KR20080075001A - Methods and apparatus for processing a substrate - Google Patents

Abstract

Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

Description

Substrate Processing Method and Apparatus {METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE}

The present invention discloses US patent application Ser. No. 11 / 299,295 (Lawyer No. 10121), filed Dec. 9, 2005, entitled "Substrate Processing Method and Apparatus" and "Substrate Processing Method and Apparatus" U.S. Patent Application No. 11 / 298,555, filed on December 9, 2005 (attorney's case number 10414), the priority of which is incorporated herein by reference in its entirety for all purposes.

FIELD OF THE INVENTION The present invention generally relates to substrate processing, and more particularly to methods and apparatus for cleaning edges of substrates.

Conventional systems that contact a substrate edge with a wear film to clean the substrate edge do not thoroughly clean the substrate edge. For example, the abrasive film does not sufficiently contact all four sides of the edge during cleaning. In addition, the abrasive film is abraded by use and thus loses the ability to sufficiently clean the substrate and requires frequent replacement, which can affect the manufacturing productivity of semiconductor devices. Therefore, there is a need for an improved method and apparatus for cleaning the edges of a substrate.

In one aspect of the invention, an apparatus configured to polish an edge of a substrate includes a polishing film; A frame applying tension to the polishing film such that at least a portion of the polishing film is supported in the flat surface; And a plane of the polishing film such that the polishing film exerts tension on the substrate and is aligned with an edge shape of the substrate including at least an outer edge and a first slope, and polishes the outer edge and the first slope as the substrate rotates. And a substrate rotation driver configured to rotate the substrate relative to the substrate.

In another aspect of the invention, an apparatus configured to polish an edge of a substrate includes a plurality of polishing films; A frame that tensions each polishing film such that at least a portion of each polishing film is supported within each flat surface; And apply a substrate to at least one of each flat surface of the polishing film such that a polishing film in contact with the substrate tensions the substrate, is aligned with an edge shape of the substrate, and polishes the edge as the substrate rotates. And a substrate rotation driver configured to rotate.

In another aspect of the invention, an apparatus configured to polish an edge of a substrate comprises: a polishing film having a polishing side and a second side; An inflatable pad disposed adjacent the second side of the polishing film; A frame configured to support the polishing film and the inflatable pad; And a substrate rotation driver configured to rotate the substrate relative to the polishing side of the polishing film. The polishing film is arranged between the edge of the substrate and the inflatable pad such that the inflatable pad and the polishing film are aligned with the edge shape of the substrate and the polishing film contacts the edge of the substrate.

In another aspect of the invention, a method of cleaning a substrate edge comprises the steps of (a) supporting a polishing film; (b) matching the polishing film to an edge of the substrate including an outer edge and at least one slope; And (c) rotating the substrate.

Other features and aspects of the present invention will become more apparent from the following detailed description, claims, and accompanying drawings.

1 is a schematic illustration of a portion of a substrate in a cross-sectional view,

2 is a view schematically showing an exemplary embodiment of an edge cleaning device according to the present invention;

3A and 3B are front and side views, respectively, of a portion of the edge cleaning apparatus of FIG. 2;

4 is a perspective view showing an exemplary embodiment of an edge cleaning device according to the present invention;

5 is a perspective view showing another exemplary embodiment of an edge cleaning device according to the present invention;

FIG. 6 is a perspective view illustrating a portion of the exemplary embodiment shown in FIG. 5;

7A and 7B are perspective views showing other embodiments of replaceable cassettes for use in embodiments of the present invention,

8A-8C are perspective views showing other embodiments of pads for use in embodiments of the present invention;

9A-9C are plan views illustrating examples of other possible head positions of the exemplary edge polishing apparatus of FIG. 4, FIGS.

10A-10C are plan views showing other possible head positions of the exemplary edge polishing apparatus of FIG. 5,

11 is a perspective view illustrating an embodiment of a multiple head edge polishing apparatus according to the present invention;

12 is a perspective view showing another embodiment of the multi-head edge polishing apparatus according to the present invention,

13 is a perspective view showing another embodiment of the multi-head edge polishing apparatus according to the present invention.

The present invention provides an improved method and apparatus for cleaning and / or polishing the edges of a substrate. Referring to FIG. 1, the substrate 100 includes two major surfaces 102, 102 ′ and an edge 104. Each major surface 102, 102 ′ of the substrate 100 may include device regions 106, 106 ′ and exclusion regions 108, 108 ′. (Normally, however, only one of the two major surfaces 102, 102 'includes the device region and the exclusion region.) The exclusion regions 108, 109' are defined between the device regions 106, 106 'and the edge 104. Can act as a shock absorber. Edge 104 of substrate 100 may include outer edge 110 and slopes 112, 114. Slopes 112 and 114 may be located between the exclusion areas 108 and 108 ′ of the two major surfaces 102 and 102 ′ and the outer edge 110. The present invention is employed to clean and / or polish at least one slope 112, 114 and outer edge 110 of the substrate 100 without affecting the device regions 106, 106 '. In some embodiments, all or some of the exclusion areas 106 and 106 'may be well cleaned or polished.

The present invention supports an abrasive buffer or film (eg, an abrasive polishing film) against the edge of the substrate 100 when the substrate 100 is rotated (eg, by a vacuum chuck, drive roller, etc.). Provides a frame for The film may be pressed against the rotating substrate edge 104 using a pad that is pressed by the actuator and / or the inflatable pad. In either case, the pads and / or inflatable pads can have a shape that is flexible or consistent to match the shape of the substrate edge 104. Depending on the amount of force exerted by the actuator, the elasticity of the selected pad, the amount of inflation of the inflatable pad, and / or the amount of tension on the film, a controlled amount of pressure may be applied to polish the edge 104. Alternatively or additionally, the film exerts a tension that allows the film itself to change on the substrate edge 104 (eg, regardless of whether it receives additional support from the pad) and at least one of the slopes 112, 114 and the outer edge. It is configured to match the shape of 110. Thus, the present invention provides accurate control of the edge polishing process that can be used to compensate for different edge shapes and to compensate for changes in the substrate 100 when material is removed from the edge 104.

In some embodiments, the frame can support multiple heads, each head being used to support a polishing film. The head can support different types of film (eg, different abrasive grit films) that can be used simultaneously or at different times in a predetermined sequence. The head may be arranged at different locations to polish different portions of the edge of the substrate 100 on which the supported film rotates. The head is configured to move around the edge 104 by the frame to polish different portions of the edge 104 (eg, around the tangential axis of the substrate 100 and / or circumferentially about the substrate 100). Are configured to translate in order). In some embodiments, the head vibrates continuously around the rotating edge 104 of the substrate 100. Each head may be included in a cassette that contains and / or replaces an index spool of film.

Additionally or alternatively, the present invention may include facilities for dispensing fluid to the substrate edge 104 to be polished. In some embodiments, one or more channels are provided to direct chemical or water to the substrate edge 104 to clean or assist with the particles resulting from polishing. The chemical may be sprayed directly onto the substrate 100 at the substrate / polish film interface or applied to and / or through the film and / or pad. Fluid may be injected from either or both sides of the substrate 100 and the present invention may use gravity or suction so that the effluent does not contaminate or contact the substrate 100 or other portions of the apparatus of the present invention. In addition, energy (eg, ultrasonic energy) may be applied to the substrate edge 104 through a fluid that carries such energy.

The substrate 100 may be rotated in the horizontal plane. In further or alternative embodiments, the substrate 100 may be rotated in a vertical, non-horizontal plane and may be moved between different rotating surfaces.

Referring to FIG. 2, a schematic diagram of an edge polishing apparatus 200 is shown. The frame 202 supports and places the polishing film 204 under tension and in a plane perpendicular to the major surfaces 102, 102 ′ of the substrate 100 so that the edge 104 of the substrate 100 is positioned relative to the polishing film 204 ( For example, as indicated by the straight down arrow 205a) and the polishing film 204 may match the shape of the substrate edge 104. As indicated by the curved arrow 205c, the substrate 100 can be rotated relative to the polishing film 204. The substrate 100 may be rotated at a rate in the range of about 50 to 300 RPM, although other rotation rates may also be used. The substrate 100 may be in contact with the polishing film 204 for about 15 to 150 seconds depending on the film type used, the grit of the film, the rotation rate, the amount of polishing required, and the like. Some time is also available. In some embodiments, the polishing film 204 may be supported by a pad 206 mounted to the frame 202 and arranged adjacent to the backside (eg, non-polishing surface) of the polishing film 204. As indicated by the straight upward pointed arrow 207, the frame including the tensioned polishing film 204 and / or the pad 206 may be pressed against the edge 104 of the substrate 100. In some embodiments, the substrate is about 0.5 lbs. It can be pressed against the polishing film in an amount of force ranging from about 2.0 lbs.

Additionally or alternatively, additional lengths of polishing film 204 may be supported or tensioned by spools 208 and 210 mounted to frame 202. The support spool 208 may be used to press and unwind the unused polishing film 204 to a position adjacent to the substrate 100, while the take-up spool 210 may be used and / or worn polishing film ( 204 is configured to receive. One or two of the spools 208, 210 can index precisely control the amount of polishing film 204 advanced. The polishing film 204 can be made of many different materials, including aluminum oxide, silicon oxide, silicon carbide, and the like. Other materials may also be used. In some embodiments, the abrasive used may range from about 0.5 μ to about 3 μ, although other sizes may be used. Different widths may be used, ranging from about 1 inch to about 1.5 inches (other widths may be used of course). In one or more embodiments, the polishing film may have a thickness of about 0.002 to about 0.02 inches and in embodiments using pad 206 resists a tensile force of about 1 to 5 lbs. And in padless embodiments Resist tensile forces of about 3 to about 8 lbs. Other films with different thicknesses and strengths can be used. Spools 208 and 210 are approximately 1 inch in diameter, hold about 500 inches of polishing film 204 and may be constructed of any practical material, such as polyurethane, polyvinyl difluoride (PVDF), and the like. Other materials may also be used. Frame 202 may be constructed from any practical material, such as aluminum, stainless steel, or the like.

In some embodiments, one or more fluid channels 212 (eg, spray nozzles or bars) may be provided to dispense chemicals and / or water to assist in polishing / cleaning the substrate edge 104, The lubricated and removed material of the substrate can be sent away. Fluid channel 212 may be configured to distribute fluid to substrate 100, polishing film 204, and / or pad 206. The fluid may include deionized water that acts as a lubricant and serves to clean the particles. Surface active agents and / or other known cleaning chemicals may also be included. In some embodiments, sonic (eg, ultrasonic) nozzles can be used to dispense sonicated fluid to the substrate edge 104 to supplement cleaning. Fluid may also be dispensed to the edge 104 through the polishing film 204 and / or the pad 206.

3A and 3B, there is shown a schematic front and cross sectional views, respectively, of the polishing film 204 and the pad 206 of Fig. 2. The force (indicated by the straight arrows) is applied to the polishing film ( It should be noted that the pad 206 and the pad 206 match the shape of the edge 104 of the substrate 100. In some embodiments, if the substrate 100 is not present, the pad 206 may cause the pad 206 to be removed. The pressing substrate 100 has a flat surface shown .. Similarly, if no substrate 100 is present, the polishing film 204 lies flat and is indicated by straight lines on both sides.

4 and 5, two further alternative examples of edge polishing apparatus 400, 500 are shown. As shown in FIG. 4, an exemplary edge polishing apparatus 400 supports a polishing film 204 that is tensioned between spools 208, 210 and supports a head 404 further supported by a pad 206. It may include a base or frame 402 that includes. As shown, the pad 206 may be mounted to the head 404 via a deflection device (eg, a spring). The edge polishing apparatus 400 of FIG. 4 includes a guide roller 410 (two shown) and one or more drive rollers configured to rotate the edge 104 of the substrate 100 relative to the polishing film 204. Two are shown). The drive rollers 408 may be themselves each other driven by a driver 412 (eg a motor, gear, belt, chain, etc.).

The driving roller 408 and the guide roller 410 may include grooves for allowing the rollers 408 and 410 to support the substrate 100 alone. In some embodiments, the groove in the drive roller 408 may have a diameter of approximately 2.5 inches and the groove in the guide roller 410 may have a diameter of approximately 1 inch. Other diameters are possible. The area of the drive roller 408 in contact with the substrate 100 may include texturing or cross grooves that enable the drive roller 408 to grip the substrate 108. The driving roller 408 and the guide roller 410 may be made of a material such as polyurethane, polyvinyl difluoride (PVDF), or the like. Other materials may also be used.

As shown in FIG. 5, another exemplary edge polishing apparatus 500 supports a polishing film 204 that is tensioned between spools 208, 210 and supports a head 504 further supported by a pad 206. It may include a base or frame 502 that includes. As shown, the pad 206 may be mounted to the head 504 via an actuator 506 (eg, pneumatic slide, hydraulic ram, servomotor drive pusher, etc.). Edge polishing apparatus 500 of FIG. 5 may include a vacuum chuck 508 connected by a driver 510 (eg, a motor, gear, belt, chain, etc.). An advantage of the embodiment shown in FIG. 5 is that the device 500 does not need to contact the edge 104 to be polished. As such, the possibility of particles laminating on the drive roller and the possibility of relaid on the edge 104 is eliminated. It also eliminates the need to clean the rollers. In addition, the possibility that the rollers damage or scratch the edges is also eliminated. By holding the substrate in a vacuum chuck, high speed rotation without vibrations can be achieved.

6-8B, details of the features of the example embodiments of FIGS. 4 and 5 are described. It is to be understood that features from different embodiments may be combined with many different practical examples in a manner that results in different designs or interests.

FIG. 6 is a detailed view of frame 502 including head 504 of FIG. 5. As mentioned above, the head 504 supports the tensioning polishing film 204 between the spools 208 and 210. The frame 502 comprising the head 504 is connected to the edge 104 of the substrate 100 held in the edge polishing apparatus 100 by a driver 600 (e.g., a servomotor) and a pivot 602. It is configured to translate at an angle to the tangent axis (Fig. 5). The angular motion of the frame (and polishing film 204) is described in more detail later with respect to FIGS. 9A-10C.

In addition, the spools 208, 210 mounted to the head 504 may be driven by one or more drivers 604 (eg servo motors). The driver 604 can provide an indexing ability to allow the unused polishing film 204 to be advanced or continuously fed to the substrate edge and a tensile ability to stretch the polishing film to apply pressure to the substrate edge. .

As shown more clearly in FIG. 6 (relative to FIG. 5), an optional pad 206 is configured to adjust the pressure of the polishing film 204 against the substrate edge 104 to match its shape. Can be mounted to head 504 via 506 (FIG. 5). In addition, one or more support rollers 606 may also be mounted to guide and align the polishing film 204 to a surface perpendicular to the main surface 102 (FIG. 1) of the substrate 100 held in the edge polishing apparatus 500. May be (Figure 5).

It should be noted that in the embodiment shown in FIGS. 5 and 6 the length of the polishing film 204 is arranged perpendicular to the edge 100 of the substrate 100 to be polished. This is in contrast to the embodiment shown in FIG. 2 in which the longitudinal direction of the polishing film 204 is aligned with the edge 104 of the substrate 100 to be polished. The orientation and configuration of other polishing films can also be used. For example, the polishing film 204 may be maintained diagonally with respect to the main surface 102 of the substrate 100.

7 and 7A, a perspective view showing two different embodiments of replaceable cassettes 700A, 700B. The cassettes 700A, 700B are polished with the head 404 in a disposable, reusable, and / or replaceable package that can be quickly and easily mounted and / or removed from the frames 402, 502 of the different edge polishing apparatus 400, 500. Film 204 may be provided.

As shown in FIG. 7A, cassette 700A may include a head 404 that supports polishing film 204 spaced apart from feed reel 208 to take-up reel 210. The polishing film 204 may be guided and aligned by a support roller 606 mounted to the head 404. The pad 206 is configured to further support the polishing film 204 as described above. As also discussed above, the deflection device 406 may be used to mount the pad 206 to the head 404 to provide flexible and / or dynamic shape matching pressure on the pad 206.

In another alternative embodiment, as shown in FIG. 7B, instead of the pad 206, the head 404 may simply rely on the tensile force of the polishing film 204 to provide lateral pressure to the substrate edge 104. (FIG. 1). In some embodiments, the head 404 may include a notch 702 as shown in FIG. 7B to accommodate the substrate 100.

8A and 8B, two different alternative embodiments of pads 206A and 206B are shown. In addition to the pad 206 (FIG. 6) having a flat surface that is co-planar with the polishing film 204 when no substrate is present, the pad 206A matches the shape of the edge 104 of the substrate 100. It may comprise a concave surface. Alternatively, as shown in FIG. 8B, the pad 206b may include a double concave surface that better matches the shape of the edge of the substrate 100. In yet another alternative embodiment, the pad 206 may include forming grooves that exactly match the shape of the edge 104 of the substrate 100, including the slopes 112, 114 and the outer edge 110 (FIG. 1). have.

The pads 206, 206A, 206B may be, for example, acetal resins (e.g., Delrin®, manufactured by DuPont Corporation), PVDF, polyurethane closed cell foam, silicone rubber, and the like. It can be made of the same material. Other materials may also be used. Such materials may have elastic or shape matching capabilities depending on the thickness or density of the pads. Such materials may be selected based on elasticity. The desired elasticity can be selected depending on the type of polishing required.

In some embodiments, the pads 206, 206A, 206B have an adjustable elasticity that may match shape with the edge of the substrate. For example, pads 206, 206A, and 206B include inflatable bladders to add more air or liquid or other fluid to make the pads harder and to reduce the amount of liquid or air or other fluid in the bladder. So that the pad can be better matched to the shape. 8C illustrates an embodiment of a pad 206C that includes an expandable bladder 802 that can be filled (and / or emptied) through the fluid channel 804 by fluid from the fluid source 806. Shows. In some embodiments, the fluid source 806 may inflate / empt the bladder by the direction of the actuator or by a program and / or user operated controller. In such an embodiment, an elastomeric material, such as silicone rubber, may be used to further improve bladder 802 the ability of the pad to be stretchable and conformal to the edge 104 of the substrate. Such an embodiment allows precise control of how far beyond the slopes 112 and 114 the interior of the exclusion area 108 and / or 108 '(FIG. 1). The polishing film 204 is formed to contact the substrate 100, for example, by limiting the amount of fluid pumped into the bladder 802. For example, if the substrate outer edge 110 is placed against pad 206C having an empty bladder 802, bladder 802 causes pad 206C to cover device regions 106, 106 ′ of substrate 100. It can be expanded to wrap around the outer edge 110 and the slopes 112, 114 of the substrate 100 and press to conform to the shape without being wrapped. In some embodiments, it should be understood that multiple bladders may be used for the pads and different shaped inflatable bladders may be used within the different shaped pads 206, 206A, 206B.

In some embodiments, the fluid used to aid polishing may be dispensed through the pads 206, 206A, 206B to the substrate edge. Fluid channels are provided to drop or spray fluid onto or within the pads. Alternatively, the inflatable pad may comprise a bladder having a semipermeable membrane that allows fluid to be slowly released and permeated into the polishing film 204 (eg, through the pad). In such embodiments, the pads 206, 206A, 206B may be covered or made of and include a material (eg, polyvinyl alcohol (PVA), etc.) that absorbs and / or retains the fluid used.

9A-9C and 10A-10C show examples of possible different head positions of different edge polishing apparatus 400, 500, respectively, as described above. The present invention is configured such that the polishing film 204 is in contact with the slopes 112, 114 and the outer edge 110 of the substrate 100 without contacting the device region 106 of the substrate 100. In operation, this results in angular movement of the heads 404 and 504 around an axis tangent to the outer edge 110 of the substrate 100 as it is rotated (as a result of which a portion of the polishing film is in contact with the edge 104 of the substrate 100). By shape matching in contact). 9A-9C and 10A-10C, each of these axes of motion may be represented by a straight line extending outwardly perpendicular to the ground at the point indicated by "P" in the figure. Heads 404 and 504 may be maintained in a number of locations that may clean certain portions of substrate edge 104 as substrate 100 is rotated. In some embodiments, heads 404 and 504 are configured to pendulum continuously or intermittently between the plurality of positions shown and / or other positions shown. Heads 404 and 504 may move on frame 502 by synchronizing 600 (FIG. 6) according to instructions of a programmed or user operated controller. Alternatively, heads 404 and 504 can be fixed and / or adjusted while the substrate is not rotating. In yet another embodiment, the substrate can be firmly fixed while the head is pendulum moving (as described above) as well as rotating the circumference of the substrate 100. In addition, the polishing film 204 may be mounted on the heads 404, 504 in a continuous loop, and the polishing film 204 may also be continuously (or intermittently) advanced to polish the substrate edge 104.

11 and 12, a further embodiment of an edge polishing apparatus is shown. FIG. 11 shows an edge polishing apparatus including three heads 404, FIG. 12 shows an edge polishing apparatus comprising two heads 504, and FIG. 13 includes four heads 1304. An edge polishing apparatus 1300 is shown. As suggested in the figures, any number of types of heads 404, 504, 1304 can be used for any practical combination. Further, in such multi-head embodiments each head 404, 504, 1304 may use different shapes or forms of polishing film 204 (eg, different grit, material, tensile force, pressure, etc.). Any number of heads 404, 504, 1304 can be used simultaneously, individually and / or continuously. Different heads 404, 504, 1304 can be used for different substrates 100 or different types of substrates. For example, a first head 404 having a strong deflection device 406 that supports a pad, such as a concave pad 206B and a coarse grit polishing film 204, has a significant amount of roughness from the substrate slopes 112, 114. It may be used initially to move the material (FIG. 1). The first head 404 may be properly positioned to access the slopes 112, 114. After cleaning by the first head 404 is completed, the first head 404 retracts away from the substrate 100 and the second head 504 with a fine grit polishing film 204 (without pads). Can be moved to a position where it is possible to polish the slopes 112 and 114 and the outer edge 110.

After cleaning one or more substrates 100, the portion of the polishing film 204 used for such cleaning is subject to wear. Therefore, the take-up reel 210 (FIG. 4) can be driven to pull the polishing film 204 by a certain amount from the feed reel 210 (FIG. 4) toward the take-up reel 210. In this manner, an unused portion of the polishing film 204 may be provided between the take-up reel 210 and the supply reel 208. Unused portions of polishing film 204 may be used to continue cleaning one or more other substrates 100 in a manner similar to that described above. As a result, the apparatus 1100, 1200 will replace the worn polishing film 204 with an unused portion that has little effect on the substrate processing yield. Similarly, if a replaceable cassette 700A is used, the impact on yield can be minimized by quickly replacing the cassette 700A when all polishing films 204 in the cassette 700A have been used.

In particular with respect to the exemplary embodiment of the edge polishing apparatus 1300 of FIG. 13, a frame 1302 supporting multiple heads 1304 is shown in schematic form. The heads 1304 are each mounted in a frame 1302, each of which has a substrate in response to control signals from a controller 1308 (eg, a programmed computer, a valve system instructed by an operator, embedded real-time processor, etc.). An actuator 1306 (eg, pneumatic piston, servo driven slide, hydraulic ram, etc.) configured to press the length of the polishing film 204 and the pad 206 against the edge 104 of 100. . The controller 1308 is connected (eg, electrically, mechanically, pneumatically, hydraulically, etc.) to each actuator 1306.

In addition, the hydraulic source 806 may be connected to and under the control of the controller 1308. Fluid source 806 independently distributes fluid (eg, deionized water, clean chemicals, sonicated fluids, gases, air, etc.) to each of heads 1304 through one or more fluid channels 2112. Can be controlled. Under the direction of the controller 1308, various fluids may be selectively dispensed through the fluid channel 212 to the pad 206, the polishing film 204, and / or the substrate edge 104. Fluid may be used for polishing, lubrication, particle removal / cleaning, and / or expansion of bladder 802 (FIG. 8C) within pad 206. For example, in some embodiments, the same fluid dispensed through the permeable pad 206 is used to polish and expand the pad 206, while through the second channel (not shown) to the same head 1304. Different fluids to be dispensed are used for cleaning and lubrication.

The foregoing descriptions are merely exemplary embodiments of the present invention. It will be apparent to those skilled in the art that there may be variations of the foregoing apparatus and method that fall within the scope of the present invention. For example, while only examples of cleaning a round substrate have been described, the present invention can also be applied to cleaning substrates having other shapes (eg, glass or polymer plates for flat panel displays). In addition, although shown as processing a single substrate by the apparatus, in some embodiments the apparatus may process multiple substrates simultaneously.

Thus, while the invention has been described in connection with exemplary embodiments of the invention, it is to be understood that other embodiments as defined in the claims may fall within the spirit and scope of the invention.

Claims (65)

A polishing apparatus of a substrate edge, Polishing film; A frame applying tension to the polishing film such that at least a portion of the polishing film is supported in the flat surface; And The polishing film is tensioned to the substrate and is aligned with an edge shape of the substrate including at least an outer edge and a first slope, and the plane of the polishing film to polish the outer edge and the first slope as the substrate rotates. A substrate rotation driver configured to rotate the substrate relative to the Polishing device at the substrate edge. The method of claim 1, The frame includes a feed reel and a take-up reel for a polishing film, wherein the frame is also configured such that portions of the polishing film in contact with the substrate can be replaced. Polishing device at the substrate edge. The method of claim 2, The polishing film is longitudinally spaced between the supply reel and the take-up reel, and the substrate rotation driver moves the substrate edge in the longitudinal direction of the polishing film, Polishing device at the substrate edge. The method of claim 1, The polishing film and the frame are contained in a replaceable cassette, Polishing device at the substrate edge. The method of claim 1, The frame is further configured to angularly move the polishing film around an axis tangential to the outer edge of the substrate such that the polishing film contacts the outer edge, the first slope of the substrate, and the second slope. Polishing device at the substrate edge. The method of claim 1, The frame is further configured to rotate about the circumference of the polishing film about the substrate edge relative to the substrate, Polishing device at the substrate edge. The method of claim 1, Further comprising a fluid supply channel, wherein the fluid supply channel is configured to distribute fluid to an edge of the substrate, Polishing device at the substrate edge. The method of claim 7, wherein The fluid supply channel is further configured to distribute fluid to the edge of the substrate through the polishing film, Polishing device at the substrate edge. The method of claim 7, wherein The fluid supply channel is configured to distribute acoustic energy to an edge of the substrate, Polishing device at the substrate edge. The method of claim 7, wherein The fluid comprises at least one of water and a cleaning chemical, Polishing device at the substrate edge. A polishing apparatus of a substrate edge, A plurality of polishing films; A frame tensioning each of the polishing films along at least a first portion of each polishing film; And A polishing film in contact with the substrate pressurizes the substrate, is matched with an edge shape of the substrate, and is polished against the length of at least one first portion of the polishing film to polish the edge as the substrate rotates Including; a substrate rotation driver configured to rotate the Polishing device at the substrate edge. The method of claim 11, Wherein the plurality of polishing films comprises films having different abrasives, Polishing device at the substrate edge. The method of claim 11, The frame includes a plurality of heads, each head configured to support at least one polishing film, wherein the head is configured such that the supported polishing film contacts approximately the edge of the substrate, Polishing device at the substrate edge. The method of claim 11, The frame includes a plurality of heads, each head configured to support at least one polishing film, each head configured to keep the supported polishing film in contact with the edge of the substrate at different times. felled, Polishing device at the substrate edge. The method of claim 14, The pad of each head is configured to push the polishing film of the head against a rotating substrate in response to an actuator pushing the pad, Polishing device at the substrate edge. The method of claim 14, Wherein each polishing film and each head is contained in a replaceable cassette, Polishing device at the substrate edge. The method of claim 14, The frame also angularly moves the respective polishing film around each axis tangential to the outer edge of the substrate such that the polishing film contacts the outer edge, the first slope of the substrate, and the second slope. Configured to Polishing device at the substrate edge. The method of claim 14, The frame is further configured to rotate about the circumference of the polishing film of each head about the substrate edge relative to the substrate, Polishing device at the substrate edge. The method of claim 11, Further comprising a fluid supply channel, wherein the fluid supply channel is configured to distribute fluid to an edge of the substrate, Polishing device at the substrate edge. The method of claim 14, Further comprising a fluid supply channel, wherein the fluid supply channel is further configured to distribute fluid to the edge of the substrate through the polishing head of each head, Polishing device at the substrate edge. The method of claim 19, The fluid supply channel is configured to distribute acoustic energy to an edge of the substrate, Polishing device at the substrate edge. The method of claim 19, The fluid comprises at least one of water and a cleaning chemical, Polishing device at the substrate edge. As a method of cleaning a substrate edge, Applying a tensile force to the polishing film in the frame, Contacting the polishing film against an edge of the substrate, Matching the polishing film to an edge of the substrate including an outer edge and at least one slope, and Rotating the substrate while the polishing film is in contact with the substrate; Method for Cleaning Substrate Edges. The method of claim 23, Applying at least one of water and a cleaning chemical to the substrate through the inflatable pad, Method for Cleaning Substrate Edges. The method of claim 23, Applying at least one of water and a cleaning chemical to the edge of the substrate through the polishing film, Method for Cleaning Substrate Edges. The method of claim 23, Further comprising matching an additional polishing film to the edge of the substrate, Method for Cleaning Substrate Edges. The method of claim 23, Further comprising distributing a fluid containing acoustic energy to an edge of the substrate, Method for Cleaning Substrate Edges. The method of claim 23, Angularly moving the polishing film around an axis tangent to the outer edge of the substrate, Method for Cleaning Substrate Edges. The method of claim 23, Rotating the polishing film circumferentially about an edge of the substrate relative to the substrate; Method for Cleaning Substrate Edges. A polishing apparatus of a substrate edge, A polishing film having a polishing side and a second side; An inflatable pad disposed adjacent the second side of the polishing film; A frame configured to support the polishing film and the inflatable pad; And A substrate rotation driver configured to rotate the substrate relative to the polishing side of the polishing film, The polishing film is arranged between an edge of the substrate and the inflatable pad such that the inflatable pad and the polishing film are aligned with the edge shape of the substrate and the polishing film contacts the edge of the substrate; Polishing device at the substrate edge. The method of claim 30, The inflatable pad can be selectively inflated, Polishing device at the substrate edge. The method of claim 31, wherein An edge of the substrate includes an outer edge and at least one slope, The inflatable pad is configured to expand the inflatable pad and the polishing film to conform to the outer edge and the at least one slope; Polishing device at the substrate edge. The method of claim 31, wherein An edge of the substrate comprises an outer edge, a first slope, and a second slope, The substrate comprises a device region and an exclusion region, The inflatable pad is configured such that the inflatable pad and the polishing film can be selectively inflated to selectively match one or more shapes of the outer edge, the first slope, the second slope, and the exclusion area, Polishing device at the substrate edge. The method of claim 33, wherein The inflatable pad and the polishing film exclude contact with the device region, Polishing device at the substrate edge. The method of claim 30, The polishing film, the inflatable pad, and the frame are contained within a replaceable cassette, Polishing device at the substrate edge. The method of claim 30, The frame is further configured to angularly move the polishing film around an axis tangent to an edge of the substrate, Polishing device at the substrate edge. The method of claim 30, The frame is further configured to rotate the polishing film about a circumference about an edge of the substrate relative to the substrate; Polishing device at the substrate edge. The method of claim 30, Further comprising a fluid supply channel, wherein the fluid supply channel is configured to distribute at least one of water and cleaning chemical to an edge of the substrate, Polishing device at the substrate edge. The method of claim 38, The fluid supply channel is further configured to distribute fluid through the polishing film to an edge of the substrate, Polishing device at the substrate edge. The method of claim 38, The fluid supply channel is configured to distribute the fluid through the inflatable pad to the edge of the substrate, Polishing device at the substrate edge. The method of claim 40, The inflatable pad is permeable to and inflated by the fluid, Polishing device at the substrate edge. The method of claim 38, The fluid supply channel is configured to distribute sound wave energy to an edge of the substrate, Polishing device at the substrate edge. As a method of cleaning a substrate edge, Supporting a polishing film; Contacting the polishing film against an outer edge of the substrate; Matching the polishing film to an edge of the substrate including an outer edge and at least one slope; And Rotating the substrate while the polishing film is in contact with the substrate; Method for Cleaning Substrate Edges. The method of claim 43, Matching the polishing film includes applying a tensile force to the polishing film in a frame, Method for Cleaning Substrate Edges. The method of claim 43, Matching the polishing film includes pushing the polishing film against an edge of the substrate by an inflatable pad, Method for Cleaning Substrate Edges. The method of claim 45, Adjusting the conformance of the polishing film to the edge of the substrate by adjusting the inflatable pad, Method for Cleaning Substrate Edges. The method of claim 45, Applying at least one of water and a cleaning chemical to the edge of the substrate through the inflatable pad, Method for Cleaning Substrate Edges. The method of claim 45, Applying at least one of water and a cleaning chemical to the edge of the substrate through the polishing pad, Method for Cleaning Substrate Edges. The method of claim 45, Further comprising matching an additional polishing film with the edge of the substrate, Method for Cleaning Substrate Edges. The method of claim 45, Further comprising distributing a fluid containing acoustic energy to an edge of the substrate, Method for Cleaning Substrate Edges. The method of claim 45, Angularly moving the polishing film around an axis tangent to the outer edge of the substrate, Method for Cleaning Substrate Edges. The method of claim 45, Rotating the polishing film about a circumference about an edge of the substrate relative to the substrate; Method for Cleaning Substrate Edges. A polishing apparatus of a substrate edge, A polishing film having a polishing surface and a back surface, A molding pad arranged adjacent to a back side of the polishing film, A frame configured to support the polishing film and the forming pad, and A substrate rotation driver configured to rotate the substrate relative to the polishing side of the polishing film, Wherein the polishing film is arranged between the edge of the substrate and the forming pad such that the shape of the substrate edge coincides with the shape of the polishing film where the forming pad and the polishing film contact the edge of the substrate, Polishing device at the substrate edge. The method of claim 53 wherein An edge of the substrate includes an outer edge and at least one slope, The forming pad is configured such that the shape of the polishing film coincides with the shape of the outer edge and at least one slope; Polishing device at the substrate edge. The method of claim 53 wherein An edge of the substrate comprises an outer edge, a first slope, and a second slope, The substrate comprises a device region and an exclusion region, The forming pad is configured to match a shape of the polishing film with one or more of the outer edge, the first slope, the second slope, and the exclusion area, Polishing device at the substrate edge. The method of claim 55, Wherein the forming pad and the polishing film are excluded from contact with the device region, Polishing device at the substrate edge. The method of claim 53 wherein Wherein the polishing film, the forming pad, and the frame are contained within a replaceable cassette, Polishing device at the substrate edge. The method of claim 53 wherein The frame is further configured to angularly move the polishing film around an axis tangent to an edge of the substrate, Polishing device at the substrate edge. The method of claim 53 wherein The frame is further configured to rotate the polishing film about a circumference about an edge of the substrate relative to the substrate; Polishing device at the substrate edge. The method of claim 53 wherein Further comprising a fluid supply channel, wherein the fluid supply channel is configured to distribute at least one of water and cleaning chemical to an edge of the substrate, Polishing device at the substrate edge. The method of claim 60, The fluid supply channel is further configured to distribute fluid through the polishing film to an edge of the substrate, Polishing device at the substrate edge. The method of claim 60, The fluid supply channel is configured to distribute the fluid through the forming pad to an edge of the substrate, Polishing device at the substrate edge. 63. The method of claim 62, The inflatable pad is permeable to and inflated by the fluid, Polishing device at the substrate edge. The method of claim 60, The fluid supply channel is configured to distribute sound wave energy to an edge of the substrate, Polishing device at the substrate edge. The method of claim 53 wherein The forming pad receives the fluid and applies the fluid to the polishing film, Polishing device at the substrate edge.

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