CN101399242A - 电力半导体模块 - Google Patents
电力半导体模块 Download PDFInfo
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- CN101399242A CN101399242A CNA2008100924095A CN200810092409A CN101399242A CN 101399242 A CN101399242 A CN 101399242A CN A2008100924095 A CNA2008100924095 A CN A2008100924095A CN 200810092409 A CN200810092409 A CN 200810092409A CN 101399242 A CN101399242 A CN 101399242A
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Abstract
提供一种电力半导体模块,利用基于金属制弹簧的压缩的反作用力而与外部的印制电路板接触,不会大幅增加制造工序的工时,其特征在于,具有:电力半导体元件;收纳上述电力半导体元件的壳体;与上述电力半导体元件的控制电极连接并从上述壳体上表面突出而设置的控制端子;内表面与上述控制端子的侧面的至少一部分接触而插入上述控制端子中,与对置于上述壳体上表面而载置的印制电路板加压接触并电气地连接的导电性弹簧。
Description
技术领域
本发明涉及电力半导体模块,特别涉及搭载有IGBT(绝缘栅双极晶体管)等的电力半导体模块中的控制端子的结构。
背景技术
在工业、电车、汽车、OA、家电制品等的电力控制或马达控制中,使用将IBGT等多个开关元件和续流二极管组合而搭载于一个封装件的电力半导体模块。在这样的电力半导体模块中,通常通过螺纹固定等的方法在主电流所流通的主电路端子上连接外部的母线等,对于控制电路,一般通过焊接等的方法在控制端子上连接安装有控制用集成电路等的印制电路板。
在这样的以往的电力半导体模块中,对于控制端子的连接需要由使用者进行焊接等的作业,存在工时增加等的问题以及长时间使用下焊接的可靠性降低的问题。因此,提出有下述结构的电力半导体模块:将控制端子形成为弹簧结构,并利用压缩该弹簧而产生的弹性力而与印制电路板加压连接,由此无需使用者进行的焊接作业(例如参照专利文献1、2)。
[专利文献1]特开2001-144249号公报(从段落0024到段落0025、图3)
[专利文献21特开2006-165499号公报(从段落0010到段落0013、图2)
但是,在现有技术的电力半导体模块中,需要解决以下的问题。
(1)在专利文献1以及2所述的现有技术中,由于令控制端子自身为弹簧构造,所以其加工以及向模块的安装需要较多工时和成本。
(2)为了提高控制端子与印制电路板的接触部的可靠性而需要加长弹簧长度而加大接触压力,但在专利文献1所述的现有技术中,由于控制端子嵌入成形在树脂壳体的侧壁上,所以其弹簧长度受到壳体高度的限制。
(3)在专利文献2所述的现有技术中,为了保持弹簧状控制端子,需要另外设置具有和与印制电路板加压接触的第1线圈部的外径大致相同的尺寸内径的端子收纳部,电力半导体模块的制造需要较多工时和成本。
(4)在专利文献2所述的现有技术中,由于如上所述模块与印制电路板的距离受到上述端子收纳部高度的限制,所以使用者的尺寸上的设计自由度降低。
(5)此外,在专利文献2所述的现有技术中,弹簧状控制端子由于通过焊接等直接接合在模块内绝缘基板上的配线图案上,所以由于印制电路板的加压接触而产生的反作用力直接施加在绝缘基板上的配线图案上。因此,在长时间使用时,在模块内部总是施加有弹簧产生的反作用力,所以会导致控制端子与绝缘基板上的配线图案的接合部的焊接断裂的可靠性方面的问题。
发明内容
本发明中,为了解决上述问题,提供一种电力半导体模块,其特征在于,具有:电力半导体元件;收纳上述电力半导体元件的壳体;与上述电力半导体元件的控制电极连接并从上述壳体上表面突出设置的控制端子;内表面与上述控制端子的侧面的至少一部分接触而插入到上述控制端子上,与对置于上述壳体上表面载置的印制电路板加压接触而电气地连接的导电性弹簧。
本发明的电力半导体模块,由于与外部的印制电路板的接触借助由导电性弹簧的压缩而产生的反作用力来实现,所以无需焊接等作业,不但能够容易且顺畅地进行外部的印制电路板的拆装,还能够消除长期使用时的焊接断裂的可靠性下降的问题。
此外,由于是以内表面与控制端子接触的方式插入导电性弹簧的结构,所以能够原样使用以往的电力半导体模块的控制端子的结构,元需大幅改变模块结构,能够不增加模块制造工序的工时和成本地实现本发明。
此外,由于印制电路板与电力半导体模块之间的距离可以任意地设定,所以提高了使用者的尺寸方面的设计自由度。
进而,由于通过壳体上表面整体来承受导电性弹簧的压缩所产生的反作用力,所以不会向模块内部的电力半导体的控制电极施加物理压力,起到提高长期的可靠性的效果。
附图说明
图1是本发明的实施方式1的电力半导体模块和进行其控制的印制电路板的立体图。
图2是本发明的实施方式1的电力半导体模块的侧视图。
图3是本发明的实施方式1的电力半导体模块和进行其控制的印制电路板的侧视图。
图4是本发明的实施方式1的电力半导体模块的控制端子与金属制弹簧的侧视图。
图5是本发明的实施方式1的变形例的电力半导体模块的控制端子与金属制弹簧的侧视图。
图6是本发明的实施方式2的电力半导体模块的侧视图。
图7是本发明的实施方式2的电力半导体模块和进行其控制的印制电路板的侧视图。
图8是表示本发明的实施方式2的电力半导体模块和进行其控制的印制电路板的连接状态的侧视图。
图9是本发明的实施方式3的电力半导体模块的控制端子与金属制弹簧的侧视图。
图10是本发明的实施方式3的变形例的电力半导体模块的控制端子与金属制弹簧的侧视图。
图11是本发明的实施方式4的电力半导体模块的控制端子与金属制弹簧的侧视图。
图12是表示本发明的实施方式4的电力半导体模块和进行其控制的印制电路板的连接状态的侧视图。
图13是本发明的实施方式5的电力半导体模块的控制端子和金属制弹簧的侧视图。
图14是表示本发明的实施方式5的电力半导体模块和进行其控制的印制电路板的连接状态的侧视图。
附图标记说明
10…壳体
16…控制端子
17…金属制弹簧
18…壳体上表面
30…印制电路板
84…电力半导体元件
164…压缩量确认机构
200…突起
具体实施方式
实施方式1
图1表示用于实施本发明的实施方式1的电力半导体模块与进行其控制的印制电路板的立体图。
图1所示的电力半导体模块具有由树脂等的绝缘性材料构成的壳体10、和导热性高的金属底板12,在金属底板12的四角具有贯通孔15。在壳体10的上表面18上,突出配置有主端子20~22以及控制端子16。主端子20~22向壳体10侧弯折90度并利用螺栓等与外部的母线(未图示)等连接。在控制端子16上插入作为导电性弹簧的金属制弹簧17。金属制弹簧17的内径具有与控制端子16的外径大致相同的尺寸,金属制弹簧17的内表面与控制端子16的侧面接触,从而二者电气地连接。
金属制弹簧17从弹性、导电性的角度出发由钢材或磷青铜等的材质构成,在其表面为了提高防锈及导电性而进行Ni电镀等处理。
印制电路板30与壳体上表面18对置而被载置,在背面的与金属制弹簧17以及控制端子16抵接的部分上具有电极31。印制电路板30与金属底板12同样,在四角具有贯通孔35,经由隔件60而利用螺栓40固定在金属底板12上。此外,印制电路板30形成为将与主端子20~22的上方对应的部分挖去的コ字形的形状,即便在固定有印制电路板30的情况下也能够没有障碍地拆装母线等。
在此,参照图2以及图3说明半导体模块的详细结构、和印制电路板的载置。图2是将壳体10的侧面的一部分切去而图示内部结构的电力半导体模块的侧视图,图3是载置并固定印制电路板30时的侧视图。
图2中,在金属底板12上载置绝缘基板80,进而在上述绝缘基板80上形成配线图案81、82、以及83。在配线图案82上利用焊接等方法固定有IGBT芯片84,并且背面的集电极与配线图案82电气连接。形成在IGBT芯片84的表面上的发射电极86以及栅电极87分别经由连接线85以及88而与配线图案81以及83电气连接。
进而,主电极20的下端焊接在配线图案20上,并且其上端部向壳体10上方突出后弯折90度,成为IGBT的主电流用的外部集电极端子。此外,主电极21的下端焊接在配线图案81上,并且其上端部向壳体10上方突出后弯折90度,成为IGBT的主电流用的外部发射极端子。此外,控制端子16的下端焊接在配线图案83上,并且其上端部向壳体10的上方突出,成为IGBT控制信号用的外部栅极端子。在突出到壳体10的外部的控制端子16上插入金属制弹簧17。金属制弹簧17的内径具有与控制端子16的外径大致相同的尺寸,金属制弹簧17的内表面与控制端于16的侧面接触,从而二者电气连接。
在图3中,印制电路板30载置在壳体10上方,经由隔件60利用螺栓40固定在金属底板12上。在与控制端子16以及金属制弹簧17抵接的印制电路板30的背面上具有电极31,金属制弹簧17被印制电路板30压缩,利用其弹性力推压电极31。由此,电力半导体模块的使用者无需焊接等的工序,能够将搭载有控制电路的印制电路板与电力半导体模块良好的电气连接。
通过适宜选择金属制弹簧17的长度而调节弹性力,能够容易地将金属制弹簧17与电极31的接触状态设定为最佳状态。此外,由于金属制弹簧17的反作用力由壳体10的上表面承受,所以在控制端子16与配线图案83的焊接接合部上不作用机械的应力,提高长期的可靠性。
图4(a)~(c)中,表示本实施方式的控制端子16与金属制弹簧17的详细图。该图(a)是控制端子16的主视图,该图(b)是控制端子16的侧视图,该图(c)是控制端子16的俯视图。控制端子16的从壳体10突出的部分的截面形状为圆形,金属制弹簧17的内径与该控制端子16的截面直径大致相同。金属性弹簧17的内表面由于遍及控制端子16的侧面全周而接触,所以接触面积大,能够实现两者的良好的电气连接。
此外,如图5(a)~(c)所示,从壳体10突出的部分的控制端子161的截面形状可以为四边形。此时如图5(c)所示,金属制弹簧17的内径与该控制端子161的截面形状的四边形的对角线长度大致相同,在四点处接触即可。利用该结构,在成形控制端子161时,能够通过冲裁冲压加工等的方法比较简单地作成金属板。
实施方式2
图6~图7表示本发明的实施方式2的电力半导体模块以及进行其控制的印制电路板的载置时的侧视图。另外,各图中对于与实施方式1相同的结构标注相同的附图标记,省略重复的说明。
在实施方式1中,金属制弹簧17的自由长度比控制端子16的从壳体10的上表面突出的部分的高度长。在这样的结构下,在安装印制电路板30时,金属制弹簧17与印制电路板30的背面的电极31的接触状态无法目视,且有时印制电路板30与电极半导体模块的载置距离受到控制端子16的突出高度的限制。
本实施方式2中,如图6所示,特征在于将金属制弹簧171的自由长度缩短为比控制端子16的突出高度短。以下,参照图7以及图8来进行详细说明。
在图7中,在与印制电路板300的控制端子162对应的位置的电极310处设置贯通孔311。在载置印制电路板300时,将控制端子162的上端插入贯通孔311。另外,贯通孔311的直径设置为比控制端子162的内径大或与其大致相同,并且比金属制弹簧171的外径小。
在图8中,将控制端子162插入贯通孔311,由于此时控制端子162比金属制弹簧171长,所以容易将控制端子162插入到贯通孔311中。之后利用印制电路板300压缩金属制弹簧171,贯通了贯通孔311的控制端子162能够从印制电路板300的表面进行目视,所以能够确认金属制弹簧171与背面的电极310是否正确地抵接。此外,由于控制端子162贯通印制电路板300而载置,所以印制电路板300与电力半导体模块的载置距离不会受到控制端子162的突出高度的限制,能够适宜地选择隔件60的高度而自由地设定印制电路板与模块之间的距离,具有提高使用者的尺寸上的设计自由度的优点。
实施方式3
图9以及图10中表示本发明的实施方式3的电力半导体模块的控制端子与金属制弹簧的侧视图。在本实施方式中,特征在于,作为金属制弹簧171的固定机构而在控制端子的根部设置锥状的突起。
在实施方式1以及2中,金属制弹簧17仅插入到具有单一的粗细的控制端子16中,所以其固定仅通过两者的摩擦来实现。因此,若向上方拉金属制弹簧17,则会容易地令其从控制端子16脱离。
在图9中在截面形状为圆形的控制端子162的根部处设置上方细而随着朝向下方逐渐变粗的锥状的突起200。在将金属制弹簧171插入到控制端子162上时,金属制弹簧171借助突起200而沿径方向被扩开,所以容易插入。插入后,即便向上方拉金属制弹簧171,弹簧的一部分卡在突起200下方的较粗部分上,所以不会轻易地脱离。
在控制端子162上设置突起200的位置只要是在将金属制弹簧171插入后弹簧能卡住的位置即可,但期望如实施方式2所示那样设置在根部,以便在载置具有贯通孔311的印制电路板300时,突起200与贯通孔311不会干涉。
图10是控制端子163的截面形状为四边形时的、在控制端子163的侧面上设置锥状的突起210的例子,也可通过冲裁、冲压加工金属板等的方法比较简单地同时地一体成形控制端子163以及突起210。
实施方式4
在实施方式2中,印制电路板300上设置的贯通孔311的直径设置为比控制端子162大或与其大致相同,但比金属制弹簧171的外径小,其尺寸余量只有金属制弹簧171的弹簧材料粗细程度而要求高的加工精度。在贯通孔311的直径比金属制弹簧171的外径大时,不仅控制端子162,金属制弹簧171自身也会进入到贯通孔311中,有时金属制弹簧171会与印制电路板300的背面的电极310不接触。
图11中表示本发明的实施方式4的电力半导体模块的控制端子与金属制弹簧的侧视图,图12中表示向本实施方式的电力半导体模块固定印制电路板300时的侧视图。具有下述倒锥状的金属制弹簧172:将金属制弹簧172的上方部即与印制电路板300接触的上端部173扩开,而使内径比控制端子162的直径即比载置的印制电路板300上设置的贯通孔311大。
通过这样的结构,如图12所示,即便在贯通孔311的尺寸稍大时,金属制弹簧172也不会进入到贯通孔311中,能够起到可靠地确保与电极310的接触的效果。
实施方式5
图13中表示本发明的实施方式5的电力半导体模块的控制端子与金属制弹簧的侧视图,图14中表示向本实施方式的电力半导体模块固定印制电路板300时的侧视图。如图13所示,也可在控制端子163的既定高度处设置染色印或刻印等的压缩量确认机构164。利用该结构,如图14所示,在载置印制电路板300时,金属制弹簧171被压缩而控制端子163显现在表面上,若进一步压缩直到能够目视到压缩量确认机构164,则能够确认到达了既定的压缩量。
以上,说明了本发明的具体实施方式,但本发明不限定于此,能够进行各种变形。例如,在本发明中表示了使用IGBT作为电力半导体元件的例子,但也可使用MOSFET及功率晶体管等具有其他的控制电极的电力半导体元件,都包含在本发明中。此外,在本发明中,表示了使用金属制弹簧作为导电性弹簧的例子,但不限定为金属,也可以是表面上进行了金属镀层的塑料制弹簧等,只要是作为弹簧而具有弹性以及导电性即能够使用,都包含在本发明中。此外,在本发明中,说明了以IGBT模块作为电力半导体模块的例子,但对于本领域技术人员而言能够容易地联想到可以适用于具有含有其他控制用IC的IPM(Intelligent Power Module)等的控制端子的模块中,所以也包含在本发明的范围中。
Claims (8)
1.一种电力半导体模块,其特征在于,具有:
电力半导体元件;
收纳上述电力半导体元件的壳体;
与上述电力半导体元件的控制电极连接并从上述壳体上表面突出设置的控制端子;
内表面与上述控制端子的侧面的至少一部分接触而插入到上述控制端子上,与对置于上述壳体上表面载置的印制电路板加压接触而电气地连接的导电性弹簧。
2.如权利要求1所述的电力半导体模块,其特征在于,
上述导电性弹簧的自由长度比上述控制端子的突出高度短,
上述控制端子插入到设置在上述印制电路板上的孔中。
3.如权利要求1或2所述的电力半导体模块,其特征在于,
上述导电性弹簧固定在上述壳体上表面或者上述控制端子上。
4.如权利要求3所述的电力半导体模块,其特征在于,
作为上述导电性弹簧的固定机构,在上述控制端子的根部设置锥状的突起。
5.如权利要求1所述的电力半导体模块,其特征在于,
在上述导电性弹簧中,仅与上述印制电路板接触的上端部具有比上述控制端子的外径大的内径。
6.如权利要求1所述的电力半导体模块,其特征在于,
在上述控制端子上还设置有上述导电性弹簧的压缩量确认机构。
7.如权利要求6所述的电力半导体模块,其特征在于,
作为上述压缩量确认机构,在上述控制端子的既定高度处设置染色印。
8.如权利要求6所述的电力半导体模块,其特征在于,
作为上述压缩量确认机构,在上述控制端子的既定高度处设置刻印.
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- 2008-04-08 DE DE102008017809.8A patent/DE102008017809B4/de active Active
- 2008-04-09 CN CN2008100924095A patent/CN101399242B/zh active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102130082A (zh) * | 2010-01-05 | 2011-07-20 | 赛米控电子股份有限公司 | 功率半导体模块 |
CN102130082B (zh) * | 2010-01-05 | 2015-07-22 | 赛米控电子股份有限公司 | 功率半导体模块 |
CN104970792A (zh) * | 2014-05-30 | 2015-10-14 | 株式会社百利达 | 测量装置 |
CN107851630A (zh) * | 2016-01-15 | 2018-03-27 | 富士电机株式会社 | 半导体装置 |
CN107851630B (zh) * | 2016-01-15 | 2020-08-04 | 富士电机株式会社 | 半导体装置 |
CN107393893A (zh) * | 2016-04-18 | 2017-11-24 | 赛米控电子股份有限公司 | 功率电子设备和具有该设备的车辆 |
CN107393893B (zh) * | 2016-04-18 | 2022-04-08 | 赛米控电子股份有限公司 | 功率电子设备和具有该设备的车辆 |
US20210134710A1 (en) * | 2019-11-06 | 2021-05-06 | Fuji Electric Co., Ltd. | Semiconductor device and method for manufacturing the same |
US11756868B2 (en) * | 2019-11-06 | 2023-09-12 | Fuji Electric Co., Ltd. | Semiconductor device and method for manufacturing the same |
Also Published As
Publication number | Publication date |
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US20090085188A1 (en) | 2009-04-02 |
JP2009081399A (ja) | 2009-04-16 |
CN101399242B (zh) | 2011-03-30 |
DE102008017809B4 (de) | 2017-12-28 |
US7777325B2 (en) | 2010-08-17 |
DE102008017809A1 (de) | 2009-04-16 |
JP4900165B2 (ja) | 2012-03-21 |
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