TWI362697B - Methods and apparatus for processing a substrate - Google Patents

Methods and apparatus for processing a substrate Download PDF

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Publication number
TWI362697B
TWI362697B TW095146154A TW95146154A TWI362697B TW I362697 B TWI362697 B TW I362697B TW 095146154 A TW095146154 A TW 095146154A TW 95146154 A TW95146154 A TW 95146154A TW I362697 B TWI362697 B TW I362697B
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TW
Taiwan
Prior art keywords
substrate
edge
film
abrasive film
flexible abrasive
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Application number
TW095146154A
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Chinese (zh)
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TW200735200A (en
Inventor
Erik C Wasinger
Gary C Ettinger
Sen-Hou Ko
Wei Yung Hsu
Liang Yuh Chen
Ho Seon Shin
Donald Olgado
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Applied Materials Inc
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Priority claimed from US11/299,295 external-priority patent/US7993485B2/en
Priority claimed from US11/298,555 external-priority patent/US20070131653A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200735200A publication Critical patent/TW200735200A/en
Application granted granted Critical
Publication of TWI362697B publication Critical patent/TWI362697B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02008Multistep processes
    • H01L21/0201Specific process step
    • H01L21/02021Edge treatment, chamfering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

1362697 九、發明說明: 【發明所屬之技術領域】 本發明大體上係有關於基材處理,且特別地係有關於 用以清潔基材邊緣之方法與設備。 【先前技術】1362697 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates generally to substrate processing, and in particular to methods and apparatus for cleaning the edges of substrates. [Prior Art]

傳統的系統係以一磨蝕膜接觸於基材邊緣以清潔邊 緣,傳統的系統無法完全地清潔邊緣。例如,磨蝕膜在清 潔期間不能足夠地接觸於邊緣之兩斜面(bevel)。此外,磨 蝕膜會隨著使用而磨損,且因此喪失足以清潔基材之能力 且需要時常更換,這會影響半導體元件製造產能。是以, 所希望的是一種可以改善清潔基材邊緣的方法與設備。 【發明内容】Conventional systems use an abrasive film to contact the edges of the substrate to clean the edges, and conventional systems do not completely clean the edges. For example, the abrasive film does not sufficiently contact the two bevels of the edge during cleaning. In addition, the abrasive film wears out with use, and thus loses the ability to clean the substrate and needs to be replaced from time to time, which affects the manufacturing capacity of the semiconductor component. Therefore, what is desired is a method and apparatus that can improve the edge of a clean substrate. [Summary of the Invention]

在本發明之第一態樣中,一種適用以研磨一基材之邊 緣的設備包含:一研磨膜;一框架,其適用以將該研磨膜 繃緊,使得該研磨膜之至少一部分被支撐於一平面中;以 及一基材旋轉驅動器,其適用以旋轉該基材抵靠該研磨膜 之平面,從而使該研磨膜可以:施加張力至該基材;輪廓 上相符於該基材之邊緣,該邊緣包括至少一外緣與一第一 斜面;以及在該基材被旋轉時研磨該外緣與該第一斜面》 在本發明之第二態樣中,一種適用以研磨一基材之邊 緣的設備包含:複數個研磨膜;一框架,其適用以將每一 研磨膜繃緊,使得每一研磨膜之至少一部分被支撐於一各 6 1362697In a first aspect of the invention, an apparatus for polishing an edge of a substrate comprises: an abrasive film; a frame adapted to tension the abrasive film such that at least a portion of the abrasive film is supported And a substrate rotary actuator adapted to rotate the substrate against the plane of the abrasive film such that the abrasive film can: apply tension to the substrate; contour conforming to the edge of the substrate, The edge includes at least one outer edge and a first bevel; and grinding the outer edge and the first bevel when the substrate is rotated. In a second aspect of the invention, one is suitable for grinding the edge of a substrate The apparatus comprises: a plurality of abrasive films; a frame adapted to tighten each of the abrasive films such that at least a portion of each of the abrasive films is supported on a respective 6 1362697

自平面中;以及一基材旋轉驅動器,其適用以 抵靠該些研磨膜之各自平面的至少一者,從而 被旋轉時,任何接觸於該基材之研磨膜係施加 材、輪廓上相符於該基材之邊緣、且研磨該邊 在本發明之第三態樣中,一種適用以研磨 緣的設備包含:一研磨膜,其具有一研磨側與 一可填充墊片,其鄰近該研磨膜之第二側;一 用以支撐該研磨膜與該可填充墊片;以及一基 器,其適用以旋轉一基材抵靠該研磨膜之研磨 膜係設置在介於該基材之邊緣與該可填充墊片 該可填充墊片與該研磨膜係輪廓上相符於該基 而該研磨膜接觸於該基材之邊緣。 在本發明之第四態樣中,一種清潔一基材 法包含:(a)支撐一研磨膜;(b)將該研磨膜共形 邊緣,該邊緣包括一外緣與至少一斜面;以及 材。 本發明之其他特徵與態樣將可以由以下詳 附申請專利範圍與附圖變為更加明顯。 【實施方式】 本發明係提供用以改善清潔與/或研磨基 法與設備。參閱第1圖,基材100包括兩個主 102’與一邊緣104。基材100之每一個主要表 旋轉該基材 使在該基材 壓力至該基 緣。 一基材之邊 一第二側; 框架,其適 .材旋轉驅動 側。該研磨 之間,使得 材之邊緣, 之邊緣的方 於該基材之 (c)旋轉該基 細說明、隨And a substrate rotary actuator adapted to abut against at least one of the respective planes of the abrasive films, such that when rotated, any abrasive film applied to the substrate is contoured to conform to The edge of the substrate and the grinding of the edge. In a third aspect of the invention, an apparatus suitable for polishing the edge comprises: an abrasive film having a polishing side and a fillable gasket adjacent the abrasive film a second side; a support for the abrasive film and the fillable gasket; and a substrate adapted to rotate a substrate against the abrasive film to be disposed at an edge of the substrate The fillable gasket is contoured to the base of the abrasive film and the abrasive film is in contact with the edge of the substrate. In a fourth aspect of the invention, a method of cleaning a substrate comprises: (a) supporting an abrasive film; (b) conforming the abrasive film to an edge, the edge comprising an outer edge and at least one slope; . Other features and aspects of the invention will be apparent from the appended claims and appended claims. [Embodiment] The present invention provides methods and apparatus for improving cleaning and/or grinding. Referring to Figure 1, substrate 100 includes two main portions 102' and an edge 104. Each of the substrates 100 is primarily rotated to rotate the substrate to the substrate. a side of a substrate a second side; a frame that is adapted to rotate the side of the material. Between the grinding, the edge of the material, the edge of the substrate (c) rotates the substrate to explain the

材邊緣之方 f表面1 02、 q 102 ' 102J 7 1362697The edge of the material f surface 1 02, q 102 ' 102J 7 1362697

包括一元件區域106、106’與一排外區域108、108’。(然 而,典型地,此兩個主要表面 102、102’中僅有一個包括 一元件區域與一排外區域。)排外區域 108、108’做為元 件區域106、106’與邊緣104之間的緩衝區。基材100之 邊緣104包括一外緣110與斜面112、114。斜面112、114 位在外緣 110與此兩個主要表面 102、102’之排外區域 1 0 8、1 0 8 ’之間。本發明係清潔與/或研磨基材1 0 0之外緣 110與至少一斜面112、114,而不會影響元件區域106、 10 6’。在一些實施例中,也可以清潔排外區域 1 0 8、1 0 8 ’ 之全部或一部分。An element area 106, 106' and an outer row of areas 108, 108' are included. (However, typically only one of the two major surfaces 102, 102' includes an element area and an outer row of areas.) The exclusion area 108, 108' acts as a buffer between the element areas 106, 106' and the edge 104. Area. The edge 104 of the substrate 100 includes an outer edge 110 and slopes 112, 114. The ramps 112, 114 are located between the outer edge 110 and the exclusion regions 1 0 8 , 1 0 8 ' of the two major surfaces 102, 102'. The present invention cleans and/or polishes the outer edge 110 of the substrate 100 and the at least one bevel 112, 114 without affecting the component regions 106, 106'. In some embodiments, all or a portion of the exclusion zone 1 0 8 , 1 0 8 ' may also be cleaned.

本發明係提供一框架,以在基材1 〇〇被旋轉時(例如被 真空夾盤、驅動滚筒等等所旋轉)能夠支撐一膜(例如一磨 蝕研磨膜)或磨蝕緩衝物而抵靠基材100之邊緣104。藉由 使用一由致動器來推擠的墊片與/或一可填充墊片,膜被壓 迫抵靠旋轉的基材邊緣1 04。在任何一種情況中,墊片與/ 或可填充墊片係柔軟,且/或包括或發展出輪廓以共形於基 材邊緣104之形狀。根據被致動器所施加的力量、所選擇 的墊片的彈性、可填充墊片的填充量、與/或膜上張力量, 可以施加一經控制的壓力量以研磨邊緣 1 0 4。替代性地或 此外地,膜可以在框架内處於張力下,而使得膜本身施加 一可變的張力量到基材邊緣1 04,且到外緣11 0與至少一 斜面 112、114(例如具有或不具有來自墊片之額外的支 撐)。是以,本發明提供了 一邊緣研磨製程之精確控制,其 可以在材料從邊緣1 04被移除時能夠補償基材1 00之不同 δ 1362697The present invention provides a frame for supporting a film (e.g., an abrasive film) or an abrasive buffer against a substrate when the substrate 1 is rotated (e.g., rotated by a vacuum chuck, drive roller, etc.) The edge 104 of the material 100. The film is pressed against the edge of the rotating substrate 104 by using a spacer pushed by the actuator and/or a fillable gasket. In either case, the gasket and/or the fillable gasket are soft and/or include or develop a contour to conform to the shape of the substrate edge 104. Depending on the force applied by the actuator, the elasticity of the selected gasket, the fill amount of the fillable gasket, and/or the amount of tension on the membrane, a controlled amount of pressure can be applied to grind the edge 104. Alternatively or additionally, the film may be under tension within the frame such that the film itself exerts a variable amount of tension to the edge of the substrate 104, and to the outer edge 110 and the at least one bevel 112, 114 (eg, having Or no additional support from the gasket). Therefore, the present invention provides an accurate control of an edge grinding process that compensates for the difference in substrate 100 when the material is removed from edge 104. δ 1362697

的邊緣幾何形狀與變化。 在一些實施例中,框架係支撐多個頭,每一頭 支撐研磨膜。這些頭係支撐不同型式的膜(例如不同 (grit)的膜),其能夠以預定順序同時地或在不同時 用。這些頭可以設置在不同位置,以使被支撐的膜 磨經旋轉基材100之邊緣104之不同部分。這些頭 架移動(例如角度上繞著基材100之切線軸,與/或 相對於基材1 0 0)環繞邊緣1 04,以研磨邊緣1 04之 分。在一些實施例中,這些頭係持續地震盪環繞著 基材100邊緣104。每一頭包括一經編索引的膜繞i 或被容納在一可更換的匣盒中。 此外地或替代性地,本發明包括輸送流體至正 之基材邊緣1 0 4之設施。在一些實施例中,可以提 多個通道以導引化學物或水至基材邊緣1 0 4以輔助 與/或沖洗研磨產生的微粒。流體可從基材1 0 0之任 兩側噴灑,且本發明可以利用重力或抽吸以使得流 污染或接觸於基材100之其他部分或本發明設備。 可以經由攜帶有能量(例如超音波能量)之流體將該 加至基材邊緣1 0 4。 基材100被旋轉於一水平平面中。在額外的或 的實施例中,基材100可以被旋轉於一垂直平面、 非水平平面中,且/或被移動於介於不同旋轉平面之 參閱第2圖,其繪示一邊緣研磨設備200之,示 框架202支撐且繃緊住一研磨膜204於垂直於基材 適用以 磨蝕礫 間被使 可以研 係被框 在周圍 不同部 旋轉之 备,且/ 被研磨 供一或 研磨, 一側或 體不會 再者, 能量施 替代性 其他的 間。 意圖。 100之 9 1362697 主要表面102、102,的平面中,使得基材丨00之邊緣ι〇4 可以被壓迫抵靠(例如由直的向下箭頭205a、205b所指) 研磨膜2 〇4,且研磨膜2〇4輪廓上抵靠基材邊緣i 04 β如同 彎曲箭頭2 05c所指,基材100基材ι〇〇係被旋轉抵靠研磨 膜204。基材100可以被旋轉於例如約5〇至300 RPM範 圍的速度’雖然可以使用其他速度。基材1〇〇可以接觸於 研磨膜204持續約1 5至1 50秒,係視所使用的膜型式、膜 之瑞(grit)'旋轉速度、所需要的研磨量等等而定。可以使 用更長或更短的時間。在一些實施例中,研磨膜204係被 一塾片206所支撐住’墊片206係鄰近於研磨膜204之背 側(例如非磨钱側)且被裝設在框架2〇2上。如同直的向上 箭頭207所指,框架2〇2係被推擠抵靠基材1〇〇之邊緣 104,其中框架202包括有繃緊的研磨膜2〇4與/或墊片 2 0 6。在一些實施例中,基材能夠以介於約〇 5磅至約2 〇 時範圍内之力量來抵靠研磨膜。也可以使用其他力量。 此外地或替代性地,額外的研磨膜2〇4長度係被繞輪 208、210所支撐住且繃緊,其中該些繞輪2〇8、21〇係裝 設於框架202。一供應繞輪208係包括未使用的研磨膜 2〇4,其欲被鬆解且被拉引到鄰近於基材ι〇〇之位置,而一 接取繞輪21〇係用以接收經使用與/或磨損的研磨膜2〇4。 繞輪2〇8、210之一者或兩者可以被編索引,以精確地控制 研磨膜204前進之量。研磨膜2〇4可以由許多不同的材料 製成,包括有氧化铭、氧化碎、噥化破等等。也可以使用 其他材料。在-些實施例中’所使用的磨姓粒的尺寸介於 10 1362697The edge geometry changes with. In some embodiments, the frame supports a plurality of heads, each supporting an abrasive film. These head systems support different types of films (e.g., grit films) that can be used simultaneously or at different times in a predetermined order. These heads can be placed at different locations to allow the supported film to be milled through different portions of the edge 104 of the rotating substrate 100. These head movements (e.g., angularly about the tangential axis of the substrate 100, and/or relative to the substrate 1000) wrap around the edge 104 to abrade the edge 104. In some embodiments, the headlines continue to oscillate around the edge 104 of the substrate 100. Each head includes an indexed film wrap or is housed in a replaceable cassette. Additionally or alternatively, the invention includes a facility for transporting fluid to the edge of the substrate 104. In some embodiments, multiple channels may be provided to direct chemicals or water to the edge of the substrate 104 to aid in and/or rinse the particles produced by the milling. The fluid can be sprayed from either side of the substrate 100, and the present invention can utilize gravity or suction to contaminate or contact the flow to other portions of the substrate 100 or the apparatus of the present invention. This can be applied to the edge of the substrate 1 0 4 via a fluid carrying energy (e.g., ultrasonic energy). The substrate 100 is rotated in a horizontal plane. In additional or additional embodiments, the substrate 100 can be rotated in a vertical plane, a non-horizontal plane, and/or moved between different planes of rotation, see FIG. 2, which depicts an edge grinding apparatus 200. The frame 202 supports and stretches a polishing film 204 to be perpendicular to the substrate to be used to abrade the gravel so that the frame can be rotated around the different parts of the frame, and / is ground for grinding or one side, Or the body will not be again, the energy is applied to the alternative. intention. 100 9 1362697 The plane of the major surfaces 102, 102, such that the edge 〇4 of the substrate 丨00 can be pressed against (for example, by the straight downward arrows 205a, 205b) to grind the film 2 〇 4, and The abrasive film 2〇4 is contoured against the edge of the substrate i 04 β as indicated by the curved arrow 2 05c, and the substrate 100 is rotated against the abrasive film 204. Substrate 100 can be rotated at a speed of, for example, a range of about 5 Torr to 300 RPM, although other velocities can be used. The substrate 1 can be contacted with the abrasive film 204 for about 15 to 150 seconds, depending on the film type used, the grit 'rotation speed of the film, the amount of polishing required, and the like. It can be used for a longer or shorter time. In some embodiments, the abrasive film 204 is supported by a web 206. The spacer 206 is adjacent to the back side of the abrasive film 204 (e.g., the non-moist side) and is mounted on the frame 2〇2. As indicated by the straight upward arrow 207, the frame 2〇2 is pushed against the edge 104 of the substrate 1 , wherein the frame 202 includes a taut abrasive film 2〇4 and/or a spacer 206. In some embodiments, the substrate is capable of abutting the abrasive film with a force ranging from about 5 pounds to about 2 inches. Other forces can also be used. Additionally or alternatively, the additional length of the abrasive film 2〇4 is supported and taut by the winding wheels 208, 210, wherein the winding wheels 2〇8, 21 are attached to the frame 202. A supply winding 208 includes an unused abrasive film 2〇4 that is to be loosened and pulled to a position adjacent to the substrate ι, and a take-up reel 21 is used to receive the used And/or worn abrasive film 2〇4. One or both of the windings 2, 8, 210 can be indexed to precisely control the amount by which the abrasive film 204 advances. The abrasive film 2〇4 can be made of many different materials, including oxidized, oxidized, mashed, and the like. Other materials can also be used. In some embodiments, the size of the millname used is between 10 1362697

約0.5微米至約3微米範圍内,雖然可以使用其他尺寸。 可以使用介於約1吋至約1.5吋範圍内之不同寬度(雖然可 以使用其他寬度)。在一或多個實施例中,研磨膜之厚度係 約0.002吋至約0.02吋,且研磨膜可以負載約1磅至約5 磅之張力,且在使用墊片206之實施例中可以負載介於約 3磅至約8磅之張力。可以使用具有不同厚度與強度之其 他膜。繞輪2 0 8 ' 2 10之直徑係約1吋,且抓持住約5 00 吋之研磨膜204,且可以由任何實用的材料來建構,例如 聚胺基曱酸酯、聚偏二氟乙稀(polyvinyl difloride,PVDF) 等等。也可以使用其他材料。框架202可以由任何其他實 用的材料來建構,例如鋁、不銹鋼等等。It is in the range of about 0.5 microns to about 3 microns, although other sizes can be used. Different widths ranging from about 1 吋 to about 1.5 。 can be used (although other widths can be used). In one or more embodiments, the thickness of the abrasive film is from about 0.002 Torr to about 0.02 Å, and the abrasive film can be loaded with a tension of from about 1 pound to about 5 pounds, and can be loaded in embodiments in which the spacer 206 is used. From about 3 pounds to about 8 pounds of tension. Other films having different thicknesses and strengths can be used. The diameter of the winding wheel 2 0 8 ' 2 10 is about 1 inch, and the abrasive film 204 of about 500 吋 is grasped, and can be constructed by any practical material, such as polyamino phthalate, polyvinylidene fluoride. Polyvinyl difloride (PVDF) and so on. Other materials can also be used. The frame 202 can be constructed from any other useful material, such as aluminum, stainless steel, and the like.

在一些實施例中,可以提供一或多個流體通道2 1 2 (例 如一喷灑喷嘴或棒),以輸送化學物與/或水以輔助基材邊 緣1 04之研磨/清潔、潤滑基材、與/或沖掉被移除的材料。 流體通道212適用以輸送流體至基材100、至研磨膜204、 與/或至至墊片206。流體可以包括有去離子水,去離子水 用做為潤滑劑且用以沖掉微粒。也可以包括有一界面活性 劑與/或其他公知的清潔化學物。在一些實施例中,音波(例 如超音波)喷嘴用以輸送音波化之流體至基材邊緣1 04,以 加強清潔。流體也可以經由研磨膜2 0 4與/或墊片2 0 6被輸 送至邊緣104。 參閱第3A圖與第3B圖,其係分別繪示第2圖之研磨 膜2 04與墊片2 0 6之局部前視圖與側視圖。值得注意的是, 力量(直箭頭所指)使得研磨膜204與墊片206輪廓上相稱 11 1362697 於基材邊緣104’且共形於基材邊緣104。在一些實施例 中,若基材100不存在,塾片206具有平坦的表面,其中 該表面係為基材1〇〇壓迫墊片206之處。同樣地’若基材 100不存在’將會平躺且在此兩圖中由直線所表示出。In some embodiments, one or more fluid channels 2 1 2 (eg, a spray nozzle or rod) may be provided to transport chemicals and/or water to aid in the grinding/cleaning of the substrate edge 104, lubricating the substrate. And/or wash away the removed material. The fluid passage 212 is adapted to deliver fluid to the substrate 100, to the abrasive film 204, and/or to the gasket 206. The fluid may include deionized water, which acts as a lubricant and is used to flush out the particles. It may also include an interfacial active agent and/or other well known cleaning chemistry. In some embodiments, a sonic (e.g., ultrasonic) nozzle is used to deliver the sonicated fluid to the edge of the substrate 104 to enhance cleaning. Fluid can also be delivered to the edge 104 via the abrasive film 205 and/or the shims 206. Referring to Figures 3A and 3B, a partial front view and a side view, respectively, of the abrasive film 206 and the spacer 206 of Figure 2 are shown. It is noted that the force (indicated by the straight arrow) causes the abrasive film 204 to conform to the contour of the spacer 206 11 1362697 at the edge 104' of the substrate and conform to the edge 104 of the substrate. In some embodiments, if the substrate 100 is absent, the crotch panel 206 has a flat surface, wherein the surface is where the substrate 1 is pressed against the spacer 206. Similarly, if the substrate 100 does not exist, it will lie flat and will be represented by a straight line in the two figures.

參閱第4圖與第5圖’其係繪示一邊緣研磨設備4〇〇、 500之兩個替代性實施例。如第4圖所示,一示範性邊緣 研磨設備400包括一基座或框架402,基座或框架402包 括一支撐住研磨膜204之頭4〇4,其中該研磨膜2〇4被繃 緊在繞輪208、210之間且更被墊片206所支撐住。如圖所 示’墊片206可以經由一偏壓元件4〇6(例如彈簧)而被裝 設於頭404。第4圖之邊緣研磨設備4 〇〇也可以包括一或 多個驅動滾筒408(顯示兩個)與導引滾筒41〇(顯示兩個), 其用以旋轉基材1〇〇之邊緣104抵靠研磨膜204 »驅動滚 筒408本身每一者係被驅動器412(例如馬達、齒輪、皮帶、 鍊條等等)驅動。 驅動滾筒408與導引滾筒410也可以包括一溝槽,该Referring to Figures 4 and 5, there are shown two alternative embodiments of an edge grinding apparatus 4, 500. As shown in FIG. 4, an exemplary edge grinding apparatus 400 includes a base or frame 402 that includes a head 4〇4 that supports the abrasive film 204, wherein the abrasive film 2〇4 is taut Between the windings 208, 210 and more supported by the spacer 206. As shown, the spacer 206 can be mounted to the head 404 via a biasing element 4〇6 (e.g., a spring). The edge grinding apparatus 4 of FIG. 4 may also include one or more drive rollers 408 (two shown) and a guide roller 41 〇 (two shown) for rotating the edge 104 of the substrate 1 to Each of the drive rollers 408 is driven by a drive 412 (eg, a motor, gear, belt, chain, etc.). The driving roller 408 and the guiding roller 410 may also include a groove,

溝槽使得滾筒408、410單獨地支撐住基材i〇〇。在一此實 施例中’驅動滾筒408中之溝槽具有約2·5吋的直徑且 滾筒41 0中之溝槽具有約1吋的直徑。也可以使用其他尺 寸。驅動滾筒408接觸於基材1〇〇之區塊係包括紋路化或 相錯溝槽,以使得驅動滾筒408抓持住基材i 〇〇。 ^ °驅動滾 筒408與導引滾筒410可以由譬如聚胺基甲酸醋聚偏二 氟乙烯(Polyvinyl diflo ride,PVDF)等等之材料來建構。也 可以使用其他材料。 12 如第5圖所示,另一個示範性邊緣研磨設備500包括 一基座或框架502,基座或框架502包括一支撐住研磨膜 2 04之頭504,其中該研磨膜2 04被繃緊在繞輪208、210 之間且更被墊片206所支撐住。如圖所示,墊片206可以 經由一致動器506(例如一氣動滑件、液壓鎚、伺服馬達驅 動推進器等等)而被裝設於頭504。第5圖之邊緣研磨設備 5〇〇也可以包括一真空夾盤508,真空夹盤508耦接至一 獎動器510(例如馬達、齒輪、皮帶、鍊條等等)。第5圖 繪示之實施例的優點在於,設備500不需要接觸於被研磨 之邊緣。是以,可以免除微粒累積在驅動滚筒上且再沉積 在邊緣104上之潛在性。也不需要清潔滾筒。再者,也可 以免除滚筒損壞或刮傷邊緣之可能性。藉由將基材固持於 中空夾盤中,可以達到高速旋轉而不震動。 參閱第6圖至第8B圖,其係繪示第4圖與第5圖之 示範性實施例的細部結構。值得注意的是,不同實施例之 特徵能夠以許多不同的實際方式結合’以應用在不同的設 計原理或關注點。 第6圖係繪示第5圖之框架502(包括頭504)之細部結 構》如前所述’頭504支撐住研磨膜204,其中該研磨媒 204被繃緊在繞輪208、210之間。框架502(包括頭5〇4) 係被一驅動器600(例如伺服馬達)與框紐602角度上轉移 (相對於相切於基材邊緣104之軸,其中該基材100被固持 在邊緣研磨設備500中(第5圖))。框架(與研磨膜2 〇4)之 角度轉移將在下文參閱第9A圖至第l〇C圖更詳細地被描 136,2697 述0 _ c 方磕綸208、210可以被一或多 此外,被裝設於頭504之繞释 饭 個驅動器604(例如伺服馬達)所驅動。驅動裔6〇4可以提 供_編索引能力以使得未使用研磨膜204之特定量被行進 或持續地饋送至基材邊緣,Μ及…端緊能力以使得研磨膜 被拉緊地伸張且施加壓力至基材邊緣° 如第ό圖所詳細地顯示(相對於第5圖)’選擇性塾片The grooves cause the rollers 408, 410 to individually support the substrate i. In one such embodiment the groove in the drive roller 408 has a diameter of about 2.5 mm and the groove in the roller 41 0 has a diameter of about 1 inch. Other sizes can also be used. The block in which the drive roller 408 is in contact with the substrate 1 includes a textured or phase-shifted groove such that the drive roller 408 grips the substrate i 〇〇. The ^ ° drive roller 408 and the guide roller 410 may be constructed of a material such as a polyvinyl diflo ride (PVDF) or the like. Other materials can also be used. 12, as shown in FIG. 5, another exemplary edge grinding apparatus 500 includes a base or frame 502 that includes a head 504 that supports an abrasive film 404, wherein the abrasive film 204 is taut Between the winding wheels 208, 210 and more supported by the spacer 206. As shown, the shim 206 can be mounted to the head 504 via an actuator 506 (e.g., a pneumatic slider, a hydraulic hammer, a servo motor driven propeller, etc.). The edge grinding apparatus 5 of Fig. 5 may also include a vacuum chuck 508 coupled to a medal 510 (e.g., motor, gear, belt, chain, etc.). An advantage of the embodiment illustrated in Figure 5 is that the device 500 does not need to be in contact with the edge being ground. Therefore, the potential for particles to accumulate on the drive roller and redeposit on the edge 104 can be eliminated. There is also no need to clean the rollers. Furthermore, the possibility of damage to the drum or scratching of the edges can be avoided. By holding the substrate in the hollow chuck, high speed rotation can be achieved without vibration. Referring to Figures 6 through 8B, there is shown a detailed structure of an exemplary embodiment of Figures 4 and 5. It is worth noting that the features of the different embodiments can be combined in many different practical ways to apply to different design principles or points of interest. Figure 6 is a diagram showing the detailed structure of the frame 502 (including the head 504) of Figure 5. The head 504 supports the abrasive film 204 as described above, wherein the abrasive medium 204 is stretched between the winding wheels 208, 210. . The frame 502 (including the head 5〇4) is angularly displaced from the frame 602 by a driver 600 (e.g., a servo motor) (relative to the axis tangent to the edge 104 of the substrate, wherein the substrate 100 is held in the edge grinding device 500 (figure 5)). The angular transfer of the frame (with the abrasive film 2 〇 4) will be described in more detail below with reference to Figures 9A through 1C, 136, which may be one or more. It is driven by a wound rice driver 604 (for example, a servo motor) mounted on the head 504. The driver 6〇4 can provide an indexing capability such that a specific amount of unused abrasive film 204 is advanced or continuously fed to the edge of the substrate, and the end-tightening ability is such that the abrasive film is stretched and stressed To the edge of the substrate ° as shown in detail in the figure (relative to Figure 5) 'Selective cymbals

206可以經由一致動器506被裝設於頭504 ’其中該致動器 506係可調整地壓迫研磨膜2 04或使研磨膜2 04輪廓上抵 靠基材邊緣1 〇4(第5圖)。再者’一或多個支撐滚筒606 也可以被裝設於頭5〇4,以導引且對齊研磨膜204於垂直 於基材100之主要表面102(第圖丨)之平面,其t該基材 100被固持在邊緣研磨設備5 00中(第5圖)。206 can be mounted to the head 504' via an actuator 506, wherein the actuator 506 adjustably presses the abrasive film 206 or contours the abrasive film 204 against the edge of the substrate 1 第 4 (Fig. 5) . Furthermore, one or more support rollers 606 may also be mounted on the head 5〇4 to guide and align the abrasive film 204 to a plane perpendicular to the major surface 102 (Fig. 基材) of the substrate 100, which The substrate 100 is held in the edge grinding apparatus 500 (Fig. 5).

值得注意的是,第5圖與第6圖所繪示之實施例中’ 研磨膜204之長度被設置成正交於正被研磨之基材1〇〇之 邊緣104。這係與第2圖之實施例形成對比,在第2圖中 研磨联204之縱向方向係對齊於正被研磨之基材100之邊 緣10 4。也可以使用其他研磨膜方位與組態。例如,研磨 膜2 04可以被固持成對角線地相對於基材1〇〇之主要表面 102 ° 參閲第7A圖與第7B圖,其係繪示可更換之匣盒 700A、700B之兩個不同實施例的立體圖。昆盒7〇〇A、700B 係以可丟棄、可再填充、與’或可更換之套件來提供頭404 與研磨膜204之特徵’該套件可以快速地且容易地被裝設 14 至且 sfe •s移除自不同邊緣研磨設備400、500之框架4〇2、 502。 如第7A圖所示’ |£盒7〇〇a包括頭404,頭4〇4係支 。住秩跨供應捲轴208至接取捲轴210之研磨膜204。研 磨膜 2〇 a 了以被支樓滾同606所導引且對齊,其中該些支 芽滾筒606係被裝設於頭4〇4。可以提供一墊片2〇6,以進 步地支撐研磨膜2〇4 ’如前所述。又如前所述,可以利 用—偏壓元件4〇6(例如彈簧)以裝設墊片2〇6於頭4〇4,而 提供彈性的/動態的反壓力至墊片206。替代性地或此外 tir ) —y 可以使用一可調整的致動器506(第6圖),以推擠墊 片206抵靠研磨膜204’或推擠整個頭4〇4朝向基材1〇〇。 在又另一替代性實施例中’如第7 B圖所示,不使用 墊片206,頭404可以僅藉由研磨膜2〇4之張力而提供橫 D壓力至基材邊緣1〇4(第1圖)。在一些實施例中,頭々ο* ° 乂包括—刻槽702,如第7B圖所示,以容納基材1〇〇。 參閱第8A圖與第8B圖,其係繪示塾片2〇6A、206B 之兩個.不同的替代性實施例。除了墊片2〇6(其在基材不存 時具有與研磨膜204共平面之平坦表面(第6圖))之外_, 勢片206A可以具有輪廓上相符於基材100邊緣ι〇4之凹 面或者’如第8B圖所示’墊片206B可以具有雙凹面以 更佳地輪廓上相符於基材100邊緣1〇4。在又其他替代性 實施例中’墊片206可以包括一塑形溝槽,該塑形溝槽係 精確地輪廓上相符於基材100邊緣1〇4(包括斜面112、 114 ’及外緣11〇(第1圖))。 1362697 墊片 206、206A、206B可以由譬如乙縮醛樹脂(例如 Dupont Corporation 所製造之 Delrin®)、PVDF、聚胺基甲 酸酯密閉室發泡體、矽橡膠等等之材料所製成。也可以使 用其他材料。這樣的材料可以具有彈性,或一種為墊片厚 度或密度之函數的能力。此材料可以根據其彈性來選擇。 所希望的彈性可以恩具需要的研磨型式來選擇。It is to be noted that in the embodiments illustrated in Figures 5 and 6, the length of the abrasive film 204 is set to be orthogonal to the edge 104 of the substrate 1 being ground. This is in contrast to the embodiment of Figure 2, in which the longitudinal direction of the abrasive joint 204 is aligned with the edge 104 of the substrate 100 being ground. Other abrasive film orientations and configurations can also be used. For example, the abrasive film 206 can be held diagonally relative to the main surface of the substrate 1 102 102 ° See Figures 7A and 7B, which show two of the replaceable cassettes 700A, 700B A perspective view of a different embodiment. The cartridges 7〇〇A, 700B are available in disposable, refillable, and replaceable kits to provide the features of the head 404 and the abrasive film 204. The kit can be quickly and easily installed 14 to sfe • s removed from frames 4〇2, 502 of different edge grinding equipment 400, 500. As shown in Fig. 7A, the box 7〇〇a includes a head 404 and a head 4〇4 system. The rank spanning supply spool 208 is moved to the abrasive film 204 of the take-up spool 210. The grinding film 2〇 a is guided and aligned by the slabs 606, wherein the bud rollers 606 are mounted on the head 〇4. A spacer 2〇6 may be provided to further support the abrasive film 2〇4' as previously described. As previously mentioned, a biasing element 4〇6 (e.g., a spring) can be utilized to provide the spacer 2〇6 to the head 4〇4 to provide an elastic/dynamic back pressure to the spacer 206. Alternatively or additionally tir)-y an adjustable actuator 506 (Fig. 6) may be used to push the spacer 206 against the abrasive film 204' or push the entire head 4〇4 toward the substrate 1〇 Hey. In yet another alternative embodiment, as shown in FIG. 7B, without the spacer 206, the head 404 can provide a transverse D pressure to the edge of the substrate by a tension of only 2*4 of the abrasive film 2〇4 ( Figure 1). In some embodiments, the head 々ο* ° 乂 includes a notch 702, as shown in FIG. 7B, to accommodate the substrate 1〇〇. Referring to Figures 8A and 8B, two different alternative embodiments of the cymbals 2〇6A, 206B are illustrated. In addition to the spacer 2〇6 (which has a flat surface coplanar with the abrasive film 204 when the substrate is not present (Fig. 6)), the potential sheet 206A may have a contour conforming to the edge of the substrate 100. The concave surface or 'shield 206B as shown in FIG. 8B' may have a double concave surface to better conformally conform to the edge 1〇4 of the substrate 100. In still other alternative embodiments, the spacer 206 can include a shaped groove that is precisely contoured to conform to the edge 1 of the substrate 100 (including the slopes 112, 114' and the outer edge 11 〇 (Fig. 1)). 1362697 The spacers 206, 206A, 206B may be made of a material such as an acetal resin (for example, Delrin® manufactured by Dupont Corporation), PVDF, a polyurethane seal chamber foam, a ruthenium rubber or the like. Other materials can also be used. Such materials may have elasticity, or a ability to function as a function of the thickness or density of the gasket. This material can be chosen according to its elasticity. The desired elasticity can be selected by the desired abrasive pattern.

在一些實施例中,墊片206、206A、206B具有共形於 基材邊緣之可調整能力。例如,墊片206、206A、206B可 以為或包括一可填充囊袋,墊片可以藉由增加更多的空氣 或液體或其他流體而變得更硬,且墊片可以經由減少囊袋 中空氣或液體或其他流體而變得更共形的。第8C圖係繪 示包含可填充囊袋8 02之墊片2 06C之實施例,其中該可 填充囊袋802可以將來自一流體供應806之流體經由一流 體通道804來填充(與/或排空)。在一些實施例中,流體供 應806可以在操作者之指示下或—程式化的與/或使用者 操作的控制器之指示下將囊袋802填充/洩漏。在這樣的實 施例中’一彈性材料(例如矽橡膠等等)可以被用於囊袋 802’以進一步地增強囊袋伸張且共形於基材邊緣1〇4之能 力15樣的實施例可以允許操作者/控制者精確地控制研磨 膜2 04接觸於基材1〇〇時超過斜面112114(若全部)多遠 且進入排外區域108與/或1〇8,多遠(第丄圖),例如藉由限 制被唧筒抽吸進入囊袋8〇2之流體的量。例如,在基材外 緣110被置玫成抵靠具有洩漏囊袋8 〇2之墊片2 時, 囊袋802得、被填充而使得墊片2〇6c被迫纏繞且共形於基 16 1362697 材100之外緣110與斜面112、114,而不會纏繞基材100 之元件區域106、106’。值得注意的是,在一些實施例中, 墊片中可以使用多個囊袋,且在不同形狀之墊片 206、 206A ' 206B中可以使用不同形狀之可填充囊袋。In some embodiments, the spacers 206, 206A, 206B have an adjustable ability to conform to the edge of the substrate. For example, the spacers 206, 206A, 206B can be or include a fillable pouch that can be made stiffer by adding more air or liquid or other fluid, and the shim can reduce air in the pouch Or liquid or other fluid to become more conformal. 8C illustrates an embodiment of a spacer 206C including a fillable pouch 802, wherein the fillable pouch 802 can fill (and/or align) fluid from a fluid supply 806 via a fluid passage 804. air). In some embodiments, the fluid supply 806 can fill/leak the bladder 802 under the direction of an operator or as directed by a programmed and/or user operated controller. In such an embodiment, an elastic material (e.g., silicone rubber, etc.) can be used for the bladder 802' to further enhance the ability of the bladder to stretch and conform to the edge of the substrate. Allowing the operator/controller to precisely control how far the abrasive film 206 contacts the substrate 1〇〇 beyond the slope 112114 (if all) and enters the exclusion region 108 and/or 1〇8, how far (Figure )), For example, by limiting the amount of fluid that is drawn into the bladder 8〇2 by the cartridge. For example, when the outer edge 110 of the substrate is placed against the spacer 2 having the leak pocket 8 〇 2, the pocket 802 is filled, such that the spacer 2 〇 6c is forced to wrap and conform to the base 16 1362697 The outer edge 110 of the material 100 and the bevels 112, 114 do not wrap around the component regions 106, 106' of the substrate 100. Notably, in some embodiments, multiple pockets may be used in the shim, and differently shaped fillable pouches may be used in the differently shaped shim 206, 206A '206B.

在一些實施例中,用以輔助研磨之流體可以經由墊片 206、206A、206B被輸送至基材邊緣。可以提供一流體通 以滴下或喷灑流體至墊片上或進入墊片。替代性地,可填 充墊片係可以包括具有一半滲透性薄膜之囊袋,其中該半 透性薄膜係允許流體可以緩慢地被釋放且傳送至研磨膜 204(例如經由塾片)。在這樣的實施例中,塾片206、206A、 20 6B可以被會吸收且/或置留使用的流體(例如聚乙焊醇 (polyvinyl alcohol, PVA)等等)之材料所覆蓋住、所製成, 與/或包括該材料。 第9A-9C圖與第10A-10C圖係分別繪示替代性的邊緣 研磨設備4 0 0、5 0 0的不同可能頭位置。本發明係適用以使 研磨膜204接觸於基材1〇〇之斜面112、114與外緣11〇, 而不會接觸到基材100之元件區域106。在操作時,這可 以藉由'將頭404、504繞著一轴來角度地轉移而達到(且因 而一部分之研磨膜接觸於且輪廓上相符於基材100之邊緣 104),其中該轴係相切於被旋轉的基材100的外緣110。 參聞第9A-9C圖與第10A-10C圖,此角度轉移之軸係由垂 直延伸出圖上紙面標示為「Pj之一線來表示。頭404、504 巧·以被保持在不同位置以當基材1 0 0被旋轉時能夠清潔基 材邊緣104之所希望部分。在一些實施例中,頭404、504 17 1362697In some embodiments, the fluid to aid in grinding can be delivered to the edge of the substrate via spacers 206, 206A, 206B. A fluid can be provided to drip or spray fluid onto the gasket or into the gasket. Alternatively, the fillable gasket can comprise a bladder having a semi-permeable membrane, wherein the semipermeable membrane allows fluid to be slowly released and delivered to the abrasive membrane 204 (e.g., via a septum). In such an embodiment, the crotch panels 206, 206A, 20 6B may be covered by a material that will absorb and/or retain a fluid (eg, polyvinyl alcohol (PVA), etc.). In, and/or include the material. Figures 9A-9C and 10A-10C show different possible head positions of the alternative edge grinding apparatus 400, 500, respectively. The present invention is applicable to the abrasive film 204 contacting the beveled surfaces 112, 114 and the outer edge 11 of the substrate 1 without contacting the component region 106 of the substrate 100. In operation, this can be achieved by 'translating the heads 404, 504 angularly about an axis (and thus a portion of the abrasive film is in contact with and contoured to conform to the edge 104 of the substrate 100), wherein the shafting Tangent to the outer edge 110 of the substrate 100 being rotated. Referring to Figures 9A-9C and 10A-10C, the axis of the angular transfer is indicated by the line on the vertical extension of the paper labeled "Pj. The heads 404, 504 are kept in different positions. The desired portion of the substrate edge 104 can be cleaned when the substrate 100 is rotated. In some embodiments, the head 404, 504 17 1362697

係適用以持續地或間歇地在所繪示的不同位置與/或其他 位置之間震盪。頭404、504可以在程式化的或使用者操作 的控制器的指示下藉由驅動器6 00(第6圖)而被移動於框 架502上。替代性地,頭404、504可以被固定住,與/或 僅在基材沒有被旋轉時被調整。在又其他實施例中,基材 可以保持固定,而頭係被震盪(如前所述)且繞著基材100 被圓周地旋轉。再者,研磨膜204能夠以持續迴圈方式被 裝設在頭404、504上,且/或研磨膜204可以被持續地(或 間歇地)向前饋送以研磨基材邊緣1 04。例如,膜之行進能 夠用以建立或加強研磨運動。可以利用任何前述實用的研 磨運動與/或方法的組合。It is suitable to oscillate continuously or intermittently between different locations and/or other locations as depicted. Heads 404, 504 can be moved to frame 502 by driver 6 00 (Fig. 6) under the direction of a programmed or user operated controller. Alternatively, the heads 404, 504 can be secured and/or adjusted only when the substrate is not being rotated. In still other embodiments, the substrate can remain stationary while the headgear is oscillated (as previously described) and rotated circumferentially about the substrate 100. Further, the abrasive film 204 can be mounted on the heads 404, 504 in a continuous loop, and/or the abrasive film 204 can be continuously (or intermittently) fed forward to grind the substrate edge 104. For example, the travel of the film can be used to establish or enhance the grinding motion. Any of the aforementioned practical grinding motions and/or combinations of methods can be utilized.

參閱第1 1 -1 2圖,其係繪示一邊緣研磨設備之額外實 施例。第11圖係繪示包括有三個頭4 0 4之邊緣研磨設備 1100,第12圖係繪示包括有兩個頭504之邊緣研磨設備 1 200 -且第13圖係繪示包括有四個頭1304之邊緣研磨設 備1 3 00。如圖所示,任何數目與型式之頭404、504、1304 可以被用在任何實際的組合中。此外,在這樣的多頭實施 例中,每一頭4 0 4、5 0 4、1 3 0 4可以使用不同組態或型式的 研磨膜 204(例如不同礫、材料、張力、壓力等等)。任何 數目之頭404、5 04、1 3 04可以同時地 '個別地與/或依序 地被使用。不同的頭404、504、1304可以用在不同的基材 100,或不同型式的基材。例如,具有一剛硬偏壓元件406 以支撐住一墊片206(例如内凹墊片206B)與一粗糙礫研磨 膜204之第一頭404可以起初地被用來從基材斜面112、 18 136.2697 114(第1圖)移除相當大量的粗糙材料。第一頭404可以適 當地被設置以接近斜面112、114。在以第一頭4 04清潔之 後,第一頭4 04係從基材100退回,且具有一精細礫研磨 膜204(且不具有一墊片)之第二頭504可以被移動至定位 以研磨斜面112、114與外緣110。Referring to Figures 1 1 - 2 2, an additional embodiment of an edge grinding apparatus is illustrated. 11 is an edge grinding apparatus 1100 including three heads 104, and 12 is an edge grinding apparatus 1 200 including two heads 504 - and FIG. 13 is a diagram including four heads 1304. Edge grinding equipment 1 3 00. As shown, any number and type of headers 404, 504, 1304 can be used in any actual combination. Moreover, in such a multi-head embodiment, each of the heads 4 04, 5 0 4, 1 3 0 4 may use a different configuration or type of abrasive film 204 (e.g., different gravel, material, tension, pressure, etc.). Any number of headers 404, 5 04, 1 3 04 can be used 'individually and/or sequentially. Different heads 404, 504, 1304 can be used on different substrates 100, or different types of substrates. For example, a first head 404 having a rigid biasing element 406 to support a shim 206 (e.g., recessed shim 206B) and a coarse gravel abrasive film 204 can be used initially from the substrate bevel 112, 18 136.2697 114 (Figure 1) removes a considerable amount of rough material. The first head 404 can be suitably positioned to approximate the ramps 112, 114. After cleaning with the first head 404, the first head 04 04 is retracted from the substrate 100, and the second head 504 having a fine gravel abrasive film 204 (and without a spacer) can be moved to position for grinding Bevels 112, 114 and outer edge 110.

在清潔了 一或多個基材1 〇 〇之後,用於這樣清潔的研 磨膜204的部分會磨損。因此,接取捲轴210(第4圖)係 被驅動以從供應捲轴208朝著接取捲軸 210拉引研磨膜 204 —固定量。依此方式,研磨膜204之未使用部分可以 被提供於介於接取捲軸210與供應捲軸208之間。研磨膜 2 04之未使用部分能夠以類似前述方式被利用來接續地清 潔一或多個其他基材1 0 0。所以,設備1 1 0 0、1 2 0 0可以將 研磨膜2 04之磨損部分更換成未使用部分,而對於基材處 理產能有少許或不具有衝擊。同樣地,當匣盒700A中所 有的研磨膜204被使用時,若利用了可更換的匣盒700A, 對於產能之衝擊可以藉由迅速地更換匣盒7 00A而被最小 化。 有關於第1 3圖之邊緣研磨設備 1 3 00的示範性實施 例,其係繪示一支撐有多個頭1304之框架1302的示意圖。 每一頭1304被裝設於框架1302,且每一頭1304包括有一 致動器1 306(例如氣動活塞、伺服驅動滑件、液壓鎚等等), 其中該致動器1306係回應於來自控制器1308(例如一程式 化電腦、一操作者指引之閥件系統、一内嵌之即時處理器 等等)之一控制訊號而適用以壓迫墊片206與研磨膜204 19 1362697 之長度抵靠基材邊緣104。值得注意的是,控制器1308耦 接至(例如電性地、機械地、氣動地、液壓地等等)每一致 動器1 3 0 6。After cleaning one or more of the substrates 1 〇 , the portion of the polishing film 204 used for such cleaning may be worn. Therefore, the take-up reel 210 (Fig. 4) is driven to pull the abrasive film 204 from the supply reel 208 toward the take-up reel 210 by a fixed amount. In this manner, an unused portion of the abrasive film 204 can be provided between the take-up spool 210 and the supply spool 208. The unused portion of the abrasive film 248 can be utilized in a manner similar to that described above to successively clean one or more other substrates 100. Therefore, the apparatus 1 1 0 0, 1 2 0 0 can replace the worn portion of the abrasive film 204 with an unused portion with little or no impact on the substrate processing capacity. Similarly, when all of the abrasive film 204 in the cassette 700A is used, if the replaceable cassette 700A is utilized, the impact on productivity can be minimized by rapidly replacing the cassette 700A. An exemplary embodiment of the edge grinding apparatus 1 3 00 of Figure 13 is a schematic illustration of a frame 1302 supporting a plurality of heads 1304. Each head 1304 is mounted to a frame 1302, and each head 1304 includes an actuator 1 306 (eg, a pneumatic piston, a servo drive slide, a hydraulic hammer, etc.), wherein the actuator 1306 is responsive to the controller 1308 One of the control signals (such as a stylized computer, an operator-guided valve system, an embedded instant processor, etc.) is adapted to press the spacer 206 and the length of the abrasive film 204 19 1362697 against the edge of the substrate 104. It is noted that the controller 1308 is coupled to (e.g., electrically, mechanically, pneumatically, hydraulically, etc.) each of the actuators 1 3 0 6 .

此外,一流體供應806可以耦接至控制器1308,且處 於控制器1 3 0 8的控制之下。流體供應8 0 6可以被控制以經 由一或多個流體通道 2 1 2獨立地輸送流體(例如去離子 水、清潔化學物、音波化流體、氣體、空氣等等)至每一頭 1304。在控制器1308之指引下,不同的流體可以經由該些 流體通道212選擇性地被輸送至墊片206、研磨膜204、與 /或基材邊緣 1 〇 4。流體可以用在研磨、潤滑、微粒移除/ 潤濕、與/或將墊片206内之囊袋802(第8C圖)填充。例如, 在一些實施例中,經由一可滲透墊片2 0 6輸送之相同的流 體能夠被用以研磨墊片206且將墊片206填充,而一經由 第二通道(未示出)輸送至同一頭 1304之不同的流體係被 用來潤濕與研磨。Additionally, a fluid supply 806 can be coupled to controller 1308 and under the control of controller 1308. Fluid supply 860 can be controlled to independently deliver fluid (e.g., deionized water, cleaning chemistry, sonicating fluid, gas, air, etc.) to each head 1304 via one or more fluid passages 2 1 2 . Under the direction of the controller 1308, different fluids may be selectively delivered to the gasket 206, the abrasive film 204, and/or the substrate edge 1 经由 4 via the fluid passages 212. The fluid can be used to grind, lubricate, particulate remove/wet, and/or fill pocket 802 (Fig. 8C) within gasket 206. For example, in some embodiments, the same fluid delivered via a permeable septum 206 can be used to grind the shim 206 and fill the shim 206, while being delivered via a second passage (not shown) to Different flow systems of the same head 1304 are used for wetting and grinding.

前述說明僅揭示本發明之示範性實施例。對於此技藝 之一般人士,所揭示而落入本發明範圍之設備與方法的變 更係為明顯。例如,雖然本發明僅揭示清潔一圓的基材的 實例,本發明可以被變更以清潔具有其他形狀之基材(例如 用在平面面板顯示器之玻璃或聚合物板)。再者,雖然上文 顯示藉由設備來處理單一基材,在一些實施例中,設備可 以同時地處理複數個基材。 是以,雖然本發明係以示範性實施例來揭示,應當瞭 解的是,其他實施例也落入本發明範圍内,如同隨附申請 20 1362697 專利範圍所界定者。 【圖式簡單說明】 第1圖為一部分之基材的截面圖。 第2圖係繪示根據本發明之一邊緣清潔設備實施例的 示意圖。 第3A與3B圖分別為第2圖之一部分邊緣清潔設備的 局部前視圖與側視圖。The foregoing description discloses only exemplary embodiments of the invention. Variations of the apparatus and method disclosed in the scope of the invention are apparent to those of ordinary skill in the art. For example, although the invention merely discloses an example of a substrate that cleans a circle, the invention can be modified to clean substrates having other shapes (e.g., glass or polymer sheets for use in flat panel displays). Moreover, while the above shows the processing of a single substrate by equipment, in some embodiments, the apparatus can process a plurality of substrates simultaneously. It is to be understood that the present invention is disclosed by way of example embodiments, and it is understood that other embodiments are also within the scope of the invention as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a part of a substrate. Figure 2 is a schematic illustration of an embodiment of an edge cleaning apparatus in accordance with the present invention. Figures 3A and 3B are partial front and side views, respectively, of a portion of the edge cleaning apparatus of Figure 2.

第4圖為根據本發明之一邊緣清潔設備實施例的立體 圖。 第5圖為根據本發明之另一邊緣清潔設備實施例的立 體圖。 第6圖為第5圖實施例之一部分的立體圖。 第7A與7B圖為用於本發明實施例之不同的可更換匣 盒實施例的局部立體圖。Figure 4 is a perspective view of an embodiment of an edge cleaning apparatus in accordance with the present invention. Figure 5 is a perspective view of another embodiment of an edge cleaning apparatus in accordance with the present invention. Fig. 6 is a perspective view showing a part of the embodiment of Fig. 5. 7A and 7B are fragmentary perspective views of different interchangeable cartridge embodiments for use in embodiments of the present invention.

第8A-8C圖為用於本發明實施例之不同的墊片實施例 的局部立體圖。 第9A-9C圖係繪示第4圖示範性邊緣研磨設備之不同 可能頭位置的實例。 第1 0A-1 0C圖係繪示第4圖示範性邊緣研磨設備之不 同可能頭位置的實例。 第1 1圖為根據本發明之一多頭邊緣研磨設備實施例 的立體圖。 第12圖為根據本發明之另一多頭邊緣研磨設備實施 21 1362697Figures 8A-8C are partial perspective views of different gasket embodiments for use in embodiments of the present invention. Figures 9A-9C are diagrams showing examples of different possible head positions of the exemplary edge grinding apparatus of Figure 4. The 10A-1 0C diagram illustrates an example of different possible head positions of the exemplary edge grinding apparatus of FIG. Figure 11 is a perspective view of an embodiment of a multi-edge edge grinding apparatus in accordance with the present invention. Figure 12 is a view of another multi-edge edge grinding apparatus according to the present invention 21 1362697

例的立體圖D 第13圖為根據本發明之又一多頭邊緣研磨設備實施 例的立體圖。Fig. 13 is a perspective view of an embodiment of a multi-head edge grinding apparatus according to the present invention.

【主要元件符號說明】 100 基材 102、 102’ 主要 表面 104 邊緣 106、 106’ 元件 區域 108、 10 8, 排外區域 110 外緣 112 斜面 114 斜面 200 邊緣研磨設備 202 框架 204 研磨膜 205a- c 箭頭 206 墊片 206A- •C 墊片 207 箭頭 208 供應繞輪 2 10 接取繞輪 212 流體通道 400 邊緣研磨設備 402 框架 404 頭 406 偏壓元件 408 驅動滾筒 410 導引滚筒 412 驅動器 500 邊緣研磨設備 502 框架 504 頭 506 致動器 508 真空夾盤 5 10 驅動器 600 驅動器 602 極紐 604 驅動器 606 支撐滾筒 700A 匣盒 700B 匣盒 702 刻槽 22 136.2697 802 可填充囊袋 804 流體通道 806 流體供應 1100 邊緣研磨設備 1200 邊緣研磨設備 1300 邊緣研磨設備 1302 框架 1304 頭 1306 致動器 1308 控制器[Main component symbol description] 100 substrate 102, 102' main surface 104 edge 106, 106' element area 108, 10 8, exclusion area 110 outer edge 112 slope 114 slope 200 edge grinding apparatus 202 frame 204 abrasive film 205a-c arrow 206 Shims 206A- • C Shims 207 Arrows 208 Supply Wraps 2 10 Pickup Wraps 212 Fluid Channels 400 Edge Grinding Equipment 402 Frame 404 Head 406 Biasing Element 408 Drive Roller 410 Guide Roller 412 Drive 500 Edge Grinding Equipment 502 Frame 504 Head 506 Actuator 508 Vacuum Chuck 5 10 Drive 600 Drive 602 Pole 604 Drive 606 Support Roller 700A Clamshell 700B Clamshell 702 Notch 22 136.2697 802 Fillable Pouch 804 Fluid Channel 806 Fluid Supply 1100 Edge Grinding Equipment 1200 edge grinding equipment 1300 edge grinding equipment 1302 frame 1304 head 1306 actuator 1308 controller

23twenty three

Claims (1)

1362697 第丨冲號專微^年7月修正作 十、申請專利範圍: 1· 一種適用以研磨—基材之邊緣的設備,其至少包含: 一可換研磨膜’其適用以輪廓上相符於該基材; 一框架’其適用以將該可撓研磨膜之至少一第一長 度繃緊’其中該可撓研磨膜之第一長度在接觸於一基材之 前形成一第一平面;以及1362697 The first slogan is revised in July. The scope of the patent application: 1. A device suitable for grinding the edge of a substrate, which comprises at least: a replaceable abrasive film which is adapted to conform to the contour a substrate; a frame adapted to tigh at least a first length of the flexible abrasive film, wherein a first length of the flexible abrasive film forms a first plane prior to contacting a substrate; —基材旋轉驅動器,其適用以旋轉該基材使其沿著 一部分之第一長度抵靠該可撓研磨膜,從而使該基材延伸 到該第一平面内’且該可撓研磨膜可以: 施加張力至該基材; 輪廓上相符於該基材之邊緣,該邊缘包括至少 一外緣與一第一斜面;以及 在該基材被旋轉時’研磨該外緣與該第—斜面; 其中該基材邊緣延伸超過該基材旋轉驅動器;以及 其中該框架更適用以角度地轉移該可撓研磨膜而繞 著該基材邊緣。a substrate rotary actuator adapted to rotate the substrate against a first length of the portion against the flexible abrasive film such that the substrate extends into the first plane ' and the flexible abrasive film can Applying tension to the substrate; contourally conforming to an edge of the substrate, the edge including at least one outer edge and a first bevel; and 'grinding the outer edge and the first bevel when the substrate is rotated; Wherein the edge of the substrate extends beyond the substrate rotary actuator; and wherein the frame is more suitable for angularly transferring the flexible abrasive film around the edge of the substrate. 2.如申請專利範圍第1項所述之設備,其中該框架包括用 在該可撓研磨膜之一供應繞輪與一接取繞輪,且其中該框 架更適用以允許該可撓研磨膜接觸於基材之部分能被更 換。 3.如申請專利範圍第2項所述之設備,其中該可撓研磨膜 24 1362697 係以縱向方向橫跨於該供應繞輪與該接取繞輪之間,且其 中該基材旋轉驅動器係移動該基材之邊緣於該可撓研磨膜 之縱向方向。 4. 如申請專利範圍第1項所述之設備,其中該可撓研磨膜 與該框架被容納在一可更換的匣盒内。2. The apparatus of claim 1, wherein the frame comprises a winding wheel and a take-up reel for use in one of the flexible abrasive films, and wherein the frame is more suitable to allow the flexible abrasive film The portion in contact with the substrate can be replaced. 3. The apparatus of claim 2, wherein the flexible abrasive film 24 1362697 spans between the supply winding and the take-up reel in a longitudinal direction, and wherein the substrate rotates the drive system The edge of the substrate is moved in the longitudinal direction of the flexible abrasive film. 4. The apparatus of claim 1, wherein the flexible abrasive film and the frame are housed in a replaceable cassette. 5. 如申請專利範圍第1項所述之設備,其中該框架更適用 以角度地轉移該可撓研磨膜而繞著一軸以使該可撓研磨膜 接觸於該外緣、該第一斜面、與該基材之一第二斜面,其 中該軸係相切於該基材之外緣。 6.如申請專利範圍第1項所述之設備,其中該框架更適用 以相對於該基材而繞著該基材之邊緣圓周地旋轉該可撓研 磨膜。5. The apparatus of claim 1, wherein the frame is more suitable for angularly transferring the flexible abrasive film about an axis such that the flexible abrasive film contacts the outer edge, the first slope, And a second bevel of the substrate, wherein the shaft is tangent to the outer edge of the substrate. 6. The apparatus of claim 1, wherein the frame is more suitable for circumferentially rotating the flexible abrasive film about the edge of the substrate relative to the substrate. 7 ·如申請專利範圍第1項所述之設備,更包含一流體供應 通道,且其中該流體供應通道係適用以輸送流體至該基材 之邊緣。 8 ·如申請專利範圍第7項所述之設備,其中該流體供應通 道更適用以經由該可撓研磨膜輸送流體至該基材之邊緣。 25 13626977. The apparatus of claim 1, further comprising a fluid supply channel, and wherein the fluid supply channel is adapted to deliver fluid to an edge of the substrate. 8. The apparatus of claim 7, wherein the fluid supply channel is further adapted to deliver fluid to the edge of the substrate via the flexible abrasive film. 25 1362697 9. 如申請專利範圍第7項所述之設備,其中該 道係適用以輸送音波能量至該基材之邊緣。 10. 如申請專利範圍第7項所述之設備,其中 水與一清潔化學物之至少一者。 11. 一種適用以研磨一基材之邊緣的設備,其」 複數個可撓研磨膜; 至少一框架,其適用以將每一可撓研磨 可撓研磨膜之至少一第一長度繃緊,其中每一 之第一長度在接觸於該基材之前形成一第一平 一基材旋轉驅動器,其適用以旋轉該基 至少一可撓研磨膜之一部分第一長度,從而使 到該第一平面内,且從而使在該基材被旋轉時 於該基材之可撓研磨膜係施加壓力至該基材、 於該基材之邊緣、且研磨該邊緣。 1 2.如申請專利範圍第1 1項所述之設備,其中 撓研磨膜包括具有不同磨蝕粒之膜。 1 3 ·如申請專利範圍第1 1項所述之設備,其中 複數個頭,且其中每一頭係適用以支撐至少 膜,且其中該些頭係適用以約同時地將經支撐 流體供應通 該流體包括 έ少包含: 膜沿著每一 可撓研磨膜 面;以及 材使其抵靠 該基材延伸 ,任何接觸 輪廓上相符 該複數個可 該框架包括 一可撓研磨 的可撓研磨 26 13626979. The apparatus of claim 7, wherein the system is adapted to deliver sonic energy to the edge of the substrate. 10. The apparatus of claim 7, wherein at least one of water and a cleaning chemistry. 11. An apparatus for grinding an edge of a substrate, wherein: a plurality of flexible abrasive films; at least one frame adapted to tension at least a first length of each of the flexible abrasive flexible abrasive films, wherein Forming, by the first length of each of the substrates, a first flat substrate rotation driver adapted to rotate a portion of the first length of the at least one flexible abrasive film to the first plane And thereby applying pressure to the substrate, at the edge of the substrate, and grinding the edge of the substrate in the flexible abrasive film of the substrate as it is rotated. 1 2. The apparatus of claim 1 wherein the flexographic film comprises a film having different abrasive particles. The apparatus of claim 11, wherein the plurality of heads, and each of the heads is adapted to support at least a membrane, and wherein the heads are adapted to simultaneously supply the supported fluid to the fluid at about the same time Included includes: a film along each of the flexible abrasive film faces; and a material that extends against the substrate, any contact contour conforming to the plurality of frames, the frame including a flexible abrasive flexible grind 26 1362697 膜接觸於該基材之邊緣。 14.如申請專利範圍第11項所述之設備,其中該框架 複數個頭,且其中每一頭係適用以支撐至少一可撓 膜,且其中每一頭包括一墊片,該墊片係適用以在不 間固持住經支撐而接觸於該基材之邊緣的可撓研磨膜 15.如申請專利範圍第14項所述之設備,其中每一頭 片係適用以推擠頭之可撓研磨膜抵靠旋轉的基材,以 於推擠在該墊片上的一致動器。 16.如申請專利範圍第14項所述之設備,其中每一可 磨膜與每一頭被容納在一可更換的匣盒内。 1 7.如申請專利範圍第1 4項所述之設備,其中該框架 用以角度地轉移每一頭之可撓研磨膜而繞著各自軸以 撓研磨膜接觸於該外緣、該第一斜面、與該基材之一 斜面,其中該軸係相切於該基材之外緣。 18.如申請專利範圍第14項所述之設備,其中該框架 用以相對於該基材而繞著基材邊緣圓周地旋轉每一頭 撓研磨膜。 包括 研磨 同時 〇 之墊 回應 撓研 更適 使可 第二 更適 之可 27 1362697 19.如申請專利範圍第11項所述之設備,更包含一流體供 應通道,且其中該流體供應通道係適用以輸送一流體至該 基材之邊緣。 20.如申請專利範圍第14項所述之設備,更包含一流體供 應通道,且其中該流體供應通道更適用以經由每一頭之可 撓研磨膜輸送一流體至該基材之邊緣-。The film is in contact with the edge of the substrate. 14. The apparatus of claim 11, wherein the frame has a plurality of heads, and wherein each of the heads is adapted to support at least one flexible film, and wherein each of the heads comprises a spacer, the spacer is adapted to A flexible abrasive film that is supported by the edge of the substrate. The apparatus of claim 14 wherein each of the head sheets is adapted to abut against the flexible abrasive film of the push head. A rotating substrate to push the actuator on the spacer. 16. The apparatus of claim 14, wherein each of the abradable membranes and each head are housed in a replaceable cassette. The apparatus of claim 14, wherein the frame is configured to angularly transfer the flexible abrasive film of each head to contact the outer edge of the first bevel around the respective axis with a scratching film. And a beveled surface of the substrate, wherein the shaft is tangent to the outer edge of the substrate. 18. The apparatus of claim 14, wherein the frame is configured to rotate each of the splayed abrasive films circumferentially about the edge of the substrate relative to the substrate. Including the grinding and the matting of the mating is more suitable for the second one. 27 1362697. 19. The apparatus of claim 11, further comprising a fluid supply passage, wherein the fluid supply passage is applicable To deliver a fluid to the edge of the substrate. 20. The apparatus of claim 14, further comprising a fluid supply channel, and wherein the fluid supply channel is adapted to deliver a fluid to the edge of the substrate via the flexible abrasive film of each head. 2 1 .如申請專利範圍第1 9項所述之設備,其中該流體供應 通道係適用以輸送音波能量至該基材之邊緣。 22.如申請專利範圍第1 9項所述之設備,其中該流體包括 水與一清潔化學物之至少一者。 23. —種適用以研磨一基材之邊緣的設備,其至少包含:The apparatus of claim 19, wherein the fluid supply channel is adapted to deliver sonic energy to the edge of the substrate. 22. The device of claim 19, wherein the fluid comprises at least one of water and a cleaning chemistry. 23. An apparatus adapted to grind the edge of a substrate, the at least comprising: 一可撓研磨膜,其適用以輪廓上相符於一基材; 一輪廓化墊片,其係預形成為輪廓上相符於一基材 之邊緣,其中該輪廓化墊片係適用以共形於該基材之邊緣; 一框架,其適用以將該可撓研磨膜之至少一第一長 度繃緊,其中該可挽研磨膜之第一長度在接觸於該基材之 前形成一第一平面;以及 一基材旋轉驅動器,其適用以旋轉該基材使其沿著 一部分之第一長度抵靠該可撓研磨膜,從而使該基材延伸 28 1362697a flexible abrasive film adapted to conformally conform to a substrate; a contoured gasket pre-formed to conformally conform to an edge of a substrate, wherein the contoured gasket is adapted to conformal to An edge of the substrate; a frame adapted to tighten at least a first length of the flexible abrasive film, wherein the first length of the washable abrasive film forms a first plane prior to contacting the substrate; And a substrate rotary actuator adapted to rotate the substrate against the flexible abrasive film along a first length of the portion to extend the substrate 28 1362697 到該第一平面内,且該可撓研磨膜可以: 施加張力至該基材; 輪廓上相符於該基材之邊緣,該邊緣包 一外緣與一第一斜面;以及 在該基材被旋轉時,研磨該外緣與該第-其中該基材邊緣延伸超過該基材旋轉驅動器 其中該框架更適用以角度地轉移該可撓研磨 著該基材邊緣。 括至少 -斜面; ;以及 膜而繞Into the first plane, and the flexible abrasive film can: apply tension to the substrate; contour conforms to the edge of the substrate, the edge includes an outer edge and a first bevel; and the substrate is When rotated, the outer edge is ground with the first - wherein the edge of the substrate extends beyond the substrate to rotate the drive wherein the frame is more suitable for angularly transferring the edge of the substrate to be flexibly ground. Including at least - bevel; ; 2929
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