JP6870531B2 - パワーモジュールおよび電力変換装置 - Google Patents
パワーモジュールおよび電力変換装置 Download PDFInfo
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- JP6870531B2 JP6870531B2 JP2017158750A JP2017158750A JP6870531B2 JP 6870531 B2 JP6870531 B2 JP 6870531B2 JP 2017158750 A JP2017158750 A JP 2017158750A JP 2017158750 A JP2017158750 A JP 2017158750A JP 6870531 B2 JP6870531 B2 JP 6870531B2
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- 239000004065 semiconductor Substances 0.000 claims description 38
- 238000006243 chemical reaction Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 35
- 239000003566 sealing material Substances 0.000 claims description 31
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
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- 229920000647 polyepoxide Polymers 0.000 description 2
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- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000000088 plastic resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Description
、絶縁基板上に設けられて、半導体素子と電気的に接続される内部端子と、内部端子の端
部が露出するように、内部端子と半導体素子と絶縁基板とを封止する封止材と、封止材と
分離され、封止材を覆うケースと、ケースと内部端子の端部とを接続する弾性部材と、弾性部材を介して内部端子に一端が電気的に接続され、ケースから他端が露出する外部端子を備え、封止材の側面と対向するケースの内側面には孔の一端が設けられ、孔の他端がケースの上面に連通して設けられ、内部端子の端部が、封止材の側面から露出して孔に挿入され、弾性部材が、内部端子の端部とケースの内部で接続され、孔に沿って弾性可能に設けられることを特徴とする。
実施の形態1におけるパワーモジュール50について説明する。図1は、実施の形態1のパワーモジュール50を示す断面図である。なお、図1以外の他図において、同一符号は同一又は相当部分を示す。図1に示すパワーモジュール50において、パワー部は、半導体素子1、絶縁基板2、内部端子3、及び導電性ワイヤー5により構成される。パワーモジュール50は、半導体素子1が導電性部材を介して絶縁基板2に接合され、封止材4によって樹脂封止されたパワー部と、ケース10とを備え、内部端子3の端部が封止材4から露出して弾性部材12と接続する構成である。なお、半導体素子1は、スイッチング素子やダイオードであればよく、例えば、IGBT(Insulated Gate Bipolar Transistor)やPNダイオードでもあってもよい。さらに、半導体素子の個数は、当然ながら一つに限定されるものではなく、二つ以上であってもよい。
実施の形態2のパワーモジュール51について説明する。図3は、実施の形態2のパワーモジュール51を示す断面図である。実施の形態2のパワーモジュール51は、封止材4から露出している内部端子3の端部に凹部6が形成されている。
実施の形態3のパワーモジュール52について説明する。図4は、実施の形態3のパワーモジュール52を示す断面図である。実施の形態3のパワーモジュール52は、弾性部材が多接点ばね14であることを特徴とする。なお、多接点ばね14は複数の接点を有してあればよく、例えば、螺旋状態の巻きばねに波形状を加えたコイルドウェーブスプリングや、図5に示すような板ばね13であってもよい。
実施の形態4のパワーモジュール53について説明する。図6は、実施の形態4のパワーモジュール53を示す断面図である。実施の形態4のパワーモジュール53は、ケース10に孔15を備えており、封止材4の側面から露出した内部端子3の端部は、孔15に挿入されて、ケース10の内部で弾性部材12が外部端子11と内部端子3の端部を電気的に接続することを特徴とする。
本実施の形態は、上述した実施の形態1から4にかかるパワーモジュールを電力変換装置に適用したものである。本発明は特定の電力変換装置に限定されるものではないが、以下、実施の形態5として、三相のインバータに本発明を適用した場合について説明する。
また、部品と部品とを接合する導電性部材は、はんだ、金属フィラーを用いた金属ペースト、又は熱により金属化する焼成金属などの電気抵抗の低い金属を用いることが好ましい。
Claims (7)
- 絶縁基板と、
前記絶縁基板上に設けられる半導体素子と、
前記絶縁基板上に設けられて、前記半導体素子と電気的に接続される内部端子と、
前記内部端子の端部が露出するように、前記内部端子と前記半導体素子と前記絶縁基板
とを封止する封止材と、
前記封止材と分離され、前記封止材を覆うケースと、
前記ケースと前記内部端子の端部とを接続する弾性部材と、
前記弾性部材を介して前記内部端子に一端が電気的に接続され、前記ケースから他端が
露出する外部端子を備え、
前記封止材の側面と対向する前記ケースの内側面には孔の一端が設けられ、前記孔の他
端が前記ケースの上面に連通して設けられ、前記内部端子の端部が、前記封止材の側面か
ら露出して前記孔に挿入され、
前記弾性部材が、前記内部端子の端部と前記ケースの内部で接続され、前記孔に沿って
弾性可能に設けられることを特徴とするパワーモジュール。 - 前記封止材は前記ケースと接触していることを特徴とする請求項1に記載のパワーモジ
ュール。 - 前記内部端子の端部には、前記弾性部材が挿入される凹部が備えられていることを特徴
とする請求項1または2に記載のパワーモジュール。 - 前記弾性部材は、複数の接点をもつ多接点ばねであることを特徴とする請求項1から3
のいずれか1項に記載のパワーモジュール。 - 前記ケースと前記封止材とから前記絶縁基板の裏面を露出し、前記絶縁基板の裏面と前
記ケースと圧接されるヒートシンクが備えられることを特徴とする請求項1から4のいず
れか1項に記載のパワーモジュール。 - 前記ケースは、シャフトを支持し、シャフトを中心に回転する操作部と押圧部とを有す
るクランプが備えられることを特徴とする請求項1から5のいずれか1項に記載のパワー
モジュール。 - 請求項1から6のいずれか1項に記載のパワーモジュールを有し、入力される電力を変
換して出力する主変換回路と、
前記主変換回路を制御する制御信号を前記主変換回路に出力する制御回路と、
を備えた電力変換装置。
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