CN102456826A - 发光二极管导线架 - Google Patents

发光二极管导线架 Download PDF

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CN102456826A
CN102456826A CN2010105282877A CN201010528287A CN102456826A CN 102456826 A CN102456826 A CN 102456826A CN 2010105282877 A CN2010105282877 A CN 2010105282877A CN 201010528287 A CN201010528287 A CN 201010528287A CN 102456826 A CN102456826 A CN 102456826A
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protection device
rubber base
electrostatic protection
functional areas
conducting wire
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廖本扬
钱正清
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2010105282877A priority Critical patent/CN102456826A/zh
Priority to US13/286,229 priority patent/US8748906B2/en
Publication of CN102456826A publication Critical patent/CN102456826A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明揭示了一种发光二极管导线架，其包括凹设有功能区的胶座、两个金属接脚及静电保护装置。每一金属接脚部分显露于功能区底部，部分从功能区穿过胶座延伸至胶座的外部。所述静电保护装置埋设成型于胶座中，仅一侧裸露出胶座，该静电保护装置与两个金属接脚电性连接。本发明的发光二极管导线架具有较佳的发光亮度。

Description

发光二极管导线架
【技术领域】
本发明涉及一种发光二极管导线架，尤其是一种表面黏着型发光二极管导线架。
【技术背景】
表面黏着型发光二极管体积较小且电力效率良好，能发出颜色鲜艳的光。又，该发光组件为半导体组件，故而无需担心灯泡烧掉等。进而具有初始驱动特性优良、振动及开关灯重复性较强的特征。由于上述优良特性，故而使用发光二极管等发光组件的发光装置被广泛用作各种光源。
虽然发光二极管具有上述众多优点，但却常因异常电压或静电放电而损坏。在现有作法中，为了避免发光二极管因异常电压或静电放电而损坏，可将发光芯片与静电保护装置并联，以避免发光二极管受到异常电压或静电放电的破坏。
美国专利第7462870揭示了一种发光二极管，该发光二极管包括塑料本体、位于塑料本体底部的电极、位于电极上的发光芯片及静电保护装置。所述塑料本体中部凹设有功能区，所述发光芯片位于功能区内，所述功能区侧壁凹设有凹槽，所述静电保护装置设于凹槽内。此静电保护装置可以防止发光芯片因静电放电而受损，惟，该静电保护装置裸露于凹槽中，会吸收发光芯片所发出的部分光线，故，会降低发光二极管的亮度，从而对发光二极管的亮度进行了很大的限制。
鉴于此，实有必要克服上述发光二极管导线架的缺陷。
【发明内容】
本发明所解决的技术问题是提供一种具有较佳亮度的发光二极管导线架。
为了解决上述技术问题，本发明提供一种发光二极管导线架，其包括凹设有功能区的胶座、两个金属接脚及静电保护装置。每一金属接脚部分显露于功能区底部，部分从功能区穿过胶座延伸至胶座的外部。所述静电保护装置埋设成型于胶座中，仅一侧裸露出胶座，该静电保护装置电性连接至两个金属接脚。
其中所述功能区具有由底部向顶部张开的倾斜侧壁，所述静电保护装置埋设于所述侧壁中，并仅露出其顶面；所述静电保护装置的顶面上方设有凹槽，以提供较大的打线空间；所述静电保护装置放置于其中一个金属接脚上以与该金属接脚电性连接；所述功能区凸设有一间隔区块，该间隔区块设置在金属接脚之间用以区隔金属接脚的极性；所述金属接脚从胶座的同一侧弯折而出形成焊接部，再分别弯折至胶座的相对两侧形成端部。
为了解决上述技术问题，本发明还提供一种发光二极管导线架，包括凹设有功能区的胶座、若干金属接脚及静电保护装置。每一金属接脚部分显露于功能区底部，部分从功能区穿过胶座延伸至胶座的外部。所述静电保护装置埋设于所述胶座的功能区中，并与所述两个金属接脚电性连接。
其中所述功能区设有侧壁，所述静电保护装置埋设于所述功能区的侧壁中；所述静电保护装置的底面固定于其中一个金属接脚上，仅有顶面裸露出胶座；所述静电保护装置于成型胶座之前设置于所述其中一个金属接脚上。
与相关技术相比，本发明的的静电保护装置埋设成型于胶座中，可以防止静电保护装置吸收发光芯片的光，从而使发光二极管导线架有较佳的亮度。
【附图说明】
图1为本发明发光二极管导线架的立体图。
图2为本发明发光二极管导线架的俯视图。
图3为本发明沿图1所示A-A线的剖面示意图。
【具体实施方式】
参阅图1所示，本发明为一种表面黏着型发光二极管导线架，其包括一绝缘的胶座1、固持于胶座1中的两金属接脚2及埋设于胶座1中的静电保护装置3。
继续参阅图1所示，胶座1为长方体，其中一侧中部凹设形成中空状的功能区10，该功能区10具有倾斜的侧壁100，使功能区10呈由内向外开放状。胶座1的功能区10中央凸设有一间隔区块12，其设置在金属接脚2之间用以区隔金属接脚2的极性。所述功能区10内放置发光芯片4。所述胶座1中埋设有静电保护装置3以防止发光芯片因静电放电而受损，该静电保护装置3仅有一侧的电极显露于外。
参阅图1及图2所示，每一金属接脚2部分可见于功能区10底部，形成与导线5连接的连接部21；部分埋设于胶座1中；还有部分从胶座1的同一长边侧壁100延伸出胶座1外，形成后续制程的焊接部22。所述焊接部22分别进一步弯折至胶座1的两个短边形成端部23。
本发明的发光二极管导线架的静电保护装置3是埋设成型于胶座1中，仅将一侧的电极外露以用于打线。参阅图3所示，本发明的较佳实施方式为将所述静电保护装置3埋设于胶座1功能区10的侧壁100中，使静电保护装置3的底部放置到其中一个金属接脚2上，顶面电极外露于胶座1，用于与另一个金属接脚2电性连接，其余区域皆被胶座1包围，使静电保护装置3不会吸收发光芯片4发出的光，从而不减少发光二极管导线架的亮度。静电保护装置3的顶面为开放的凹槽101，为静电保护装置3提供足够的打线空间。
本发明的静电保护装置3埋设于胶座1中，不仅不会减少发光二极管导线架的亮度，同时可以节约空间，不会占用功能区10的空间，给发光芯片4保留较大空间，也不会占用胶座1过多的空间，可以满足发光二极管导线架的轻薄短小的趋势。
本发明的发光二极管导线架采用如下方法制作，在冲压成型的金属接脚2上放置静电保护装置3，通过导电胶或其它材料将静电保护装置3固定，然后通过射出成型方式在金属接脚2上注塑成型胶体，形成胶座1，其中注塑时给静电保护装置3的顶面预留出凹槽101，使静电保护装置3顶面裸露，注塑后再将金属接脚2弯折形成焊接部22和端部23。此制成流程简单，将静电保护装置3埋设成型于胶座1中，可避免在发光二极管导线架成型后再设置静电保护装置3，致使存在预留空间较小，不易安装静电保护装置3的困难。
以上仅为本发明的优选实施方案，其它在本实施方案基础上所做的任何改进变换也应当不脱离本发明的技术方案。

Claims (10)

1.一种发光二极管导线架，包括：凹设有功能区的胶座、两个金属接脚及静电保护装置，每一金属接脚部分显露于功能区底部，部分从功能区穿过胶座延伸至胶座的外部，其特征在于：所述静电保护装置埋入于胶座中，仅一侧裸露出胶座，并且该静电保护装置与所述两个金属接脚电性连接。
2.如权利要求1所述的发光二极管导线架，其特征在于：所述功能区具有由底部向顶部张开的倾斜侧壁，所述静电保护装置埋设于所述侧壁中，并仅露出其顶面。
3.如权利要求2所述的发光二极管导线架，其特征在于：所述静电保护装置的顶面上方设有凹槽，以提供较大的打线空间。
4.如权利要求3所述的发光二极管导线架，其特征在于：所述静电保护装置放置于其中一个金属接脚上以与该金属接脚电性连接。
5.如权利要求4所述的发光二极管导线架，其特征在于：所述功能区凸设有一间隔区块，该间隔区块设置在金属接脚之间用以区隔金属接脚的极性。
6.如权利要求5所述的发光二极管导线架，其特征在于：所述金属接脚从胶座的同一侧弯折而出形成焊接部，再分别弯折至胶座的相对两侧形成端部。
7.一种发光二极管导线架，包括：凹设有功能区的胶座、若干金属接脚及静电保护装置，每一金属接脚部分显露于功能区底部，部分从功能区穿过胶座延伸至胶座的外部，其特征在于：所述静电保护装置埋设于所述胶座的功能区中，并与所述两个金属接脚电性连接。
8.如权利要求7所述的发光二极管导线架，其特征在于：所述功能区设有侧壁，所述静电保护装置埋设于所述功能区的侧壁中。
9.如权利要求7所述的发光二极管导线架，其特征在于：所述静电保护装置的底面固定于其中一个金属接脚上，仅有顶面裸露出胶座。
10.如权利要求7所述的发光二极管导线架，其特征在于：所述静电保护装置于成型胶座之前设置于所述其中一个金属接脚上。
CN2010105282877A 2010-11-01 2010-11-01 发光二极管导线架 Pending CN102456826A (zh)

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