JP2017087305A - Polishing method and polishing device for disk-shaped work-piece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to perform stable polishing for an outer periphery of a disk-shaped work-piece without generation of a crack or the like.SOLUTION: A polishing method for a disk-shaped work-piece 1 is a method for polishing an outer periphery 2 of the disk-shaped work-piece 1. According to the method, the disk-shaped work-piece 1 is rotated around a central axis A1 perpendicular to surfaces 1a, 1b thereof while a tape 12 provided with a polishing surface 11 being pushed onto the outer periphery 2 of the disk-shaped work-piece 1, whereby the outer periphery 2 of the disk-shaped work-piece 1 is polished.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a polishing method and a polishing apparatus for a disk-shaped workpiece, and more particularly to a technique for polishing the outer periphery of a disk-shaped workpiece.

  For example, a disk-shaped plate glass may be used as a member for supporting a semiconductor wafer during a semiconductor wafer manufacturing process. At this time, the outer periphery of the plate-like plate glass is generally subjected to a polishing process such as chamfering.

  Here, as means for performing polishing processing on the peripheral portion of the plate glass, for example, in Patent Document 1, the polishing tape is sent in the longitudinal direction while pressing the polishing tape against the peripheral portion (edge portion) of the plate glass. Then, a method of polishing the portion pressed against the polishing tape has been proposed.

JP-A-11-99458

  If the polishing tape is used, the contact with the plate glass can be reduced more than the grindstone, so that the occurrence of breakage such as chipping can be avoided and high-quality polishing can be stably performed. However, if the plate glass is to be polished over the entire circumference, it is a matter of course that the polishing tape needs to be moved along the peripheral edge of the plate glass, which increases the time required for the polishing process.

  In view of the above circumstances, in this specification, it is a technical problem to be solved to perform stable polishing in a short time without causing cracks or the like on the outer periphery of a disk-shaped workpiece.

  The solution to the above problem is achieved by the method for polishing a disk-shaped workpiece according to the present invention. That is, this polishing method is a method for polishing the outer periphery of a disk-shaped workpiece, and the disk-shaped workpiece is placed on the surface of the disk-shaped workpiece while pressing a tape having a polishing surface on the outer periphery of the disk-shaped workpiece. It is characterized by the fact that the outer periphery of the disk-shaped workpiece is polished by rotating around a central axis perpendicular to the axis.

  Thus, in the present invention, paying attention to the shape (disk shape) of the workpiece to be polished, the disk-shaped workpiece is placed on the surface while pressing the tape having the polishing surface on the outer periphery of the disk-shaped workpiece. It is characterized by being rotated about a vertical central axis. By rotating the disk-shaped workpiece around its central axis while pressing the tape having the polishing surface in this way, polishing with the tape can be continuously performed along the outer periphery of the disk-shaped workpiece. Further, the polishing speed at that time can be adjusted by the rotational speed of the disk-shaped workpiece. Therefore, the time required for the polishing process can be greatly reduced as compared with the case where the polishing process is performed while moving the tape. In addition, since it is not necessary to move the tape along the outer periphery of the disk-shaped workpiece, the pressing mode of the tape is stable, and high quality and stable polishing can be performed.

  In the polishing method according to the present invention, the tape is disposed at positions facing each other via the disk-shaped workpiece, and the pair of tapes facing each other is pressed against the outer periphery of the disk-shaped workpiece. The workpiece may be rotated.

  According to the polishing method according to the present invention, by rotating the disk-shaped workpiece, it is possible to perform polishing by producing a relative movement with the tape, so that it is possible to avoid the duplication of installation space, A pair of tapes can be arranged at positions facing each other. In addition, by arranging the pair of tapes in this way, the polishing speed for the rotating disk-shaped workpiece can be substantially doubled. Therefore, the time required for the polishing process can be further shortened. Further, by pressing the tape against the outer periphery of the disk-shaped workpiece at positions facing each other via the disk-shaped workpiece, the pressing force by the tape acts on the disk-shaped workpiece from both directions facing each other. Therefore, the pressing force acts on the disk-shaped workpiece in a balanced manner, and more stable polishing can be performed.

  Further, the polishing method according to the present invention may reciprocate the tape along its longitudinal direction while pressing the tape against the outer periphery of the disk-shaped workpiece.

  Thus, if the tape is reciprocated in the longitudinal direction while pressing the tape, the polishing efficiency can be increased as compared with the case where the tape is simply moved in one direction. Therefore, it is possible to shorten the time required for the polishing process and improve the production efficiency. Of course, the risk of cracking and the like is lower than when the tape is fixed and the disk-shaped workpiece is rotated and reciprocated along the longitudinal direction of the tape.

  Further, the polishing method according to the present invention may be a method in which the tape is swung around a virtual axis along the width direction while pressing the tape against the outer periphery of the disk-shaped workpiece.

  As described above, the tape can be swung while being pressed against the disk-shaped workpiece, whereby polishing can be performed while finely changing the region to be polished. Therefore, polishing can be efficiently performed while preventing polishing leakage. Further, the outer periphery of the disk-shaped workpiece can be polished into a shape in which, for example, an end surface (side end surface) orthogonal to the surface and the surface are smoothly connected by a tapered surface or an R surface. Therefore, it becomes possible to finish the outer periphery of the disc-shaped workpiece into a shape resistant to cracking by reducing corner portions that are likely to cause cracking as much as possible. Further, when the tape is swung while being pressed against the outer periphery of the disk-shaped workpiece and is reciprocated along the longitudinal direction, the pressing force of the tape against the outer periphery of the disk-shaped workpiece can be further increased. . Therefore, in order to further improve the polishing efficiency, it is preferable to give the tape a combined operation of swing and reciprocation in the longitudinal direction.

  Further, the polishing method according to the present invention may be such that the tape is reciprocated along the width direction while pressing the tape against the outer periphery of the disk-shaped workpiece.

  When the tape is pressed against the outer periphery of the disk-shaped workpiece, the tape and the disk-shaped workpiece are theoretically point contact or line contact, but in reality, a part of the tape is the outer periphery of the disk-shaped workpiece. Surface contact is made because the shape is deformed according to the above. Nevertheless, since the substantially contacting area is limited to a part of the area centering on the center of the tape in the width direction (for example, an elliptical area having the width direction as the short axis), the areas on both sides in the width direction are used for polishing. It remains unused. Therefore, if the tape is reciprocated along the width direction while pressing the disc against the disk-shaped workpiece as described above, the area that is not used for polishing is reduced as much as possible, and the tape is used efficiently and economically. It becomes possible to do.

  Moreover, the polishing method according to the present invention may be such that the tape is pressed against the outer periphery of the disk-shaped workpiece so that the end in the width direction of the tape does not contact the disk-shaped workpiece.

  On the other hand, if the amount of reciprocation in the direction along the width of the tape is set so that the entire area in the width direction of the tape is in contact with the disk-shaped workpiece, the swing width in the width direction of the tape (reciprocation) When the (amount) is larger than the expected amount, a state in which the tape is completely detached from the disk-shaped workpiece (becomes non-contact) can occur. Therefore, when the tape is next moved in the width direction and brought into contact with the workpiece from the width direction end portion, an undesired contact mode such as bending of the width direction end portion may occur, which is not preferable. Therefore, if the tape is pressed against the outer periphery of the disk-shaped workpiece so that the widthwise end of the tape does not contact the disk-shaped workpiece, the above situation can be avoided and the tape and the disk-shaped workpiece can be avoided. The contact state with the workpiece can be stabilized.

  In the polishing method according to the present invention, the disk-shaped workpiece may be a plate glass for supporting a semiconductor wafer.

  As described above, according to the polishing method according to the present invention, even if the disk-shaped workpiece is made of a brittle material such as glass, a good quality polishing process can be stably performed without causing cracks. Can be applied. Further, due to the flexibility of the tape in the width direction, the tape can be easily copied to the outer periphery of the disk-shaped workpiece and polished without leakage. Therefore, the polishing method according to the present invention can be suitably applied to the outer periphery of a semiconductor wafer supporting plate glass having the same size and shape as the semiconductor wafer.

  Moreover, the solution of the above-mentioned problem is also achieved by the plate glass polishing apparatus according to the present invention. That is, this polishing apparatus is an apparatus for polishing the outer periphery of a disk-shaped workpiece, and is a tape that has a polishing surface and a press that moves the tape in a direction in which the tape is pressed against the outer periphery of the disk-shaped workpiece. It is characterized by the point provided with the tape pressing apparatus which has a contact movement means, and the workpiece | work rotation apparatus which rotates a disk-shaped workpiece | work about the central axis perpendicular | vertical to the surface.

  As described above, according to the polishing apparatus according to the present invention, as in the polishing method according to the present invention, the disk-shaped work is pressed while pressing the tape having the polishing surface on the outer periphery of the disk-shaped work. It can be rotated around a central axis perpendicular to the surface. Thereby, the grinding | polishing process by a tape can be performed continuously along the outer periphery of a disk-shaped workpiece. In addition, the polishing speed at that time can be adjusted by the rotational speed of the disk-shaped workpiece. Therefore, the time required for the polishing process can be greatly reduced as compared with the case where the polishing process is performed while moving the tape. In addition, since it is not necessary to move the tape along the outer periphery of the disk-shaped workpiece, the pressing mode of the tape is stable, and high quality and stable polishing can be performed.

  Further, in the polishing apparatus according to the present invention, the pair of tape pressing devices may be disposed at positions facing each other via the disk-shaped workpiece.

  If comprised in this way, a pair of tape can be arrange | positioned in the position which mutually opposes via a disk-shaped workpiece. Therefore, the tape pressing devices can be installed at positions separated from each other, and a situation where installation spaces overlap can be avoided. Further, if a pair of tapes can be arranged as described above, the polishing speed for the rotating disk-shaped workpiece can be substantially doubled. Therefore, the time required for the polishing process can be further shortened. Further, by pressing the tape against the outer periphery of the disk-shaped workpiece at positions corresponding to each other via the disk-shaped workpiece, the pressing force by the tape acts on the disk-shaped workpiece from both directions facing each other. Therefore, the pressing force acts on the disk-shaped workpiece in a balanced manner, and more stable polishing can be performed.

  In the polishing apparatus according to the present invention, the tape pressing device may further include first reciprocating means for reciprocating the tape in the longitudinal direction.

  Thus, by having both the pressing movement means and the first reciprocating movement means, it is possible to reciprocate in the longitudinal direction while pressing the tape against the disk-shaped workpiece. Therefore, the polishing efficiency can be increased as compared with the case of simply moving in one direction. Accordingly, it is possible to shorten the time required for the polishing process and further improve the production efficiency.

  In the polishing apparatus according to the present invention, the tape pressing device may further include a swinging unit that swings the tape around a virtual axis along the width direction thereof.

  Thus, by having both the pressing and moving means and the swinging means, the tape can be swung while being pressed against the outer periphery of the disk-shaped workpiece. Thereby, since it can grind | polish, changing a grinding | polishing object area | region finely, a grinding | polishing leak can be prevented and it can grind efficiently. Further, the outer periphery of the disk-shaped workpiece can be polished into a shape in which, for example, an end surface (side end surface) orthogonal to the surface and the surface are smoothly connected by a tapered surface or an R surface. Therefore, it becomes possible to finish the outer periphery of the disc-shaped workpiece into a shape resistant to cracking by reducing corner portions that are likely to cause cracking as much as possible. At this time, since the first reciprocating means is provided in addition to the swinging means, the tape can be swung while being pressed against the outer periphery of the disk-shaped workpiece, and can be reciprocated along the longitudinal direction. The effect of further increasing the pressing force of the tape against the outer periphery of the disk-shaped workpiece can be expected.

  In the polishing apparatus according to the present invention, the tape pressing device may further include a second reciprocating means for reciprocating the tape along its width direction.

  Thus, by having both the pressing movement means and the second reciprocating movement means, the tape can be reciprocated along the width direction while pressing the tape against the disk-shaped workpiece. Therefore, it is possible to use the tape efficiently and economically by minimizing the areas not used for polishing, such as both sides of the tape in the width direction.

  As described above, according to the present invention, it is possible to perform stable polishing in a short time without causing cracks or the like on the outer periphery of the disk-shaped workpiece.

1 is a side view of a polishing apparatus according to a first embodiment of the present invention. FIG. 2 is a plan view of the polishing apparatus shown in FIG. 1. It is a principal part expanded sectional view of the plate glass used as grinding | polishing object. It is a principal part enlarged plan view of the notch provided in the outer periphery of plate glass. It is a principal part side view of the grinding | polishing processing apparatus for demonstrating the pressing aspect of the tape at the time of grinding | polishing. It is a principal part side view for demonstrating the attitude | position of the tape at the time of grinding | polishing processing, (a) is the state which orientated the tape in the direction along the side end surface provided in the outer periphery of plate glass, (b) is one side end surface and one side (C) is a diagram showing a state oriented in a direction along a second taper surface connecting the side end face and the other surface. . It is a perspective view of a grinding fluid supply part. It is a principal part expanded sectional view of the plate glass for demonstrating the press aspect of the tape at the time of grinding | polishing. It is a principal part side view of the grinding | polishing processing apparatus for demonstrating the adjustment aspect of the tape length of the predetermined part at the time of grinding | polishing. It is a principal part side view of the grinding | polishing processing apparatus for demonstrating the adjustment aspect of the tape length of the predetermined part at the time of grinding | polishing. It is a principal part side view of the grinding | polishing processing apparatus which concerns on 2nd embodiment of this invention, Comprising: (a)-(c) is a head when a head part exists in the attitude | position shown to Fig.6 (a)-(c), respectively. It is a principal part side view for demonstrating the operation | movement aspect of a part. (A)-(c) is the principal part expanded sectional view of the plate glass for demonstrating the pressing aspect of the tape when a head part rock | fluctuates in the aspect shown to Fig.11 (a)-(c), respectively. . It is a side view of the polish processing apparatus concerning a third embodiment of the present invention. FIG. 14 is a plan view of the polishing apparatus shown in FIG. 13. It is a principal part perspective view for demonstrating the pressing aspect of the tape at the time of the grinding | polishing process using the apparatus shown in FIG.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the case where a plate glass for supporting a semiconductor wafer is polished as an example of a disk-shaped workpiece to be polished will be described below.

  As shown in FIGS. 1 and 2, a polishing apparatus 10 according to a first embodiment of the present invention is for polishing an outer periphery 2 of a disk-shaped plate glass 1, and has a polishing surface 11. A tape pressing device 15 having a tape 12 provided, a pressing moving means 13 for moving the tape 12 in a direction to press the tape 12 against the outer periphery 2 of the plate glass 1, and a tape feeding means 14 for feeding the tape 12 in the longitudinal direction thereof. And a work rotating device 16 for rotating the plate glass 1 as a disk-shaped work around a central axis A1 perpendicular to the surfaces 1a and 1b. Here, the plate glass 1 and the work rotation device 16 are arranged in a predetermined posture so that the central axis A1 of the plate glass 1 is parallel to the vertical direction Z, for example, as shown in FIG.

  In the present embodiment, the tape pressing device 15 is disposed in a pair at positions facing each other via the work rotating device 16. Thereby, the tape 12 of each tape pressing apparatus 15 is arrange | positioned in the position which mutually opposes via the plate glass 1 rotatably supported by the workpiece | work rotation apparatus 16 (both refer FIG. 1).

  Here, the plate glass 1 to be polished is a plate glass for supporting a semiconductor wafer as described above, and has a substantially disk shape as shown in FIG. A notch 3 is provided on the outer periphery 2 of the plate glass 1. Moreover, in this embodiment, when it sees in the cross section containing the central axis A1 of the plate glass 1, as shown in FIG. 3, the outer periphery 2 of the plate glass 1 follows a direction (plate | board thickness direction) parallel to the central axis A1. The side end face 4 that extends linearly and one surface 1a of the glass sheet 1 are connected by the first taper surface 5, and the side end face 4, the other surface 1b of the glass sheet 1 and the second taper surface 6 are connected. It has a cross-sectional shape. Hereinafter, each configuration of the polishing apparatus 10 will be described in detail. In this embodiment, since each tape pressing device 15 has the same structure, the configuration of one tape pressing device 15 (the left tape pressing device 15 in FIG. 1) will be described in detail.

  The tape 12 has a polishing surface 11 on at least one surface, and has such flexibility that it can be deformed following the surface of the outer periphery 2 when pressed against the outer periphery 2 of the plate glass 1 to be polished. Therefore, the material and thickness dimension of the tape 12 can be arbitrarily selected and used within a range that satisfies the above conditions, for example. In addition, when the plate glass 1 has the notch part 3 in the outer periphery 2 like this embodiment, the width direction dimension Wt of the tape 12 is the surface of the notch part 3, and the tape 12 as shown, for example in FIG. For the purpose of avoiding the contact, it can be set larger than the widthwise dimension Wn of the notch 3.

  For the polishing surface 11 of the tape 12, for example, a material in which abrasive grains of a known material such as alumina, silicon carbide, diamond, etc., are fixed to the base of the tape 12 (resin film such as PE) can be used. Further, the particle size is set to, for example, 300 or more and 10,000 or less, preferably 500 or more and 3000 or less.

  For example, as shown in FIG. 1, the tape feeding means 14 includes a tape 12 and a first tape winding body 17 continuous on one side in the longitudinal direction, and a tape 12 and a second tape continuous on the other side in the longitudinal direction. A plurality of support rollers 19 a 1, 19 a 2, 19 b 1, 19 b 2, which are disposed between the tape winding body 18, the first tape winding body 17 and the second tape winding body 18 and support the tape 12. And 20.

  In this case, one of the first tape winding body 17 and the second tape winding body 18 is a delivery side, and the other is a winding side. For example, in the example shown in FIG. Are disposed on a base 21 standing upright as a delivery side and a second tape winding body 18 as a winding side. Therefore, motors 22 and 23 are connected to the first tape winding body 17 and the second tape winding body 18 (see FIG. 2), and by rotating these motors 22 and 23, The tape 12 wound around the plurality of support rollers 19a1, 19a2, 19b1, 19b2, 20 from the first tape winding body 17 toward the second tape winding body 18 is supported by the support rollers 19a1, 19a2, 19b1. , 19b2 and 20 are sent in the longitudinal direction with rotation. The feeding direction in this case is a direction in which the tape 12 passes through the region 24 that can be pressed against the outer periphery 2 of the glass sheet 1 in the direction indicated by the arrow B in FIG. Further, the feeding speed of the tape 12 at this time can be controlled to a predetermined size (for example, 50 mm / min or more and 500 mm / min or less) by adjusting the number of rotations of the motors 22 and 23.

  In the present embodiment, the plurality of support rollers 19a1, 19a2, 19b1, 19b2, and 20 are configured by free rollers 19a1, 19a2, 19b1, and 19b2, and a drive roller 20. Some free rollers 19a1 and 19a2 (hereinafter referred to as first free rollers 19a1 and 19a2) are provided on the base 21 of the tape feeding means 14 together with the tape winding bodies 17 and 18, and the remaining free rollers 19b1 and 19a1 19b2 (hereinafter, referred to as second free rollers 19b1 and 19b2) and the driving roller 20 are provided in the head portion 25 of the tape pressing device 15 described later.

  As shown in FIG. 5, the head portion 25 mainly includes a head base 26 and a head slide portion 27 that can reciprocate in a predetermined direction C with respect to the head base 26. Some of the second free rollers 19b1 (two in the illustrated example) are attached to the head base 26, the remaining second free rollers 19b2 (two in the illustrated example) and the driving roller 20 (two in the illustrated example). Are attached to the head slide portion 27. Here, the predetermined direction C substantially coincides with the longitudinal direction of the tape 12 passing through the pressable area 24 (that is, the feeding direction B). Therefore, the posture of the head unit 25 with respect to the fixed coordinate system (XYZ coordinate system in each figure) by the first rotation drive unit 30 described later, that is, the longitudinal direction (feed direction) of the tape 12 passing through the pressable area 24. When B) changes, the reciprocating direction C of the head slide portion 27 in the fixed coordinate system changes accordingly (details will be described later).

  Here, the head base 26 is provided with a reciprocating drive unit 28 for reciprocating the head slide portion 27 with respect to the head base 26 in a predetermined direction C. By reciprocating the head slide portion 27 in a predetermined direction C by the reciprocating drive unit 28, a part of the second free rollers 19b2 attached to the head slide portion 27 and the drive roller 20 reciprocate integrally ( (See FIG. 5). The second free roller 19b1 attached to the head base 26 does not move relative to the head base 26. Therefore, when the head slide portion 27 is reciprocated in a predetermined direction C with the tape 12 being wound around the free rollers 19b1 and 19b2 and the driving roller 20 as shown in FIG. The passing tape 12 reciprocates in the longitudinal direction. In this case, the first reciprocating means for reciprocating the tape 12 in the longitudinal direction by the head base 26, the head slide part 27, the reciprocating drive part 28, and the second free rollers 19b1, 19b2 and the driving roller 20 described above. Is configured.

  In this case, the amount of reciprocation (stroke amount) of the head slide portion 27 is arbitrary, but if the amount of movement is too small, sufficient polishing cannot be performed, and if the amount of movement is too large, the tape 12 From the viewpoint of followability, the tape 12 is loosened, and the tension of the tape 12 stretched between the pair of second free rollers 19b1 closest to the plate glass 1 provided on the head base 26 may be reduced. From the above viewpoint, the reciprocating amount of the tape 12 by the first reciprocating means is preferably set to 0.5 mm or more and 30 mm or less, and preferably set to 2.0 mm or more and 15 mm or less. Good.

  Further, the reciprocating speed of the head slide portion 27 is also arbitrary. For example, the lower limit thereof is preferably set to such an extent that sufficient polishing can be performed, and the upper limit is a pair of second free rollers without the tape 12 being loosened. It is preferable to set the tension of the tape 12 stretched between 19b1 to such an extent that the tension can be maintained at a required level. Specifically, the reciprocating speed of the tape 12 is preferably set to 100 mm / sec or more and 1500 mm / sec or less, preferably 300 mm / sec or more and 1000 mm / sec or less, More preferably, it is set to 500 mm / sec or more and 700 mm / sec or less. When the tape 12 is fed from one side in the longitudinal direction to the other side at a predetermined feed speed and reciprocated along the feed direction B as in this embodiment, naturally, the tape 12 is reciprocated. It is important to make the moving speed larger than the feed speed.

  A known drive means can be applied to the reciprocating drive unit 28. For example, a combination of one or more known drive means such as a motor, a cylinder, and a cam mechanism can be used.

  The support portion 29 that rotatably supports the head base 26 is provided with a first rotation drive unit 30 (see FIG. 2), and the head unit including the head base 26 is provided by the first rotation drive unit 30. 25 can be tilted at a predetermined angle with respect to the support portion 29. To be precise, by driving the first rotation drive unit 30, as shown in FIGS. 2 and 6, the direction orthogonal to both the feeding direction B of the tape 12 and the pressing movement direction D of the tape 12 is orthogonal. With the central axis A2 extending in the Y-axis direction (in the illustrated example) as the center, the head portion 25 rotates in either the forward or reverse direction with respect to the support portion 29, and the posture of the head portion 25 is set at a predetermined angle. It is configured so that it can be adjusted (ie tilted). In this embodiment, according to the cross-sectional shape (refer FIG. 3) of the outer periphery 2 of the plate glass 1, the 1st attitude | position (attitude shown as a continuous line in FIG. 6 (a)) when mainly grind | polishing the side end surface 4 and The second posture when the first taper surface 5 is mainly polished (the posture indicated by a solid line in FIG. 6B) and the third posture when the second taper surface 6 is mainly polished (FIG. 6 (c), the posture (angle) of the head unit 25 by the first rotation drive unit 30 can be adjusted so as to take three postures (postures indicated by solid lines). The position of the central axis A2 is in the horizontal direction from the position shown in FIG. 6 (where the tape 12 is pressed against the outer periphery 2 of the plate glass 1) depending on various conditions such as the rigidity of the tape 12 and the size of the plate glass 1. It may be set at a position slightly shifted in the X or vertical direction Z. In this case, the head unit 25, the support unit 29, and the first rotation drive unit 30 constitute tilting means. Note that the known drive means described above can be applied to the first rotation drive unit 30 as well as the reciprocation drive unit 28.

  If necessary, the head portion 25 may be provided with a grinding fluid spraying portion 31 for spraying a grinding fluid L such as water toward the polishing surface 11 of the tape 12 (see FIG. 1 and the like). The grinding fluid injection section 31 has a cylindrical shape as shown in FIG. 7, for example, and is formed by opening an injection port 32 for the grinding fluid L on the outer peripheral surface 31a. Further, the direction of the ejection port 32 is constant with respect to the head portion 25 (head base 26), and the grinding liquid L is directed to the polishing surface 11 of the tape 12 that always passes through the pressable area 24 or slightly upstream thereof. Thus, the direction of the injection port 32 is set to a predetermined angle (FIG. 6).

  Further, in the present embodiment, the tape pressing device 15 is configured such that the tape length between the tape take-up bodies 17 and 18 and the pair of drive rollers 20 provided in the head portion 25 (as shown in FIG. The longitudinal dimension of the tape 12 from the one tape winding body 17 to the upper drive roller 20 via the first free rollers 19a1 and 19a2 and the second free roller 19b2, and the second tape winding body 18 Tape length adjusting means 33 for keeping the longitudinal dimension of the tape 12 between the first free rollers 19a1, 19a2 and the second free roller 19b2 and the lower drive roller 20 constant. In the example shown in FIG. 1, a cylinder 34 as a roller moving unit is provided on the base 21 of the tape feeding unit 14. Of the first free rollers 19 a 1 and 19 a 2 attached to the base 21, the side closer to the drive roller 20. The first free roller 19a2 can reciprocate. The cylinder 34 is configured to pull the first free roller 19a2 at a constant pressure.

  In this case, back tension may be applied to the motor 22 of the first tape winding body 17 on the feeding side for the purpose of controlling the tension of the tape 12 (suppressing fluctuation).

  In this embodiment, the pair of driving rollers 20 is provided on the head slide portion 27, and the frictional force generated by winding the tape 12 is applied to the tape 12 and the winding torque is applied to the tape 12. By increasing the tension, the tape length between the drive rollers 20 (the longitudinal dimension of the tape 12 from the one drive roller 20 to the other drive roller 20 through the pressable area 24) can be kept constant. It has a simple structure. At this time, in order to increase the tension of the tape 12 by applying a pulling force by the lower cylinder 34 or a pulling force by the motor 23 of the second tape winding body 18 to the tape 12, the downstream side in the feed direction B of the tape 12. A one-way clutch function may be added to the driving roller 20 (the lower driving roller 20 in FIG. 1).

  Further, for the purpose of reducing vibration when the head slide portion 27 is reciprocated at high speed, for example, as shown in FIG. 1, a compression spring 35, a damper, or the like is provided between the head base 26 side and the head slide portion 27 side. A buffer member may be interposed.

  The pressing movement means 13 is capable of moving in a predetermined direction a moving base 36 to which a support portion 29 that supports the head portion 25 and the base body 21 is attached. For example, a linear movement driving portion such as a motor or a cylinder. (Fig. 1). Further, the moving direction of the head portion 25 at this time is such that the tape 12 can be pressed against the outer periphery of the glass sheet 1 held by the work rotating device 16 described later (direction of arrow D in FIG. 1). Is set. At this time, the pressing direction D of the tape 12 is set so as to be orthogonal to the central axis A1 of the plate glass 1 held by the work rotating device 16.

  The work rotation device 16 includes a holding base 37 for holding the glass sheet 1 as a disk-shaped work, and a second rotation driving unit 38 that rotates the holding base 37 around the central axis A1. The method of holding the plate glass 1 by the holding table 37 is arbitrary, and there are known means such as a means for adsorbing the lower surface 1b of the plate glass 1 and a means for holding the plate glass 1 in its thickness direction by a holding member (not shown). The fixing means of the plate glass 1 can be employ | adopted.

  Next, an example of the grinding | polishing method of the plate glass 1 using the grinding | polishing processing apparatus 10 of the said structure is demonstrated.

  First, as shown in FIG. 1, the plate glass 1 to be polished is placed on the holding table 37 and held (fixed here) in the holding table 37, and the moving base 36 is moved by the pressing moving means 13. The head part 25 attached to the support part 29 is moved in the direction of arrow D. Thereby, the tape 12 moves toward the pressable area 24 together with the head portion 25, and the tape 12 is pressed against the outer periphery 2 of the plate glass 1 (FIG. 5). Here, for example, when the outer periphery 2 of the plate glass 1 has a cross-sectional shape as shown in FIG. 3, the tape 12 is pressed against the side end face 4 provided on the outer periphery 2 of the plate glass 1 (FIG. 8A). )).

  At this time, the motors 22 and 23 connected to the first and second tape winding bodies 17 and 18 are respectively driven to change the first tape winding body 17 to the second tape winding body 18. The tape 12 is sent to the head (FIG. 1). In addition, in the present embodiment, as shown in FIG. 5, the reciprocating drive unit 28 is driven, and the second free roller 19b2 and the drive roller 20 provided on the head slide unit 27 and the head slide unit 27 are described above. By reciprocating integrally along the direction of the double arrow C, the tape 12 stretched between the pair of second free rollers 19b1 disposed closest to the plate glass 1 is moved in the longitudinal direction, that is, the double arrow C. Move back and forth in the direction of. During this time, the second rotation drive unit 38 is driven to rotate the plate glass 1 held by the holding table 37 around the central axis A1. By the above operation, the region (side end surface 4) where the tape 12 is pressed on the surface of the outer periphery 2 of the glass sheet 1 is polished over the entire thickness direction and circumferential direction by sliding of the tape 12, and the surface roughness is increased. Is finished to a predetermined size or less (see FIG. 8A). Further, the above-described polishing process is performed while the region actually used in the polishing surface 11 of the tape 12 is continuously shifted in the direction of the arrow B by the feeding operation of the tape 12 by both the tape winding bodies 17 and 18. Is called.

  After the side end surface 4 of the glass sheet 1 is polished in this way, the head unit 25 and the tape 12 are rotated around the central axis A2 by the first rotation driving unit 30, and FIG. 3 and FIG. As shown, it is set as the attitude | position which match | combined the longitudinal direction of the tape 12 with the direction along the 1st taper surface 5 provided in the outer periphery 2 of the plate glass 1. FIG. Then, while feeding the tape 12 in the direction of the arrow B while maintaining the posture shown in FIG. 6 (b), the tape 12 is reciprocated in the direction of the double arrow C, and the plate glass 1 is rotated around the central axis A1. Thereby, the 1st taper surface 5 is grind | polished over the whole thickness direction and the circumferential direction, and the surface roughness is finished below to predetermined magnitude | size (refer FIG.8 (b)).

  Further, the head unit 25 and the tape 12 are rotated around the central axis A2 by the first rotation driving unit 30, and as shown in FIG. 3 and FIG. The orientation is such that the longitudinal direction of the tape 12 is aligned with the direction along the tapered surface 6. Then, while keeping the posture shown in FIG. 6C, the tape 12 is reciprocated in the direction of the arrow C while feeding the tape 12 in the direction of the arrow B, and the plate glass 1 is rotated around the central axis A1. Thereby, the 2nd taper surface 6 is grind | polished over the whole thickness direction and the circumferential direction, and the surface roughness is finished below to predetermined magnitude | size (refer FIG.8 (c)).

  Thus, in the present invention, the plate glass 1 is rotated around the central axis A1 perpendicular to the surfaces 1a and 1b while pressing the tape 12 provided with the polishing surface 11 against the outer periphery 2 of the plate glass 1 as a disk-shaped workpiece. I tried to make it. By pressing the tape 12 in this way, polishing with the tape 12 can be continuously performed along the outer periphery 2 of the plate glass 1. Further, the polishing speed at that time can be adjusted by the rotation speed of the glass sheet 1 by the second rotation drive unit 38. Therefore, the time required for the polishing process can be greatly reduced as compared with the case where the polishing process is performed while moving the tape 12. Moreover, since it is not necessary to move the tape 12 along the outer periphery 2 of the plate glass 1, the pressing mode of the tape 12 is stabilized, and high quality and stable polishing can be performed. In particular, in this embodiment, as shown in FIGS. 1 and 2, a pair of tape pressing devices 15 are arranged at positions facing each other with the plate glass 1, and each tape pressing device 15 corresponds. While pressing the tape 12 against the outer periphery 2 of the plate glass 1, the plate glass 1 was rotated around the central axis A1. According to this, the grinding | polishing speed with respect to the plate glass 1 of a rotation state can be substantially doubled. Therefore, the time required for the polishing process can be further shortened. Moreover, the pressing force by the tape 12 acts on the plate glass 1 from the opposite direction by pressing the tape 12 against the outer periphery 2 of the plate glass 1 at a position facing each other through the plate glass 1 by 180 °. Therefore, the pressing force acts on the plate glass 1 in a well-balanced manner. In other words, the pressing force from the tape 12 can be effectively applied without rotating or moving the plate glass 1, so that more stable polishing can be performed. It becomes.

  In this embodiment, the tape 12 is reciprocated in the longitudinal direction C while pressing the tape 12 against the outer periphery 2 of the plate glass 1, so that the tape 12 is moved only in one direction (for example, only in the direction of arrow B). Polishing efficiency can be increased compared with the case of sending). Accordingly, it is possible to shorten the time required for the polishing process and further improve the production efficiency.

  Further, in the present embodiment, as the tape length adjusting means 33, the first on the driving roller 20 side disposed between the tape winding bodies 17 and 18 and the driving rollers 20 and 20 by the two cylinders 34, respectively. The free rollers 19a2 and 19a2 are each configured to be pulled at a constant pressure. Thus, for example, when the tape length between the first tape winding body 17 and one (upper side in FIG. 1) drive roller 20 changes due to the reciprocating movement of the head slide portion 27, the reaction from the tape 12 occurs. The first free roller 19a2 is moved in a direction to cancel the change in the tape length to a position that balances with the force (and to a position that balances the reaction force received by the first free roller 19a2 from the tape 12). For example, when the head slide portion 27 moves upward from the reference position shown in FIG. 5 due to reciprocal movement, and the tape length between the first tape winding body 17 and the upper drive roller 20 increases, FIG. As shown, the upper first free roller 19a2 corresponding to the upper cylinder 34 increases in the direction of arrow D, that is, the tape length between the first tape winding body 17 and the upper drive roller 20 increases. The lower first free roller 19a2 corresponding to the lower cylinder 34 moves in the direction opposite to the arrow D. Thus, the tape length between the first tape winding body 17 and the corresponding upper driving roller 20 and the tape length between the second tape winding body 18 and the corresponding lower driving roller 20 are the same. Are kept constant. Further, when the head slide portion 27 moves downward from the reference position shown in FIG. 5 and the tape length between the second tape winding body 18 and the lower drive roller 20 increases, the head slide portion 27 is shown in FIG. Thus, the lower first free roller 19a2 corresponding to the lower cylinder 34 increases in the direction of arrow D, that is, the tape length between the second tape winding body 18 and the lower drive roller 20 increases. The upper first free roller 19a2 corresponding to the upper cylinder 34 moves in the direction opposite to the arrow D. Thus, the tape length between the second tape winding body 18 and the corresponding lower driving roller 20 and the tape length between the first tape winding body 17 and the corresponding upper driving roller 20 are as follows. Are kept constant. As described above, even when the head slide portion 27 reciprocates, the tape length between the tape take-up bodies 17 and 18 and the drive rollers 20 and 20 can be kept constant. It becomes possible to control the pressing force to the outer periphery 2 to a constant magnitude while suppressing the fluctuation. In particular, if the first free roller 19a2 is moved by the constant pressure cylinder 34, the response to the reciprocating movement of the head sliding portion 27 is excellent. Therefore, the head sliding portion 27 (and tape 12) is reciprocated at high speed. It is suitable when making it.

  Of course, in the present invention, since the plate glass 1 is rotated while pressing the tape 12 provided with the polishing surface 11 against the outer periphery of the plate glass 1, the flexibility of the tape 12, particularly the flexibility in the width direction, is exhibited. Thus, the tape 12 can easily follow the outer peripheral surface 2 of the plate glass 1. Further, the tape 12 provided with the polishing surface 11 does not deteriorate its polishing performance even if its shape changes (for example, even if it is curved along the width direction or the longitudinal direction). Therefore, even if the outer periphery 2 of the glass sheet 1 is composed of a plurality of surfaces (a ring-shaped side end surface 4, a first taper surface 5, and a second taper surface 6) as shown in FIG. The outer periphery 2 can be polished without leakage by following the tape 12 on the surface. In addition, since the tape 12 is gentle against the plate glass 1, the possibility of cracking during processing can be reduced compared to a disk-type polishing tool such as a grindstone, and high-quality polishing can be stably performed. Can be applied.

  In the present embodiment, the one in which the notch 3 is provided on the outer periphery 2 of the plate glass 1 is the object to be polished, and the width direction dimension Wt of the tape 12 used for the polishing process is greater than the width direction dimension Wn of the notch 3. Is also set larger. Therefore, as described above, even when the polishing is performed by pressing the tape 12 on the outer periphery while rotating the plate glass 1, there is no concern that the width direction end 12 a of the tape 12 is caught by the notch 3. Therefore, it is possible to perform stable polishing of the surface of the outer periphery 2 regardless of the presence or absence of the notch 3.

  Although the first embodiment of the present invention has been described above, the above-described polishing apparatus 10 and the polishing method can naturally take any form within the scope of the present invention.

  For example, in the first embodiment, as a pressing mode of the tape 12 against the outer periphery 2 of the plate glass 1, the tape 12 is reciprocated along the longitudinal direction C while being fed along the feed direction B, and the plate glass 1 is centered. Although the case where it rotates around A1 was illustrated, of course, this invention can also take other pressing aspects. FIG. 11 illustrates a polishing method according to an example (second embodiment of the present invention). That is, the first rotation drive unit 30 of the head unit 25 according to the present embodiment has the head unit 25 in a predetermined posture and the head unit 25 in both the forward and reverse directions around the central axis A2 based on the predetermined posture. It is configured to repeatedly rotate (that is, swing) at a predetermined speed. For example, when the head unit 25 takes a three-stage polishing posture as shown in FIGS. 6A to 6C, the first rotation driving unit 30 has each posture shown in FIGS. 6A to 6C. Is the reference position, and the head portion 25 is swung around the center axis A2 (repetitively rotated between the postures indicated by two-dot chain lines in FIGS. 11A to 11C).

  When the head portion 25 can be swung (repeatedly rotated in both forward and reverse directions) as described above, the polishing of the glass sheet 1 by pressing the tape 12 is performed in addition to the above-described feeding operation and reciprocating movement of the tape 12, for example. This is performed with the swing of the tape 12. Specifically, first, as shown in FIG. 6A, the head portion 25 is moved in the direction along the side end face 4 provided on the outer periphery 2 of the plate glass 1 by the first rotation driving portion 30. The posture is in the same direction. 6 (a), the tape 12 is fed along the feeding direction B and reciprocated along the longitudinal direction C, and the plate glass 1 is rotated around the central axis A1. Further, with the posture of the head portion 25 shown in FIG. 6A as a reference (with the swing center), the head portion 25 is swung as shown in FIG. The tape 12 is swung around the central axis A2 with a constant amplitude width θ1 (FIG. 12A). Thus, the side end surface 4 is polished over the entire thickness direction and circumferential direction, and the corner portion 7a between the side end surface 4 and the first tapered surface 5 connected on one side in the thickness direction, and the side end surface. The corner portion 7b between 4 and the second tapered surface 6 connected on the other side in the thickness direction is polished.

  Thereafter, the head unit 25 is rotated by the first rotation driving unit 30, and the tape is oriented in the direction along the first tapered surface 5 provided on the outer periphery 2 of the plate glass 1 as shown in FIG. The posture is a combination of 12 longitudinal directions. 6 (b), the tape 12 is fed along the feeding direction B, reciprocated along the longitudinal direction C, and the plate glass 1 is rotated around the central axis A1. Further, with the posture of the head portion 25 shown in FIG. 6B as a reference (with a swing center), the head portion 25 is swung as shown in FIG. The tape 12 is swung around the central axis A2 with a constant amplitude width θ2 (FIG. 12B). Thereby, the first tapered surface 5 is polished over the entire thickness direction and circumferential direction, and the corner portion 7c between the first tapered surface 5 and one surface 1a connected on one side in the thickness direction. And the corner | angular part 7a between the side end surfaces 4 mentioned above is grind | polished.

  Further, the head unit 25 is rotated by the first rotation driving unit 30, and the tape 12 is oriented in the direction along the second tapered surface 6 provided on the outer periphery 2 of the plate glass 1 as shown in FIG. The posture is the same in the longitudinal direction. Then, in the posture shown in FIG. 6C, the tape 12 is fed along the feeding direction B, reciprocated along the longitudinal direction C, and the plate glass 1 is rotated around the central axis A1. Further, with the posture of the head portion 25 shown in FIG. 6C as a reference (with a swing center), the head portion 25 is swung as shown in FIG. The tape 12 is swung around the central axis A2 with a constant amplitude width θ3 (FIG. 12C). Accordingly, the second tapered surface 6 is polished over the entire thickness direction and the circumferential direction, and the corner portion 7d between the second tapered surface 6 and the other surface 1b connected on one side in the thickness direction. And the corner | angular part 7b between the side end surfaces 4 mentioned above is grind | polished.

  In this way, the tape 12 is swung while being pressed against the plate glass 1, and the polishing process is performed while finely changing the area of the outer peripheral surface 2 where the tape 12 is mainly pressed strongly (that is, the substantial polishing area). Can do. Therefore, polishing can be efficiently performed while preventing polishing leakage. Further, the outer periphery 2 of the plate glass 1 is arranged between the side end face 4 in the direction orthogonal to the surfaces 1a and 1b and the first and second tapered faces 5 and 6 (corner portions 7a and 7b), and each tapered face 5 , 6 and the surfaces 1a and 1b of the glass sheet 1 (corner portions 7c and 7d) can be polished into a shape that is smoothly connected by, for example, an R surface. Therefore, it becomes possible to finish the outer periphery 2 of the glass sheet 1 into a shape resistant to cracking by reducing the corners 7a to 7d that are likely to cause cracking as much as possible. In particular, when the tape 12 is swung while being pressed against the outer periphery 2 of the plate glass 1 as in the present embodiment and is reciprocated along the longitudinal direction C, the tape 12 is pressed against the outer periphery 2 of the plate glass 1. The power can be further increased.

  In addition, the present invention can take still another pressing mode. FIG. 13 is a side view of a polishing apparatus 10 according to an example (third embodiment of the present invention), and FIG. 14 is a plan view of the polishing apparatus 10. In addition to the holding table 37 and the second rotation driving unit 38 described above, the work rotation device 16 of the polishing apparatus 10 moves the holding table 37 and the second rotation driving unit 38 in a predetermined direction E (both shown in FIG. 14). It differs from the polishing apparatus 10 according to the first and second embodiments in that it has second reciprocating means 39 that reciprocates along the direction of arrow E). In this case, the reciprocating direction E of the holding table 37 and the second rotation drive unit 38 by the second reciprocating means 39 is parallel to the central axis A2 when the head unit 25 is swung as shown in FIG. It is set as follows. In other words, the reciprocating direction E is set in a direction orthogonal to both the pressing movement direction D and the reciprocating direction C of the tape 12. Further, the amount of reciprocation at this time is such that, for example, as shown in FIGS. 15B and 15C, which will be described later, the tape 12 and the plate glass 1 are greatly displaced in the width direction of the tape 12. The width direction end portion 12a is set to an appropriate size in relation to the width direction dimension Wt (FIG. 4) of the tape 12 so as not to contact the outer periphery 2 of the plate glass 1.

  When the plate glass 1 can be reciprocated in the width direction of the tape 12 in this way, the polishing of the plate glass 1 by pressing the tape 12 is performed in addition to the above-described feeding operation, reciprocating movement, and swinging of the tape 12, for example. The reciprocation along the width direction of the tape 12 is performed. Specifically, first, as shown in FIG. 6A, the head portion 25 is moved in the direction along the side end face 4 provided on the outer periphery 2 of the plate glass 1 by the first rotation driving portion 30. The posture is in the same direction. Then, while feeding the tape 12 along the feeding direction B and reciprocating along the longitudinal direction C in the posture shown in FIG. 6A, the tape 12 is swung around the central axis A2 (FIG. 12A). ) And the plate glass 1 is rotated around the central axis A1. Furthermore, the tape 12 is reciprocated along the width direction by reciprocating the plate glass 1 with a constant amplitude width along the width direction E of the tape 12 as shown in FIG. Thereby, the polishing surface 11 of the tape 12 contacts (presses) in a wide area in the width direction with the outer peripheral surface 2 of the plate glass 1, in particular, the side end surface 4, and the polishing surface 11 of the tape 12 has a side end surface over the wide area in the width direction. 4 is used for polishing.

  Thereafter, the head unit 25 is rotated by the first rotation driving unit 30, and the tape is oriented in the direction along the first tapered surface 5 provided on the outer periphery 2 of the plate glass 1 as shown in FIG. The posture is a combination of 12 longitudinal directions. 6 (b), the tape 12 is swung around the central axis A2 while being fed along the feed direction B and reciprocating along the longitudinal direction C (FIG. 12 (b)). ) And the plate glass 1 is rotated around the central axis A1. Further, as shown in FIG. 15 (b), by reciprocating the plate glass 1 with a constant amplitude width along the width direction E of the tape 12, the tape 12 is reciprocated along the width direction. Thereby, the polishing surface 11 of the tape 12 contacts (presses) in the wide direction in the width direction with the outer peripheral surface 2 of the plate glass 1, particularly the first taper surface 5, and the polishing surface 11 of the tape 12 wide in the width direction. The first taper surface 5 is used for polishing.

  Thereafter, the head unit 25 is rotated by the first rotation driving unit 30, and the tape is oriented in the direction along the second tapered surface 6 provided on the outer periphery 2 of the plate glass 1 as shown in FIG. The posture is a combination of 12 longitudinal directions. Then, the tape 12 is swung around the central axis A2 while feeding the tape 12 along the feeding direction B and reciprocating along the longitudinal direction C in the posture shown in FIG. 6C (FIG. 12C). ) And the glass sheet 1 is rotated around the central axis A1. Furthermore, the tape 12 is reciprocated along the width direction by reciprocating the plate glass 1 with a constant amplitude width along the width direction E of the tape 12 as shown in FIG. As a result, the polishing surface 11 of the tape 12 is in contact with the outer circumferential surface 2 of the glass sheet 1, particularly the second tapered surface 6, in a wide area in the width direction (pressed), and the polishing surface 11 of the tape 12 is wide in the width direction The second taper surface 6 is used for polishing.

  In this way, if the tape 12 is reciprocated along the width direction E while pressing the outer periphery 2 of the plate glass 1, the region of the polishing surface 11 of the tape 12 that is not used for polishing is reduced as much as possible. The tape 12 can be used efficiently and economically. Of course, the reciprocating movement along the width direction E of the tape 12 described above is an operation independent of the feeding operation along the feeding direction B and the reciprocating movement along the longitudinal direction C described above. By polishing the outer periphery 2 of the glass sheet 1 with reciprocation along the width direction E, it becomes possible to further improve the polishing efficiency and shorten the polishing time.

  In the first to third embodiments, the tape 12 is moved in three different positions (FIGS. 6A to 6) by repeating the intermittent rotation of the head unit 25 by the first rotation driving unit 30. The posture shown in (c)) is held for a certain period of time, during which the feeding operation of the tape 12, the reciprocating movement along the longitudinal direction C, the swinging around the central axis A2, and the reciprocating movement along the width direction E are performed. Although the case where it performs is illustrated, of course, it is not restricted to this pressing aspect. For example, the polishing process may be performed while continuously changing the posture of the tape 12 in accordance with the three-dimensional surface shape of the outer periphery 2 to be polished.

  Moreover, the series of pressing operations described above may be arbitrarily combined. For example, the feeding operation of the tape 12, the reciprocating movement along the longitudinal direction C, and the reciprocating movement along the width direction E can be combined and used for polishing. In short, as long as the sheet glass 1 is rotated around the central axis A2 perpendicular to the surfaces 1a and 1b while pressing the tape 12 against the outer periphery 2 of the sheet glass 1, the other operations of the tape 12 are arbitrary.

  In the above description, the case where the outer periphery 2 of the glass sheet 1 provided with the notch 3 is polished is illustrated, but the present invention is applied to the disk-shaped glass plate 1 without the notch 3. It is possible to apply. Of course, as long as the plate glass 1 to be polished has a disk shape, its use and material are not limited.

DESCRIPTION OF SYMBOLS 1 Sheet glass 1a, 1b Surface 2 Outer periphery 3 Notch part 4 Side end surface 5, 6 Tapered surface 7a, 7b, 7c, 7d Corner | angular part 10 Polishing apparatus 11 Polishing surface 12 Tape 12a Width direction edge part 13 Pushing movement means 14 Tape Feed means 15 Tape pressing device 16 Work rotation device 17, 18 Tape winding body 19a1, 19a2, 19b1, 19b2 Free roller 20 Driving roller 21 Base 22, 23 Motor 24 Pressable area 25 Head portion 26 Head base 27 Head slide Unit 28 reciprocating drive unit 29 support unit 30 first rotation driving unit 31 grinding fluid injection unit 32 injection port 33 tape length adjusting means 34 cylinder 35 compression spring 36 moving base 37 holding base 38 second rotation driving unit 39 second reciprocating movement Mean A1 Center axis (sheet glass)
A2 Center axis (head)
B Tape feed direction C Tape longitudinal direction D Tape pressing direction E Tape width direction L Grinding fluid Wn Notch width dimension Wt Tape width dimension

Claims (12)

A method for polishing the outer periphery of a disk-shaped workpiece,
The outer periphery of the disk-shaped workpiece is polished by rotating the disk-shaped workpiece around a central axis perpendicular to the surface of the disk-shaped workpiece while pressing a tape having a polishing surface against the outer periphery of the disk-shaped workpiece. A polishing method for a disk-shaped workpiece to be applied.   The tape is disposed at positions facing each other via the disk-shaped workpiece, and the disk-shaped workpiece is rotated while pressing a pair of tapes facing each other against the outer periphery of the disk-shaped workpiece. 2. A polishing method for a disk-shaped workpiece according to 1.   The method for polishing a disk-shaped workpiece according to claim 1 or 2, wherein the tape is reciprocated along a longitudinal direction thereof while pressing the tape against an outer periphery of the disk-shaped workpiece.   The method for polishing a disk-shaped workpiece according to any one of claims 1 to 3, wherein the tape is swung around an imaginary axis along a width direction thereof while pressing the tape against an outer periphery of the disk-shaped workpiece. .   The method for polishing a disk-shaped workpiece according to any one of claims 1 to 4, wherein the tape is reciprocated along the width direction while pressing the tape against the outer periphery of the disk-shaped workpiece.   The disk-shaped workpiece polishing process according to any one of claims 1 to 5, wherein the tape is pressed against an outer periphery of the disk-shaped workpiece so that an end in a width direction of the tape is not brought into contact with the disk-shaped workpiece. Method.   The disk-shaped workpiece polishing method according to any one of claims 1 to 6, wherein the disk-shaped workpiece is a plate glass for supporting a semiconductor wafer. An apparatus for polishing the outer periphery of a disk-shaped workpiece,
A tape pressing device having a tape provided with a polishing surface, and a pressing moving means for moving the tape in a direction in which the tape is pressed against the outer periphery of the disk-shaped workpiece;
A disk-shaped workpiece polishing apparatus comprising: a workpiece rotating device configured to rotate the disk-shaped workpiece around a central axis perpendicular to the surface thereof.   The disk-shaped workpiece polishing apparatus according to claim 8, wherein the pair of tape pressing devices are disposed at positions facing each other with the disk-shaped workpiece interposed therebetween.   The disk work polishing apparatus according to claim 8 or 9, wherein the tape pressing device further includes first reciprocating means for reciprocating the tape in the longitudinal direction thereof.   The disk work polishing apparatus according to any one of claims 8 to 10, wherein the tape pressing device further includes a swinging unit that swings the tape about a virtual axis along the width direction thereof. The disk work polishing apparatus according to any one of claims 8 to 11, wherein the tape pressing device further includes second reciprocating means for reciprocating the tape along the width direction thereof.

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