KR101019878B1 - 프로브 장치, 프로브 방법 및 기억 매체 - Google Patents

프로브 장치, 프로브 방법 및 기억 매체 Download PDF

Info

Publication number
KR101019878B1
KR101019878B1 KR1020080047168A KR20080047168A KR101019878B1 KR 101019878 B1 KR101019878 B1 KR 101019878B1 KR 1020080047168 A KR1020080047168 A KR 1020080047168A KR 20080047168 A KR20080047168 A KR 20080047168A KR 101019878 B1 KR101019878 B1 KR 101019878B1
Authority
KR
South Korea
Prior art keywords
probe
probe card
inspection
test head
ionizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020080047168A
Other languages
English (en)
Korean (ko)
Other versions
KR20090031196A (ko
Inventor
이사오 고우노
가즈키 하나와
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090031196A publication Critical patent/KR20090031196A/ko
Application granted granted Critical
Publication of KR101019878B1 publication Critical patent/KR101019878B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020080047168A 2007-09-21 2008-05-21 프로브 장치, 프로브 방법 및 기억 매체 Expired - Fee Related KR101019878B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007245915A JP2009076776A (ja) 2007-09-21 2007-09-21 プローブ装置及びプローブ方法
JPJP-P-2007-00245915 2007-09-21

Publications (2)

Publication Number Publication Date
KR20090031196A KR20090031196A (ko) 2009-03-25
KR101019878B1 true KR101019878B1 (ko) 2011-03-04

Family

ID=40493641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080047168A Expired - Fee Related KR101019878B1 (ko) 2007-09-21 2008-05-21 프로브 장치, 프로브 방법 및 기억 매체

Country Status (4)

Country Link
JP (1) JP2009076776A (enrdf_load_stackoverflow)
KR (1) KR101019878B1 (enrdf_load_stackoverflow)
CN (1) CN101393251B (enrdf_load_stackoverflow)
TW (1) TWI427295B (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968518B (zh) * 2009-07-27 2012-08-08 京元电子股份有限公司 具同心圆探针座的半导体测试设备
JP6289962B2 (ja) * 2013-07-11 2018-03-07 東京エレクトロン株式会社 プローブ装置
CN107976576A (zh) * 2016-10-24 2018-05-01 精工爱普生株式会社 电子元器件传送装置以及电子元器件检查装置
CN108885238A (zh) * 2017-01-19 2018-11-23 深圳市汇顶科技股份有限公司 一种用于矩阵排列芯片的测试装置
AT527530B1 (de) * 2017-02-22 2025-04-15 Sintokogio Ltd Prüfsystem
KR101897638B1 (ko) * 2017-08-21 2018-09-13 (주)씨온테크 반도체 소자의 전기적 특성 자동 측정용 고정밀 테스트 장치
TWI655444B (zh) * 2017-12-20 2019-04-01 亞亞科技股份有限公司 IC inspection machine with temporary fixing effect
US10698025B2 (en) * 2018-07-20 2020-06-30 Formfactor Beaverton, Inc. Probe systems and methods that utilize a flow-regulating structure for improved collection of an optical image of a device under test
US20240288469A1 (en) * 2021-06-23 2024-08-29 Mitsubishi Electric Corporation Inspection device
CN113725131B (zh) * 2021-11-02 2022-02-08 西安奕斯伟材料科技有限公司 晶圆预处理装置及晶圆缺陷检测方法
CN114966147B (zh) * 2022-05-27 2023-12-22 江苏艾科半导体有限公司 一种芯片测试探针台保护罩
KR102761296B1 (ko) * 2023-11-24 2025-02-03 주식회사 비이링크 고전압-고전류용 전력반도체용 프로브 카드

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6251280U (enrdf_load_stackoverflow) * 1985-09-19 1987-03-30
JP2006133119A (ja) 2004-11-08 2006-05-25 Internatl Business Mach Corp <Ibm> Ｔｆｔの検査装置および検査方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996029607A1 (fr) * 1995-03-18 1996-09-26 Tokyo Electron Limited Procede et appareil de controle d'un substrat
JPH0982766A (ja) * 1995-09-18 1997-03-28 Sony Corp プロービング測定装置
JP3842468B2 (ja) * 1998-12-08 2006-11-08 株式会社日本マイクロニクス プローブの清掃方法及び装置
JP2002340974A (ja) * 2001-05-17 2002-11-27 Matsushita Electric Ind Co Ltd 半導体素子の電気特性測定装置、及び半導体素子の電気特性測定方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6251280U (enrdf_load_stackoverflow) * 1985-09-19 1987-03-30
JP2006133119A (ja) 2004-11-08 2006-05-25 Internatl Business Mach Corp <Ibm> Ｔｆｔの検査装置および検査方法

Also Published As

Publication number Publication date
TWI427295B (zh) 2014-02-21
CN101393251A (zh) 2009-03-25
CN101393251B (zh) 2011-10-26
TW200914835A (en) 2009-04-01
KR20090031196A (ko) 2009-03-25
JP2009076776A (ja) 2009-04-09

Similar Documents

Publication Publication Date Title
KR101019878B1 (ko) 프로브 장치, 프로브 방법 및 기억 매체
US5461327A (en) Probe apparatus
KR100283856B1 (ko) 프로우브장치 및 프로우브카드
JP3188935B2 (ja) 検査装置
US20160054385A1 (en) Capacitive opens testing of low profile components
US11709199B2 (en) Evaluation apparatus for semiconductor device
JP5873741B2 (ja) 半導体検査装置および半導体検査方法
JP5280041B2 (ja) プローブ支持台とプローブ支持台の使用の下で検査物質を検査する方法
TWI533006B (zh) 檢查裝置及檢查方法
JP4825610B2 (ja) 検査用ソケット
JP2007256277A (ja) 印刷回路板を走査検査する装置
US12032012B1 (en) Detection unit, semiconductor film layer inspection apparatus including the same, and semiconductor film layer inspection method using the same
TW201400821A (zh) 探針裝置
US20210033642A1 (en) Probe Module and Probe
US10962565B2 (en) Substrate inspection apparatus
CN101995525A (zh) 一种测试装置及其测试方法
US11467099B2 (en) Inspection apparatus
JPH0737945A (ja) プローブ装置
JP4329087B2 (ja) 半導体デバイスの静電破壊試験方法と装置
JP2000097985A (ja) 間隔が密な試験場所用走査試験機
JP2008292372A (ja) 検査支援システムを搭載する回路検査装置とその検査支援方法
JP2011007647A (ja) Ｔｆｔ基板検査装置用プローバフレームの検査装置
JPH0758168A (ja) プローブ装置
KR100709796B1 (ko) 피처리체 탑재대
JP3783074B2 (ja) ウエハ検査装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20140204

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20150130

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160127

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20170202

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20180219

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20190218

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20200218

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240226

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240226