CN101393251B - 探测装置和探测方法 - Google Patents

探测装置和探测方法 Download PDF

Info

Publication number
CN101393251B
CN101393251B CN2008100988561A CN200810098856A CN101393251B CN 101393251 B CN101393251 B CN 101393251B CN 2008100988561 A CN2008100988561 A CN 2008100988561A CN 200810098856 A CN200810098856 A CN 200810098856A CN 101393251 B CN101393251 B CN 101393251B
Authority
CN
China
Prior art keywords
detecting card
mounting table
chip
substrate
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008100988561A
Other languages
English (en)
Chinese (zh)
Other versions
CN101393251A (zh
Inventor
河野功
花轮一纪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101393251A publication Critical patent/CN101393251A/zh
Application granted granted Critical
Publication of CN101393251B publication Critical patent/CN101393251B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
CN2008100988561A 2007-09-21 2008-05-19 探测装置和探测方法 Active CN101393251B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-245915 2007-09-21
JP2007245915A JP2009076776A (ja) 2007-09-21 2007-09-21 プローブ装置及びプローブ方法
JP2007245915 2007-09-21

Publications (2)

Publication Number Publication Date
CN101393251A CN101393251A (zh) 2009-03-25
CN101393251B true CN101393251B (zh) 2011-10-26

Family

ID=40493641

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100988561A Active CN101393251B (zh) 2007-09-21 2008-05-19 探测装置和探测方法

Country Status (4)

Country Link
JP (1) JP2009076776A (enExample)
KR (1) KR101019878B1 (enExample)
CN (1) CN101393251B (enExample)
TW (1) TWI427295B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968518B (zh) * 2009-07-27 2012-08-08 京元电子股份有限公司 具同心圆探针座的半导体测试设备
JP6289962B2 (ja) * 2013-07-11 2018-03-07 東京エレクトロン株式会社 プローブ装置
CN107976576A (zh) * 2016-10-24 2018-05-01 精工爱普生株式会社 电子元器件传送装置以及电子元器件检查装置
CN108885238A (zh) * 2017-01-19 2018-11-23 深圳市汇顶科技股份有限公司 一种用于矩阵排列芯片的测试装置
US11125814B2 (en) * 2017-02-22 2021-09-21 Sintokogio, Ltd. Test system
KR101897638B1 (ko) * 2017-08-21 2018-09-13 (주)씨온테크 반도체 소자의 전기적 특성 자동 측정용 고정밀 테스트 장치
TWI655444B (zh) * 2017-12-20 2019-04-01 亞亞科技股份有限公司 IC inspection machine with temporary fixing effect
US10698025B2 (en) * 2018-07-20 2020-06-30 Formfactor Beaverton, Inc. Probe systems and methods that utilize a flow-regulating structure for improved collection of an optical image of a device under test
JP2020145323A (ja) * 2019-03-06 2020-09-10 東京エレクトロン株式会社 基板保持装置および基板吸着方法
CN117501137A (zh) * 2021-06-23 2024-02-02 三菱电机株式会社 检查装置
CN113725131B (zh) * 2021-11-02 2022-02-08 西安奕斯伟材料科技有限公司 晶圆预处理装置及晶圆缺陷检测方法
CN114966147B (zh) * 2022-05-27 2023-12-22 江苏艾科半导体有限公司 一种芯片测试探针台保护罩
KR102761296B1 (ko) * 2023-11-24 2025-02-03 주식회사 비이링크 고전압-고전류용 전력반도체용 프로브 카드

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6251280U (enExample) * 1985-09-19 1987-03-30
WO1996029607A1 (en) * 1995-03-18 1996-09-26 Tokyo Electron Limited Method and apparatus for inspecting substrate
JPH0982766A (ja) * 1995-09-18 1997-03-28 Sony Corp プロービング測定装置
JP3842468B2 (ja) * 1998-12-08 2006-11-08 株式会社日本マイクロニクス プローブの清掃方法及び装置
JP2002340974A (ja) * 2001-05-17 2002-11-27 Matsushita Electric Ind Co Ltd 半導体素子の電気特性測定装置、及び半導体素子の電気特性測定方法
JP4791023B2 (ja) * 2004-11-08 2011-10-12 インターナショナル・ビジネス・マシーンズ・コーポレーション Tftの検査装置および検査方法

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
JP昭62-51280U 1987.03.30
JP特开2000-294472A 2000.10.20
JP特开2003-100821A 2003.04.04
JP特开2005-195547A 2005.07.21
JP特开2005-195548A 2005.07.21

Also Published As

Publication number Publication date
KR101019878B1 (ko) 2011-03-04
CN101393251A (zh) 2009-03-25
TW200914835A (en) 2009-04-01
TWI427295B (zh) 2014-02-21
KR20090031196A (ko) 2009-03-25
JP2009076776A (ja) 2009-04-09

Similar Documents

Publication Publication Date Title
CN101393251B (zh) 探测装置和探测方法
JP3188935B2 (ja) 検査装置
KR100187559B1 (ko) 전기적특성의 측정방법 및 그의 측정장치
KR101037255B1 (ko) 프로빙 방법, 프로브 장치 및 기억 매체
CN103376341B (zh) 垂直式探针卡及应用其的检测模块
CN105445972B (zh) 探针移动装置
JP2020012685A (ja) プローブ、検査治具、及び検査装置
WO2016157964A1 (ja) 検査治具及び基板検査装置
JP5280041B2 (ja) プローブ支持台とプローブ支持台の使用の下で検査物質を検査する方法
US10962565B2 (en) Substrate inspection apparatus
CN101995525B (zh) 一种测试装置及其测试方法
CN213716852U (zh) 一种清洗刷对中装置和晶圆清洗装置
TW200918914A (en) Testing system module
JP4391738B2 (ja) プローブの接触位置の採取方法、プローブの接触位置の補正方法及びプローブ装置間の接触誤差の解消方法
CN219179467U (zh) 一种电性隔离测试探针
US9915682B2 (en) Non-permanent termination structure for microprobe measurements
CN104049114A (zh) 电子器件量测治具及量测装置
JP5217063B2 (ja) 検査方法及び検査装置
JP2008292372A (ja) 検査支援システムを搭載する回路検査装置とその検査支援方法
KR100737384B1 (ko) 모바일용 디스플레이 패널의 검사장치 및 방법
JP4406218B2 (ja) プローブを備えた検査装置、およびプローブを備えた検査装置の位置決め機構による位置決め方法
JPH0758168A (ja) プローブ装置
JP2006003135A (ja) 半導体集積回路の不良診断方法
KR100802385B1 (ko) 기판 검사장치
JP2006343197A (ja) 検査装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant