CN101346777B - 用于各向异性导电互连的导电颗粒 - Google Patents
用于各向异性导电互连的导电颗粒 Download PDFInfo
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- CN101346777B CN101346777B CN2006800485190A CN200680048519A CN101346777B CN 101346777 B CN101346777 B CN 101346777B CN 2006800485190 A CN2006800485190 A CN 2006800485190A CN 200680048519 A CN200680048519 A CN 200680048519A CN 101346777 B CN101346777 B CN 101346777B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C09J11/04—Non-macromolecular additives inorganic
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
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Abstract
Description
Claims (10)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020050131736 | 2005-12-28 | ||
KR1020050131736A KR100719802B1 (ko) | 2005-12-28 | 2005-12-28 | 이방 전도 접속용 고신뢰성 전도성 미립자 |
KR10-2005-0131736 | 2005-12-28 | ||
PCT/KR2006/003488 WO2007074962A1 (en) | 2005-12-28 | 2006-09-04 | Conductive particles for anisotropic conductive interconnection |
Publications (2)
Publication Number | Publication Date |
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CN101346777A CN101346777A (zh) | 2009-01-14 |
CN101346777B true CN101346777B (zh) | 2012-03-21 |
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CN2006800485190A Active CN101346777B (zh) | 2005-12-28 | 2006-09-04 | 用于各向异性导电互连的导电颗粒 |
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Country | Link |
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US (1) | US8089151B2 (zh) |
JP (1) | JP4920698B2 (zh) |
KR (1) | KR100719802B1 (zh) |
CN (1) | CN101346777B (zh) |
TW (1) | TWI332666B (zh) |
WO (1) | WO2007074962A1 (zh) |
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US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
KR100667374B1 (ko) * | 2004-12-16 | 2007-01-10 | 제일모직주식회사 | 이방전도성 접속부재용 고분자 수지 미립자, 전도성 미립자 및 이를 포함한 이방 전도성 접속재료 |
KR100720895B1 (ko) * | 2005-07-05 | 2007-05-22 | 제일모직주식회사 | 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물 |
KR101402892B1 (ko) * | 2007-09-11 | 2014-06-11 | 삼성디스플레이 주식회사 | 도전성 입자를 갖는 이방성 도전 접착제, 상기 도전성입자의 제조 방법, 및 상기 이방성 도전 접착제를 이용하여표시 장치를 제조하는 방법 |
KR100920612B1 (ko) * | 2007-11-08 | 2009-10-08 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름 |
JP5151920B2 (ja) * | 2008-02-05 | 2013-02-27 | 日立化成工業株式会社 | 導電粒子及び導電粒子の製造方法 |
JP5430093B2 (ja) * | 2008-07-24 | 2014-02-26 | デクセリアルズ株式会社 | 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法 |
JP5358328B2 (ja) * | 2009-07-16 | 2013-12-04 | デクセリアルズ株式会社 | 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法 |
JP5833809B2 (ja) * | 2010-02-01 | 2015-12-16 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体及び接続方法 |
WO2011158761A1 (ja) * | 2010-06-17 | 2011-12-22 | 日立化成工業株式会社 | 架橋ポリマー粒子及びその製造方法、導電性粒子 |
JP5494299B2 (ja) * | 2010-07-06 | 2014-05-14 | デクセリアルズ株式会社 | 磁性粉体の脱磁方法 |
JP5614135B2 (ja) * | 2010-07-06 | 2014-10-29 | デクセリアルズ株式会社 | 異方性導電接着剤、その製造方法、接続構造体及びその製造方法 |
KR101309821B1 (ko) * | 2010-12-31 | 2013-09-23 | 제일모직주식회사 | 이방 전도성 필름 조성물 |
JP6018831B2 (ja) * | 2011-08-05 | 2016-11-02 | 積水化学工業株式会社 | 接合構造体の製造方法 |
JP5941328B2 (ja) * | 2012-04-10 | 2016-06-29 | 日本化学工業株式会社 | 導電性粒子及びそれを含む導電性材料 |
JP6445833B2 (ja) * | 2013-10-21 | 2018-12-26 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP6453032B2 (ja) * | 2013-10-21 | 2019-01-16 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
US11027374B2 (en) | 2015-11-20 | 2021-06-08 | Sekisui Chemical Co., Ltd. | Particles, connecting material and connection structure |
JP6959005B2 (ja) | 2015-11-20 | 2021-11-02 | 積水化学工業株式会社 | 接続材料及び接続構造体 |
US11017916B2 (en) | 2015-11-20 | 2021-05-25 | Sekisui Chemical Co., Ltd. | Particles, connecting material and connection structure |
CN107849402A (zh) * | 2015-12-15 | 2018-03-27 | 积水化学工业株式会社 | 导电性粘接带 |
EP3584333A4 (en) * | 2017-02-20 | 2020-07-29 | Sekisui Chemical Co., Ltd. | SINTER MATERIAL, CONNECTING STRUCTURE, COMPOSITE PARTICLES, CONNECTING COMPOSITION AND METHOD FOR PRODUCING SINTER MATERIAL |
CN109158590B (zh) * | 2018-09-29 | 2020-11-24 | 淮阴师范学院 | 一维棒状核壳结构的复合金粉的制备方法 |
FR3100822B1 (fr) * | 2019-09-12 | 2021-10-01 | Lifco Ind | Billes de soudure composites metallisees en surface et calibrees pour l'assemblage de cartes electroniques |
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JP2000030526A (ja) * | 1998-07-10 | 2000-01-28 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電接着剤及び導電接続構造体 |
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- 2005-12-28 KR KR1020050131736A patent/KR100719802B1/ko active IP Right Grant
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- 2006-08-04 TW TW095128663A patent/TWI332666B/zh active
- 2006-08-07 US US11/500,018 patent/US8089151B2/en active Active
- 2006-09-04 WO PCT/KR2006/003488 patent/WO2007074962A1/en active Application Filing
- 2006-09-04 CN CN2006800485190A patent/CN101346777B/zh active Active
- 2006-09-04 JP JP2008548370A patent/JP4920698B2/ja active Active
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Also Published As
Publication number | Publication date |
---|---|
US8089151B2 (en) | 2012-01-03 |
KR100719802B1 (ko) | 2007-05-18 |
JP2009522716A (ja) | 2009-06-11 |
JP4920698B2 (ja) | 2012-04-18 |
TWI332666B (en) | 2010-11-01 |
US20070145585A1 (en) | 2007-06-28 |
CN101346777A (zh) | 2009-01-14 |
WO2007074962A1 (en) | 2007-07-05 |
TW200725646A (en) | 2007-07-01 |
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