz的频率的电磁噪声通过介质诸如信号线和电源线传输时进行CE。相对地，当主要具有大于30MHz的频率的电磁噪声辐射至空气时进行RE。因此，RE具有比CE更宽的辐射范围。
正在积极进行各种研究以解决上述问题和保护电子器件免于外部冲击。
图1和2是说明根据现有技术的屏蔽装置及其制造方法的视图。
参考图1和2，在PCB 100上安装多个电子器件110并在所述PCB 100中形成连接沟槽102。
而且，在屏蔽罩140中形成将插入连接沟槽102中的连接部分142。
将PCB 100固定在夹具上(S100)之后，使用分配器120将焊膏10加入到PCB 100的连接沟槽102中(S110)。
然后，将屏蔽罩140的连接部分142移动到PCB 100的连接沟槽102上，并将屏蔽罩140安装在PCB 100上(S120)。
之后，通过回流处理固化焊膏10以连接屏蔽罩140与PCB 100(S130)。
在屏蔽装置及其制造方法中，重要的是由分配器120加入固定量的焊膏10。如果焊膏10的量过多，那么焊膏10可以传导至电子器件110，其可能导致集成模块出现故障。
而且，由于现有技术的屏蔽装置形成为具有屏蔽罩140与PCB 100连接的结构，所以难以小型化。
发明内容
技术问题
本发明的实施方案提供能够防止电磁干扰的屏蔽装置及其制造方法。
本发明的实施方案提供能够保护电子器件免于外部冲击的屏蔽装置及其制造方法。
技术方案
本发明的实施方案提供屏蔽装置，该屏蔽装置包括：其上安装有电子器件的基板，在所述基板上的模制层，在该模制层表面上的导体层，以及将基板的接地端子与导体层电连接的接地元件。
本发明的实施方案提供制造屏蔽装置的方法，所述方法包括：准备其上安装有电子器件的基板，形成电连接至基板的接地端子的接地元件，形成模制层以覆盖电子器件和接地元件的一部分，和在模制层上形成导体层使得导体层电连接至接地元件。
本发明的实施方案提供屏蔽装置，该屏蔽装置包括：其上安装有电子器件的基板，在该基板上的用于覆盖电子器件的模制层，在模制层上的导体层，和形成为穿过模制层并且连接基板与导体层的导电材料。
本发明的实施方案提供屏蔽装置，该屏蔽装置包括：其上安装有电子器件的基板，在该基板上用于覆盖电子器件的模制层，在模制层上的导体层，以及在模制层中用于将基板与导体层连接的导线。
有利效果
根据本发明的实施方案，能够保护电子器件免于外部冲击并有效地防止电磁干扰。
附图说明
图1和2是说明根据现有技术的屏蔽装置及其制造方法的视图；
图3是说明根据本发明第一实施方案的屏蔽装置的横截面图；
图4是说明根据本发明第二实施方案的屏蔽装置的横截面图；和
图5是说明根据本发明一个实施方案的屏蔽装置的制造方法的流程图。
具体实施方式
以下，将参考附图详细描述本发明的优选实施方案。
图3是说明根据本发明第一实施方案的屏蔽装置的横截面图。
参考图3，根据本发明第一实施方案的屏蔽装置200包括模制层220、导体层210和金属引脚230。
在其上安装屏蔽装置200的基板中形成不同的金属图案280诸如用于接地的金属图案、用于连接的金属图案以及用于信号传输的金属图案。还在基板表面上安装电子器件240。所述电子器件240通过导线250连接至金属图案280。
PCB或低温共烧陶瓷(LTCC)基板可以用作基板260。
使用在800～1000℃温度范围的陶瓷和金属的共烧加工来形成LTCC基板。即，将陶瓷和低熔点的玻璃混合并形成具有足够介电常数的生坯板(green plate)之后，在所述生坯板上印刷和堆叠主要由银或铜制成的导电膏，然后形成LTCC基板。
LTCC基板具有多层结构，在LTCC基板中形成待通过通孔传导至在基板表面上的金属图案或电子器件的无源器件诸如电容器、电阻和电感器，使得能够实现高度集成、细小和重量轻的屏蔽装置。
模制层220保护电子器件240免于外部冲击并且固定连接部件以防止电子器件240之间的短路。
模制层220可由合成树脂诸如环氧树脂和硅树脂形成。可以使用围堰(dam)和填充模制或转移模制形成模制层220。
转移模制是使用热固性树脂的模制方法，其中将已经在加热室中增塑化的热固性树脂挤压到模具空腔中。另一方面，在围堰和填充模制中，在形成围绕模制区域的隔离壁之后，用粘稠的热固性树脂填充所述模制区域然后固化。然后，移除隔离壁。
同时，形成模制层220以具有从基板的上表面向上的500～1000μm的高度。
可以使用镀敷来在模制层220的表面上形成导体层210。导体层210可形成在包括模制层220的上表面和侧表面的模制层220的整个表面上。也可根据预定图案仅在模制层220的一部分上形成导体层210。
导体层210是用作金属罩的屏蔽层。由于导体层210使用镀敷形成，所以与金属罩相比导体层210可具有小的厚度。
例如，可通过在注入活性气体的气氛中溅射金属或使用通过电极供给的大电流沉积金属膜来形成导体层210。
根据本发明的一个实施方案，处于连接到模制层220和所得结构的坚固性的原因，导体层210可以是多层。导体层210也可包括依次镀敷的Cu层216、Ni层214和Au层212。
导体层210具有约20μm的厚度，而Cu层216、Ni层214和Au层212的厚度分别为约10～15μm、5～10μm和0.1～0.5μm。
Cu层216提供极好的RF屏蔽效应，Ni层214提供极好的层间粘合，Au层212提供极好的坚固性以保护导体层210免于由冲击或摩擦所导致的损害。
可以考虑趋肤深度确定导体层210的厚度。趋肤深度是高频信号沿导体表面流动的深度的指数。趋肤深度随着导体和频带而改变。
即，导体层210可以形成为厚于所述趋肤深度，使得其中的高频信号不能辐射出导体层，因此不会引起EMI。例如，当高频信号具有1GHz的频率时，Au层具有2.49μm的趋肤深度，Cu层具有3.12μm的趋肤深度，Ni层具有4.11μm的趋肤深度。
因此，根据本发明第一实施方案的屏蔽装置具有以下优点：其尺寸显著减小；物理粘合强度提高；和有效防止EMI。
同时，导体层210接地以释放出屏蔽的电磁波。导体层210可以通过金属引脚230电连接至金属图案280用于使基板260接地。
即，金属引脚230形成为穿过模制层220并且电连接至导体层210和金属图案280二者用于使基板260接地。
金属引脚230可以形成为穿透用于接地的金属图案280并固定在基板260上。金属引脚230也可以形成为插入并固定在通孔270中，该通孔270电连接至金属图案280用于使基板260接地，如图3所示。
图4是说明根据本发明第二实施方案的屏蔽装置的横截面图。
参考图4，屏蔽装置包括模制层320、导体层310和导线350。
导体层310通过导线电连接至用于接地的金属图案380。
导体层310可以形成在包括模制层320的上表面和侧表面的模制层320的整个表面上。导体层310也可根据预定图案仅形成在模制层320的一部分上。
导线350连接电子器件340的接地端子至基板360上的金属图案380。调整导线350的长度使得导线350具有抛物线形状并且导线350的一部分与导体层310接触以电连接导线350至导体层310。
而且，虽然没有显示，导线350的一部分可以与导体层310接触，而导线350的另一部分与电连接至用于接地的金属图案380的通孔接触。
导线350可以由金形成。调整导线350的长度使得导线350可以不突出到导体层310之外。
以下，将描述根据本发明第一实施方案和第二实施方案的电磁屏蔽装置200和300的制造方法。由于根据本发明第一实施方案和第二实施方案的电磁屏蔽装置的制造方法非常类似，所以将参考图5一起描述它们的制造方法。
图5是说明根据本发明一个实施方案的屏蔽装置200和300的制造方法的流程图。
首先，根据本发明第一实施方案的屏蔽装置200的制造方法描述如下。
形成具有多层结构的基板260，在该基板上形成包括用于接地的金属图案的金属图案280(S200)。还在基板260中形成通孔270(S210)。
在基板260上安装不同的电子器件240诸如无源器件和有源器件(S220)。还在基板260上进行用于连接导线250的工艺。
然后，进行金属引脚工艺。可以使用锤击将金属引脚230插入通孔270用于使基板260接地(S230)。
然后，使用围堰和填充模制或转移模制将模制层220形成为预定高度(S240)之后，将金属引脚230从模制层220中突出的部分在非常接近于模制层220的上表面处切断。
然后，在模制层220上进行表面处理诸如研磨和抛光(S250)。
设计表面处理用于使得模制层220的表面平滑，使得镀敷的导体层210可以牢固地粘合于模制层220的表面。当处理模制层220的表面时，可以一起处理金属引脚230从模制层220的表面突出的部分，使得金属引脚230不从导体层210中突出。
同时，可以省略研磨或抛光，并且也可省略金属引脚230的所述部分的切断。
当金属引脚230形成为低于模制层220时，可以研磨或抛光模制层220使得模制层220的表面可以是平滑的并且金属引脚230的一部分可以从模制层220中突出。由此，当沉积导体层210时，导体层210可电连接至金属引脚230。
最后，在模制层220的表面上依次沉积铜216、镍214和金212以形成多层导体层210，并且因此形成根据本发明一个实施方案的屏蔽装置200(S260)。
接下来，根据本发明第二实施方案的屏蔽装置300的制造方法描述如下。
形成具有多层结构的基板360，并在该基板上形成包括用于接地的金属图案的金属图案380(S200)。还在基板360中形成通孔370(S210)。
在基板360上安装不同的电子器件340诸如无源器件和有源器件(S220)。还在基板260上进行用于连接导线的工艺。
此处，形成导线，使得导线350的两端分别连接至电子器件340的接地端子和金属图案380用于使基板360接地。而且，导线形成为具有足够的长度，使得导线350的一部分可电连接至之后形成在模制层320外部的导体层310(S230)。
然后，在使用围堰和填充模制或转移模制将模制层320形成为预定高度(S240)之后，将导线350从模制层320中突出的部分在非常接近模制层320的上表面处切断。
然后，对模制层320进行表面处理诸如研磨和抛光(S250)。
设计表面处理用于使模制层320的表面平滑，使得镀敷的导体层310可以牢固地粘合于模制层320的表面。当研磨或抛光模制层320的表面时，可一起研磨或抛光导线350从模制层320的表面中突出的部分，使得导线350不从导体层310中突出。
同时，可以省略研磨或抛光，也可省略导线350的所述部分的切断。
当导线350形成为低于模制层320时，可以研磨或抛光模制层320使得模制层320的表面可以是平滑的并且导线350的一部分可从模制层320中突出。由此，当沉积导体层310时，导体层310可以电连接至导线350。
最后，在模制层320的表面上依次沉积铜216、镍214和金212以形成多层导体层310，并因此形成根据本发明一个实施方案的屏蔽装置300(S260)。
实施方式
虽然在本文中已经参考本发明的优选实施方案对本发明进行了描述和说明，但是对于本领域技术人员很明显，不背离本发明的精神和范围就可对其做出各种改变和变化。
因此，本发明意图涵盖在所附权利要求及其等同物的范围之内的本发明的改变和变化。
工业实用性
本发明的实施方案可应用于其中安装有电子器件的电子装置及其制造方法。

Claims (20)

1.一种屏蔽装置，包括：
其上安装有电子器件的基板；
在所述基板上的模制层；
在所述模制层表面上的导体层；和
电连接所述基板的接地端子与所述导体层的接地元件。
2.根据权利要求1所述的屏蔽装置，其中所述接地元件形成为穿透所述模制层。
3.根据权利要求1所述的屏蔽装置，其中所述接地元件包括金属引脚。
4.根据权利要求1所述的屏蔽装置，其中所述接地元件包括导线。
5.根据权利要求1所述的屏蔽装置，其中所述接地元件电连接所述电子器件、所述导体层和所述接地端子。
6.根据权利要求1所述的屏蔽装置，其中所述导体层形成在所述模制层的包括上表面和侧表面的表面上。
7.根据权利要求1所述的屏蔽装置，其中所述导体层根据预定图案形成在所述模制层的一部分上。
8.根据权利要求1所述的屏蔽装置，其中所述接地端子包括通孔和金属图案中的一种。
9.根据权利要求1所述的屏蔽装置，其中所述导体层由多种金属制成的多个层构成。
10.根据权利要求1所述的屏蔽装置，其中所述导体层由铜、镍和金形成。
11.一种制造屏蔽装置的方法，所述方法包括：
准备其上安装有电子器件的基板；
形成电连接至所述基板的接地端子的接地元件；
形成模制层以覆盖所述电子器件和所述接地元件的一部分；和
在所述模制层上形成导体层使得所述导体层电连接至所述接地元件。
12.根据权利要求11所述的方法，其中所述模制层的形成包括：形成模制层以全部覆盖所述接地元件和移除所述模制层的一部分使得所述接地元件的一部分从所述模制层中暴露出。
13.根据权利要求12所述的方法，其中所述模制层的所述部分的移除包括使用研磨和抛光中的一种对所述模制层进行表面处理。
14.根据权利要求11所述的方法，其中所述接地端子包括通孔和金属图案中的一种。
15.根据权利要求11所述的方法，其中所述接地元件包括金属引脚。
16.根据权利要求11所述的方法，其中所述接地元件包括电连接所述电子器件与所述接地端子的导线。
17.根据权利要求11所述的方法，其中所述导体层的形成包括在所述模制层的外表面上镀敷金属。
18.根据权利要求12所述的方法，其中所述导体层的形成包括在所述模制层的表面上依次镀敷多种金属。
19.一种屏蔽装置，包括：
其上安装有电子器件的基板；
在所述基板上的用于覆盖所述电子器件的模制层；
在所述模制层上的导体层；和
形成为穿过所述模制层并连接所述基板与所述导体层的导电材料。
20.一种屏蔽装置，包括：
其上安装有电子器件的基板；
在所述基板上的用于覆盖所述电子器件的模制层；
在所述模制层上的导体层；和
在所述模制层中的用于连接所述基板与所述导体层的导线。
CN2006800538639A 2006-03-16 2006-12-14 屏蔽装置及其制造方法 Expired - Fee Related CN101401499B (zh)

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