TW200810881A - Methods and apparatus for polishing an edge of a substrate - Google Patents

Methods and apparatus for polishing an edge of a substrate Download PDF

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Publication number
TW200810881A
TW200810881A TW096111418A TW96111418A TW200810881A TW 200810881 A TW200810881 A TW 200810881A TW 096111418 A TW096111418 A TW 096111418A TW 96111418 A TW96111418 A TW 96111418A TW 200810881 A TW200810881 A TW 200810881A
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TW
Taiwan
Prior art keywords
substrate
edge
grinding
amount
abrasive film
Prior art date
Application number
TW096111418A
Other languages
Chinese (zh)
Inventor
Ho Seon Shin
Gary C Ettinger
Donald J K Olgado
Erik C Wasinger
Sen-Hou Ko
Charles I Dodds
Yufei Chen
Wei Yung Hsu
Original Assignee
Applied Materials Inc
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Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200810881A publication Critical patent/TW200810881A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/067Work supports, e.g. adjustable steadies radially supporting workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.

Description

200810881 九、發明說明: 【發明所屬之技術領域】 本發明大體上係有關於基材處理,尤其係有關於用以 研磨一基材之邊緣的方法與設備。 【先前技術】200810881 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates generally to substrate processing, and more particularly to methods and apparatus for polishing the edges of a substrate. [Prior Art]

傳統系統以一磨餘膜接觸基材邊緣以清潔該邊緣,傳 統系統無法完全地研磨或清潔該邊緣。例如,磨蝕膜在清 潔期間無法充分地接觸邊緣之兩斜面。此外,磨餘膜會因 為使用而變得磨損,因此失去了足夠清潔基材之能力且需 要時常更換,這會影響半導體元件製造產能。是以,需要 清潔基材邊緣之改善方法與設備。 【發明内容】 在本發明之第一態樣中,本發明係提供一種研磨一基 材之邊緣的方法。該方法包括:(1)旋轉一基材使其抵靠一 研磨膜,以從該基材之邊緣移除材料;以及(2)偵測在旋轉 該基材使其抵靠該研磨膜時施加之能量與扭矩其中一者的 量。本發明之實施例更包括:(3)根據所偵測之在旋轉該基 材使其抵靠該研磨膜時所施加之能量或扭矩,決定從該基 材之邊緣移除的材料量;(4)秦定經決定之所移除材料量與 一預定研磨程度之間差異;以及(5)根據經決定之所移除材 料量與一預定研磨程度之間差異,決定在旋轉該 土材時欲 被施加之能量或扭矩的量,其係適以使基材達到 ^ 1頂定的研Conventional systems contact the edge of the substrate with a rubbing film to clean the edges, and conventional systems cannot completely grind or clean the edges. For example, the abrasive film does not adequately contact the two bevels of the edge during cleaning. In addition, the worn-out film becomes worn due to use, so it loses the ability to clean the substrate sufficiently and needs to be replaced from time to time, which affects the manufacturing capacity of the semiconductor component. Therefore, there is a need for improved methods and equipment for cleaning the edges of the substrate. SUMMARY OF THE INVENTION In a first aspect of the invention, the invention provides a method of grinding the edges of a substrate. The method includes: (1) rotating a substrate against an abrasive film to remove material from an edge of the substrate; and (2) detecting application of the substrate while rotating it against the abrasive film The amount of energy and torque. Embodiments of the invention further include: (3) determining the amount of material removed from the edge of the substrate based on the detected energy or torque applied when the substrate is rotated against the abrasive film; 4) the difference between the amount of material removed by Qin Ding and a predetermined degree of grinding; and (5) determining the difference between the amount of material removed and a predetermined degree of grinding, when rotating the soil The amount of energy or torque to be applied, which is suitable for the substrate to reach the top

200810881 磨程度。 在本發明之第二態樣中,本發明係提供一種研磨一 材之邊緣的替代性方法。該方法包括:(1)旋轉一基材使 抵靠一研磨膜,以從該基材之邊緣移除材料;以及(2)偵 在壓迫該研磨膜抵靠該基材時施加之力量的量。本發明 實施例更包括:(3)根據所偵測之在壓迫該研磨膜抵靠該 轉基材時施加之力量,決定從該基材之邊緣移除的材 量;(4)讀定經決定之所移除材料量與一預定研磨程度之 差異;以及(5)根據經決定之所移除材料量與該預定研磨 度之間差異,決定欲被施加至該研磨膜之力量位準,其 該力量位準係適以使基材違到預定研磨程度·,以及調整 力量至該經決定之位準。 在本發明之第三態樣中,本發明係提供一種適用以 磨一基材之邊緣的系統。該系統包括··( 1) 一基材旋轉驅 器,其係適用以旋轉一基材之邊緣使其抵靠一研磨膜; 及(2) —第一感測器,其連接至該旋轉器動器,該第一感 器係通用以當該基材旋轉驅動器旋棒該基材使其抵靠該 磨膜時,可以偵測被該基材旋轉驅動器施加的力量與扭 其中一者。本發明之實施例更包括:(3)—控制器,其係 接至該第一感測器與至該基材旋轉驅動器,該控制器係 用以接收來自該第一感測器之訊號,其中該訊號指示出 偵測而被該基材旋轉驅動器施加之能量或扭矩,該控制 亦適用以根據經偵測而施加之能量或扭矩來傳送控制訊 基 其 測 之 旋 料 間 程 中 該 研 動 以 測 研 矩 連 適 經 器 號 6 200810881 至該基材旋轉驅動器。 • 在本發明之第四癌樣中,本發明係提供一種適用以施 ,加一預定壓力至一研磨膜之設備,該研磨膜係接觸於一基 材之邊緣。該設備包鉍:(1)一致動器,其係適用以施加一 預定壓力至該研磨膜;以及(2)一控制器,其係連接至該致 動器,且適用以接收一訊號,該訊號係指示出該基材之邊 緣的狀態’且適用以根據經接收之訊號來調整被該致動器 施加至該研磨膜之壓力以維持住該預定壓力。 由以下詳細說明、隨附申請專利範圍與附圖,本發明 之其他特徵與態樣將可以變得更加明顯。 【實施方式】 本發明係提供清潔與/或研磨基材邊緣之改善方法與 设備。請參照第1圖,一基材i 〇〇包括有兩主表面1 〇2、 102 ’以及一邊緣104。基材100之每一主表面1〇2、102,200810881 The degree of grinding. In a second aspect of the invention, the invention provides an alternative method of grinding the edges of a material. The method comprises: (1) rotating a substrate against an abrasive film to remove material from an edge of the substrate; and (2) detecting an amount of force applied when pressing the abrasive film against the substrate . The embodiment of the invention further comprises: (3) determining the amount of material removed from the edge of the substrate according to the detected force applied when pressing the polishing film against the rotating substrate; (4) reading the classic Determining the difference between the amount of material removed and a predetermined degree of grinding; and (5) determining the level of force to be applied to the abrasive film based on the determined difference between the amount of material removed and the predetermined degree of polishing, The force level is adapted to cause the substrate to violate the predetermined degree of grinding, and to adjust the force to the determined level. In a third aspect of the invention, the invention provides a system suitable for use to sharpen the edges of a substrate. The system includes: (1) a substrate spin drive adapted to rotate an edge of a substrate against an abrasive film; and (2) a first sensor coupled to the rotator The first sensor is versatile to detect the force applied by the substrate rotary actuator and twist when the substrate rotates the driver to rotate the substrate against the film. The embodiment of the present invention further includes: (3) a controller coupled to the first sensor and to the substrate rotation driver, the controller is configured to receive a signal from the first sensor, Wherein the signal indicates the energy or torque applied by the substrate rotation driver, and the control is also adapted to transmit the control signal according to the detected energy or torque. Move the tester with the adaptor number 6 200810881 to the substrate rotary drive. • In the fourth cancer sample of the present invention, the present invention provides an apparatus for applying a predetermined pressure to a polishing film which is in contact with the edge of a substrate. The apparatus includes: (1) an actuator adapted to apply a predetermined pressure to the abrasive film; and (2) a controller coupled to the actuator and adapted to receive a signal, the device The signal indicates the state of the edge of the substrate and is adapted to adjust the pressure applied by the actuator to the abrasive film to maintain the predetermined pressure based on the received signal. Other features and aspects of the present invention will become more apparent from the detailed description and appended claims. [Embodiment] The present invention provides an improved method and apparatus for cleaning and/or grinding the edges of a substrate. Referring to Figure 1, a substrate i 〇〇 includes two major surfaces 1 〇 2, 102 ′ and an edge 104. Each major surface of the substrate 100 is 1, 2, 102,

包括一元件區域106、106’,以及一排除區域1〇8、108,。 (然而,典型地,僅該兩主表面1〇2、102,之一者會包括 一元件區域與一排除區域。)排除區域108、108,作為元 ... .... ' . .. ... , ·. 件區域106、1〇6,與邊緣104之間的緩衝。基材1〇〇之邊 _ . . . . . . . ·; , 緣1〇4包括一外緣1 10與斜面1 12、1 14。斜面1 12、1 14 位在外緣1 10與該兩主表面102、102,之排除區域108、108, ....... · . . .· . .. 1 -厂. . .. ; .- . . 之間。本發明係適用以清潔與/或研磨基材100之外緣110 與至少一斜面112、114,而不會影響元件區域106、106,。 200810881 在一些實施例中,排除區域108、108,之全部或一部分也 會被清潔或研磨。 本發明提供一框架,以在基材1 00被旋轉時能夠支撐 - - . —膜(例如一磨钱研磨膜)或磨蝕緩衝物抵靠基材100之邊 ♦ - 緣1〇4(例如藉由真空夾盤、驅動滾輪等等)。藉由利甩一 被致動器推擠之墊片或一可填充墊片,膜被壓迫抵靠旋轉 的基材邊緣1〇4。在任一情況中,墊片或可填充墊片係為 柔軟的,且/或包括或發展出輪廓以共形於基材邊緣1〇4的 开>/狀取決於致動器施加之力量的量,可以施加所選擇墊 片之彈性、可填充墊片之填充量、與/或膜上張力量、經控 制的壓力量以研磨邊緣1〇4。替代性地或此外地,膜可以 在框架内處於張力下,從而使得膜本身可以(例如具有或不 具有來自塾片的額外支撐)施加可變的張力量至基材邊緣 104與至輪麻,以及至外緣110與至少一斜面112、114。 口此本發明提供了一邊緣研磨製程之精確控制,當從邊 緣ι〇4移除材料時,其補足了基材中不同的邊緣幾何結構 與變化。 在些實施例中,框架可以支撐多個研磨頭,每一研 磨頭係適用从支撐研磨膜。此些研磨頭係以一預定順序或 在不同時間點支撐同時被使用之不同型式的膜(例如不同 磨餘石>、碟的麟)。此些頭可以被設置在不同位置與不同配向 (例如對齊於邊緣104、正交於邊緣104、相對於邊緣1〇4 角又)以允許被支撐的膜研磨旋轉基材1 Q 〇之邊緣1 〇4 的不同部分。此些頭係藉由框架環繞著或沿箸邊緣被震盪 200810881 或移動(例如燒著基材100之一切捲軸與/或圓周地相對於 基材100而角度地轉移),以研磨邊緣1〇4之不同部分 '在 一些實施例中’此些頭係持績地環繞著或沿著基材1 00之 旋轉邊緣1 04震盪^每一頭可以包括膜之一標示捲軸’且/ 或被容納在一可更換的E盒内。一標示捲軸可以允許一精 確的膜量被饋送,以將未使用的膜定位以用在研磨。在一 些實施例中,可以使用兩個標示捲軸以使膜在捲轴之間來 回地被移動。An element area 106, 106' is included, as well as an exclusion area 1〇8, 108. (However, typically only one of the two major surfaces 1, 2, 102 will include an element area and an exclusion area.) Exclusion areas 108, 108, as a meta..... . . . ... , ·. The buffer between the area 106, 1〇6, and the edge 104. The edge of the substrate 1 _ . . . . . . . . , the edge 1 〇 4 includes an outer edge 1 10 and the slopes 1 12, 1 14 . The bevels 1 12, 1 14 are located at the outer edge 1 10 and the two main surfaces 102, 102, the exclusion areas 108, 108, . . . . . . . . . . . . . . . . . . . . . .- . . between. The present invention is suitable for cleaning and/or grinding the outer edge 110 of the substrate 100 with at least one bevel 112, 114 without affecting the component regions 106, 106. 200810881 In some embodiments, all or a portion of the exclusion zones 108, 108 may also be cleaned or ground. The present invention provides a frame to support a film (e.g., a grind abrasive film) or an abrasive buffer against the edge of the substrate 100 when the substrate 100 is rotated. By vacuum chuck, drive roller, etc.). The film is pressed against the edge of the rotating substrate 1〇4 by means of a gasket pushed by the actuator or a fillable gasket. In either case, the gasket or fillable gasket is soft and/or includes or develops a contour to conform to the opening of the substrate edge 1 〇 4 / depending on the force applied by the actuator The amount of elasticity of the selected gasket, the amount of filler that can be filled, and/or the amount of tension on the membrane, and the amount of pressure controlled to grind the edge 1〇4 can be applied. Alternatively or additionally, the film may be under tension within the frame such that the film itself may (eg with or without additional support from the haptics) apply a variable amount of tension to the substrate edge 104 and to the ramie, And to the outer edge 110 and the at least one slope 112, 114. The present invention provides an accurate control of the edge grinding process which complements the different edge geometries and variations in the substrate as the material is removed from the edge ι4. In some embodiments, the frame can support a plurality of polishing heads, each of which is adapted to support the abrasive film. Such abrasive heads support different types of membranes (e.g., different rubble stones>, discs) that are used simultaneously in a predetermined sequence or at different time points. The heads can be placed at different locations and in different orientations (eg, aligned to the edge 104, orthogonal to the edge 104, and at an angle of 1〇4 relative to the edge) to allow the supported membrane to grind the edge of the rotating substrate 1 Q 〇 1 〇4 different parts. The heads are swayed by the frame around or along the edge of the rim 200810881 or moved (eg, all of the reels of the substrate 100 are rotated and/or circumferentially angularly displaced relative to the substrate 100) to sharpen the edges 1〇4 The different portions 'in some embodiments' are such that the heads are oscillated around or along the rotating edge of the substrate 100. ^Each head may include one of the films indicating the reel' and/or being housed in a Replaceable E box. A marking reel can allow an accurate amount of film to be fed to position the unused film for use in the grinding. In some embodiments, two indexing reels can be used to move the film back and forth between the reels.

此外地或替代性地,本發明包括設施,該設施係輸送 流體至正被研磨之基材邊緣〗〇4。在一些實施例中,提供 有一或多個管道,以導引化學物或水至基材邊緣1〇4,以 辅助研磨且/或沖洗掉研磨產生的微粒。化學物可以直接地 被喷灑至基材100上(在基材/研磨膜界面),且/或可以被施 加至或通過膜與/或墊片。流體可以從基材100之一或兩側 被喷麗’並且本發明可以利用地心引力或吸力,以使流體 不會污染或接觸於基材100之其他部分、或本發明設備。 再者’可以經由流體來施加能量(例如超音波能量)至基材 邊緣104,其中該流體係攜帶有這樣的能量。 基材1 0 0可以被旋轉於一水平平面中。基材1 0 〇之邊 緣104可以對齊於或正交於研磨膜、墊片、與/或研磨頭。 在額外的或替代性的實施例中,基材100可以被旋轉於一 垂直平面、其他非水平平面中,且/或被移動於不同的旋轉 平面之間。 在一些實施例中,用來旋轉基材100之驅動器以及用 200810881 來推擠塾片與/或研磨膜抵靠基材邊緣104之致動器係被 一控制器所控制。同樣地,標示捲軸與/或流體管道之操作 也處於控制斋之指示下'控制器係適用以回饋來自驅動 器與/或致動器之訊號,其中該些訊號係分別地指出:(1) 被施加以驅動基材100之能量與/或扭矩的量(例如旋轉一 固持住基材100之真空夾盤);以及/或(2)被施加至致動器 以推擠藝片/研磨膜抵靠基材100之力量的量。這些回饋訊 號被利用以決定已經從基材邊緣被移除之材料的量,其可 以包括是否已經移除了一特定層之材料與/或是否已經達 到了一希望的邊緣剖面。例如,在研磨程序期間旋轉基材 100之扭矩的減少(或耗用在將基材100旋轉的能量)可以 指出基材100與研磨膜與/或墊片之間摩擦的減少。扭矩或 旋轉能量的減少係對應於位在或靠近基材與研磨膜之間接 觸點處從基材邊緣被移除之材料的量,以及/或一特徵邊緣 剖面(例如在基材100邊緣之形狀、彎曲性或平順程度)。 替代性地或此外地,一被設置接觸於基材邊緣之摩擦 感測器可以提供訊號,該訊號係指示出已經從基材1〇〇被 移除之材料的量。 請參照第2圖,其係繪示一邊緣研磨設備200之示意 圖。一框架2〇2係支撐住且繃緊一研磨膜204於一平面中, 該平面係垂直於基材100之主表面1〇2、102,,使得基材 1 00之邊緣1 04可以被壓迫抵靠(例如直向下箭頭2〇5a、 205b所指)研磨膜204,且研磨膜204可以輪廓上相符於基 材邊緣104。如彎曲箭頭2〇5c所指,基材100被旋轉抵靠 10 200810881Additionally or alternatively, the invention includes a facility that delivers fluid to the edge of the substrate being ground. In some embodiments, one or more conduits are provided to direct the chemical or water to the edge 1b of the substrate to aid in grinding and/or rinsing off the particles produced by the milling. The chemical can be sprayed directly onto the substrate 100 (at the substrate/abrasive film interface) and/or can be applied to or through the film and/or gasket. The fluid may be sprayed from one or both sides of the substrate 100 and the present invention may utilize gravity or suction to prevent fluid from contaminating or contacting other portions of the substrate 100, or the apparatus of the present invention. Again, energy (e.g., ultrasonic energy) can be applied via the fluid to the substrate edge 104, wherein the flow system carries such energy. The substrate 100 can be rotated in a horizontal plane. The edge 104 of the substrate 10 can be aligned or orthogonal to the abrasive film, gasket, and/or polishing head. In an additional or alternative embodiment, the substrate 100 can be rotated in a vertical plane, other non-horizontal planes, and/or moved between different planes of rotation. In some embodiments, the actuator used to rotate the substrate 100 and the actuator that pushes the cymbal and/or abrasive film against the substrate edge 104 with 200810881 is controlled by a controller. Similarly, the operation of the marking reel and/or the fluid conduit is also under the direction of control. The controller is adapted to feed back signals from the driver and/or the actuator, wherein the signals are respectively indicated: (1) An amount of energy and/or torque applied to drive the substrate 100 (eg, rotating a vacuum chuck holding the substrate 100); and/or (2) being applied to the actuator to push the art piece/grinding film against The amount of force that depends on the substrate 100. These feedback signals are utilized to determine the amount of material that has been removed from the edge of the substrate, which may include whether a particular layer of material has been removed and/or whether a desired edge profile has been achieved. For example, a reduction in the torque of rotating the substrate 100 during the grinding process (or consumption of energy to rotate the substrate 100) may indicate a reduction in friction between the substrate 100 and the abrasive film and/or gasket. The reduction in torque or rotational energy corresponds to the amount of material removed from the edge of the substrate at or near the point of contact between the substrate and the abrasive film, and/or a feature edge profile (eg, at the edge of the substrate 100) Shape, bendability or smoothness). Alternatively or additionally, a friction sensor disposed in contact with the edge of the substrate can provide a signal indicative of the amount of material that has been removed from the substrate. Referring to Figure 2, there is shown a schematic view of an edge grinding apparatus 200. A frame 2 2 supports and tensions an abrasive film 204 in a plane perpendicular to the major surfaces 1 , 2 , 102 of the substrate 100 such that the edge 10 of the substrate 100 can be pressed The film 204 is abraded against (e.g., as indicated by the straight downward arrows 2〇5a, 205b), and the abrasive film 204 may conform to the substrate edge 104 in a contoured manner. As indicated by the curved arrow 2〇5c, the substrate 100 is rotated against 10 200810881

研磨膜204。基材100被旋轉於例如介於約50至3 00RPM 之速率,雖然可以使用其他速率。基材1 0 0接觸研磨膜2 0 4 約1 5至1 5 〇秒,取決於所使用膜之型式、膜之砂礫、旋轉 速率、所需要的研磨量等等。可以使用更多或更少的時間。 在一些實施例中,研磨膜204被一墊片206所支撲,墊片 206被設置鄰近於研磨膜204之背侧(例如非磨蝕側)且被 裝設在框架202上。如直向上箭頭207所指,框架202(包 括有經編緊研磨膜204)與/或墊片206係被推擠抵靠基材 100之邊緣104。在一些實施例中,基材1〇〇可以被推擠抵 靠研磨膜介於約0·5 lbs至約2.0 lbs力量之量。可以使用 其他力量之量。 此外地或替代性地,研磨膜204之額外的長度可以被 捲軸208、210所支撐且繃緊,其中該捲軸2〇8、21〇被裝 δ又至框架2 0 2。一供應捲轴2 0 8包括未使用的研磨膜2 〇 4, 其可以被捲開且被拉引至鄰近基材1 〇〇之位置;一接取捲 軸可以接收經使用且/或磨損的研磨膜2〇4。捲軸2〇8、21〇 之或兩者可以被標示,以精確地控制被饋送之研磨膜 204的量。研磨膜2〇4可以由許多不同的材料製成,包括 氧化鋁、氧化矽、碳化矽等等。也可以使用其他材料。在 一些實施例中,所使用磨飩粒之尺寸可以介於約〇5微米 至約3微米’雖然可以使用其他尺寸s磨蝕板也可以具有 不同形狀與紋理。可以使用不同寬度之研磨暝2〇4,:於 約1吋至約1·5吋(雖然可以使用其他寬度)。在一或更多 實施例中,研磨膜之厚度可以約〇 〇吋 夕 4王4 0·〇2吋,並 200810881 且在使用塾片206之實施例中可以忍受的v 、、' 1至5 lbs之張 力,且在不使用墊片之實施例中可以忍香$ 〜又約3至8 lbs之 張力。可以使用其他具有不同厚度與強度夕_The film 204 is ground. Substrate 100 is rotated at a rate of, for example, between about 50 and 300 RPM, although other rates may be used. The substrate 100 contacts the abrasive film 2 0 4 for about 15 to 15 seconds, depending on the type of film used, the grit of the film, the rate of rotation, the amount of grinding required, and the like. More or less time can be used. In some embodiments, the abrasive film 204 is swept by a spacer 206 that is disposed adjacent the back side of the abrasive film 204 (e.g., non-abrasive side) and that is mounted on the frame 202. As indicated by the straight upward arrow 207, the frame 202 (including the warp-knitted abrasive film 204) and/or the gasket 206 is pushed against the edge 104 of the substrate 100. In some embodiments, the substrate 1 can be pushed against the abrasive film in an amount from about 0.5 lbs to about 2.0 lbs of force. Other forces can be used. Additionally or alternatively, the additional length of the abrasive film 204 can be supported and tightened by the spools 208, 210, wherein the spools 2, 8, 21 are loaded with δ and the frame 220. A supply spool 208 includes an unused abrasive film 2 〇 4 that can be rolled up and pulled to a position adjacent to the substrate 1 ;; a take-up spool can receive the used and/or worn abrasive Membrane 2〇4. The reels 2, 8, 21 or both can be labeled to precisely control the amount of the abrasive film 204 being fed. The abrasive film 2〇4 can be made of many different materials including alumina, yttria, tantalum carbide, and the like. Other materials can also be used. In some embodiments, the size of the abrasive particles used can range from about 5 microns to about 3 microns. While other sizes can be used, the plates can also have different shapes and textures. Grinding 暝2〇4 of different widths can be used: from about 1 吋 to about 1-5 吋 (although other widths can be used). In one or more embodiments, the thickness of the abrasive film can be about 4 4 4 〇 2 吋, and 200810881 and v, '1 to 5 can be tolerated in the embodiment using the cymbal 206. The tension of the lbs, and in the embodiment where the spacer is not used, can withstand the scent of $ 〜 and about 3 to 8 lbs. Others with different thicknesses and strengths can be used _

厌之膜。捲軸208 V 210之直徑可以約1寸,固持住約500崎夕„ & 丁 <研磨膜204,並 且可以由任何可實施的材料(例如聚胺基甲駿『、聚偏 技 乙晞(poly vinyl difloride,PVDF)等等)來逮 μ y水蠖構。可以使用J:Disgusting film. The reel 208 V 210 may have a diameter of about 1 inch, holding about 500 s of & butyl <grinding film 204, and may be made of any implementable material (e.g., polyamine amide) Poly vinyl difloride, PVDF), etc.) to catch μ y water structure. You can use J:

他材料。框架202可以由任何可實施的材料來建構例^ 銘、不錄鋼等等。 在一些實施例中,可以提供一或多個流體管道212(例 如一喷麗喷嘴或條),以輸送化學物與/或永* 4水U助於基材邊 緣104之研磨/清潔、潤滑基材、且/或沖咮 人#洗掉經移除的材 料。流體管道212係輸送流體至基材100、δ m命时 u 至研磨膜204、 與/或至墊片206。流體可以包括去離子水,甘a * 、入’其用作為潤滑 劑且沖洗掉微粒。也可以包括一界面活性劑與/咬其他已去 的清潔化學物。在一些實施例中,可以使用立油/ 〜巾曰波(例如超音 波)喷嘴,以输送經音波化流體至基材邊緣1Λ4 ιν & 1 υ外以補助清 潔。也可以經由研磨膜204與/或墊片輸送流體至邊緣1〇4。 請參照第3Α與3Β圖,其係分別緣示第2願々m丄 乐2圖之研磨膜 204與墊片206的前視圖與側視圖。需注意的是,力θ (直 箭頭所指)使得研磨膜204與墊片206輪廓符合於且共形於 基材100之邊緣104。在一些實施例中,若不左* 士 卜仔在有基材 100 ’墊片206會具有一平坦表面,該平坦表面即是圖上某 材100 1迫墊片206之處。同樣地,若不存在有基材1〇〇 , 研磨膜204係平坦,且在此兩圖中由一直線所表示。 12 200810881 請參照第4與5圖’其係繪不一邊緣研磨設備4 〇 〇、His materials. The frame 202 can be constructed of any material that can be implemented, without recording steel, and the like. In some embodiments, one or more fluid conduits 212 (eg, a spray nozzle or strip) may be provided to transport chemicals and/or permanent water to aid in the grinding/cleaning of the substrate edge 104, the lubrication base. Material, and / or rushing people # wash off the removed material. Fluid conduit 212 delivers fluid to substrate 100, δ m lifetime u to abrasive film 204, and/or to gasket 206. The fluid may include deionized water, which is used as a lubricant and rinses off the particles. It may also include a surfactant and/or other cleaning chemicals that have been removed. In some embodiments, a vertical oil/~ towel chopper (e.g., ultrasonic) nozzle may be used to deliver the sonicated fluid to the edge of the substrate at a level of 1 Λ ιν & 1 补助 to aid in cleaning. Fluid can also be delivered to the edge 1〇4 via the abrasive film 204 and/or the gasket. Please refer to the third and third figures, which are front and side views, respectively, of the polishing film 204 and the spacer 206 of the second wish. It should be noted that the force θ (indicated by the straight arrow) causes the abrasive film 204 and the shim 206 to conform to and conform to the edge 104 of the substrate 100. In some embodiments, if there is a flat surface on the substrate 100' spacer 206, the flat surface is where the material 100 1 is forced to the spacer 206. Similarly, if the substrate 1 is not present, the abrasive film 204 is flat and is indicated by a straight line in the two figures. 12 200810881 Please refer to Figures 4 and 5 for the different edge grinding equipment 4 〇 〇,

5 00之兩個額外的替代性實施例。如第4圖所示,一示範 性邊緣研磨設備400包括一基座或框架402,基座或框架 4 〇 2包括一支撐住研磨膜2 0 4之頭4 0 4,研磨膜2 0 4被繃緊 在捲軸2 0 8、2 1 0之間且更被一墊片2 0 6戶斤支標住。如圖所 示,墊片206經由一偏壓元件406(例如彈簧)被裝設至頭 404。第4圖之邊緣研磨設備也包括一或更多驅動滾輪 408(圖上顯示兩個)與導引滾輪41 〇(圖上顯示兩個),導引 滚輪410適用以旋轉基材100之邊緣1〇4抵靠研磨膜204。 每一驅動滚輪408係被驅動器412(例如馬達、齒輪、皮帶、 鏈條)所驅動。 驅動滚輪408與導引滾輪41 〇包括一溝槽,溝槽使得 滾輪408、410單獨地支撐住基材1〇〇。在一些實施例中, 驅動滾輪408中之溝槽具有約2.5吋的直徑,且導引滚輪 41〇中之溝槽具有約1吋的直徑。也可以使用其他尺寸。 驅動滚輪408接觸於基材1〇0之區塊係包括紋理化或相錯 溝槽,以使得驅動滚輪408抓持住基材1〇〇。驅動滚輪4〇8 與導引滾輪41〇可以由譬如聚胺基甲酸_、聚偏二氟乙烯 (Polyvinyl difl〇ride,PVDF)等等之材料來建構。也可以使 用其他材料。 .· /_'.· ' . ... . / 如第5圖所示,另一個示範性邊緣研磨設備5〇〇包括 基座或框架502 ’基座或框架502包括〜支撐住研磨膜 204之頭5〇4 ’其中該研磨膜2〇4被編緊在捲軸2〇8、HO <間且更被墊片2〇6所支撐住。如倒所示,墊片2〇6可以 13 200810881Two additional alternative embodiments of 00. As shown in FIG. 4, an exemplary edge grinding apparatus 400 includes a base or frame 402, and the base or frame 4 包括 2 includes a head 404 that supports the polishing film 220, and the polishing film 205 is Tightened between the reels 2 0 8 and 2 1 0 and further marked by a spacer of 2 0 6 kg. As shown, the spacer 206 is mounted to the head 404 via a biasing member 406 (e.g., a spring). The edge grinding apparatus of FIG. 4 also includes one or more drive rollers 408 (two shown) and guide rollers 41 〇 (two shown), and the guide roller 410 is adapted to rotate the edge of the substrate 100. The crucible 4 abuts against the abrasive film 204. Each drive roller 408 is driven by a driver 412 (eg, a motor, gear, belt, chain). The drive roller 408 and the guide roller 41 〇 include a groove such that the rollers 408, 410 individually support the substrate 1 〇〇. In some embodiments, the grooves in the drive roller 408 have a diameter of about 2.5 inches, and the grooves in the guide rollers 41 have a diameter of about 1 inch. Other sizes can also be used. The block in which the drive roller 408 is in contact with the substrate 1〇 includes a textured or phase-shifted groove such that the drive roller 408 grips the substrate 1〇〇. The driving roller 4〇8 and the guiding roller 41〇 may be constructed of materials such as polyaminocarbamate, polyvinylidene difluoride (PVDF), and the like. Other materials can also be used. . . /_'.. ' . . . / / As shown in Fig. 5, another exemplary edge grinding apparatus 5 includes a base or frame 502 'the base or frame 502 includes ~ to support the abrasive film 204 The head 5〇4' is in which the abrasive film 2〇4 is knitted between the reels 2〇8, HO < and more supported by the spacers 2〇6. As shown, the gasket 2〇6 can be 13 200810881

經.由一致動器506(例如一氣動滑件、液壓缒、祠服馬達驅 動推進务專等)被裝設至頭504。第5爵之邊緣研磨設備500 也可以包括一真空夾盤5 〇 8,真空夾盤5 0 8耦接至一驅動 器510(例如馬達、齒輪、皮帶、鏈條等等)。第5圖綠示 之實施例的優點在於,設備500不需要接觸於正被研磨之 邊緣。疋以’可以免除微粒累積在驅動滚輪上且再沉積在 邊緣104上之潛在性。也不需要清潔滚輪。再者,也可以 免除滾輪損壞或到傷邊緣之可能性。藉由將基材固持於中 空夾盤中,可以達到高速旋轉而不震動。 參照第6圖至第8B圖,其係緣示第4與5圖之示範 性實施例的細部結構特徵。需注意的是,不同實施例之特 徵能夠以許多不同的實際方式結合,以應用在不同的設計 原理或考量中。 第6圖係繪示第5圖之框架502(包括頭504)之細部結 構。如前所述,頭504支撐住研磨膜204,其中該研磨膜 204被繃緊在捲軸208、21〇之間。輕架5〇2(包括頭5〇4) 係被一驅動器600(例如飼服馬達)與樞紐602角度上轉移 (相對於相切於基材邊緣104之軸,其中該基材1〇〇被固持 在邊緣研磨設備500中(第5圖))。框架(與研磨膜2〇4)之 角度轉移將在下文參照第9A圖至第10C圖更詳細地被描 述。 此外,被裝設至頭504之捲軸208、210可以被一或多 個驅動器604(例如伺服馬達)所驅動。驅動器 604可以提 供一標示能力以使得未使用研磨膜204之一特定量被行進 14 200810881 或持續地被饋送至基材邊緣,以及一繃緊能力以使得研磨 膜被拉緊地伸張且施加壓力至基材邊緣。 如第6圖所詳細地顯示(相對於第5圖),選擇性墊片 206可以經由一致動器506被裝設至頭504,其中該致動器 506係可調整地«迫研磨膜204或將研磨膜204輪廓符合 抵靠基材邊緣104(第5圖)。再者,一或多個支撐滾輪6〇6 也可以被裝設至頭504,以導引且對齊研磨膜2〇4於一垂 直於基材100之主要表面1 〇2(第1圖)之平面,其中該基 材1 00被固持在邊緣研磨設備50〇中(第5圖)。 需注意的是,第5與6圖所繪示之實施例中,研磨膜 204之長度被設置成正交於正被研磨之基材1〇〇之邊緣 1 04。這係與第2圖之實施例形成對比,在第2圖中研磨膜 2 04之縱向方向係對齊於正被研磨之基材1〇〇之邊緣1〇4。 也可以使用其他研磨膜配向與組態。例如,研磨膜204可 以被固捧成對角線地相對於基材1〇〇之主要表面1〇2。 參照第7A與7B圖,其係繪示可更換之匣盒7〇〇a、 700B之兩個不同實施例的立體圖。匣盒7〇〇a、7〇〇b像以 可丟棄、可再填充、與/或可更換之套件來提供頭4〇4與研 磨膜204之特徵,該套件可以快速地且容易地被裝設至且/ 或移除自不同邊緣研磨設備400、500之框架402、502。 如第7A圖所示,匣盒700A包括頭404,頭404係支 撐住&跨供應捲轴2 0 8至接取捲轴2 1 〇之研磨膜2 0 4。研 磨膜204可以被支撐滚輪606所導引且對齊,其中該些支 撐滾輪606係被裝設至頭404。可以提供一墊片2〇6,以進 15 200810881 一步地支撐研磨膜204,如前所述。又如前所述,可以利 用一偏壓元件4 0 6 (例如彈簧)以裝設墊片2 0 6至頭4 0 4,而 提供彈性的/動態的反壓力至墊片206。替代性地或此外 地,可以使用一可調整的致動器506(第6圖),以推擠墊 片206抵菲研磨膜204 ’或推擠整個頭404朝向基材1 〇〇。The head 504 is mounted by an actuator 506 (e.g., a pneumatic slider, a hydraulic ram, a servo motor drive, etc.). The 5th edge edge grinding apparatus 500 can also include a vacuum chuck 5 〇 8 and a vacuum chuck 508 coupled to a driver 510 (e.g., motor, gear, belt, chain, etc.). An advantage of the embodiment shown in Fig. 5 is that the device 500 does not need to be in contact with the edge being ground.疋 ’ can eliminate the potential for particles to accumulate on the drive roller and redeposit on the edge 104. There is also no need to clean the rollers. Furthermore, it is also possible to eliminate the possibility of damage to the roller or to the edge of the injury. By holding the substrate in the hollow chuck, high speed rotation can be achieved without vibration. Referring to Figures 6 through 8B, the rims show the detailed structural features of the exemplary embodiments of Figures 4 and 5. It should be noted that the features of the different embodiments can be combined in many different practical ways to be applied to different design principles or considerations. Figure 6 is a diagram showing the detailed structure of the frame 502 (including the head 504) of Figure 5. As previously mentioned, the head 504 supports the abrasive film 204, wherein the abrasive film 204 is stretched between the spools 208, 21A. The light frame 5〇2 (including the head 5〇4) is angularly transferred from the hub 600 by a driver 600 (e.g., a feeding motor) (relative to the axis tangent to the edge 104 of the substrate, wherein the substrate is It is held in the edge grinding apparatus 500 (Fig. 5)). The angular transfer of the frame (with the abrasive film 2〇4) will be described in more detail below with reference to Figures 9A through 10C. Additionally, the spools 208, 210 that are mounted to the head 504 can be driven by one or more drivers 604 (e.g., servo motors). The driver 604 can provide an indication capability such that a particular amount of unused abrasive film 204 is advanced 14 200810881 or continuously fed to the edge of the substrate, and a tightening capability to cause the abrasive film to be stretched and pressure applied to The edge of the substrate. As shown in detail in FIG. 6 (relative to FIG. 5), the selective spacer 206 can be mounted to the head 504 via an actuator 506, wherein the actuator 506 is adjustably «forces the abrasive film 204 or The contour of the abrasive film 204 is conformed to the edge of the substrate 104 (Fig. 5). Furthermore, one or more support rollers 6〇6 may also be mounted to the head 504 to guide and align the abrasive film 2〇4 to a major surface 1〇2 (Fig. 1) perpendicular to the substrate 100. A plane in which the substrate 100 is held in the edge grinding apparatus 50 (Fig. 5). It is to be noted that in the embodiment illustrated in Figures 5 and 6, the length of the abrasive film 204 is set to be orthogonal to the edge 1 04 of the substrate 1 being ground. This is in contrast to the embodiment of Fig. 2, in which the longitudinal direction of the abrasive film 404 is aligned with the edge 1〇4 of the substrate 1 being ground. Other abrasive film alignments and configurations can also be used. For example, the abrasive film 204 can be held diagonally relative to the major surface 1〇2 of the substrate 1〇〇. Referring to Figures 7A and 7B, there are shown perspective views of two different embodiments of replaceable cassettes 7a, 700B. The cassettes 7〇〇a, 7〇〇b provide features of the head 4〇4 and the abrasive film 204 in a disposable, refillable, and/or replaceable kit that can be quickly and easily loaded The frames 402, 502 from the different edge grinding devices 400, 500 are provided to and/or removed. As shown in Fig. 7A, the cassette 700A includes a head 404 which supports the abrasive film 2 0 4 across the supply spool 2 0 8 to the take-up spool 2 1 . The abrasive film 204 can be guided and aligned by the support rollers 606, which are attached to the head 404. A spacer 2〇6 can be provided to support the abrasive film 204 in one step, as previously described. As previously mentioned, a biasing element 406 (e.g., a spring) can be utilized to provide the spacers 206 to 4404 to provide an elastic/dynamic back pressure to the spacer 206. Alternatively or in addition, an adjustable actuator 506 (Fig. 6) may be used to push the pad 206 against the squeegee film 204' or push the entire head 404 toward the substrate 1'.

在又另一替代性實施例中,如第7B圖所示,不使用 墊片206,頭404可以僅藉由研磨膜204之張力而提供橫 向Μ力至基材邊緣1 〇4(弟1圖)。在一些實施例中,頭404 可以包括一刻槽702,如第7Β圖所示,以容納基材j 〇〇。 參照第8Α與8Β圖,其係繪示墊片206Α、206Β之兩 個不同的替代性實施例。除了墊片2〇6(其在基材不存在時 具有與研磨臈204共平面之平坦表面(第6圖))之外,墊片 206Α可以具有輪廓上相符於基材1〇〇邊緣1〇4之凹面。或 者,如第8Β圖所示,墊片206Β可以具有雙凹面以更佳地 輪廓上相符於基材i 00之邊緣、〇4、在又其代性實施 地輪廓上相符於基材1〇〇之邊緣104(包括斜面ii2、ii4 , 及外緣110(第1圖))。In still another alternative embodiment, as shown in FIG. 7B, without the spacer 206, the head 404 can provide lateral force to the edge of the substrate by only the tension of the abrasive film 204. ). In some embodiments, the head 404 can include a notch 702, as shown in FIG. 7 to accommodate the substrate j 〇〇. Referring to Figures 8 and 8, there are shown two different alternative embodiments of the spacers 206A, 206A. In addition to the spacer 2〇6 (which has a flat surface coplanar with the polishing crucible 204 when the substrate is absent (Fig. 6)), the spacer 206Α may have a contour conforming to the edge of the substrate 1〇. 4 concave. Alternatively, as shown in FIG. 8 , the spacer 206 Β may have a double concave surface to better conform to the edge of the substrate i 00 , 〇 4 , and conformally conform to the substrate 1 又 in a contoured manner. The edge 104 (including the slopes ii2, ii4, and the outer edge 110 (Fig. 1)).

Uupont Corporation 所製诰夕、,•命 之 Delrin )、PVDF、聚胺Uupont Corporation's eve, Delrin, PVDF, polyamine

酸酯密閉室發泡體、矽橡膠 u L 田甘^ 像勝專專之材料所製成。也可 用"、他材料。這樣的材料可 u ^ ^ 具有彈性,或一種爲執 度或密度之函數的共形能力。”、、墊 摞,欞认 。此材料可以根據其彈性 擇,弹性可以接著根據需要的饥 要的研磨型式來選擇。 16 200810881The acid ester sealed chamber foam, 矽 rubber u L Tian Gan ^ is made of materials specializing in winning. You can also use ", his material. Such materials can be u ^ ^ elastic, or a conformal capability that is a function of persistence or density. ”, 垫 摞, 棂 . This material can be chosen according to its elasticity, and the elasticity can then be selected according to the hungry grinding pattern needed. 16 200810881

在二貝施例中’墊片206、206A、206B具有共形於 基材邊緣之能力的可調整量。例如,墊片206、206A、206B 可以為或包括可填充嚢袋,墊片可以藉由增加更多的空 氣或液體或’、他",L體而變得更硬,且墊片可以經由減少囊 衣中工氣或液體或其他流體而變得更共形。第8C圖係繪 不包s可填充囊袋8〇2之墊片2〇6C之實綠例,其中該可 填充囊袋802可以將來自一流體供應源8〇6之流體經由一 ⑽體s道804來填充(與/或排空在一些實施例中,流體 供應源806可以在操作者之指示下或一程式化的與/或使 用者操作的控制器之指示下,將囊袋8〇2填充/浪漏。在這 樣的具施例中’一彈性材料(例如石夕橡膠等等)可以被用於 囊袋802,以進一步地增強囊袋伸張且共形於基材邊緣1〇4 之能力。這樣的實施例可以允許操作者/控制者精確地控制 研磨膜204接觸於基材1〇〇時超過斜面U2、1 14(若全部) 多遠且進入排除區域1〇8與/或1〇8,多遠(第^圖),例如藉 由限制被卿筒抽吸進入囊袋802之流體的量。例如,在基 材外緣110被置放成抵靠具有汽漏囊袋8〇2之塾片2〇6c 時,囊袋802係被填充而使得塾片2〇6c被迫繼繞且共形 於基材100之外緣110與斜面112、114,而不會纏繞基材 100之元件區域106、106,。需得注意的是,在一些實施例 中,塾片中可以使用多個囊袋,且在不同形狀之塾片206、 206A、206B中可以使用不同形狀之可填充囊袋。 在一些實施例中,用以輔助研磨之流體可以經由塾片 206、206A、206B被輸送至基材邊緣。可以提供一流體管 17 200810881 道以滴下或喷灑流體至墊片上或進入墊片。替代性地,可 填充墊片係可以包括具有一半滲透性薄膜之囊袋,其中該 半透性薄膜係允命流體可以缓慢地被釋放且被傳送至研磨 膜204(例如經由墊片)。在這樣的實施例中,墊片2〇6、 206A、206B可以被會吸收且/或置留使用的流體〈例如聚乙 烯醇(polyvinyl alcohol·,PVA)等等)之材料所覆蓋住、所製 成,與/或包括該材料。In the second embodiment, the spacers 206, 206A, 206B have an adjustable amount of ability to conform to the edge of the substrate. For example, the spacers 206, 206A, 206B can be or include a fillable pocket that can be made stiffer by adding more air or liquid or ', he', L-shaped, and the gasket can be Reduces the work fluid or liquid or other fluid in the garment to become more conformal. Figure 8C depicts a green example of a gasket 2 〇 6C that can be filled with a pocket 8 〇 2, wherein the fillable pocket 802 can fluid from a fluid supply source 8 经由 6 via a (10) body s The fill 804 is filled (and/or emptied). In some embodiments, the fluid supply source 806 can be slid under the direction of the operator or under the direction of a stylized and/or user operated controller. 2 filling/wave leakage. In such an embodiment, an elastic material (such as Shishi rubber, etc.) can be used for the pouch 802 to further enhance the pouch stretch and conformal to the edge of the substrate 1〇4 The ability of such an embodiment may allow the operator/controller to precisely control how far the abrasive film 204 is in contact with the substrate 1 超过 over the slopes U2, 146 (if all) and into the exclusion zone 1 〇 8 and/or 1 〇 8, how far (Fig. 2), for example, by limiting the amount of fluid that is drawn into the bladder 802 by the cartridge. For example, the outer edge 110 of the substrate is placed against the pocket having the vapor leak pocket 8 When the 塾 2 〇 2 〇 6c, the capsular bag 802 is filled so that the cymbal 2 〇 6c is forced to follow and conform to the outer edge 110 and oblique of the substrate 100 112, 114, without wrapping the component regions 106, 106 of the substrate 100. It should be noted that in some embodiments, a plurality of pockets may be used in the septum, and the sepals 206 of different shapes, Different shapes of fillable pouches can be used in 206A, 206B. In some embodiments, fluid to aid in grinding can be delivered to the edge of the substrate via the crotch panels 206, 206A, 206B. A fluid tube 17 can be provided. To drip or spray fluid onto the gasket or into the gasket. Alternatively, the fillable gasket may comprise a bladder having a semi-permeable membrane, wherein the semipermeable membrane allows the fluid to be slowly released And being transferred to the abrasive film 204 (eg, via a gasket). In such an embodiment, the gaskets 2〇6, 206A, 206B can be absorbed and/or retained for use (eg, polyvinyl alcohol (polyvinyl alcohol) •, PVA), etc.) are covered, made, and/or included with the material.

第9A-9C圖與第10A-10C圖係分別繪示替代性的邊緣 研磨設備400、500的不同可能頭位置。本發明係適用以使 研磨膜2 0 4接觸於基材1 〇 〇之斜面丨丨2、〗丨4與外緣丨! 〇, 而不會接觸到基材100之元件區域1〇6。在操作時,這可 以藉由將頭404、504繞著一軸來角度地轉移而達到(且因 而一部分之研磨膜接觸於且輪廓上相符於基材1〇〇之邊緣 104),其中該軸係相切於被旋轉的基材1〇〇的外緣丨1〇。 參照第9A-9C圖與第10A_1〇c圖,此角度轉移之軸係由垂 直延伸出圖上紙面標示為r p」之一線來表示。頭4〇4、5〇4 可以被保持在不同位置,以當基材1〇〇被旋轉時能约清潔 基材邊緣104之所希望部分。在一些實施例中,頭4〇4、 5 04係適用以挎續地或間歇地在所繪示的不同位置與/或其 他位置之間震盤。頭404、504可以在程式化的或使用者操 作的控制器的指示下藉由驅動器600(第6圖)而被移動於 框架502上。替代性地,頭4〇4、5〇4可以被固定住,與/ 或僅在基材沒有被旋轉時被調整。在又其他實施例中,基 材可以被保持固定,而頭係被震盤(如前所述)且繞著基材 18 200810881 100被圓周地旋轉。再者,研磨膜204能夠以持續迴圈方 式被裝設在頭404、504上,且/或研磨膜204可以被持巧 地(或間歇地)向前饋送以研磨基材邊緣104與/或増加對於 基#邊緣1 04的研磨效應。例如,膜之行進能夠用以建立 或加強研磨運動。在一些實施例中,膜2〇4可以被來回地 震靈,以研磨與/或加強對於靜止或旋轉的基材的研磨致 應。在一些實施例中,膜2〇4在研磨期間可以被保持靜止。 再者,膜204張力與/或力量207(第2圖)可以依據各種因 素被改變’其中該些因素係例如包括研磨膜204之角戶與/ 或位置、研磨時間、基材中所使用材料、正被研磨之層\ 被移除之材料的量、基材正被旋轉的速度、驅動器旋轉基 材之電流量等等。可以利用任何上述可以實施之研磨運動 與/或方法的組合。這些方法對於邊緣研磨製程提供了額外 的控制,當膜204繞著或相對於邊緣1〇4被旋轉/移動時, 其能用來補足幾何結構與正被移除之材料的變化。 參照第11 -1 2圖,其係繪示一邊緣研磨設備之額外實 施例。第11圖係繪示包括有三個頭404之邊緣研磨設備 1100,第12圖係繪示包括有兩個頭5〇4之邊緣研磨設備 1200 ’且第13圖係繪示包括有四個頭13〇4之邊緣研磨設 備1 300。如圖所示,任何數目與型式之頭4〇4、5〇4、13〇4 可以被用在任何可實施的組合中。此外,在這樣的多頭實 施例中,每一頭404、5σ4、1304可以使用不 的研磨膜2〇4(例如不同砂礫、材料、張力、壓力等等 任何數目之頭404、504、1304可以同時地、個別地與/或 19 200810881 依序地被使用。不同的頭404、504、1 304可以被用在不同 w的基材100,或不同型式的基材。例如,具有一剛硬偏壓 元件406以支撐住一塾片2〇6(例如内凹塾片2〇6B)與一粗 糙砂礫研磨膜204之第一頭4〇4可以起初地被用來從基材 斜面112、114(第1圖)移除栢當大量的粗糙材料。第一頭 4 04可以適當地被設置,以接近斜面112、114。在以第一 頭404清潔完成之後,第一頭4〇4係從基材1〇〇退回,且 馨 具有一精細砂礫研磨膜204(且不具有一墊片)之第二頭 5 04可以被移動至定位以研磨斜面112、114與外緣11〇。 在清潔了 一或多個基材1〇〇之後,用於這樣清潔的研 磨膜204的部分會磨損。因此,接取捲軸21〇(第4圖)可 以被驅動以從供應捲軸2〇8朝著接取捲軸21〇拉引研磨膜 204 —固疋置。依此方式,研磨膜2〇4之未使用部分可以 被提供於介於接取捲軸21〇與供應捲軸2〇8之間。研磨膜 204之未使用部分能夠以類似前述方式被利用來接續地清 潔一或多個其他基材1〇〇。所以,設備11〇〇、可以將 • 研磨膜204之磨損部分更換成未使甩部分,而對於基材處 - 理產此有少許或不具有衝擊。同樣地,當匣盒7〇〇a中所 有的研磨膜204被使用時,若利用了可更換的臣盒7〇〇a, 對於產能之衝擊可以籍由迅逮地更換匣盒7〇〇八雨被最小 化0 有關於第13圖之邊緣研磨設備13〇0的示範性實施 例,其係输示出一支撐有多個頭丨3 〇 4之框架13〇2。每一 頭1304被裝設至框架13〇2,且每一頭13〇4包括有一致動 20 200810881 :.. ,. . - . . . ' . 器1306(例如氣動活塞、祠服驅動滑件、液壓鎚等等),其 中該致動裔1 3 0 6係回應於來自控制器1 3 0 8 (例如一程式化 電腦、一操作者指引之闊件系統、一内嵌之即時處理器等 等)之一控制訊號而適用以壓迫塾片206與研磨膜204之長 度抵靠基材邊緣1 〇 4。需得注意的是,控制器1 3 0 8耦接至 (例如電性地、檄械地、氣動地、液壓地等等)每一致動器 1306。Figures 9A-9C and 10A-10C illustrate different possible head positions of the alternative edge grinding apparatus 400, 500, respectively. The present invention is applied so that the abrasive film 204 is in contact with the bevel 丨丨2, 丨4 and the outer edge of the substrate 1 丨 丨! 〇, without touching the component area 1〇6 of the substrate 100. In operation, this can be achieved by angularly transferring the heads 404, 504 about an axis (and thus a portion of the abrasive film is in contact with and contoured to conform to the edge 104 of the substrate 1), wherein the shafting It is tangent to the outer edge 丨1〇 of the substrate 1 that is rotated. Referring to Figures 9A-9C and 10A_1〇c, the axis of the angular transition is represented by a line extending vertically from the surface of the drawing labeled r p". The heads 4, 4, 5, 4 can be held in different positions to clean about the desired portion of the substrate edge 104 as the substrate 1 is rotated. In some embodiments, the heads 4, 4, 504 are adapted to be slammed between successively or intermittently at different locations and/or other locations as depicted. The headers 404, 504 can be moved to the frame 502 by the driver 600 (Fig. 6) under the direction of a programmed or user operated controller. Alternatively, the heads 4〇4, 5〇4 can be fixed and/or adjusted only when the substrate is not being rotated. In still other embodiments, the substrate can be held stationary while the headgear is circumferentially rotated by the shock disk (as previously described) and around the substrate 18 200810881 100. Furthermore, the abrasive film 204 can be mounted on the heads 404, 504 in a continuous loop, and/or the abrasive film 204 can be fed forward (or intermittently) forward to grind the substrate edge 104 and/or Add the grinding effect on the base #Edge 1 04. For example, the travel of the film can be used to establish or enhance the grinding motion. In some embodiments, the membrane 2〇4 can be reciprocated to grind and/or reinforce the abrasive response to a stationary or rotating substrate. In some embodiments, film 2〇4 can be held stationary during grinding. Furthermore, the film 204 tension and/or force 207 (Fig. 2) can be varied depending on various factors, such as including the angle and/or position of the abrasive film 204, the grinding time, and the materials used in the substrate. , the layer being grounded \ the amount of material being removed, the speed at which the substrate is being rotated, the amount of current that the substrate is rotating the substrate, and so on. Any combination of the above-described grinding motions and/or methods that can be implemented can be utilized. These methods provide additional control over the edge grinding process that can be used to complement the geometry and the material being removed as the film 204 is rotated/moved about or relative to the edge 1〇4. Referring to Figures 11-12, an additional embodiment of an edge grinding apparatus is illustrated. 11 is an edge grinding apparatus 1100 including three heads 404, 12 is an edge grinding apparatus 1200' including two heads 5〇4, and FIG. 13 is a diagram including four heads 13〇4 Edge grinding apparatus 1 300. As shown, any number and type of heads 4〇4, 5〇4, 13〇4 can be used in any implementable combination. Moreover, in such a multi-head embodiment, each of the heads 404, 5σ4, 1304 can use no abrasive film 2〇4 (eg, different numbers of heads 404, 504, 1304 of different grit, material, tension, pressure, etc. can simultaneously Individually and/or 19 200810881 are used sequentially. Different heads 404, 504, 1 304 can be used on different w substrates 100, or different types of substrates. For example, having a rigid biasing element The first head 4 〇 4 of the 406 to support a cymbal 2 〇 6 (eg, the concave cymbal 2 〇 6B) and a rough grit abrasive film 204 may be initially used to slant from the substrate 112, 114 (1st Figure) Removing a large amount of rough material from the cypress. The first head 04 04 can be suitably positioned to approximate the slopes 112, 114. After cleaning with the first head 404, the first head 4 〇 4 is from the substrate 1 The second head 504 having a fine grit abrasive film 204 (and having no spacer) can be moved to position to grind the bevels 112, 114 and the outer edge 11〇. After the substrate is 1 ,, the portion of the abrasive film 204 used for such cleaning is worn. Therefore, The take-up spool 21 (Fig. 4) can be driven to pull the abrasive film 204 from the supply spool 2〇8 toward the take-up spool 21. In this manner, the unused portion of the abrasive film 2〇4 can be Provided between the take-up reel 21 〇 and the supply reel 2 〇 8. The unused portion of the abrasive film 204 can be utilized in a manner similar to that described above to successively clean one or more other substrates 1 〇〇. The device 11 can replace the worn portion of the abrasive film 204 with the untwisted portion, with little or no impact on the substrate - as in the case of the cartridge 7〇〇a. When the abrasive film 204 is used, if the replaceable box 7〇〇a is used, the impact on the capacity can be replaced by the snap box. The rain is minimized. 0 About the edge grinding of Fig. 13 An exemplary embodiment of the device 13A0, which is shown as a frame 13〇2 supporting a plurality of heads 3〇4. Each head 1304 is mounted to the frame 13〇2, and each head 13〇4 includes Alignment 20 200810881 :.. , . . - . . . ' . . . 1306 (eg pneumatic piston, 驱动 drive drive slip , hydraulic hammer, etc.), wherein the activist 1 3 0 6 is in response to the controller 1 3 0 8 (eg a stylized computer, an operator-guided wide-range system, an embedded instant processor, etc.) And one of the control signals is adapted to press the length of the diaphragm 206 and the abrasive film 204 against the edge of the substrate 1 〇 4. It is noted that the controller 1 3 0 8 is coupled to (eg, electrically, 檄Each of the actuators 1306 is mechanically, pneumatically, hydraulically, and the like.

此外,一流體供應源806可以耦接至控制器1 308,且 處於控制器1 308的控制之下。流體供應源806可以被控制 以經由一或多個流體管道2 1 2獨立地輸送流體(例如去離 子水、清潔化學物、音波化流體、氣體、空氣等等)至每一 頭1304。在控制器13〇8之指引下,各種流體可以經由該 些流體管道212選擇性地被輸送至墊片206、研磨膜204、 與/或基材邊緣1〇4。流體可以用在研磨、潤滑、微粒移除 /潤濕、與/或將墊片206内之囊袋8〇2(第8C圖)填充。例 如,在一些實施例中,經由一可滲透墊片2〇6输送之相同 的流體能夠被用以研磨墊片206且將墊片206填充,而一 / . . . - \ , - 經由第二管道(未示出)輸送至同一頭 1 304之不同的流體 係被用來潤濕與研磨。 請參照第14圖,其係繪示類似於第2圖邊緣研磨設備 2〇〇之一本發明實施例。如同第2圖之實施例,一框架202 係支撐住且端緊一研磨膜204於一平面中,談平面係垂直 於基材100之主表面jOr、」〇2,(第1圖),使得基材100 之邊緣104可以被壓迫抵靠(例如直向下箭頭2〇5a、205b 21 200810881Additionally, a fluid supply source 806 can be coupled to controller 1 308 and under the control of controller 1 308. Fluid supply source 806 can be controlled to independently deliver fluid (e.g., deionized water, cleaning chemistry, sonicating fluid, gas, air, etc.) to each head 1304 via one or more fluid conduits 2 1 2 . Under the direction of the controller 13A8, various fluids may be selectively delivered to the gasket 206, the abrasive film 204, and/or the substrate edge 1〇4 via the fluid conduits 212. The fluid can be used to grind, lubricate, particulate remove/wet, and/or fill the bladder 8〇2 (Fig. 8C) in the gasket 206. For example, in some embodiments, the same fluid delivered via a permeable gasket 2〇6 can be used to grind the shim 206 and fill the shim 206, while a / . . . - \ , - via the second Different flow systems that are piped (not shown) to the same head 1 304 are used for wetting and grinding. Referring to Figure 14, there is shown an embodiment of the invention similar to the edge grinding apparatus 2 of Figure 2. As in the embodiment of Fig. 2, a frame 202 supports and terminates an abrasive film 204 in a plane perpendicular to the major surfaces jOr, 〇2 (Fig. 1) of the substrate 100, such that The edge 104 of the substrate 100 can be pressed against (for example, a straight downward arrow 2〇5a, 205b 21 200810881

所指)研磨膜204,且研磨膜204可以輪廓上相符於基材邊 緣104。如彎曲箭頭205c所指,基材100被旋轉抵靠研磨 膜204。研磨膜204被一塾片206所支撐,墊片206被設 置鄰近於研磨膜204之背侧且被裝設在框架202上。如直 向上箭頭207所指,框架202(包括有經端緊研磨膜204) 與/或墊片206係被推擠抵靠基材1〇〇之邊緣1〇4。研磨膜 2〇4被捲軸208、21〇所支撐且繃緊,其中該捲軸2〇8、21〇The film 204 is ground and the abrasive film 204 can conform to the substrate edge 104 in a contoured manner. The substrate 100 is rotated against the abrasive film 204 as indicated by the curved arrow 205c. The abrasive film 204 is supported by a die 206 which is disposed adjacent to the back side of the abrasive film 204 and which is mounted on the frame 202. As indicated by the up arrow 207, the frame 202 (including the end-to-end abrasive film 204) and/or the gasket 206 is pushed against the edge 1〇4 of the substrate 1〇〇. The abrasive film 2〇4 is supported and tightened by the reels 208, 21〇, wherein the reels 2〇8, 21〇

被裝設至框架202。一供應捲軸208包括未使用的研磨膜 204 ’其可以被捲開且被拉引至鄰近基材1〇〇之位置;一接 取捲軸可以揍收經使用且/或磨損的研磨膜2〇4。捲軸 208、210之一或兩者可以被標示,以精確地控制被饋送之 研磨膜204的量。可以提供一或多個流體管道212,以輸 送化學物與/或水以助於基材邊緣1〇4之研磨/清潔、潤滑 基材且/或冲洗掉經移除的材料。流體管道212係輸送流 體至基材loo、至研磨膜2〇4、與/或至塾片Μ6' 第14圖更包括一控制器13〇8(例如一軟體驅動電腦、 一程式化處理器、一蘭搞陆 閘極陣列、—邏輯電路等等),控制器 1 3 0 8係適用以指引驅叙哭」。 A驅動益1402之操作,其中驅動器1402 係用來旋轉基材1〇〇。嗯叙 ^ 驅動兔1402可以例如為一馬達,以 旋轉真空失盤、驅動滾給黧望 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 1 勁哀輸等專。控制器1 308係經由一訊號 線1 404傳送或輪出一控击丨斑 ®徑制與/或功專訊號至驅動器1402。 再者,控制器1 308可用以妞山 Ί由一或多個訊號線1406接收 來自驅動器1402夕一十厂加 ’夕個回饋或資訊訊號。如前所述, 來自驅動态1 4 0 2之回饋人 謂A貝訊訊號可以提供各種有關於 22 200810881 驅動器1402、邊緣研磨設備202與/或基材1 〇〇之狀態的 指示。例如’驅動盜1 402之旋轉速度可以由指示出驅動器 14 02内一馬達電流量之訊號來決定。替代性地,驅動器 1 4 0 2内之一感測器(未示出)可以被用來產生一訊號,該訊 號係指示出當固持住基材1〇0之平台(例如真空夾盤)被驅 動器1402旋轉時平台之扭矩、與/或被驅動器1402所施加 以經由平台來旋轉基材100之能量。It is mounted to the frame 202. A supply spool 208 includes an unused abrasive film 204' which can be unwound and drawn to a position adjacent to the substrate 1; a take-up spool can pick up the used and/or worn abrasive film 2〇4 . One or both of the spools 208, 210 can be labeled to precisely control the amount of abrasive film 204 being fed. One or more fluid conduits 212 may be provided to transport chemicals and/or water to aid in the grinding/cleaning of the substrate edges 1〇4, to lubricate the substrate, and/or to rinse away the removed material. The fluid conduit 212 transports fluid to the substrate loo, to the abrasive film 2〇4, and/or to the cymbal Μ6'. Figure 14 further includes a controller 13〇8 (eg, a software driven computer, a stylized processor, A Lan land gate array, logic circuit, etc., controller 1 3 0 8 is suitable for guiding the cry." A drives the operation of benefit 1402, in which driver 1402 is used to rotate the substrate 1〇〇.嗯 叙 ^ Drive rabbit 1402 can be, for example, a motor, with a rotating vacuum loss, drive rolling to look at ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 1 sorrow and so on. The controller 1 308 transmits or rotates a control spot 径 径 and/or power signal to the driver 1402 via a signal line 1 404. Moreover, the controller 1 308 can be used to receive the feedback from the driver 1402 by the one or more signal lines 1406. As previously mentioned, the feedback from the drive state 1 4 0 2 can provide a variety of indications regarding the status of the 22 200810881 driver 1402, the edge grinding device 202, and/or the substrate 1 . For example, the rotational speed of the drive thief 1 402 can be determined by a signal indicating the amount of motor current in the drive 142. Alternatively, a sensor (not shown) in the driver 1 4 0 2 can be used to generate a signal indicating that the platform (eg, vacuum chuck) holding the substrate 1〇0 is The torque of the platform when the driver 1402 is rotated, and/or the energy applied by the driver 1402 to rotate the substrate 100 via the platform.

訊號線14〇6上之資訊訊號可用以監視邊緣研磨設備 202之研磨製程。例如,驅動器1402内馬連電流量之變化 (如同訊號線1406上之回饋訊號所指)可以被控制器13〇8 解讀成一指示,即邊緣研磨設備202與基材之間的摩擦量 已經改變了^假設邊緣研磨設備202在基材1〇〇上維持一 恆定力量207,控制器1 3 08可以將摩擦量之變化解讀成目 前正在研磨不同的材料。基材1 0 0包括有多個材料層(例如 包含一膜層)’其可以由不同材料組成。是以,控制器丨3 08 可以決定在訊號線1406上指示出的電流變化,係意謂著一 材料層已經從基材100之邊緣104被移除了(例如被研磨去 除)。此外地或替代性地,取決於基材1〇〇之邊緣1〇4的特 徵,控制器1 308可以將摩擦量之變化解讀成一特定量之材 料已經從邊緣104被移除且因而邊緣剖面已經改變了。 第14圖之實施例更包括一致動器i408,致動器14〇8 . ' - . -. 是由控制器1308來指引。致動器1408用以將墊片206與/ 或膜204壓迫抵靠旋槔基材100。致動器14〇8係施加一怪 定力量抵靠基材,或一由控制器13〇8決定之可變力量。致 23 200810881 動器1 408可以例如是一氣動活塞、一液壓鎚、一電性螺線 管等等。控制器1 308係經由一訊號線1410傳送或輸出一 控制與/或功率訊號至致動器1408。再者,控制器1 308可 以經由一或多個訊號線1412接收來自致動器1408之一或 多個回饋或賢訊訊號。來自致動器1408之回饋或資訊訊號 可以提供各種有關於致動器1408、驅動器1402與/或基材 1 00之狀態的指示。例如,致動器1 408所施加力量之量可 以由一訊號來決定,其中該訊號係指示出致動器14〇8内一 螺線管的電流量。替代性地,致動器1 40 8内之一感測器(例 如一換能器’未示出)可以被用來產生一訊號,該訊號係指 示出被致動器1408所運用以施加至基材1〇〇之能量。 如同訊號線1406上之資訊訊號,訊號線1412上之訊 號可以用來監視邊緣研磨設備2〇2之研磨進度。例如,當 材料從基材100被移除且基材直徑減少時,致動器1408 可以自動地維持住施加在基材上之固定力量,可以調整墊 片206與’或研磨膜204之位置、與/或施加至墊片206與/The information signal on signal line 14〇6 can be used to monitor the grinding process of edge grinding apparatus 202. For example, a change in the amount of galvanic current in the driver 1402 (as indicated by the feedback signal on the signal line 1406) can be interpreted by the controller 13 〇 8 as an indication that the amount of friction between the edge grinding apparatus 202 and the substrate has changed. Assuming that the edge grinding apparatus 202 maintains a constant force 207 on the substrate 1 控制器, the controller 1 3 08 can interpret the change in the amount of friction as being material that is currently being ground. Substrate 100 includes a plurality of material layers (e.g., comprising a film layer) 'which may be composed of different materials. Thus, the controller 丨300 can determine the change in current indicated on the signal line 1406, meaning that a layer of material has been removed from the edge 104 of the substrate 100 (e.g., removed by grinding). Additionally or alternatively, depending on the characteristics of the edge 1〇4 of the substrate 1 控制器, the controller 1 308 can interpret the change in the amount of friction as a specific amount of material that has been removed from the edge 104 and thus the edge profile has been changed. The embodiment of Fig. 14 further includes an actuator i408, which is directed by the controller 1308. Actuator 1408 is used to urge gasket 206 and/or membrane 204 against rotary substrate 100. Actuator 14A8 applies a strange force against the substrate, or a variable force determined by controller 13A8.致 23 200810881 The actuator 1 408 can be, for example, a pneumatic piston, a hydraulic hammer, an electrical solenoid, or the like. Controller 1 308 transmits or outputs a control and/or power signal to actuator 1408 via a signal line 1410. Moreover, controller 1 308 can receive one or more feedback or signals from actuator 1408 via one or more signal lines 1412. The feedback or information signal from the actuator 1408 can provide various indications regarding the state of the actuator 1408, the driver 1402, and/or the substrate 100. For example, the amount of force applied by actuator 1 408 can be determined by a signal indicative of the amount of current in a solenoid within actuator 14A. Alternatively, a sensor (e.g., a transducer 'not shown) in the actuator 1 8 8 can be used to generate a signal indicative of being applied by the actuator 1408 for application to The energy of the substrate. As with the information signal on signal line 1406, the signal on signal line 1412 can be used to monitor the progress of the edge grinding apparatus 2〇2. For example, when the material is removed from the substrate 100 and the substrate diameter is reduced, the actuator 1408 can automatically maintain the fixed force applied to the substrate, and the position of the spacer 206 and the 'or abrasive film 204 can be adjusted, And/or applied to the shims 206 and /

或研磨膜204之力量。訊號線14!2上之訊號係指示出此變 化’並且控制器13〇8可以根據此訊號來決定是否一特定量 之材料已^從基材1⑽被移除(例如被研磨去除)。 控制薄 《I , ' @ 1 308可以使用由驅動器14〇2提供之回饋訊 '、疋疋否已經達到預定的邊緣研磨終點(例如希望的 邊緣剖面)、盥i, k 人興/或邊緣104目前狀態與此預定終點之間的 美.里.〇 ^ 八 右已經達到終點或邊緣104目前狀態接近於 終點(例如以已經從邊緣104被移除又材料量來測量)時, 24 200810881 則控制器丨308可以傳送訊號至驅動器14〇2以減少基 100之旋轉速度,藉以在前者狀況中避免進一步地從ς 104 #^#^ , t ^104 的速率。同樣地’控制器1308可以使用由致動器1408提 供之回饋訊號,以決定是否已經達到預定終點或接近於預 定終點。在決定之時,控制器1308可以傳送訊號至致動器 1408’以減少施加至墊片206與/或研磨膜之力量的量,藉Or the force of the abrasive film 204. The signal on signal line 14!2 indicates this change' and controller 13A can determine from this signal whether a particular amount of material has been removed from substrate 1 (10) (e.g., removed by grinding). The control thin film "I, '@1 308 can use the feedback provided by the driver 14"2, whether the predetermined edge grinding end point (e.g., the desired edge profile) has been reached, 盥i, k, or edge 104 When the current state and the predetermined end point of the US have reached the end point or the current state of the edge 104 is close to the end point (for example, measured by the amount of material that has been removed from the edge 104), 24 200810881 controls The device 308 can transmit a signal to the driver 14 〇 2 to reduce the rotational speed of the base 100, thereby avoiding further rates from ς 104 #^#^ , t ^ 104 in the former situation. Similarly, controller 1308 can use the feedback signal provided by actuator 1408 to determine if a predetermined end point has been reached or is close to a predetermined end point. At the time of the decision, the controller 1308 can transmit a signal to the actuator 1408' to reduce the amount of force applied to the spacer 206 and/or the abrasive film.

以暫停或減緩從邊緣1 〇 4進一步的材料移除。 前述說明僅揭示本發明之示範性實施例。對於此技藝 之一般人士’所揭示而落入本發明範圍之設備與方法的變 更係為明顯。例如,雖然本發明僅揭示清潔一圓的基材的 實例,本發明可以被變更以清潔具有其他形狀之基材(例如 用在平面面板顯示器之玻璃或聚合物板)。再者,雖然上文 顯示藉由設備來處理單一基材,在一些實施例中,設備可 以同時地處理數個基材。再者’本發明之邊緣研磨設備 200可以被併入至其他裝置中。例如,設備200可以被併 入一主要表面研磨機或一基材清潔機。將一邊緣研磨模組 併入一基材研磨機(例如APPLIED,MATERIALS,INC·公司 之Reflexion Oxide CMP Sy stem)交換設備之輸出站具有許 多優點。這樣的併入可以利用基材交換設備,而不需要額 外的基材傳輸件。例如去離子水與排管之設施已經建置’ 並且可以輕易地經由研磨機視窗來接取模組。此外,這樣 的併入可以在不衝擊工具佔據面積下被完成。再者,尤其 對於具有相當長之製程循環時間的應用(例如鋼應用)而 25 200810881 言,具有足夠時間來研磨基材邊緣,而不會降低工具之整 體產能。 是以,雖然本發明係以示範性實施例來揭示,應當暸 解的是,其他實施例也落入本發明隨附申請專利範圍所界 定之精神與範圍内。 【圖式簡單說明】 第1圖為一部分之基材的截面圖。To suspend or slow down further material removal from the edge 1 〇 4. The foregoing description discloses only exemplary embodiments of the invention. Variations of the apparatus and method disclosed by those of ordinary skill in the art that are within the scope of the invention are apparent. For example, although the invention merely discloses an example of a substrate that cleans a circle, the invention can be modified to clean substrates having other shapes (e.g., glass or polymer sheets for use in flat panel displays). Moreover, while the above shows the processing of a single substrate by equipment, in some embodiments, the apparatus can process several substrates simultaneously. Further, the edge grinding apparatus 200 of the present invention can be incorporated into other apparatuses. For example, apparatus 200 can be incorporated into a primary surface grinder or a substrate cleaner. The integration of an edge grinding module into a substrate mill (e.g., APPLIED, MATERIALS, INC. Reflexion Oxide CMP Sy stem) exchange station has many advantages. Such incorporation can utilize substrate exchange equipment without the need for additional substrate transport members. For example, deionized water and piping facilities have been built and the modules can be easily accessed via the grinder window. Moreover, such incorporation can be accomplished without impacting the tool footprint. Furthermore, especially for applications with relatively long process cycle times (eg steel applications), 25 200810881, there is sufficient time to grind the edges of the substrate without reducing the overall productivity of the tool. It is to be understood that the invention has been described by the exemplary embodiments of the invention, and it is understood that other embodiments are within the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a part of a substrate.

第2圖係繪示根據本發明之一邊緣清潔設備之示範性 實施例的示意圖。 第3A與3B圖分別為第2圖之一部分邊緣清潔設備的 局部前視圖與側視圖。 第4圖為根據本發明之一邊緣清潔設備實施例的立體 鼠。 第5圖為根據本發明之另一邊緣清潔設備實施例的立 體圖。 第6圖為第5圖實施例之一部分的立體圖。 第7A與7B圖為用於本發明實施例之不同的可更換匣 盒實施例的局部立體圖。 第8A-8C圖為用於本發明實施例之不同的墊片實施例 的局部立體圖。 第9A-9C圖係繪示第4圖示範性邊緣研磨設備之不同 可能頭位置的實例。 第1 0A-1 0C圖係繪示第5圖示範性邊緣研磨設備之不 26 200810881 同可能頭位置的實例。 第1 1圖為根據本發明之一多頭邊緣研磨設備實施例 的立體圖。 4 第12圖為根據本發明之另一多頭邊緣研磨設備實施 例的立體圖。 第13圖為根據本發明之又一多頭邊緣研磨設備實施 例的立體圖。Figure 2 is a schematic illustration of an exemplary embodiment of an edge cleaning apparatus in accordance with the present invention. Figures 3A and 3B are partial front and side views, respectively, of a portion of the edge cleaning apparatus of Figure 2. Figure 4 is a perspective view of an embodiment of an edge cleaning apparatus in accordance with the present invention. Figure 5 is a perspective view of another embodiment of an edge cleaning apparatus in accordance with the present invention. Fig. 6 is a perspective view showing a part of the embodiment of Fig. 5. 7A and 7B are fragmentary perspective views of different interchangeable cartridge embodiments for use in embodiments of the present invention. Figures 8A-8C are partial perspective views of different gasket embodiments for use in embodiments of the present invention. Figures 9A-9C are diagrams showing examples of different possible head positions of the exemplary edge grinding apparatus of Figure 4. The 10A-1 0C diagram shows an example of the possible edge position of the exemplary edge grinding apparatus of FIG. 5 2008. Figure 11 is a perspective view of an embodiment of a multi-edge edge grinding apparatus in accordance with the present invention. 4 Figure 12 is a perspective view of another embodiment of a multi-head edge grinding apparatus in accordance with the present invention. Figure 13 is a perspective view of another embodiment of a multi-head edge grinding apparatus in accordance with the present invention.

第14圖係繪示根據本發明之一邊緣清潔設備之示範 性實施例的示意圖。 【主要元件符號說明】 100 基材 102、 102, 主表面 104 邊緣 106、 106’ 元件區域 108、 108’ 排除區域 110 外緣 112 斜面 114 斜面 200 邊緣研磨設備 202 框架 204 研磨膜 205a-e 箭頭 2 06 墊片 206A-C 墊片 207 箭頭 208 供應棬軸 210 揍取捲軸 212 流體管道 400 邊緣研磨設備 402 框架 404 頭 406 偏壓元件 408 驅動滾輪 410 導引滚輪 412 驅動器 500 邊緣研磨設備 27 200810881Figure 14 is a schematic illustration of an exemplary embodiment of an edge cleaning apparatus in accordance with the present invention. [Main component symbol description] 100 substrate 102, 102, main surface 104 edge 106, 106' element region 108, 108' exclusion region 110 outer edge 112 bevel 114 slope 200 edge grinding device 202 frame 204 abrasive film 205a-e arrow 2 06 Shims 206A-C Shims 207 Arrows 208 Supply Shafts 210 Pickup Reels 212 Fluid Ducts 400 Edge Grinding Equipment 402 Frames 404 Heads 406 Biasing Elements 408 Drive Rollers 410 Guide Rollers 412 Drives 500 Edge Grinding Equipment 27 200810881

502 框架 504 頭 506 致動器 50 8 真空夾盤. 510 驅動器 600 驅動器 602 樞紐 6 04 驅動器 606 支禮滾輪 700A 匣盒 700B 匣盒 702 刻槽 8 02 可填充嚢袋 804 流體管道 8 06 流體供應源 1100 邊緣研磨設備 120 0 邊緣研磨設備 13 0 0 邊緣研磨設備 13 02 框架 1304 頭 1306 致動器 1308 控制器 14 02 驅動器 1404 訊號線 1406 訊號線 1408 致動器 1410 訊號線 14 1 2 訊號線502 Frame 504 Head 506 Actuator 50 8 Vacuum chuck. 510 Drive 600 Drive 602 Hub 6 04 Drive 606 Gift Roller 700A 匣 Box 700B 匣 Box 702 Groove 8 02 Fillable 嚢 Bag 804 Fluid Pipe 8 06 Fluid Supply 1100 edge grinding equipment 120 0 edge grinding equipment 13 0 0 edge grinding equipment 13 02 frame 1304 head 1306 actuator 1308 controller 14 02 driver 1404 signal line 1406 signal line 1408 actuator 1410 signal line 14 1 2 signal line

2828

Claims (1)

200810881 十、申請專利範圍: 1. 一種研磨一基材之邊緣的方法,該方法至少包含: 旋轉一基材使其抵靠一研磨膜,以從該基材之邊緣 移除材料;以及 偵測在旋轉該基材使其抵靠該研磨膜時所施加之能 量與扭矩其中一者的量。200810881 X. Patent Application Range: 1. A method of grinding an edge of a substrate, the method comprising: rotating a substrate against an abrasive film to remove material from an edge of the substrate; and detecting The amount of energy and torque applied when the substrate is rotated against the abrasive film. 2·如申請專利範圍第1項所述之方法,更包含: 根據所偵測之在旋轉該基材使其抵靠該研磨膜時所 施加之能量或扭矩,決定從該基材之邊緣移除的材料量。 3 ·如申請專利範圍第2項所述之方法,更包含: 確定經決定之所移除材料量與一預定研磨程度之間 差異。 4·如申請專利範圍第3項所述之方法,更包含: 根據經決定之所移除材料量與一預定研磨程度之間 差異’決定在旋轉該基材時欲被施加之能量或扭矩的量, 其適以使基材達到預定的研磨程度。 . - ... .. .. ..... / 5·如申請專利範圍第4項所述之方法,更包含: 調整在旋轉該基材時所施加之能量或扭矩的量至該 經決定的量。 292. The method of claim 1, further comprising: determining the shift from the edge of the substrate based on the detected energy or torque applied to rotate the substrate against the abrasive film The amount of material removed. 3. The method of claim 2, further comprising: determining a difference between the determined amount of material removed and a predetermined degree of grinding. 4. The method of claim 3, further comprising: determining the amount of energy or torque to be applied when rotating the substrate based on the determined difference between the amount of removed material and a predetermined degree of grinding The amount is adapted to bring the substrate to a predetermined degree of grinding. - The method of claim 4, further comprising: adjusting the amount of energy or torque applied when rotating the substrate to the The amount of decision. 29 200810881 6·如申請專利範圍第3項所述之方法 由已經從該基材邊緣被移除的 經移除一材料層。 7·如申請專利範圍第1項所述之方法 藉由輸送一流體至該研磨膜, 磨膜之間摩擦。 8·如申請專利範圍第1項所述之方法 在微粒接觸該基材之期間,藉 磨膜,以從該基材之邊緣移除微粒。 9· 一種研磨一基材之邊緣的方法,1 方疋轉一基材使其抵靠一研磨月 移除材料;以及 偵測在壓迫該研磨膜抵靠兮 量。 Χ 10·如申請專利範圍第9項所述之方 根據所偵測之在壓迫該研廢 加之力量,決定從該基材之邊绫人 %移除 ,更包含: 材料量,確定是否已 ,更包含: 以減少該基材與該研 「,更包含: 由輸送一流體至該研 ^方法至少包含: ,以從該基材之邊緣 基材時施加之力量的 法,更包含: 抵靠該旋轉基材時施 的材料量。 30 200810881 11·如申請專利範圍第10項所述夕士、土 S h 1 %之方法,更包含: 確定經決定之所移除材粗旦也 = * 竹科Η與一預定研磨程度之間 差異。 12·如申請專利範圍第η項所述之方法,更包含:200810881 6. The method of claim 3, wherein a layer of material has been removed from the edge of the substrate. 7. The method of claim 1, wherein the film is rubbed by transporting a fluid to the abrasive film. 8. The method of claim 1, wherein the particles are removed by the film during the contact of the particles with the substrate to remove particles from the edge of the substrate. 9. A method of grinding an edge of a substrate, wherein the substrate is transferred to a substrate to remove the material against a grinding month; and the amount of the abrasive film is pressed against the amount of the film. Χ 10· As stated in item 9 of the scope of patent application, according to the detected force to oppress the scrapping, it is decided to remove from the side of the substrate, including: the amount of material, determine whether it is, The method further comprises: reducing the substrate and the grinding, and further comprising: a method of conveying a fluid to the grinding method comprising at least: a force applied from the edge substrate of the substrate, further comprising: abutting The amount of material to be applied when the substrate is rotated. 30 200810881 11· The method of claim 1 and the soil S 1 1% as described in claim 10, further includes: determining the determined coarse material of the removed material also = * The difference between the bamboo and the predetermined degree of grinding. 12· The method described in claim n, further includes: 根據經決定之所移除材料量與該預定研磨程度之間 差異,決定欲被施加至該研磨臈之力量位準,其適以使基 材達到預定的研磨程度;以及 調整該力量至該經決定之位準。 1 3 · —種適用以研磨一基材之邊緣的系統,該系統至少包 含·· 一基材旋轉驅動器,其係適用以旋轉一基材之邊緣 使其抵靠一研磨膜;以及 一第一感測器,其連接至該旋轉器動器,該第一感 測器係適用以當該基材旋轉驅動器旋轉該基材使其抵靠該 . . …_ —— 研磨膜時,可以偵測被該基材旋轉驅動器施加的力量與扭 矩其中一者。 14·如申請專利範圍第13項所述之系統,更包含: 一控制器,其係連接至該第一感測器與至該基材旋 轉驅動器,該控制器係適用以接收來自該第一感測器之訊 號,其中該訊號指示出經偵測而被該基材旋轉驅動器施加Determining the level of force to be applied to the abrasive crucible according to the determined difference between the amount of material removed and the predetermined degree of grinding, which is adapted to achieve a predetermined degree of grinding of the substrate; and adjusting the force to the The level of decision. 1 3 - a system for polishing the edge of a substrate, the system comprising at least one substrate rotation driver adapted to rotate an edge of a substrate against an abrasive film; and a first a sensor coupled to the rotator, the first sensor being adapted to detect when the substrate rotation driver rotates the substrate against the .... _ - abrasive film One of the force and torque applied by the substrate rotation drive. 14. The system of claim 13, further comprising: a controller coupled to the first sensor and to the substrate rotary drive, the controller being adapted to receive from the first a signal from the sensor, wherein the signal indicates that it is detected and applied by the substrate rotary actuator 31 200810881 之能量或扭矩,讀 t μ控制器亦適用以根據經偵測而施加 量或扭矩來傳送抑心_ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ % 二制訊號至該基材旋轉驅動器。 15·如申請枣利|各囹 固第14項所述之系統,其中該控制器係 適以根據所接收之來 〜Λ就决定已經從該基材移除之材料量。 16·如申請專利笳阌铉」, 彳觀圍第1 3項所述之系統,更包含: 動哭 杜 、 0X1 ’,、適以壓迫該研磨膜使其抵靠該旋轉基 材。 17·如申請專利範圍第16項所述之系統,其中該致動器係 適以提供一訊號,該訊號係指示出在壓迫該研磨膜使其抵 靠該旋轉基材時該致動器施加之力量。31 200810881 Energy or torque, read t μ controller is also suitable to transmit the suppression according to the detected amount or torque. _ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 2 two signals to the substrate rotation driver. 15. The system of claim 14, wherein the controller is adapted to determine the amount of material that has been removed from the substrate based on the receipt. 16. If the patent application is filed, the system described in Item 13 of the Guanguanwei, further comprises: a crying duo, 0X1', which is adapted to press the abrasive film against the rotating substrate. The system of claim 16, wherein the actuator is adapted to provide a signal indicating that the actuator is applied when the abrasive film is pressed against the rotating substrate. The power. 1 8.如申請專利範圍第1 7項所述之系統,其中該控制器連 接至該致動器,且該控制器係適以根據該致動器提供之訊 號來決定該致動器施加至該研磨膜之力量。 1 9 ·如申請專利範圍第1 6項所述之糸統,其中該致動器係 適以壓迫該研磨膜使其抵靠該旋轉基材長達介於15秒至 1 50秒時間,以獲得一預定的研磨程度。 20·如申請專利範圍第18項所述之系統,其中該致動.器係 32 200810881 適以施加約0·5磅至2·0時之力量至該研磨膜,以獲得一 預定的研磨程度。 21.如申請專利範圍第14項所述之系統,更包含: 一流體供應源,其係連接至該控制器與至該研磨膜; 其中該控制器係適以導引該流體供應源以輸送流體 至該研磨膜上。The system of claim 17, wherein the controller is coupled to the actuator, and the controller is adapted to determine the actuator to be applied to the actuator based on the signal provided by the actuator The power of the abrasive film. 1 9 - The system of claim 16, wherein the actuator is adapted to press the abrasive film against the rotating substrate for a period of between 15 seconds and 150 seconds, A predetermined degree of grinding is obtained. 20. The system of claim 18, wherein the actuating device 32 200810881 is adapted to apply a force of between about 0.5 pounds and about 2:00 to the abrasive film to achieve a predetermined degree of grinding. . 21. The system of claim 14, further comprising: a fluid supply source coupled to the controller and to the abrasive membrane; wherein the controller is adapted to direct the fluid supply to deliver Fluid is applied to the abrasive film. 22.如申請專利範圍第21項所述之系統,其中流體被供應 至該研磨膜與該基材邊緣之間的一接觸點。 23. —種適以施加一預定壓力至一研磨膜之設備,該研磨 膜係接觸一基材之邊緣,該譟備至少包含: 一致動器,其適以施加一預定壓力至該研磨膜;以 及 m 一控制器,其係連接至該致動器,且適以接收一訊 號,該訊號係指示出該基材之邊緣的狀態,且適以根據經 接收之訊號來調整被該致動器施加至該研磨膜之壓力以維 持住該預定壓力。 24.如申請專利範圍第23項所述之設備,其中該訊號係指 示出是否已經從該基材邊緣移除一材料層。 33 200810881 25.如申請專利範圍第23項所述之設備,更包含: 一驅動器,其係連揍至該控制器,該驅動器係 旋轉該基材使其抵靠該研磨膜,該驅動器係適以產生 號,該訊號係指示出該基材之邊緣的狀態。 2 6.如申請專利範圍第25項所述之設備,其中該控制 連接至該驅動器且適以指引該驅動器之操作,以回應 少一感測器接收之訊號,藉以達到一預定的研磨程度 適以 一訊 器係 從至 3422. The system of claim 21, wherein the fluid is supplied to a point of contact between the abrasive film and the edge of the substrate. 23. An apparatus adapted to apply a predetermined pressure to a polishing film, the abrasive film contacting an edge of a substrate, the noise comprising at least: an actuator adapted to apply a predetermined pressure to the abrasive film; And a controller coupled to the actuator and adapted to receive a signal indicative of a state of an edge of the substrate and adapted to be adjusted by the received signal The pressure applied to the abrasive film is maintained at the predetermined pressure. 24. The device of claim 23, wherein the signal is indicative of whether a layer of material has been removed from the edge of the substrate. The apparatus of claim 23, further comprising: a driver coupled to the controller, the driver rotating the substrate against the abrasive film, the driver being adapted To generate a number, the signal indicates the state of the edge of the substrate. 2. The device of claim 25, wherein the control is coupled to the driver and is adapted to direct operation of the driver in response to a signal received by the sensor, thereby achieving a predetermined degree of grinding. From a signal system to 34
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WO2007126815A2 (en) 2007-11-08
US20090036039A1 (en) 2009-02-05

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