CN101393251B - 探测装置和探测方法 - Google Patents
探测装置和探测方法 Download PDFInfo
- Publication number
- CN101393251B CN101393251B CN2008100988561A CN200810098856A CN101393251B CN 101393251 B CN101393251 B CN 101393251B CN 2008100988561 A CN2008100988561 A CN 2008100988561A CN 200810098856 A CN200810098856 A CN 200810098856A CN 101393251 B CN101393251 B CN 101393251B
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Links
- 238000000034 method Methods 0.000 title description 5
- 238000001514 detection method Methods 0.000 claims abstract description 19
- 239000007921 spray Substances 0.000 claims description 36
- 239000000523 sample Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 16
- 230000005611 electricity Effects 0.000 claims description 11
- 238000007689 inspection Methods 0.000 claims description 11
- 230000003068 static effect Effects 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 4
- 229910052742 iron Inorganic materials 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007245915A JP2009076776A (ja) | 2007-09-21 | 2007-09-21 | プローブ装置及びプローブ方法 |
JP2007-245915 | 2007-09-21 | ||
JP2007245915 | 2007-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101393251A CN101393251A (zh) | 2009-03-25 |
CN101393251B true CN101393251B (zh) | 2011-10-26 |
Family
ID=40493641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100988561A Active CN101393251B (zh) | 2007-09-21 | 2008-05-19 | 探测装置和探测方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2009076776A (enrdf_load_stackoverflow) |
KR (1) | KR101019878B1 (enrdf_load_stackoverflow) |
CN (1) | CN101393251B (enrdf_load_stackoverflow) |
TW (1) | TWI427295B (enrdf_load_stackoverflow) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101968518B (zh) * | 2009-07-27 | 2012-08-08 | 京元电子股份有限公司 | 具同心圆探针座的半导体测试设备 |
JP6289962B2 (ja) * | 2013-07-11 | 2018-03-07 | 東京エレクトロン株式会社 | プローブ装置 |
CN107976576A (zh) * | 2016-10-24 | 2018-05-01 | 精工爱普生株式会社 | 电子元器件传送装置以及电子元器件检查装置 |
CN108885238A (zh) * | 2017-01-19 | 2018-11-23 | 深圳市汇顶科技股份有限公司 | 一种用于矩阵排列芯片的测试装置 |
AT527530B1 (de) * | 2017-02-22 | 2025-04-15 | Sintokogio Ltd | Prüfsystem |
KR101897638B1 (ko) * | 2017-08-21 | 2018-09-13 | (주)씨온테크 | 반도체 소자의 전기적 특성 자동 측정용 고정밀 테스트 장치 |
TWI655444B (zh) * | 2017-12-20 | 2019-04-01 | 亞亞科技股份有限公司 | IC inspection machine with temporary fixing effect |
US10698025B2 (en) * | 2018-07-20 | 2020-06-30 | Formfactor Beaverton, Inc. | Probe systems and methods that utilize a flow-regulating structure for improved collection of an optical image of a device under test |
US20240288469A1 (en) * | 2021-06-23 | 2024-08-29 | Mitsubishi Electric Corporation | Inspection device |
CN113725131B (zh) * | 2021-11-02 | 2022-02-08 | 西安奕斯伟材料科技有限公司 | 晶圆预处理装置及晶圆缺陷检测方法 |
CN114966147B (zh) * | 2022-05-27 | 2023-12-22 | 江苏艾科半导体有限公司 | 一种芯片测试探针台保护罩 |
KR102761296B1 (ko) * | 2023-11-24 | 2025-02-03 | 주식회사 비이링크 | 고전압-고전류용 전력반도체용 프로브 카드 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6251280U (enrdf_load_stackoverflow) * | 1985-09-19 | 1987-03-30 | ||
WO1996029607A1 (fr) * | 1995-03-18 | 1996-09-26 | Tokyo Electron Limited | Procede et appareil de controle d'un substrat |
JPH0982766A (ja) * | 1995-09-18 | 1997-03-28 | Sony Corp | プロービング測定装置 |
JP3842468B2 (ja) * | 1998-12-08 | 2006-11-08 | 株式会社日本マイクロニクス | プローブの清掃方法及び装置 |
JP2002340974A (ja) * | 2001-05-17 | 2002-11-27 | Matsushita Electric Ind Co Ltd | 半導体素子の電気特性測定装置、及び半導体素子の電気特性測定方法 |
JP4791023B2 (ja) * | 2004-11-08 | 2011-10-12 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Tftの検査装置および検査方法 |
-
2007
- 2007-09-21 JP JP2007245915A patent/JP2009076776A/ja active Pending
-
2008
- 2008-05-19 CN CN2008100988561A patent/CN101393251B/zh active Active
- 2008-05-21 KR KR1020080047168A patent/KR101019878B1/ko not_active Expired - Fee Related
- 2008-09-19 TW TW097136136A patent/TWI427295B/zh not_active IP Right Cessation
Non-Patent Citations (5)
Title |
---|
JP昭62-51280U 1987.03.30 |
JP特开2000-294472A 2000.10.20 |
JP特开2003-100821A 2003.04.04 |
JP特开2005-195547A 2005.07.21 |
JP特开2005-195548A 2005.07.21 |
Also Published As
Publication number | Publication date |
---|---|
TWI427295B (zh) | 2014-02-21 |
CN101393251A (zh) | 2009-03-25 |
KR101019878B1 (ko) | 2011-03-04 |
TW200914835A (en) | 2009-04-01 |
KR20090031196A (ko) | 2009-03-25 |
JP2009076776A (ja) | 2009-04-09 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |