JP4825610B2 - 検査用ソケット - Google Patents
検査用ソケット Download PDFInfo
- Publication number
- JP4825610B2 JP4825610B2 JP2006204437A JP2006204437A JP4825610B2 JP 4825610 B2 JP4825610 B2 JP 4825610B2 JP 2006204437 A JP2006204437 A JP 2006204437A JP 2006204437 A JP2006204437 A JP 2006204437A JP 4825610 B2 JP4825610 B2 JP 4825610B2
- Authority
- JP
- Japan
- Prior art keywords
- inspected
- support block
- opening
- probe
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Measuring Leads Or Probes (AREA)
Description
2 支持ブロック
3 押え板
4 デバイスガイド
4a 開口部
5 センタリング機構
51 支柱
52 ローラガイド
53 押圧手段
54 支柱バネ
55 ローラ軸
56 ローラバネ
57 調整ネジ
6 被検査デバイス
7 押し具
Claims (4)
- プローブを支持するため複数個の貫通孔が設けられる支持ブロックと、該支持ブロックの貫通孔内に固定して設けられ、該支持ブロックの一面側に設けられる被検査デバイスの電極端子および他面側に設けられる検査装置に接続された配線端子を電気的に接続する信号用、電源用およびグランド用の各プローブと、前記支持ブロックの一面側に該支持ブロックと一体でまたは別体で固定して設けられ、前記被検査デバイスをガイドする平面形状が四角形状の開口部を有するデバイスガイドと、該デバイスガイドの開口部の中心位置に前記被検査デバイスの位置を調整する被検査デバイスのセンタリング機構とを具備し、前記センタリング機構が、前記被検査デバイスを一時的に支持し、荷重により上下動し得る支柱と、前記デバイスガイドの開口部のそれぞれの一辺側に、少なくとも一部がそれぞれ前記開口部側に露出し、かつ、該一辺と実質的に平行な回転軸を有するように設けられるローラガイドと、前記ローラガイドを前記一辺と垂直方向に移動させ得る押圧手段とを有してなる検査用ソケット。
- 前記各プローブが、少なくとも前記被検査デバイス側のピンの先端部がスプリングにより上下動し得るコンタクトプローブからなり、該コンタクトプローブのピンの先端が自由に突出する際の前記支持ブロック表面からの高さをh3、前記ローラガイドのローラ軸の中心位置の前記支持ブロック表面からの高さをh2、前記支柱に荷重がかからない状態での該支柱の上面の前記支持ブロックからの高さをh1とするとき、h1>h2>h3となるように、前記支柱、前記ガイドローラおよび前記プローブが設けられてなる請求項1記載の検査用ソケット。
- 前記被検査デバイスの前記開口部に対する位置を検出する位置検出手段がさらに設けられ、該位置検出手段により検出される被検査デバイスの位置が前記開口部の中心位置になるように前記押圧手段で調整し得るように調整手段が前記押圧手段に設けられてなる請求項1または2記載の検査用ソケット。
- 前記ローラガイドが静電気防止材料により形成されてなる請求項1ないし3のいずれか1項記載の検査用ソケット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006204437A JP4825610B2 (ja) | 2006-07-27 | 2006-07-27 | 検査用ソケット |
PCT/JP2007/064792 WO2008013273A1 (fr) | 2006-07-27 | 2007-07-27 | Support pour inspection |
TW096127467A TWI412747B (zh) | 2006-07-27 | 2007-07-27 | 檢查用插座 |
US12/375,263 US8076952B2 (en) | 2006-07-27 | 2007-07-27 | Socket for inspection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006204437A JP4825610B2 (ja) | 2006-07-27 | 2006-07-27 | 検査用ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008034173A JP2008034173A (ja) | 2008-02-14 |
JP4825610B2 true JP4825610B2 (ja) | 2011-11-30 |
Family
ID=38981583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006204437A Active JP4825610B2 (ja) | 2006-07-27 | 2006-07-27 | 検査用ソケット |
Country Status (4)
Country | Link |
---|---|
US (1) | US8076952B2 (ja) |
JP (1) | JP4825610B2 (ja) |
TW (1) | TWI412747B (ja) |
WO (1) | WO2008013273A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101043023B1 (ko) | 2010-01-28 | 2011-06-21 | 리노공업주식회사 | 적층 세라믹 커패시터용 검사 소켓 |
JP6150681B2 (ja) * | 2013-08-29 | 2017-06-21 | 株式会社エンプラス | 上プレート付勢ユニットおよび電気部品用ソケット |
JP6404104B2 (ja) * | 2014-12-11 | 2018-10-10 | 株式会社エンプラス | 電気部品用ソケット |
JP6480798B2 (ja) * | 2015-04-23 | 2019-03-13 | 株式会社ヨコオ | ソケット |
US9933455B2 (en) * | 2015-05-04 | 2018-04-03 | Qualcomm Incorporated | Known good die testing for high frequency applications |
CN105044398A (zh) * | 2015-08-14 | 2015-11-11 | 苏州听毅华自动化设备有限公司 | 电测检查机构 |
CN109564240A (zh) | 2016-08-08 | 2019-04-02 | 积水化学工业株式会社 | 导通检测装置用部件和导通检测装置 |
WO2020189664A1 (ja) * | 2019-03-18 | 2020-09-24 | 株式会社エンプラス | ソケット及び検査用ソケット |
KR102566041B1 (ko) * | 2019-11-05 | 2023-08-16 | 주식회사 프로웰 | 반도체 소자 테스트 장치 |
JP2021120924A (ja) * | 2020-01-30 | 2021-08-19 | 株式会社ヨコオ | 検査用ソケット |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0520286U (ja) | 1991-08-30 | 1993-03-12 | 株式会社エンプラス | Icソケツト |
US6229320B1 (en) * | 1994-11-18 | 2001-05-08 | Fujitsu Limited | IC socket, a test method using the same and an IC socket mounting mechanism |
JP3453526B2 (ja) * | 1998-09-29 | 2003-10-06 | 株式会社日立製作所 | 半導体素子検査用ソケット、半導体装置、半導体装置の製造方法及び半導体装置の検査方法 |
US7042238B2 (en) * | 2001-12-28 | 2006-05-09 | Nhk Spring Co., Ltd. | Socket for inspection |
JP2004014470A (ja) * | 2002-06-11 | 2004-01-15 | Yamaichi Electronics Co Ltd | Icソケット |
US20040095257A1 (en) * | 2002-08-12 | 2004-05-20 | Smartlink Ltd. | High-speed analog modem |
JP4251855B2 (ja) | 2002-11-19 | 2009-04-08 | 株式会社ヨコオ | 高周波・高速用デバイスの検査治具の製法 |
US6958616B1 (en) * | 2003-11-07 | 2005-10-25 | Xilinx, Inc. | Hybrid interface apparatus for testing integrated circuits having both low-speed and high-speed input/output pins |
-
2006
- 2006-07-27 JP JP2006204437A patent/JP4825610B2/ja active Active
-
2007
- 2007-07-27 TW TW096127467A patent/TWI412747B/zh active
- 2007-07-27 US US12/375,263 patent/US8076952B2/en not_active Expired - Fee Related
- 2007-07-27 WO PCT/JP2007/064792 patent/WO2008013273A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TWI412747B (zh) | 2013-10-21 |
US8076952B2 (en) | 2011-12-13 |
TW200809206A (en) | 2008-02-16 |
JP2008034173A (ja) | 2008-02-14 |
US20090230983A1 (en) | 2009-09-17 |
WO2008013273A1 (fr) | 2008-01-31 |
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