CN101332580B - 抛光装置和抛光方法 - Google Patents

抛光装置和抛光方法 Download PDF

Info

Publication number
CN101332580B
CN101332580B CN2008101285883A CN200810128588A CN101332580B CN 101332580 B CN101332580 B CN 101332580B CN 2008101285883 A CN2008101285883 A CN 2008101285883A CN 200810128588 A CN200810128588 A CN 200810128588A CN 101332580 B CN101332580 B CN 101332580B
Authority
CN
China
Prior art keywords
rubbing head
sand belt
substrate
wafer
oscillating motion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008101285883A
Other languages
English (en)
Chinese (zh)
Other versions
CN101332580A (zh
Inventor
高桥圭瑞
関正也
草宏明
伊藤贤也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN101332580A publication Critical patent/CN101332580A/zh
Application granted granted Critical
Publication of CN101332580B publication Critical patent/CN101332580B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/16—Machines or devices using grinding or polishing belts; Accessories therefor for grinding other surfaces of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
CN2008101285883A 2007-06-29 2008-06-27 抛光装置和抛光方法 Active CN101332580B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007171959 2007-06-29
JP171959/2007 2007-06-29

Publications (2)

Publication Number Publication Date
CN101332580A CN101332580A (zh) 2008-12-31
CN101332580B true CN101332580B (zh) 2012-05-09

Family

ID=39816648

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101285883A Active CN101332580B (zh) 2007-06-29 2008-06-27 抛光装置和抛光方法

Country Status (7)

Country Link
US (1) US7976361B2 (enExample)
EP (1) EP2008769B1 (enExample)
JP (2) JP5188285B2 (enExample)
KR (1) KR101488993B1 (enExample)
CN (1) CN101332580B (enExample)
DE (1) DE602008005211D1 (enExample)
TW (1) TWI436852B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110081839A1 (en) * 2009-10-06 2011-04-07 Apple Inc. Method and apparatus for polishing a curved edge
US8892238B2 (en) * 2009-10-06 2014-11-18 Edward T. Sweet Edge break details and processing
CN101934489B (zh) * 2010-07-30 2012-10-03 溧阳市四方不锈钢制品有限公司 管坯焊缝打磨机
JP5649417B2 (ja) * 2010-11-26 2015-01-07 株式会社荏原製作所 固定砥粒を有する研磨テープを用いた基板の研磨方法
US8540551B2 (en) * 2010-12-15 2013-09-24 Corning Incorporated Glass edge finish system, belt assembly, and method for using same
CN102233536A (zh) * 2011-05-10 2011-11-09 淄博隆嘉工贸有限公司 陶瓷手模自动抛光机
TWI663018B (zh) * 2012-09-24 2019-06-21 日商荏原製作所股份有限公司 研磨方法及研磨裝置
US9339912B2 (en) 2013-01-31 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer polishing tool using abrasive tape
JP6071611B2 (ja) * 2013-02-13 2017-02-01 Ｍｉｐｏｘ株式会社 オリエンテーションフラット等切り欠き部を有する、結晶材料から成るウエハの周縁を、研磨テープを使用して研磨することにより円形ウエハを製造する方法
JP2015000451A (ja) * 2013-06-17 2015-01-05 ワイエイシイ株式会社 基板表面加工装置
JP6113624B2 (ja) * 2013-10-11 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
CN105196140B (zh) * 2015-10-20 2017-05-31 慈溪市华表机械有限公司 一种外圆超精机
EP3335832B1 (en) * 2016-12-15 2021-02-03 Ebara Corporation Polishing apparatus and pressing pad for pressing polishing tool
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6974067B2 (ja) * 2017-08-17 2021-12-01 株式会社荏原製作所 基板を研磨する方法および装置
JP7129166B2 (ja) * 2018-01-11 2022-09-01 株式会社荏原製作所 基板処理装置及び制御方法
JP7226711B2 (ja) * 2019-02-28 2023-02-21 範多機械株式会社 斫り装置
CN110405587B (zh) * 2019-07-29 2024-12-24 周口市超越科技电子有限公司 一种马达电枢自动抛光机
CN111745504B (zh) * 2020-05-20 2022-06-21 深圳市裕展精密科技有限公司 打磨机构、打磨装置及打磨方法
CN111941201B (zh) * 2020-08-21 2021-12-07 许昌学院 一种用于法布里-珀罗干涉仪镜板的高精度制造装置
CN114619338B (zh) * 2022-03-28 2024-11-15 南通市睿联环保设备有限公司 一种扫地车液压杆生产装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1977361A (zh) * 2005-04-19 2007-06-06 株式会社荏原制作所 基底处理设备

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2837342B2 (ja) * 1993-12-13 1998-12-16 日本ミクロコーティング株式会社 研磨装置
JP3081140B2 (ja) 1995-09-21 2000-08-28 日本ミクロコーティング株式会社 研磨テープによる研磨装置
NO306765B1 (no) * 1998-04-03 1999-12-20 Grobi As Anordning for kantrunding av hull i et arbeidsstykke
US6685539B1 (en) * 1999-08-24 2004-02-03 Ricoh Company, Ltd. Processing tool, method of producing tool, processing method and processing apparatus
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
JP4156200B2 (ja) * 2001-01-09 2008-09-24 株式会社荏原製作所 研磨装置及び研磨方法
JP2003220546A (ja) * 2002-01-24 2003-08-05 Soken Kogyo Kk ベルト式研磨装置
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus
KR101249430B1 (ko) * 2004-10-15 2013-04-03 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치 및 폴리싱방법
JP2006142388A (ja) * 2004-11-16 2006-06-08 Nihon Micro Coating Co Ltd 研磨テープ及び方法
JP5196709B2 (ja) * 2005-04-19 2013-05-15 株式会社荏原製作所 半導体ウエハ周縁研磨装置及び方法
US20090017733A1 (en) * 2005-04-19 2009-01-15 Ebara Corporation Substrate processing apparatus
EP1976806A4 (en) * 2005-12-09 2011-08-10 Applied Materials Inc METHOD AND DEVICE FOR PROCESSING A SUBSTRATE
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
WO2007126815A2 (en) * 2006-03-30 2007-11-08 Applied Materials, Inc. Methods and apparatus for polishing an edge of a subtrate
JP2008036783A (ja) * 2006-08-08 2008-02-21 Sony Corp 研磨方法および研磨装置
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1977361A (zh) * 2005-04-19 2007-06-06 株式会社荏原制作所 基底处理设备

Also Published As

Publication number Publication date
JP5525590B2 (ja) 2014-06-18
EP2008769A1 (en) 2008-12-31
US7976361B2 (en) 2011-07-12
US20090004952A1 (en) 2009-01-01
KR101488993B1 (ko) 2015-02-02
DE602008005211D1 (de) 2011-04-14
EP2008769B1 (en) 2011-03-02
CN101332580A (zh) 2008-12-31
TWI436852B (zh) 2014-05-11
TW200932423A (en) 2009-08-01
KR20090004590A (ko) 2009-01-12
JP2013075358A (ja) 2013-04-25
JP2009028892A (ja) 2009-02-12
JP5188285B2 (ja) 2013-04-24

Similar Documents

Publication Publication Date Title
CN101332580B (zh) 抛光装置和抛光方法
US6306016B1 (en) Wafer notch polishing machine and method of polishing an orientation notch in a wafer
CN102941522B (zh) 抛光装置
TW200810881A (en) Methods and apparatus for polishing an edge of a substrate
US20080293334A1 (en) Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement
KR102063157B1 (ko) 스프링 연마장치
CN1289281A (zh) 研磨装置及研磨方法
US6220940B1 (en) Micro-finishing apparatus
JP2009016759A (ja) 半導体ウェーハ端面研磨装置およびこれに用いる研磨ヘッド
JPH11198009A (ja) 薄板円板状ワークの両面研削装置および断面形状測定装置
CN216179321U (zh) 一种砂带打磨机
JP4078183B2 (ja) デバイスウェハの周辺部研磨装置
JPH0724720A (ja) 両端軸状部研磨装置
KR200424875Y1 (ko) 연마필름을 이용한 평면폴리싱장치
JP3888618B2 (ja) ロッド端面加工装置
CN107443213B (zh) 一种可翻转的xy轴全伺服砂带机
KR200414569Y1 (ko) 자동연마장치
CN108436674B (zh) 异型工件自调整磨削装置及磨削方法
CN219853787U (zh) 一种恒力浮动砂带机
KR200208032Y1 (ko) 리니어 모션가이드가 설치된 초정밀 연마기
JP2929227B2 (ja) ワーク研摩機
JP2007007818A (ja) 研磨加工方法および研磨加工装置
CN121104843A (zh) 磨抛设备
JPH02232159A (ja) 平面研磨方法及び装置
JP2002096262A (ja) 研削装置及び被加工物の保持方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant