TWI409140B - A method for manufacturing a glass substrate, and a manufacturing apparatus for a glass substrate - Google Patents

A method for manufacturing a glass substrate, and a manufacturing apparatus for a glass substrate Download PDF

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Publication number
TWI409140B
TWI409140B TW100149337A TW100149337A TWI409140B TW I409140 B TWI409140 B TW I409140B TW 100149337 A TW100149337 A TW 100149337A TW 100149337 A TW100149337 A TW 100149337A TW I409140 B TWI409140 B TW I409140B
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Taiwan
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glass substrate
polishing
arm
grinding wheel
force
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TW100149337A
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Chinese (zh)
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TW201226109A (en
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Hironori Ise
Osamu Ikai
Yutaka Matsuoka
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Avanstrate Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Surface Treatment Of Glass (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass substrate optimally carrying out grinding in response to a grinding position of the glass substrate. <P>SOLUTION: In the method for manufacturing a glass substrate including a grinding process of grinding both end faces of a conveyed glass substrate, a pair of grinding wheels grinding both end faces is turnably held and applied with first force in a glass substrate direction, and it is held so as to follow with respect to fluctuation in a width direction of the glass substrate. In the pair of grinding wheels, when carrying in or carrying out the glass substrate in the grinding process, second force is applied such that turning is regulated. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

玻璃基板之製造方法及玻璃基板之製造裝置Method for producing glass substrate and device for manufacturing glass substrate

本發明係關於一種玻璃基板之製造方法。The present invention relates to a method of manufacturing a glass substrate.

自先前以來,電子機器用之玻璃基板係藉由將片狀之玻璃切斷為所需之尺寸而製造。切斷為所需之尺寸之片狀之玻璃(玻璃基板)之側面(端面)形成有微小之凹凸或裂痕。該凹凸或裂痕可能造成玻璃基板之斷裂及缺欠等。為防止此種玻璃基板之斷裂及破損,例如專利文獻1(日本專利特開2009-297865號公報)所示,藉由研磨構件對玻璃基板之端面進行研磨。於專利文獻1中,提出有如下方法:檢測研磨輪與玻璃基板之接觸時之負載電流值,並使用該負載電流值對玻璃基板之端面適當地進行研磨。Since the prior art, glass substrates for electronic devices have been manufactured by cutting sheet-like glass into a desired size. The side surface (end surface) of the glass (glass substrate) cut into a desired size is formed with minute irregularities or cracks. Such irregularities or cracks may cause breakage and imperfection of the glass substrate. In order to prevent breakage and breakage of such a glass substrate, for example, the end surface of the glass substrate is polished by a polishing member as shown in Patent Document 1 (Japanese Laid-Open Patent Publication No. 2009-297865). Patent Document 1 proposes a method of detecting a load current value at the time of contact between a polishing wheel and a glass substrate, and appropriately polishing the end surface of the glass substrate using the load current value.

[先前技術文獻][Previous Technical Literature] [專利文獻][Patent Literature]

[專利文獻1]日本專利特開2009-297865號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-297865

然而,於專利文獻1所揭示之技術中,係於玻璃基板之搬送中進行玻璃基板之端面之研磨。於玻璃基板之搬送中對玻璃基板之端面進行研磨之情形時,根據玻璃基板之搬送狀態,有時無法對玻璃基板之端面適當地進行研磨。However, in the technique disclosed in Patent Document 1, the end surface of the glass substrate is polished during the conveyance of the glass substrate. When the end surface of the glass substrate is polished during the conveyance of the glass substrate, the end surface of the glass substrate may not be appropriately polished depending on the state of conveyance of the glass substrate.

本發明之課題在於提供一種於一面搬送玻璃基板之端面一面對其進行研磨之情形時提高研磨之精度的玻璃基板之製造方法。An object of the present invention is to provide a method for producing a glass substrate which improves the precision of polishing when the end surface of the glass substrate is polished while being conveyed.

本發明之玻璃基板之製造方法包括對所搬送之玻璃基板之兩端面進行研磨的研磨步驟。又,對兩端面進行研磨之一對研磨磨石係旋動自如地被保持,並且向玻璃基板方向被賦予第1力。而且,一對研磨磨石被保持為可追隨相對於玻璃基板之寬度方向之變動。此處,所謂玻璃基板方向,係相對於玻璃基板之搬送方向正交之方向。又,所謂玻璃基板之寬度方向之變動,係指沿與玻璃基板之搬送方向正交之方向的玻璃基板之位置之變動。進而,一對研磨磨石係於研磨步驟中之玻璃基板之搬入時及搬出時以規制旋動之方式被賦予第2力。所謂玻璃基板之搬入時、及搬出時,係指玻璃基板與研磨磨石接觸時、及玻璃基板自研磨磨石離開時。The method for producing a glass substrate of the present invention includes a polishing step of polishing both end faces of the glass substrate to be conveyed. Further, one of the both end faces is polished to the grinding stone to be held in a rotatable manner, and a first force is applied in the direction of the glass substrate. Further, the pair of grinding stones are kept to follow the fluctuation in the width direction of the glass substrate. Here, the glass substrate direction is a direction orthogonal to the conveyance direction of the glass substrate. In addition, the fluctuation of the width direction of the glass substrate means the change of the position of the glass substrate in the direction orthogonal to the conveyance direction of the glass substrate. Further, the pair of polishing stones are given a second force by the regulation of the rotation when the glass substrate is moved in and out during the polishing step. When the glass substrate is carried in and out, the glass substrate is in contact with the polishing stone and the glass substrate is separated from the grinding stone.

又,較佳為於以規制一對研磨磨石之旋動之方式賦予有第2力之期間,藉由彈性構件吸收因玻璃基板與研磨磨石之接觸而引起之衝擊。Moreover, it is preferable to absorb the impact by the contact of the glass substrate and the grindstone by the elastic member while the second force is applied so as to regulate the swirling of the pair of grindstones.

進而,較佳為一對研磨磨石係於玻璃基板之研磨步驟中之搬入時及搬出時,突出至較玻璃基板之兩端更內側而配置,且使周緣部抵接於玻璃基板之前方端面,隨著玻璃基板之搬送使周緣部退避而對玻璃基板進行研磨。Further, it is preferable that a pair of polishing stones are placed in the polishing step of the glass substrate during the loading and the unloading, and are protruded to the inside of the glass substrate, and the peripheral edge portion is in contact with the front end of the glass substrate. The glass substrate is polished by retracting the peripheral portion as the glass substrate is transferred.

本發明之玻璃基板之製造方法中,可根據玻璃基板之研磨位置最佳地進行研磨,且不存在未研磨區域。In the method for producing a glass substrate of the present invention, polishing can be performed optimally according to the polishing position of the glass substrate, and there is no unpolished region.

以下,一面參照圖式一面對本發明之一實施形態之玻璃基板之製造方法中所使用的玻璃基板GL之研磨裝置10a進行說明。再者,於本實施形態中,「搬送方向」係指玻璃基板GL之搬送方向,「寬度方向」係指玻璃基板GL之寬度方向。又,所謂「玻璃基板GL之傾斜」,係指玻璃基板GL相對於搬送裝置80之傾斜,所謂「玻璃基板GL之寬度方向之位置」,係指相對於搬送裝置80之玻璃基板GL之寬度方向之位置。進而,所謂「玻璃基板方向」,係相對於玻璃基板之搬送方向正交之方向,所謂「玻璃基板之寬度方向之變動」,係指沿與玻璃基板之搬送方向正交之方向的玻璃基板之位置之變動。Hereinafter, a polishing apparatus 10a for a glass substrate GL used in a method for producing a glass substrate according to an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, the "transport direction" refers to the transport direction of the glass substrate GL, and the "width direction" refers to the width direction of the glass substrate GL. In addition, the "inclination of the glass substrate GL" refers to the inclination of the glass substrate GL with respect to the conveying device 80, and the "position of the glass substrate GL in the width direction" means the width direction of the glass substrate GL with respect to the conveying device 80. The location. In addition, the "glass substrate direction" is a direction orthogonal to the direction in which the glass substrate is conveyed, and the "variation in the width direction of the glass substrate" means a glass substrate in a direction orthogonal to the direction in which the glass substrate is conveyed. Change in location.

(1) 整體構成(1) Overall composition

首先,使用圖1對本發明之玻璃基板之製造方法中所包含之複數個步驟S1~S7進行說明。複數個步驟中包含成形步驟S1、切斷步驟S2、研削步驟S3、研磨步驟S4、清洗步驟S5、檢查步驟S6、及出貨步驟S7。First, a plurality of steps S1 to S7 included in the method for producing a glass substrate of the present invention will be described with reference to Fig. 1 . The plurality of steps include a forming step S1, a cutting step S2, a grinding step S3, a polishing step S4, a washing step S5, an inspection step S6, and a shipping step S7.

於成形步驟S1中,首先,將玻璃原料熔解而形成熔融玻璃。其後,進行熔融玻璃中所含有之氣泡之去除等。進而,使用熔融法將藉由氣泡之去除等而均質化之熔融玻璃成形為片狀之玻璃。其後,將片狀之玻璃裁剪為規定尺寸而成為原料板。In the forming step S1, first, the glass raw material is melted to form molten glass. Thereafter, removal of bubbles contained in the molten glass or the like is performed. Further, the molten glass which is homogenized by the removal of bubbles or the like is formed into a sheet-shaped glass by a melting method. Thereafter, the sheet glass is cut into a predetermined size to form a raw material sheet.

於切斷步驟S2中,將原料板切斷為所需之大小。此處,將原料板切斷為電子機器或平板顯示器中所使用之玻璃尺寸。藉由切斷步驟S2進行切斷後之原料板(玻璃基板GL)藉由如圖2所示之搬送裝置80向下游搬送。本實施形態中所使用之搬送裝置80包含沿玻璃基板GL之搬送方向延伸之搬送帶81、82。搬送帶81、82係於橫穿玻璃基板GL之搬送方向之方向(玻璃基板GL之寬度方向)上空出特定之間隔而配置。搬送帶81、82與玻璃基板GL之下表面接觸,一面吸附玻璃基板GL一面將其向下游搬送。再者,本實施形態中所使用之搬送裝置80係以5 m/s~15 m/s之速度將玻璃基板GL向下游搬送。更佳為以10 m/s~15 m/s之速度將玻璃基板GL向下游搬送。又,本實施形態之玻璃基板之製造方法中所製造之玻璃基板GL具有0.2 mm~0.8 mm之厚度。玻璃基板GL之厚度更佳為0.2 mm~0.4 mm。In the cutting step S2, the raw material sheet is cut to a desired size. Here, the raw material sheet is cut into a glass size used in an electronic device or a flat panel display. The raw material sheet (glass substrate GL) which has been cut by the cutting step S2 is transported downstream by the conveying device 80 as shown in FIG. 2 . The conveying device 80 used in the present embodiment includes conveying belts 81 and 82 extending in the conveying direction of the glass substrate GL. The conveyance belts 81 and 82 are arranged at a predetermined interval in a direction transverse to the conveyance direction of the glass substrate GL (the width direction of the glass substrate GL). The conveyor belts 81 and 82 are in contact with the lower surface of the glass substrate GL, and are transported downstream while adsorbing the glass substrate GL. Further, the transport device 80 used in the present embodiment transports the glass substrate GL downstream at a speed of 5 m/s to 15 m/s. More preferably, the glass substrate GL is transported downstream at a speed of 10 m/s to 15 m/s. Further, the glass substrate GL produced in the method for producing a glass substrate of the present embodiment has a thickness of 0.2 mm to 0.8 mm. The thickness of the glass substrate GL is preferably from 0.2 mm to 0.4 mm.

於研削步驟S3中,利用研削輪9a、9b對藉由搬送裝置80向下游搬送之玻璃基板GL進行研削。詳細而言,係對玻璃基板GL之端面進行研削。端面為玻璃基板GL之側面(切斷面)。如圖3所示,玻璃基板GL之端面包含前端部分TP、後端部分EP、及中央部分CP。前端部分TP係相對於搬送方向D1為下游側之端面。玻璃基板GL之後端部分EP係相對於搬送方向D1為上游側之端面。玻璃基板GL之中央部分CP係夾在玻璃基板GL之前端部分TP及後端部分EP之間之部分。玻璃基板GL之端面藉由研削輪9a、9b而加工為略微帶弧度的形狀(R面加工)。研削輪9a、9b係如圖2所示般配置於搬送裝置80之兩側。又,研削輪9a、9b沿圖2之箭頭R3方向進行旋轉。In the grinding step S3, the glass substrate GL conveyed downstream by the conveying device 80 is ground by the grinding wheels 9a and 9b. Specifically, the end surface of the glass substrate GL is ground. The end surface is a side surface (cut surface) of the glass substrate GL. As shown in FIG. 3, the end surface of the glass substrate GL includes a front end portion TP, a rear end portion EP, and a central portion CP. The distal end portion TP is an end surface on the downstream side with respect to the transport direction D1. The rear end portion EP of the glass substrate GL is an end surface on the upstream side with respect to the transport direction D1. The central portion CP of the glass substrate GL is sandwiched between the front end portion TP and the rear end portion EP of the glass substrate GL. The end surface of the glass substrate GL is processed into a slightly curved shape (R-face processing) by the grinding wheels 9a and 9b. The grinding wheels 9a and 9b are disposed on both sides of the conveying device 80 as shown in Fig. 2 . Further, the grinding wheels 9a and 9b are rotated in the direction of the arrow R3 of Fig. 2 .

於研磨步驟S4中,利用研磨輪11a、11b對藉由研削步驟S3進行研削後之玻璃基板GL之端面進行研磨。如圖2所示,研磨輪11a、11b係配置於研削輪9a、9b之下游且於搬送裝置80之兩側。又,研磨輪11a、11b沿圖2之箭頭R3方向進行旋轉。In the polishing step S4, the end faces of the glass substrate GL which have been ground by the grinding step S3 are polished by the grinding wheels 11a and 11b. As shown in FIG. 2, the grinding wheels 11a and 11b are disposed downstream of the grinding wheels 9a and 9b and on both sides of the conveying device 80. Further, the grinding wheels 11a and 11b rotate in the direction of the arrow R3 of Fig. 2 .

於清洗步驟S5中,對玻璃基板GL進行清洗。藉此,將附著於玻璃基板GL之表面之微細之異物或污漬除去。於進行清洗後,將玻璃基板GL乾燥。In the cleaning step S5, the glass substrate GL is cleaned. Thereby, fine foreign matter or stain adhering to the surface of the glass substrate GL is removed. After the cleaning, the glass substrate GL is dried.

於檢查步驟S6中,判定玻璃基板GL有無缺陷。此處,具有缺陷之玻璃基板GL係作為不良品而被除去。In the inspection step S6, it is determined whether or not the glass substrate GL is defective. Here, the defective glass substrate GL is removed as a defective product.

其後,於出貨步驟S7中,將玻璃基板GL捆包併發送給客戶。Thereafter, in the shipping step S7, the glass substrate GL is bundled and sent to the customer.

以下,對研磨步驟S4中所使用之研磨裝置10a之構成進行詳細說明。再者,於本實施形態之玻璃基板之製造方法中,玻璃基板GL設為以一定狀態被搬送至研磨步驟S4者。所謂一定狀態,係指相對於玻璃基板GL正確地被搬送之情形時所估計之玻璃基板GL之位置,實際上被搬送之玻璃基板GL之位置之偏移為一定範圍內(±0.1 mm)。玻璃基板GL之位置之偏移包括玻璃基板GL向搬送裝置80之寬度方向單側之偏倚,及玻璃基板GL相對於搬送裝置80之傾斜。所謂玻璃基板GL向搬送裝置80之寬度方向單側之偏倚,係指玻璃基板GL之中心線C1(參照圖2)相對於搬送裝置80之中心線C2(參照圖2)於寬度方向上偏移。玻璃基板GL之中心線C1及搬送裝置80之中心線C2為沿玻璃基板GL之搬送方向之線。因此,所謂玻璃基板GL向搬送裝置80之寬度方向單側偏倚之狀態,係指玻璃基板GL之中心線C1向搬送裝置80之中心線C2之寬度方向右側略微偏移之狀態,或玻璃基板GL之中心線C1向搬送裝置80之中心線C2之寬度方向左側略微偏移之狀態(參照圖13A~圖13C)。又,所謂玻璃基板GL相對於搬送裝置80之傾斜,係指自玻璃基板GL之前端部分TP至研磨輪11a、11b之距離與自玻璃基板GL之後端部分EP至研磨輪11a、11b之距離不同之狀態。因此,玻璃基板GL相對於搬送裝置80傾斜之狀態中包含玻璃基板GL之右側前端部位於較玻璃基板GL之左側前端部更於搬送方向下游側之狀態,或玻璃基板GL之右側前端部位於較玻璃基板GL之左側前端部更於搬送方向上游側之狀態(參照圖16A~圖16C)。Hereinafter, the configuration of the polishing apparatus 10a used in the polishing step S4 will be described in detail. In the method of manufacturing a glass substrate of the present embodiment, the glass substrate GL is transported to the polishing step S4 in a predetermined state. The predetermined state refers to the position of the glass substrate GL estimated when the glass substrate GL is correctly conveyed, and the position of the glass substrate GL actually transferred is within a certain range (±0.1 mm). The offset of the position of the glass substrate GL includes the bias of the glass substrate GL on one side in the width direction of the transport device 80 and the inclination of the glass substrate GL with respect to the transport device 80. The bias of the glass substrate GL on one side in the width direction of the transport device 80 means that the center line C1 (see FIG. 2) of the glass substrate GL is offset in the width direction from the center line C2 (see FIG. 2) of the transport device 80. . The center line C1 of the glass substrate GL and the center line C2 of the transport device 80 are lines along the transport direction of the glass substrate GL. Therefore, the state in which the glass substrate GL is biased to the one side in the width direction of the transport device 80 is a state in which the center line C1 of the glass substrate GL is slightly shifted to the right in the width direction of the center line C2 of the transport device 80, or the glass substrate GL. The center line C1 is slightly shifted to the left side in the width direction of the center line C2 of the conveying device 80 (see FIGS. 13A to 13C). Further, the inclination of the glass substrate GL with respect to the conveying device 80 means that the distance from the front end portion TP of the glass substrate GL to the grinding wheels 11a and 11b is different from the distance from the rear end portion EP of the glass substrate GL to the grinding wheels 11a and 11b. State. Therefore, in a state where the glass substrate GL is inclined with respect to the transport apparatus 80, the right end portion of the glass substrate GL is located on the downstream side of the left end portion of the glass substrate GL, or the right end portion of the glass substrate GL is located. The left end portion of the glass substrate GL is in a state of being upstream of the transport direction (see FIGS. 16A to 16C).

(2) 研磨裝置之構成(2) Composition of the grinding device

研磨裝置10a、10b對藉由研削輪9a、9b進行研削後之玻璃基板GL之端面進行研磨,使端面之凹凸或裂痕減少。The polishing apparatuses 10a and 10b polish the end faces of the glass substrate GL which have been ground by the grinding wheels 9a and 9b to reduce irregularities or cracks in the end faces.

於圖4A及圖4B中表示本實施形態之研磨裝置10a之概略構成。圖4A係研磨裝置10a之平面圖,圖4B係研磨裝置10a之側視圖。再者,圖4A及圖4B表示包含圖2之右側所示之研磨輪11a之研磨裝置10a。以下,對研磨裝置10a之構成進行詳細說明,包含圖2中所示之另一研磨輪11b之研磨裝置10b之構成亦設為與研磨裝置10a相同之構成。其中,研磨裝置10b之構成及動作設為相對於搬送裝置80之中心線C2而與研磨裝置10a之構成對稱(參照圖11A~圖11C等)。The schematic configuration of the polishing apparatus 10a of the present embodiment is shown in Figs. 4A and 4B. 4A is a plan view of the polishing apparatus 10a, and FIG. 4B is a side view of the polishing apparatus 10a. 4A and 4B show a polishing apparatus 10a including the grinding wheel 11a shown on the right side of Fig. 2. Hereinafter, the configuration of the polishing apparatus 10a will be described in detail, and the configuration of the polishing apparatus 10b including the other polishing wheel 11b shown in Fig. 2 is also the same as that of the polishing apparatus 10a. The configuration and operation of the polishing apparatus 10b are symmetrical with respect to the center line C2 of the conveying apparatus 80 and the configuration of the polishing apparatus 10a (see FIGS. 11A to 11C and the like).

研磨裝置10a主要包括研磨輪(相當於研磨磨石)11a、機械臂12a、基板13a、制動機構14a、及控制部15。The polishing apparatus 10a mainly includes a grinding wheel (corresponding to a grinding stone) 11a, a robot arm 12a, a substrate 13a, a brake mechanism 14a, and a control unit 15.

(2-1) 研磨輪(2-1) Grinding wheel

研磨輪11a與藉由研削輪9a進行研削後之玻璃基板GL之端面接觸而使端面之凹凸或裂痕減少。對於研磨輪11a使用有填充著樹脂之纖維。樹脂中分散有鑽石研磨粒、碳化矽研磨粒、CBN(Cubic Boron Nitride,立方氮化硼)研磨粒、或氧化鈰研磨粒等研磨粒。藉此,研磨輪11a包含具有彈性之周緣部。The grinding wheel 11a is in contact with the end surface of the glass substrate GL which has been ground by the grinding wheel 9a, and the unevenness or crack of the end surface is reduced. A resin-filled fiber is used for the grinding wheel 11a. Hard particles such as diamond abrasive grains, cerium carbide abrasive grains, CBN (Cubic Boron Nitride) abrasive grains, or cerium oxide abrasive grains are dispersed in the resin. Thereby, the grinding wheel 11a includes a peripheral portion having elasticity.

研磨輪11a中形成有用以切入玻璃端面之槽。槽以覆蓋玻璃基板GL之端面及端面附近之方式與玻璃基板GL接觸。研磨輪11a藉由馬達17a而以輪旋轉軸110a為中心進行旋轉。具體而言,研磨輪11a係以與玻璃基板GL之端面接觸之研磨輪11a之研磨面即周緣部向與玻璃基板GL之搬送方向D1相反之方向行進之方式進行旋轉(圖2之箭頭R3)。A groove for cutting into the end face of the glass is formed in the grinding wheel 11a. The groove is in contact with the glass substrate GL so as to cover the end surface and the end surface of the glass substrate GL. The grinding wheel 11a is rotated about the wheel rotating shaft 110a by the motor 17a. Specifically, the polishing wheel 11a rotates so that the peripheral edge portion of the polishing surface of the polishing wheel 11a that is in contact with the end surface of the glass substrate GL travels in a direction opposite to the transport direction D1 of the glass substrate GL (arrow R3 in FIG. 2). .

(2-2) 機械臂(2-2) Robot arm

機械臂12a成為以機械臂旋動軸120a為中心進行旋動之構成。機械臂12a藉由旋動而改變相對於搬送方向D1之傾斜。研磨裝置10a藉由改變機械臂12a之傾斜,而將自研磨輪11a對玻璃基板GL所施加之壓力維持在一定範圍內,且使研磨輪11a追隨於玻璃基板之端面。The arm 12a is configured to be rotated about the arm rotating shaft 120a. The robot arm 12a changes the inclination with respect to the conveyance direction D1 by the rotation. The polishing apparatus 10a maintains the pressure applied from the grinding wheel 11a to the glass substrate GL within a certain range by changing the inclination of the robot arm 12a, and causes the grinding wheel 11a to follow the end surface of the glass substrate.

如圖4B所示,機械臂12a包含第1端部121及第2端部122。第1端部121為位於玻璃基板GL之附近之端部,第2端部122為位於相對於玻璃基板GL遠離之位置的端部。於第1端部121上,可旋動地安裝有研磨輪11a。於第2端部122上,安裝有恆壓氣缸16a。恆壓氣缸16a沿箭頭F1方向對第2端部122施加有一定之力(荷重)(相當於第1力)(參照圖4A)。若藉由恆壓氣缸16a對第2端部122施加有力,則機械臂12a以機械臂旋動軸120a為中心,沿箭頭R1方向進行旋動。於機械臂12a之第2端部122之附近配置有擋止部15a。藉由機械臂12a之旋動,使機械臂之第2端部122與擋止部15a接觸。藉此,機械臂12a向R1方向之旋動被抑制。又,機械臂12a向R1方向之旋動亦可藉由研磨輪11a與玻璃基板GL之端面接觸而抑制。As shown in FIG. 4B, the robot arm 12a includes a first end portion 121 and a second end portion 122. The first end portion 121 is an end portion located in the vicinity of the glass substrate GL, and the second end portion 122 is an end portion located at a position away from the glass substrate GL. A grinding wheel 11a is rotatably attached to the first end portion 121. A constant pressure cylinder 16a is attached to the second end portion 122. The constant pressure cylinder 16a applies a constant force (load) to the second end portion 122 in the direction of the arrow F1 (corresponding to the first force) (see FIG. 4A). When a force is applied to the second end portion 122 by the constant pressure cylinder 16a, the robot arm 12a is rotated in the direction of the arrow R1 around the arm rotating shaft 120a. A stopper portion 15a is disposed in the vicinity of the second end portion 122 of the robot arm 12a. The second end portion 122 of the robot arm is brought into contact with the stopper portion 15a by the rotation of the robot arm 12a. Thereby, the rotation of the robot arm 12a in the R1 direction is suppressed. Further, the rotation of the arm 12a in the R1 direction can be suppressed by the contact of the grinding wheel 11a with the end surface of the glass substrate GL.

再者,機械臂12a之旋動亦可藉由下述制動機構14a之動作而限制。關於制動機構14a與機械臂12a之旋動之關係,與下述制動機構14a之說明一併進行說明。Furthermore, the rotation of the robot arm 12a can also be restricted by the action of the brake mechanism 14a described below. The relationship between the braking mechanism 14a and the rotation of the robot arm 12a will be described together with the description of the brake mechanism 14a described below.

(2-3) 基板(2-3) Substrate

如圖4B所示,基板13a為保持恆壓氣缸16a及機械臂旋動軸120a之板。As shown in FIG. 4B, the substrate 13a is a plate that holds the constant pressure cylinder 16a and the arm rotation shaft 120a.

(2-4) 制動機構(2-4) Brake mechanism

制動機構14a於玻璃基板GL之搬入時及搬出時限制機械臂12a之旋動範圍(相當於第2力)。如圖5所示,制動機構14a包括上部機構41與下部機構42。上部機構41成為上下移動之構成。具體而言,上部機構41在與下部機構42接觸之位置(規制位置)、及自下部機構42離開之位置(解除位置)之間進行上下移動。藉由上部機構41在規制位置與下部機構42接觸,而限制機械臂12a之旋動。即,對機械臂12a之旋動施加制動。另一方面,於上部機構41自下部機構42離開而位於解除位置時,機械臂12a變得可自由旋動。即,制動被解除。藉此,機械臂12a根據玻璃基板GL之傾斜而自由地旋動。以下,對上部機構41與下部機構42之構成進行詳細說明。The brake mechanism 14a limits the range of rotation (corresponding to the second force) of the arm 12a during loading and unloading of the glass substrate GL. As shown in FIG. 5, the brake mechanism 14a includes an upper mechanism 41 and a lower mechanism 42. The upper mechanism 41 is configured to move up and down. Specifically, the upper mechanism 41 moves up and down between a position (regular position) that comes into contact with the lower mechanism 42 and a position (released position) that is separated from the lower mechanism 42. The rotation of the robot arm 12a is restricted by the upper mechanism 41 being in contact with the lower mechanism 42 at the regulatory position. That is, the brake is applied to the rotation of the robot arm 12a. On the other hand, when the upper mechanism 41 is separated from the lower mechanism 42 and is at the release position, the arm 12a is freely rotatable. That is, the brake is released. Thereby, the robot arm 12a is freely rotated according to the inclination of the glass substrate GL. Hereinafter, the configuration of the upper mechanism 41 and the lower mechanism 42 will be described in detail.

(2-4-1) 上部機構(2-4-1) Upper mechanism

上部機構41主要包括制動用氣缸411與上部接觸單元412。The upper mechanism 41 mainly includes a brake cylinder 411 and an upper contact unit 412.

制動用氣缸411藉由螺釘411b而固定於板411a上。又,制動用氣缸411經由板411a而與推拉桿(push-and-pull rod)411c連結。推拉桿411c與下述上部接觸單元412相連接。制動用氣缸411使上部接觸單元412上下移動。上部接觸單元412藉由制動用氣缸411,而在位於上方之解除位置與位於下方之規制位置之間移動。The brake cylinder 411 is fixed to the plate 411a by a screw 411b. Further, the brake cylinder 411 is coupled to a push-and-pull rod 411c via a plate 411a. The push-pull rod 411c is connected to the upper contact unit 412 described below. The brake cylinder 411 moves the upper contact unit 412 up and down. The upper contact unit 412 is moved between the release position located above and the regulation position located below by the brake cylinder 411.

上部接觸單元412為與下部機構42接觸之構件。上部接觸單元412中形成有插入部413a、413b、413c。於插入部413a-413c中插入有滑動軸414。滑動軸414在板411a之下表面與機械臂旋動軸120a之上表面之間沿垂直方向延伸。上部接觸單元412於藉由制動用氣缸411進行上下移動時,沿滑動軸414移動。又,插入部413a-413c成為可容納滑動軸承(slider bearing)415與彈性構件416之構成。滑動軸承415具有使上部接觸單元412之沿滑動軸414之移動平穩地進行之功能。即,上部接觸單元412經由滑動軸承415而沿著滑動軸414上下移動。The upper contact unit 412 is a member that is in contact with the lower mechanism 42. Insertion portions 413a, 413b, and 413c are formed in the upper contact unit 412. A slide shaft 414 is inserted into the insertion portions 413a to 413c. The slide shaft 414 extends in a vertical direction between the lower surface of the plate 411a and the upper surface of the robot arm rotation shaft 120a. When the upper contact unit 412 is moved up and down by the brake cylinder 411, it moves along the slide shaft 414. Further, the insertion portions 413a to 413c are configured to accommodate the slider bearing 415 and the elastic member 416. The sliding bearing 415 has a function of smoothly moving the upper contact unit 412 along the sliding shaft 414. That is, the upper contact unit 412 moves up and down along the slide shaft 414 via the sliding bearing 415.

彈性構件416具有貫通孔h1。貫通孔h1形成於彈性構件416之中央部。滑動軸414及滑動軸承415配置於貫通孔h1之內側。即,彈性構件416配置於滑動軸承415之周圍。彈性構件416為胺基甲酸酯系材料、矽系材料、或橡膠。此處,使用胺基甲酸酯系材料作為彈性構件416。彈性構件416具有於上部接觸單元412位於規制位置時,使機械臂12a相對於滑動軸414略微移動之程度之彈性。具體而言,如圖7A及圖7B所示,彈性構件416具有可使機械臂12a沿R1方向或R2方向旋動特定量之程度之彈性。藉由機械臂12a旋動特定量,而於本實施形態中,滑動軸414及滑動軸承415自中心線C3向左右偏移0.1 mm~0.3 mm。此處,所謂特定量,係容許自研磨輪11a之中心至玻璃基板GL之端面之距離成為恰當距離之量。又,中心線C3為自上部接觸單元412之中心向插入部413a-413c之中心延長之直線。雖認為彈性構件416之彈性根據玻璃基板GL之種類(玻璃基板GL之組成)而發生變更,但於本實施形態中,較佳為使用具有下述程度之彈性之彈性構件416:於上部接觸單元412位於規制位置時,略微容許機械臂12a之旋動,且使機械臂12a於所容許之範圍內旋動時,滑動軸414及滑動軸承415自中心線C3向左右偏移0.2 mm。The elastic member 416 has a through hole h1. The through hole h1 is formed in a central portion of the elastic member 416. The slide shaft 414 and the slide bearing 415 are disposed inside the through hole h1. That is, the elastic member 416 is disposed around the sliding bearing 415. The elastic member 416 is a urethane-based material, a lanthanide-based material, or a rubber. Here, a urethane-based material is used as the elastic member 416. The resilient member 416 has a degree of elasticity that causes the robot arm 12a to move slightly relative to the sliding shaft 414 when the upper contact unit 412 is in the regulatory position. Specifically, as shown in FIGS. 7A and 7B, the elastic member 416 has elasticity that allows the mechanical arm 12a to be rotated by a certain amount in the R1 direction or the R2 direction. In the present embodiment, the slide shaft 414 and the slide bearing 415 are shifted by 0.1 mm to 0.3 mm from the center line C3 by a specific amount by the mechanical arm 12a. Here, the specific amount is an amount that allows the distance from the center of the grinding wheel 11a to the end surface of the glass substrate GL to be an appropriate distance. Further, the center line C3 is a straight line extending from the center of the upper contact unit 412 toward the center of the insertion portions 413a to 413c. Although the elasticity of the elastic member 416 is changed depending on the type of the glass substrate GL (the composition of the glass substrate GL), in the present embodiment, it is preferable to use the elastic member 416 having the following degree of elasticity: the upper contact unit When the 412 is in the regulation position, the rotation of the arm 12a is slightly allowed, and when the arm 12a is rotated within the allowable range, the slide shaft 414 and the slide bearing 415 are shifted by 0.2 mm from the center line C3 to the left and right.

如圖5所示,於上部接觸單元412之下表面安裝有固定製動片417。對於固定製動片417使用有具有特定之剛性及特定之摩擦係數的材料。所謂特定之剛性,係指與彈性構件416之剛性為相同程度之剛性,或較彈性構件416之剛性強之剛性。又,所謂特定之摩擦係數,係指於上部機構41位於規制位置時,固定製動片417可與外力F1、F2相對抗之程度的摩擦係數。固定製動片417與下述下部機構42之旋轉制動片422接觸。As shown in FIG. 5, a fixed brake pad 417 is attached to the lower surface of the upper contact unit 412. For the fixed brake pad 417, a material having a specific rigidity and a specific friction coefficient is used. The specific rigidity refers to the rigidity which is the same as the rigidity of the elastic member 416, or the rigidity which is stronger than the rigidity of the elastic member 416. Further, the specific friction coefficient refers to a coefficient of friction in which the fixed brake pad 417 can be opposed to the external forces F1 and F2 when the upper mechanism 41 is at the regulation position. The fixed brake pad 417 is in contact with the rotating brake pad 422 of the lower mechanism 42 described below.

(2-4-2) 下部機構(2-4-2) Lower mechanism

下部機構42為與位於規制位置之上部機構41接觸之機構。下部機構42主要包含下部接觸單元421。下部接觸單元421配置於機械臂12a之第2端部。於下部接觸單元421之上表面安裝有旋轉制動片422。具體而言,旋轉制動片422係以與位於規制位置之上部機構41之固定製動片417接觸之方式安裝。與上述固定製動片417同樣地,對於旋轉制動片422亦使用有具有特定之剛性及特定之摩擦係數的材料。The lower mechanism 42 is a mechanism that is in contact with the upper mechanism 41 at the regulatory position. The lower mechanism 42 mainly includes a lower contact unit 421. The lower contact unit 421 is disposed at the second end of the arm 12a. A rotating brake pad 422 is attached to the upper surface of the lower contact unit 421. Specifically, the rotary brake pad 422 is attached in contact with the fixed brake pad 417 of the upper mechanism 41 located at the regulation position. Similarly to the above-described fixed brake pad 417, a material having a specific rigidity and a specific friction coefficient is also used for the rotary brake pad 422.

(2-5) 控制部(2-5) Control Department

如圖6所示,控制部15分別與研磨輪11a、機械臂旋動軸120a、制動機構14a、馬達17a、及各種感測器16連接。控制部15主要包含CPU(Central Processing Unit,中央處理單元)、ROM(Read Only Memory,唯讀記憶體)、RAM(Random Access Memory,隨機存取記憶體)、及硬碟等。控制部15基於ROM、RAM或硬碟等中所記憶之程式或各種資訊進行各構成之控制。再者,控制部15亦可對兩方之研磨裝置10a、10b生成控制命令並加以發送。As shown in FIG. 6, the control unit 15 is connected to the grinding wheel 11a, the arm rotating shaft 120a, the brake mechanism 14a, the motor 17a, and various sensors 16. The control unit 15 mainly includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and a hard disk. The control unit 15 performs control of each configuration based on a program or various information stored in a ROM, a RAM, a hard disk, or the like. Further, the control unit 15 may generate and transmit a control command to both of the polishing apparatuses 10a and 10b.

(3) 與機械臂之旋動相對應之滑動軸之位置(3) Position of the sliding shaft corresponding to the rotation of the robot arm

其次,參照圖7A及圖7B,對制動機構14a作動時之滑動軸414之位置之變化進行說明。如上所述,制動機構14a係於插入部413a-413c中包含彈性構件416。於制動機構14a作動之情形時,機械臂12a之旋動受滑動軸414之阻礙。然而,藉由滑動軸414之周邊之彈性構件416產生變形,而容許機械臂12a略微進行旋動。Next, a change in the position of the slide shaft 414 when the brake mechanism 14a is actuated will be described with reference to FIGS. 7A and 7B. As described above, the brake mechanism 14a includes the elastic member 416 in the insertion portions 413a to 413c. When the brake mechanism 14a is actuated, the rotation of the robot arm 12a is hindered by the slide shaft 414. However, the deformation is caused by the elastic member 416 around the sliding shaft 414, and the mechanical arm 12a is allowed to slightly rotate.

圖7A及圖7B係表示制動機構14a作動時之機械臂12a之旋動方向R1、R2、與根據機械臂12a之旋動而產生變化之滑動軸414之位置的圖。圖7A表示於制動機構14a作動時機械臂12a沿方向R1進行旋動之情形時,滑動軸414向方向M1移動。圖7B表示於制動機構14a作動時機械臂12a沿方向R2進行旋動之情形時,滑動軸414向方向M2移動。7A and 7B are views showing the positions of the rotation directions R1 and R2 of the arm 12a and the position of the slide shaft 414 which changes according to the rotation of the arm 12a when the brake mechanism 14a is actuated. Fig. 7A shows a case where the arm 12a is rotated in the direction R1 when the brake mechanism 14a is actuated, and the slide shaft 414 is moved in the direction M1. Fig. 7B shows a state in which the slide shaft 414 is moved in the direction M2 when the arm 12a is rotated in the direction R2 when the brake mechanism 14a is actuated.

如圖7A及圖7B所示,根據彈性構件416之變形之程度而決定機械臂12a之旋動量(旋動範圍)。As shown in FIGS. 7A and 7B, the amount of rotation (rotation range) of the arm 12a is determined in accordance with the degree of deformation of the elastic member 416.

(4) 施加至機械臂之外力與滑動軸之位置之關係(4) Relationship between the force applied to the arm and the position of the sliding shaft

其次,使用圖8A~圖8C對施加至機械臂12a之外力、與插入部413a內之滑動軸414之位置之關係進行說明。此處,所謂施加至機械臂12a之外力,係指由恆壓氣缸16a施加之力(外力F1)、與因研磨輪11a與玻璃基板GL接觸而施加之力(外力F2)。再者,圖8A~圖8C係圖7A及圖7B之插入部413a之放大圖。Next, the relationship between the force applied to the arm 12a and the position of the slide shaft 414 in the insertion portion 413a will be described with reference to Figs. 8A to 8C. Here, the force applied to the arm 12a refers to a force applied by the constant pressure cylinder 16a (external force F1) and a force applied by the grinding wheel 11a in contact with the glass substrate GL (external force F2). 8A to 8C are enlarged views of the insertion portion 413a of Figs. 7A and 7B.

於圖8A中,滑動軸414位於插入部413a之中心(恰當位置)。於滑動軸414位於恰當位置時,滑動軸414位於中心線C3之中心。於滑動軸414位於恰當位置時,處於藉由外力F2欲使機械臂12a進行旋動之力、與藉由外力F1欲使機械臂12a進行旋動之力平衡之狀態。認為於滑動軸414位於恰當位置時,自玻璃基板GL至研磨輪11a之中心之距離為特定之距離間隔。彈性構件416於滑動軸414及滑動軸承415之周圍具有均勻之厚度。即,彈性構件416未產生變形,保持著原型。In Fig. 8A, the slide shaft 414 is located at the center (appropriate position) of the insertion portion 413a. When the sliding shaft 414 is in the proper position, the sliding shaft 414 is located at the center of the center line C3. When the slide shaft 414 is at the proper position, the force to rotate the arm 12a by the external force F2 is in a state of being balanced with the force by which the external arm F1 is required to rotate the arm 12a. It is considered that the distance from the glass substrate GL to the center of the grinding wheel 11a is a specific distance interval when the sliding shaft 414 is at the proper position. The elastic member 416 has a uniform thickness around the sliding shaft 414 and the sliding bearing 415. That is, the elastic member 416 is not deformed, and the prototype is maintained.

於圖8B中,機械臂12a沿順時針略微進行旋動,結果滑動軸414位於自中心線C3向左側偏移之位置。此處,處於藉由外力F2欲使機械臂12a進行旋動之力大於藉由外力F1欲使其旋動之力之狀態。認為自玻璃基板GL至研磨輪11a之中心之距離較特定之距離間隔近。彈性構件416之中心線C3之左側被壓縮而變形。藉由壓縮彈性構件416,而於制動機構14a作動時保護研磨輪11a不受外力F2過度上升之影響。In Fig. 8B, the robot arm 12a is slightly rotated clockwise, with the result that the slide shaft 414 is located offset to the left from the center line C3. Here, the force at which the mechanical arm 12a is to be rotated by the external force F2 is greater than the force by which the external force F1 is to be rotated. It is considered that the distance from the glass substrate GL to the center of the grinding wheel 11a is closer than a specific distance. The left side of the center line C3 of the elastic member 416 is compressed and deformed. By compressing the elastic member 416, the grinding wheel 11a is protected from excessive rise of the external force F2 when the brake mechanism 14a is actuated.

於圖8C中,機械臂12a沿逆時針略微進行旋動,結果滑動軸414位於自中心線C3向右側偏移之位置。此處,處於藉由外力F1欲使機械臂12a進行旋動之力大於藉由外力F2欲使機械臂12a進行旋動之力之狀態。認為自玻璃基板GL至研磨輪11a之中心之距離較特定之距離間隔遠。彈性構件416之中心線C3之右側被壓縮而變形。被壓縮之彈性構件416雖然欲恢復為原型,但外力F1大於欲恢復為原型之力(恢復力)。研磨輪11a對玻璃基板GL之端面施加一定範圍之壓力而與其接觸。又,藉由彈性構件416之恢復力,而於玻璃基板GL之加工開始時使自玻璃基板GL傳遞至研磨輪11a之衝擊降低。即,藉由彈性構件416吸收自玻璃基板GL傳遞至研磨輪11a之衝擊。In Fig. 8C, the robot arm 12a is slightly rotated counterclockwise, and as a result, the slide shaft 414 is located offset to the right from the center line C3. Here, the force at which the mechanical arm 12a is to be rotated by the external force F1 is greater than the force at which the mechanical arm 12a is to be rotated by the external force F2. It is considered that the distance from the glass substrate GL to the center of the grinding wheel 11a is farther apart than the specific distance. The right side of the center line C3 of the elastic member 416 is compressed and deformed. Although the compressed elastic member 416 is intended to be restored to the prototype, the external force F1 is larger than the force (recovery force) to be restored to the prototype. The grinding wheel 11a applies a certain range of pressure to the end surface of the glass substrate GL to be in contact therewith. Further, by the restoring force of the elastic member 416, the impact transmitted from the glass substrate GL to the grinding wheel 11a at the start of processing of the glass substrate GL is lowered. That is, the impact transmitted from the glass substrate GL to the grinding wheel 11a is absorbed by the elastic member 416.

(5) 研磨步驟之概略說明(5) Outline description of the grinding step

其次,使用圖9對研磨步驟之概略進行說明。再者,研磨裝置10a預先使制動機構14a作動,並等待玻璃基板GL搬送而來。Next, the outline of the polishing step will be described using FIG. Further, the polishing apparatus 10a operates the brake mechanism 14a in advance and waits for the glass substrate GL to be transported.

首先,於步驟S101中,藉由感測器16判斷研磨輪11a是否已與玻璃基板GL接觸。於本實施形態中,如圖10所示,以研磨輪11a之外緣(周緣部)位於自玻璃基板GL之端面起算為特定距離W之內側之方式使研磨輪11a與玻璃基板GL之端面接觸。即,研磨輪11a係以突出至較玻璃基板之兩端部更內側之方式配置。此處,特定距離W較佳為大於0且小於100 μmm之範圍之值。特定距離W更佳為50 μmm。藉由使玻璃基板GL之端面與旋轉之研磨輪11a接觸,而於使制動機構14a作動之狀態下對玻璃基板GL之前端部分TP進行研磨(第1研磨步驟)。研磨輪11a於彈性構件416可變形之範圍內,一面追隨玻璃基板之端面一面對其進行研磨。即,研磨輪11a於使周緣部抵接於玻璃基板GL之前端部分TP(前方端面)後,隨著玻璃基板GL之向下游方向之搬送,使周緣部自玻璃基板GL退避而對玻璃基板GL進行研磨。First, in step S101, it is judged by the sensor 16 whether or not the grinding wheel 11a has come into contact with the glass substrate GL. In the present embodiment, as shown in FIG. 10, the grinding wheel 11a is brought into contact with the end surface of the glass substrate GL such that the outer edge (peripheral portion) of the grinding wheel 11a is located inside the specific distance W from the end surface of the glass substrate GL. . That is, the grinding wheel 11a is disposed so as to protrude to the inner side of both end portions of the glass substrate. Here, the specific distance W is preferably a value in a range of more than 0 and less than 100 μmm. The specific distance W is preferably 50 μmm. By bringing the end surface of the glass substrate GL into contact with the rotating grinding wheel 11a, the front end portion TP of the glass substrate GL is polished while the brake mechanism 14a is actuated (first polishing step). The grinding wheel 11a is polished while following the end surface of the glass substrate within a range in which the elastic member 416 is deformable. In other words, the polishing wheel 11a is brought into contact with the front end portion TP (front end surface) of the glass substrate GL, and the peripheral portion is retracted from the glass substrate GL to the glass substrate GL as the glass substrate GL is transported in the downstream direction. Grinding.

若於步驟S101中,藉由感測器16檢測出研磨輪11a與玻璃基板GL之接觸,則於步驟S102中,開始計時器之計數。進而,於步驟S103中,制動機構14a被解除。即,機械臂12a配合玻璃基板GL相對於搬送裝置80之傾斜(自研磨輪11a之中心至玻璃基板GL之端面之距離)而自由地旋動。繼而,機械臂12a於藉由外力F2欲使機械臂12a沿R2方向進行旋動之力、與藉由外力F1欲使機械臂12a沿R1方向進行旋動之力平衡之位置上穩定,在該位置上,研磨輪11a對玻璃基板GL之端面進行研磨(第2研磨步驟)。藉由機械臂12a配合玻璃基板GL之傾斜自由地旋動,從而研磨輪11a一面追隨玻璃基板之端面一面對其進行研磨。If the sensor 16 detects the contact between the grinding wheel 11a and the glass substrate GL in step S101, the counting of the timer is started in step S102. Further, in step S103, the brake mechanism 14a is released. That is, the robot arm 12a is freely rotated in accordance with the inclination of the glass substrate GL with respect to the conveying device 80 (the distance from the center of the grinding wheel 11a to the end surface of the glass substrate GL). Then, the mechanical arm 12a is stabilized at a position where the external force F2 is intended to cause the mechanical arm 12a to rotate in the R2 direction and the force to be rotated by the external force F1 to rotate the mechanical arm 12a in the R1 direction. At the position, the grinding wheel 11a grinds the end surface of the glass substrate GL (second polishing step). The mechanical arm 12a is freely rotated by the inclination of the glass substrate GL, and the polishing wheel 11a is polished while following the end surface of the glass substrate.

其後,於步驟S104中,判斷以計時器進行計測之時間是否達到特定時間。於未達到特定時間之情形時,待機直至達到特定時間為止,若達到特定時間,則進入步驟S105。Thereafter, in step S104, it is determined whether or not the time measured by the timer has reached a certain time. When the specific time is not reached, the standby time is reached until the specific time is reached, and if the specific time is reached, the process proceeds to step S105.

於步驟S105中,使制動機構14a作動。即,於規制機械臂12a之旋動之狀態下對玻璃基板GL之端面進行研磨(第3研磨步驟)。研磨輪11a於彈性構件416可變形之範圍內,一面追隨玻璃基板之端面一面對其進行研磨。In step S105, the brake mechanism 14a is actuated. That is, the end surface of the glass substrate GL is polished in a state where the regulatory robot arm 12a is rotated (third polishing step). The grinding wheel 11a is polished while following the end surface of the glass substrate within a range in which the elastic member 416 is deformable.

(6) 研磨步驟之詳細說明(6) Detailed description of the grinding step

其次,參照圖11A~圖16C對與玻璃基板GL之搬送狀態相對應之研磨裝置10a之動作進行說明。圖11A~圖11C、圖13A~圖13C、及圖16A~圖16C係表示關於玻璃基板GL之搬送狀態之複數個例之圖。詳細而言,表示如下情況:研磨裝置10a、10b根據玻璃基板GL之傾斜、玻璃基板GL之寬度方向之變動、及自研磨輪11a之中心至玻璃基板GL之端面之距離之變動,使機械臂12a進行動作,從而使研磨輪11a追隨玻璃基板GL之端面。再者,於本實施形態中,構成為研磨輪11a於對玻璃基板GL施加有一定範圍之壓力之狀態下,對玻璃基板GL之端面進行研磨。Next, the operation of the polishing apparatus 10a corresponding to the conveyance state of the glass substrate GL will be described with reference to FIGS. 11A to 16C. 11A to 11C, FIGS. 13A to 13C, and FIGS. 16A to 16C are views showing a plurality of examples of the conveyance state of the glass substrate GL. Specifically, the polishing apparatus 10a and 10b are configured such that the inclination of the glass substrate GL, the fluctuation of the width direction of the glass substrate GL, and the distance from the center of the polishing wheel 11a to the end surface of the glass substrate GL cause the robot arm The operation of 12a causes the grinding wheel 11a to follow the end surface of the glass substrate GL. Further, in the present embodiment, the polishing wheel 11a is configured to polish the end surface of the glass substrate GL with a certain range of pressure applied to the glass substrate GL.

圖11A~圖16C中,箭頭D1表示玻璃基板GL之搬送方向。箭頭F1表示自恆壓氣缸16a賦予之外力,箭頭F2表示自玻璃基板GL賦予之外力。又,箭頭F1及箭頭F2之大小表示外力之大小。進而,圖11A~圖16D中,圖11B、圖12C、圖13B、圖14C、圖15C、及圖16B表示制動機構14a被解除之狀態,其他圖表示制動機構14a正在作動之狀態。In FIGS. 11A to 16C, an arrow D1 indicates a conveyance direction of the glass substrate GL. An arrow F1 indicates that an external force is applied from the constant pressure cylinder 16a, and an arrow F2 indicates an external force applied from the glass substrate GL. Further, the magnitudes of the arrow F1 and the arrow F2 indicate the magnitude of the external force. Further, in FIGS. 11A to 16D, FIGS. 11B, 12C, 13B, 14C, 15C, and 16B show a state in which the brake mechanism 14a is released, and the other figures show a state in which the brake mechanism 14a is being actuated.

(6-1) 自研磨輪之中心至玻璃基板之端面之距離為恰當距離之情形(6-1) The distance from the center of the grinding wheel to the end face of the glass substrate is the proper distance

圖11A~圖11C及圖12A~圖12D表示自研磨輪11a之中心至玻璃基板GL之距離為恰當距離之情形。所謂恰當距離,係於研磨輪11a與玻璃基板GL之端面接觸時,滑動軸414位於恰當位置之距離。於圖11A~圖11C中,以玻璃基板GL配置於搬送裝置80之中央之情形為例進行說明。此處,玻璃基板GL之中心線C1與搬送裝置80之中心線C2一致。即,自搬送帶81、82之外側至玻璃基板GL之端面之距離L1於玻璃基板GL之下游側、上游側、左側、及右側均相同。11A to 11C and Figs. 12A to 12D show the case where the distance from the center of the grinding wheel 11a to the glass substrate GL is an appropriate distance. The appropriate distance is the distance at which the sliding shaft 414 is at an appropriate position when the grinding wheel 11a comes into contact with the end surface of the glass substrate GL. In FIGS. 11A to 11C , a case where the glass substrate GL is disposed at the center of the transport device 80 will be described as an example. Here, the center line C1 of the glass substrate GL coincides with the center line C2 of the conveying device 80. That is, the distance L1 from the outer side of the conveyance belts 81 and 82 to the end surface of the glass substrate GL is the same on the downstream side, the upstream side, the left side, and the right side of the glass substrate GL.

圖11A表示研磨輪11a與玻璃基板GL之端面接觸之前之狀態。此處,如圖12A所示,對機械臂12a僅施加外力F1。機械臂12a欲沿以箭頭R1表示之方向進行旋動。由於制動機構14a進行作動,故而機械臂12a不會自由地旋動,但藉由彈性構件416之變形,而容許機械臂12a之旋動(彈性構件變形步驟)。藉此,機械臂12a沿箭頭R1方向略微旋動。此時,滑動軸414之位置自恰當位置向M1方向偏移。Fig. 11A shows a state before the grinding wheel 11a comes into contact with the end surface of the glass substrate GL. Here, as shown in FIG. 12A, only the external force F1 is applied to the mechanical arm 12a. The robot arm 12a is intended to be rotated in the direction indicated by the arrow R1. Since the brake mechanism 14a is actuated, the mechanical arm 12a is not freely rotated, but the rotation of the elastic member 416 allows the rotation of the mechanical arm 12a (elastic member deformation step). Thereby, the robot arm 12a is slightly rotated in the direction of the arrow R1. At this time, the position of the slide shaft 414 is shifted from the appropriate position toward the M1 direction.

其後,若玻璃基板GL與研磨輪11a接觸,則如圖12B所示,對機械臂12a亦施加有外力F2。機械臂12a受到外力F2,而欲沿以箭頭R2表示之方向進行旋動。由於制動機構14a進行作動,故而機械臂12a不會自由地旋動,但藉由彈性構件416之變形,而容許機械臂12a之旋動(彈性構件變形步驟)。藉此,機械臂12a沿箭頭R2方向略微旋動。此時,滑動軸414之位置向M2方向偏移。此處,藉由機械臂12a沿箭頭R2方向略微旋動,而滑動軸414返回至恰當位置。若與玻璃基板GL接觸前位於圖11A之實線所示之位置之研磨輪11a與玻璃基板GL之前端部分TP接觸,則移動至以虛線表示之位置。如此,玻璃基板GL之前端部分TP於制動機構14a作動之狀態下藉由研磨輪11a而研磨(第1研磨步驟)。Thereafter, when the glass substrate GL is in contact with the grinding wheel 11a, an external force F2 is also applied to the arm 12a as shown in Fig. 12B. The robot arm 12a receives an external force F2 and is intended to rotate in a direction indicated by an arrow R2. Since the brake mechanism 14a is actuated, the mechanical arm 12a is not freely rotated, but the rotation of the elastic member 416 allows the rotation of the mechanical arm 12a (elastic member deformation step). Thereby, the robot arm 12a is slightly rotated in the direction of the arrow R2. At this time, the position of the slide shaft 414 is shifted in the M2 direction. Here, the mechanical arm 12a is slightly rotated in the direction of the arrow R2, and the sliding shaft 414 is returned to the proper position. When the grinding wheel 11a located at the position indicated by the solid line in FIG. 11A before the contact with the glass substrate GL is in contact with the front end portion TP of the glass substrate GL, it moves to the position indicated by the broken line. In this manner, the front end portion TP of the glass substrate GL is ground by the grinding wheel 11a in a state where the brake mechanism 14a is actuated (first polishing step).

圖11B表示第1研磨步驟之後且玻璃基板GL之前端部分TP位於較研磨輪11a、11b更下游側之狀態。即,圖11B表示對玻璃基板GL之中央部分CP進行研磨之狀態。研磨裝置10a、10b於對玻璃基板GL之中央部分CP進行研磨時,解除制動機構14a、14b。即,上部機構41自下部機構42遠離而位於解除位置。於解除位置上,不對上部接觸單元412施加任何外力F1、F2。如上所述,由於圖11B中所示之自研磨輪11a之中心至玻璃基板GL之距離為恰當距離,故而不會使機械臂12a旋動,成為藉由外力F1欲使機械臂12a向R1方向旋動之力與藉由外力F2欲使機械臂12a向R2方向旋動之力平衡之狀態(參照圖12C)。研磨輪11a於欲使其向R1方向旋動之力與欲使其向R2方向旋動之力平衡之狀態下,對玻璃基板GL之端面進行研磨(第2研磨步驟)。即,研磨輪11a一面追隨玻璃基板之端面一面對其進行研磨。Fig. 11B shows a state after the first polishing step and the front end portion TP of the glass substrate GL is located further downstream than the grinding wheels 11a and 11b. That is, FIG. 11B shows a state in which the central portion CP of the glass substrate GL is polished. When the polishing apparatuses 10a and 10b polish the central portion CP of the glass substrate GL, the brake mechanisms 14a and 14b are released. That is, the upper mechanism 41 is located away from the lower mechanism 42 and is located at the release position. In the release position, no external force F1, F2 is applied to the upper contact unit 412. As described above, since the distance from the center of the grinding wheel 11a to the glass substrate GL shown in Fig. 11B is an appropriate distance, the robot arm 12a is not rotated, and the mechanical arm 12a is intended to be oriented in the R1 direction by the external force F1. The force of the rotation is in a state of balancing the force by which the external force F2 is required to rotate the robot arm 12a in the R2 direction (refer to Fig. 12C). The grinding wheel 11a grinds the end surface of the glass substrate GL in a state in which the force to be rotated in the R1 direction is balanced with the force to be rotated in the R2 direction (second polishing step). That is, the polishing wheel 11a is polished while following the end surface of the glass substrate.

圖11C表示玻璃基板GL將要離開研磨輪11a之前。即,表示玻璃基板GL之中央部分CP之研磨結束後且對玻璃基板GL之後端部分EP進行研磨之狀態。如圖12D所示,對機械臂12a施加有外力F1與外力F2。其為藉由外力F1欲使機械臂12a沿R1方向旋動之力、與藉由外力F2欲使機械臂12a沿R2方向旋動之力平衡之狀態。即,滑動軸414位於恰當位置。此處,制動機構14a作動。玻璃基板GL之後端部分EP於制動機構14a作動之狀態下藉由研磨輪11a而研磨(第3研磨步驟)。其後,若玻璃基板GL自研磨輪11a離開,則對機械臂12a僅施加外力F1。藉此,如圖12A所示,機械臂12a藉由外力F1而欲沿R1方向旋動,且彈性構件416被壓縮(彈性構件變形步驟)。藉此,滑動軸414自恰當位置向M1方向略微偏移。Fig. 11C shows the glass substrate GL before it leaves the grinding wheel 11a. In other words, the state in which the polishing of the central portion CP of the glass substrate GL is completed and the end portion EP of the glass substrate GL is polished is shown. As shown in Fig. 12D, an external force F1 and an external force F2 are applied to the mechanical arm 12a. This is a state in which the external force F1 is intended to cause the mechanical arm 12a to rotate in the R1 direction and the external force F2 to balance the force of the mechanical arm 12a in the R2 direction. That is, the sliding shaft 414 is in the proper position. Here, the brake mechanism 14a is actuated. The rear end portion EP of the glass substrate GL is ground by the grinding wheel 11a in a state where the brake mechanism 14a is actuated (third polishing step). Thereafter, when the glass substrate GL is separated from the grinding wheel 11a, only the external force F1 is applied to the arm 12a. Thereby, as shown in FIG. 12A, the mechanical arm 12a is intended to be rotated in the R1 direction by the external force F1, and the elastic member 416 is compressed (elastic member deformation step). Thereby, the slide shaft 414 is slightly offset from the proper position toward the M1 direction.

(6-2) 自研磨輪之中心至玻璃基板之端面之距離不為恰當距離之情形(6-2) The distance from the center of the grinding wheel to the end face of the glass substrate is not the proper distance

圖13A~圖16C表示自研磨輪11a之中心至玻璃基板GL之端面之距離不為恰當距離之情形之研磨裝置10a(及10b)之動作。圖13A~圖13C表示玻璃基板GL位於偏向搬送裝置80之寬度方向單側之位置之狀態,圖16A~圖16C表示玻璃基板GL相對於搬送裝置80傾斜之狀態。以下,對於自研磨輪11a之中心至玻璃基板GL之端面之距離不為恰當距離之情形之研磨裝置10a之動作,分為玻璃基板GL位於偏向搬送裝置80之寬度方向單側之位置之情形、與玻璃基板GL相對於搬送裝置80傾斜之情形進行說明。13A to 16C show the operation of the polishing apparatus 10a (and 10b) from the case where the distance from the center of the grinding wheel 11a to the end surface of the glass substrate GL is not an appropriate distance. 13A to 13C show a state in which the glass substrate GL is located on one side in the width direction of the deflection conveyance device 80, and FIGS. 16A to 16C show a state in which the glass substrate GL is inclined with respect to the conveyance device 80. In the following, the operation of the polishing apparatus 10a in the case where the distance from the center of the grinding wheel 11a to the end surface of the glass substrate GL is not an appropriate distance is divided into a position where the glass substrate GL is located on one side in the width direction of the deflection conveyance device 80, The case where the glass substrate GL is inclined with respect to the conveyance device 80 is demonstrated.

(6-2-1) 玻璃基板偏向搬送裝置之寬度方向單側之情形(6-2-1) The case where the glass substrate is biased to one side in the width direction of the conveying device

圖13A~圖13C表示自研磨輪11a之中心至玻璃基板GL之端面之距離小於恰當距離之情形(紙面右側之研磨輪11a)、與自研磨輪11b之中心至玻璃基板GL之端面之距離大於恰當距離之情形(紙面左側之研磨輪11b)。自搬送帶81、82之外側至玻璃基板GL之端面之距離L2及L3於玻璃基板GL之上游側及下游側相同。13A to 13C show that the distance from the center of the grinding wheel 11a to the end surface of the glass substrate GL is smaller than the proper distance (the grinding wheel 11a on the right side of the paper surface), and the distance from the center of the grinding wheel 11b to the end surface of the glass substrate GL is larger than The case of the proper distance (grinding wheel 11b on the left side of the paper). The distances L2 and L3 from the outer side of the conveyor belts 81 and 82 to the end faces of the glass substrate GL are the same on the upstream side and the downstream side of the glass substrate GL.

首先,使用圖13A~圖13C(紙面右側之研磨裝置10a)與圖14A~14D,對自研磨輪11a之中心至玻璃基板GL之端面之距離小於恰當距離之情形進行說明。First, the case where the distance from the center of the grinding wheel 11a to the end surface of the glass substrate GL is smaller than the proper distance will be described using FIGS. 13A to 13C (the polishing apparatus 10a on the right side of the paper) and FIGS. 14A to 14D.

圖13A表示研磨輪11a與玻璃基板GL之端面接觸之前之狀態。此處,如圖14A所示,對機械臂12a僅施加來自恆壓氣缸16a之外力F1。機械臂12a欲沿以箭頭R1表示之方向進行旋動。由於制動機構14a進行作動,故而機械臂12a不會自由地旋動,但藉由彈性構件416之變形,而容許機械臂12a之旋動(彈性構件變形步驟)。藉此,機械臂12a沿箭頭R1方向略微旋動。此時,滑動軸414之位置自恰當位置向M1方向略微偏移。Fig. 13A shows a state before the grinding wheel 11a comes into contact with the end surface of the glass substrate GL. Here, as shown in Fig. 14A, only the force F1 from the constant pressure cylinder 16a is applied to the robot arm 12a. The robot arm 12a is intended to be rotated in the direction indicated by the arrow R1. Since the brake mechanism 14a is actuated, the mechanical arm 12a is not freely rotated, but the rotation of the elastic member 416 allows the rotation of the mechanical arm 12a (elastic member deformation step). Thereby, the robot arm 12a is slightly rotated in the direction of the arrow R1. At this time, the position of the slide shaft 414 is slightly shifted from the proper position toward the M1 direction.

其後,若玻璃基板GL與研磨輪11a接觸,則對機械臂12a亦施加有來自玻璃基板GL之外力F2(參照圖14B)。此處,由於自研磨輪11a之中心至玻璃基板GL之端面之距離小於恰當距離,故而施加至機械臂12a之外力F2變得大於圖12B中施加至機械臂12a之外力F2。機械臂12a受到外力F2而欲沿以箭頭R2表示之方向大幅度地旋動。由於制動機構14a進行作動,故而機械臂12a不會自由地旋動,但藉由彈性構件416之較大之變形,而容許機械臂12a之旋動(彈性構件變形步驟)。藉此,機械臂12a沿箭頭R2方向進行旋動。此時,滑動軸414之位置自恰當位置向M2方向偏移。此處,藉由彈性構件416之較大之變形,而抑制玻璃基板GL之切入過多(切入過多抑制步驟)。若在與玻璃基板GL接觸之前位於圖13A之實線所示之位置之研磨輪11a與玻璃基板GL之前端部分TP接觸,則移動至以虛線表示之位置。如此,玻璃基板GL之前端部分TP於制動機構14a作動之狀態下藉由研磨輪11a而研磨(第1研磨步驟)。Thereafter, when the glass substrate GL is in contact with the polishing wheel 11a, a force F2 from the glass substrate GL is also applied to the arm 12a (see FIG. 14B). Here, since the distance from the center of the grinding wheel 11a to the end surface of the glass substrate GL is smaller than the proper distance, the force F2 applied to the robot arm 12a becomes larger than the force F2 applied to the robot arm 12a in Fig. 12B. The robot arm 12a is subjected to an external force F2 and is to be largely rotated in a direction indicated by an arrow R2. Since the brake mechanism 14a is actuated, the mechanical arm 12a does not rotate freely, but the large deformation of the elastic member 416 allows the rotation of the mechanical arm 12a (elastic member deformation step). Thereby, the robot arm 12a is rotated in the direction of the arrow R2. At this time, the position of the slide shaft 414 is shifted from the appropriate position toward the M2 direction. Here, excessive deformation of the glass substrate GL is suppressed by the large deformation of the elastic member 416 (the excessive cut inhibiting step). When the grinding wheel 11a located at the position indicated by the solid line in FIG. 13A before the contact with the glass substrate GL is in contact with the front end portion TP of the glass substrate GL, it moves to the position indicated by the broken line. In this manner, the front end portion TP of the glass substrate GL is ground by the grinding wheel 11a in a state where the brake mechanism 14a is actuated (first polishing step).

圖13B表示第1研磨步驟之後且玻璃基板GL之前端部分TP位於較研磨輪11a為下游側之狀態。即,圖13B表示對玻璃基板GL之中央部分CP進行研磨之狀態。研磨裝置10a於對玻璃基板GL之中央部分CP進行研磨時,解除制動機構14a。即,上部機構41自下部機構42遠離而位於解除位置。於解除位置上,不對上部接觸單元412施加任何外力F1、F2。藉此,被壓縮之彈性構件416恢復為原本之形狀(恢復步驟)。即,如圖14C所示,上部接觸單元412以滑動軸414自實線之位置移至虛線之位置(恰當位置)之方式進行旋動。另一方面,藉由解除制動機構14a,而機械臂12a直接受到外力F1與外力F2。藉此,機械臂12a進行旋動直至欲使其沿R1方向進行旋動之力與欲使其沿R2方向進行旋動之力平衡之位置為止,且以自研磨輪11a之中心至玻璃基板GL之端面之距離變為恰當距離之方式使研磨輪11a移動。研磨輪11a於欲沿R1方向進行旋動之力與欲沿R2方向進行旋動之力平衡之狀態下,對玻璃基板GL之端面進行研磨(第2研磨步驟)。Fig. 13B shows a state after the first polishing step and the front end portion TP of the glass substrate GL is located on the downstream side of the grinding wheel 11a. That is, FIG. 13B shows a state in which the central portion CP of the glass substrate GL is polished. When the polishing apparatus 10a polishes the central portion CP of the glass substrate GL, the brake mechanism 14a is released. That is, the upper mechanism 41 is located away from the lower mechanism 42 and is located at the release position. In the release position, no external force F1, F2 is applied to the upper contact unit 412. Thereby, the compressed elastic member 416 is restored to its original shape (recovery step). That is, as shown in FIG. 14C, the upper contact unit 412 is rotated such that the slide shaft 414 moves from the position of the solid line to the position of the broken line (appropriate position). On the other hand, the mechanical arm 12a directly receives the external force F1 and the external force F2 by releasing the brake mechanism 14a. Thereby, the robot arm 12a is rotated until the force to be rotated in the R1 direction is balanced with the force to be rotated in the R2 direction, and is from the center of the grinding wheel 11a to the glass substrate GL. The grinding wheel 11a is moved in such a manner that the distance of the end face becomes an appropriate distance. The grinding wheel 11a grinds the end surface of the glass substrate GL in a state where the force to be rotated in the R1 direction is balanced with the force to be rotated in the R2 direction (second polishing step).

圖13C表示玻璃基板GL將要離開研磨輪11a之前。即,表示玻璃基板GL之中央部分CP之研磨結束後且對玻璃基板GL之後端部分進行研磨之狀態。如圖14D所示,對機械臂12a施加有外力F1與外力F2,且為欲使其沿R1方向進行旋動之力與欲使其沿R2方向進行旋動之力平衡之狀態。此處,制動機構14a進行作動。於制動機構14a作動時,由外力F1及外力F2所產生之力平衡,因此上部接觸單元412不受任一外力F1、F2之影響。因此,彈性構件416保持原型,使滑動軸414停留於彈性構件416之中央(恰當位置)。玻璃基板GL之後端部分EP於制動機構14a作動之狀態下藉由研磨輪11a而研磨(第3研磨步驟)。其後,若玻璃基板GL自研磨輪11a離開,則對機械臂12a僅施加外力F1,因此如圖14A所示,彈性構件416產生變形,容許機械臂12a之旋動(彈性構件變形步驟)。又,滑動軸414隨著機械臂12a之旋動,而自恰當位置向M1方向略微偏移。Fig. 13C shows that the glass substrate GL is about to leave the grinding wheel 11a. In other words, the state in which the polishing of the central portion CP of the glass substrate GL is completed and the rear end portion of the glass substrate GL is polished is shown. As shown in Fig. 14D, an external force F1 and an external force F2 are applied to the mechanical arm 12a, and the force for which the force is to be swung in the R1 direction is balanced with the force for which the rotation is to be performed in the R2 direction. Here, the brake mechanism 14a is actuated. When the brake mechanism 14a is actuated, the force generated by the external force F1 and the external force F2 is balanced, so that the upper contact unit 412 is not affected by any external force F1, F2. Thus, the resilient member 416 remains prototyped such that the sliding shaft 414 stays in the center (appropriate position) of the resilient member 416. The rear end portion EP of the glass substrate GL is ground by the grinding wheel 11a in a state where the brake mechanism 14a is actuated (third polishing step). Thereafter, when the glass substrate GL is separated from the grinding wheel 11a, only the external force F1 is applied to the arm 12a. Therefore, as shown in Fig. 14A, the elastic member 416 is deformed, and the rotation of the arm 12a is allowed (the elastic member deforming step). Further, the slide shaft 414 is slightly shifted from the appropriate position toward the M1 direction as the robot arm 12a is rotated.

其次,使用圖13A~圖13C(紙面左側之研磨裝置10b)與圖15A~15D,對自研磨輪11a、11b之中心至玻璃基板GL之端面之距離大於恰當距離之情形進行說明。再者,雖然圖15A~圖15D之研磨裝置10a之配置與圖13A~圖13C之研磨裝置10a之配置不同,但動作原理相同。Next, the case where the distance from the center of the grinding wheels 11a and 11b to the end surface of the glass substrate GL is larger than the proper distance will be described using FIGS. 13A to 13C (the polishing apparatus 10b on the left side of the paper) and FIGS. 15A to 15D. Further, although the arrangement of the polishing apparatus 10a of FIGS. 15A to 15D is different from the arrangement of the polishing apparatus 10a of FIGS. 13A to 13C, the operation principle is the same.

如上所述,圖13A表示研磨輪11b與玻璃基板GL之端面接觸之前之狀態。此處,如圖15A所示,對機械臂12a僅施加來自恆壓氣缸16a之外力F1。機械臂12a欲沿以箭頭R1表示之方向進行旋動。由於制動機構14a進行作動,故而機械臂12a不會自由地旋動,但藉由彈性構件416之變形,而容許機械臂12a之旋動(彈性構件變形步驟)。藉此,機械臂12a沿箭頭R1方向略微旋動。此時,滑動軸414之位置自恰當位置向M1方向略微偏移。As described above, FIG. 13A shows a state before the grinding wheel 11b is in contact with the end surface of the glass substrate GL. Here, as shown in Fig. 15A, only the force F1 from the constant pressure cylinder 16a is applied to the robot arm 12a. The robot arm 12a is intended to be rotated in the direction indicated by the arrow R1. Since the brake mechanism 14a is actuated, the mechanical arm 12a is not freely rotated, but the rotation of the elastic member 416 allows the rotation of the mechanical arm 12a (elastic member deformation step). Thereby, the robot arm 12a is slightly rotated in the direction of the arrow R1. At this time, the position of the slide shaft 414 is slightly shifted from the proper position toward the M1 direction.

其後,若玻璃基板GL與研磨輪11a接觸,則對機械臂12a亦施加有外力F2(參照圖15B)。此處,由於自研磨輪11a之中心至玻璃基板GL之端面之距離大於恰當距離,故而施加至機械臂12a之外力F2變得小於圖12B中施加至機械臂12a之外力F2。機械臂12a欲沿以箭頭R2表示之方向小幅度地旋動。由於制動機構14a進行作動,故而機械臂12a不會自由地旋動,但藉由使彈性構件416之形狀略微恢復,而容許機械臂12a以相當於所恢復之程度進行旋動(恢復步驟)。藉此,機械臂12a沿箭頭R2方向進行旋動。此時,滑動軸414之位置自恰當位置向M2方向偏移。在與玻璃基板GL之端面接觸之前位於圖13A之實線所示之位置之研磨輪11a於與玻璃基板GL接觸後,移動至以虛線表示之位置。如此,玻璃基板GL之前端部分TP於制動機構14a作動之狀態下藉由研磨輪11a而研磨(第1研磨步驟)。Thereafter, when the glass substrate GL comes into contact with the grinding wheel 11a, an external force F2 is also applied to the arm 12a (see FIG. 15B). Here, since the distance from the center of the grinding wheel 11a to the end surface of the glass substrate GL is larger than the proper distance, the force F2 applied to the robot arm 12a becomes smaller than the force F2 applied to the robot arm 12a in Fig. 12B. The robot arm 12a is intended to be rotated slightly in the direction indicated by the arrow R2. Since the brake mechanism 14a is actuated, the robot arm 12a does not rotate freely, but the shape of the elastic member 416 is slightly restored, and the robot arm 12a is allowed to rotate at a level corresponding to the recovery (recovery step). Thereby, the robot arm 12a is rotated in the direction of the arrow R2. At this time, the position of the slide shaft 414 is shifted from the appropriate position toward the M2 direction. The grinding wheel 11a located at a position shown by the solid line in FIG. 13A before coming into contact with the end surface of the glass substrate GL is moved to a position indicated by a broken line after coming into contact with the glass substrate GL. In this manner, the front end portion TP of the glass substrate GL is ground by the grinding wheel 11a in a state where the brake mechanism 14a is actuated (first polishing step).

如上所述,圖13B表示對玻璃基板GL之中央部分CP進行研磨之狀態。即,圖13B表示第1研磨步驟之後且玻璃基板GL之前端部分TP位於較研磨輪11b為下游側之狀態。研磨裝置10b於對玻璃基板GL之中央部分CP進行研磨時,解除制動機構14b。即,上部機構41自下部機構42遠離而位於解除位置。於解除位置上,不對上部接觸單元412施加任何外力F1、F2。藉此,被壓縮之彈性構件416恢復為原本之形狀(恢復步驟)。即,如圖15C所示,上部接觸單元412以滑動軸414自實線之位置移至虛線之位置(恰當位置)之方式進行旋動。另一方面,藉由解除制動機構14a,而機械臂12a直接受到來自恆壓氣缸之外力F1與來自玻璃基板GL之外力F2。藉此,機械臂12a進行旋動直至欲使其沿R1方向進行旋動之力與欲使其沿R2方向進行旋動之力平衡之位置為止,且以自研磨輪11a之中心至玻璃基板GL之端面之距離變為恰當距離之方式使研磨輪11a移動。研磨輪11b於欲使其沿R1方向進行旋動之力與欲使其沿R2方向進行旋動之力平衡之狀態下,對玻璃基板GL之端面進行研磨(第2研磨步驟)。As described above, FIG. 13B shows a state in which the central portion CP of the glass substrate GL is polished. That is, FIG. 13B shows a state in which the front end portion TP of the glass substrate GL is located downstream of the grinding wheel 11b after the first polishing step. When the polishing apparatus 10b polishes the central portion CP of the glass substrate GL, the brake mechanism 14b is released. That is, the upper mechanism 41 is located away from the lower mechanism 42 and is located at the release position. In the release position, no external force F1, F2 is applied to the upper contact unit 412. Thereby, the compressed elastic member 416 is restored to its original shape (recovery step). That is, as shown in FIG. 15C, the upper contact unit 412 is rotated such that the slide shaft 414 is moved from the position of the solid line to the position of the broken line (appropriate position). On the other hand, by releasing the brake mechanism 14a, the robot arm 12a directly receives the force F1 from the constant pressure cylinder and the force F2 from the glass substrate GL. Thereby, the robot arm 12a is rotated until the force to be rotated in the R1 direction is balanced with the force to be rotated in the R2 direction, and is from the center of the grinding wheel 11a to the glass substrate GL. The grinding wheel 11a is moved in such a manner that the distance of the end face becomes an appropriate distance. The grinding wheel 11b grinds the end surface of the glass substrate GL in a state in which the force to be rotated in the R1 direction is balanced with the force to be rotated in the R2 direction (second polishing step).

如上所述,圖13C表示玻璃基板GL將要離開研磨輪11b之前。即,表示玻璃基板GL之中央部分CP之研磨結束後且對玻璃基板GL之後端部分進行研磨之狀態。如圖15D所示,對機械臂12a施加有外力F1與外力F2,且為欲使其沿R1方向進行旋動之力與欲使其沿R2方向進行旋動之力平衡之狀態。此處,制動機構14a進行作動。於制動機構14a作動時,由外力F1及外力F2所產生之力平衡,因此上部接觸單元412不受任一外力F1、F2之影響。因此,彈性構件416保持原型,使滑動軸414停留於彈性構件416之中央(恰當位置)。玻璃基板GL之後端部分EP於制動機構14a作動之狀態下藉由研磨輪11a而研磨(第3研磨步驟)。其後,若玻璃基板GL自研磨輪11a離開,則對機械臂12a僅施加外力F1,因此如圖15A所示,彈性構件416產生變形,容許機械臂12a之旋動(彈性構件變形步驟)。又,滑動軸414隨著機械臂之旋動,而自恰當位置向M1方向略微偏移。As described above, Fig. 13C shows that the glass substrate GL is about to leave the grinding wheel 11b. In other words, the state in which the polishing of the central portion CP of the glass substrate GL is completed and the rear end portion of the glass substrate GL is polished is shown. As shown in Fig. 15D, an external force F1 and an external force F2 are applied to the mechanical arm 12a, and the force for which the force is to be swung in the R1 direction is balanced with the force for which the rotation is to be performed in the R2 direction. Here, the brake mechanism 14a is actuated. When the brake mechanism 14a is actuated, the force generated by the external force F1 and the external force F2 is balanced, so that the upper contact unit 412 is not affected by any external force F1, F2. Thus, the resilient member 416 remains prototyped such that the sliding shaft 414 stays in the center (appropriate position) of the resilient member 416. The rear end portion EP of the glass substrate GL is ground by the grinding wheel 11a in a state where the brake mechanism 14a is actuated (third polishing step). Thereafter, when the glass substrate GL is separated from the grinding wheel 11a, only the external force F1 is applied to the arm 12a. Therefore, as shown in Fig. 15A, the elastic member 416 is deformed, and the rotation of the arm 12a is allowed (the elastic member deforming step). Further, the slide shaft 414 is slightly shifted from the appropriate position toward the M1 direction as the arm is rotated.

(6-2-2)玻璃基板相對於搬送裝置傾斜之情形(6-2-2) The case where the glass substrate is inclined with respect to the conveying device

圖16A~圖16C表示自搬送帶81、82之外側至玻璃基板GL之前端部分TP之距離L2、L3、與自搬送帶81、82之外側至玻璃基板GL之後端部分EP之距離L3、L2不同之情形。換言之,就紙面右側之研磨裝置10a與玻璃基板GL之關係而言,自研磨輪11a之中心至玻璃基板GL之前端部分TP之距離小於恰當距離,自研磨輪11a之中心至玻璃基板GL之後端部分EP之距離大於恰當距離。又,就紙面左側之研磨裝置10b與玻璃基板GL之關係而言,自研磨輪11b之中心至玻璃基板GL之前端部分TP之距離大於恰當距離,自研磨輪11b之中心至玻璃基板GL之後端部分EP之距離小於恰當距離。16A to 16C show the distances L2, L3 from the outer side of the conveyor belts 81, 82 to the front end portion TP of the glass substrate GL, and the distances L3, L2 from the outer side of the self-propelled belts 81, 82 to the rear end portion EP of the glass substrate GL. Different situations. In other words, in terms of the relationship between the polishing apparatus 10a on the right side of the paper and the glass substrate GL, the distance from the center of the grinding wheel 11a to the front end portion TP of the glass substrate GL is smaller than the proper distance from the center of the grinding wheel 11a to the rear end of the glass substrate GL. The distance between some EPs is greater than the proper distance. Further, in terms of the relationship between the polishing apparatus 10b on the left side of the paper and the glass substrate GL, the distance from the center of the grinding wheel 11b to the front end portion TP of the glass substrate GL is larger than the proper distance from the center of the grinding wheel 11b to the rear end of the glass substrate GL. The distance of part EP is less than the proper distance.

於此情形時,如圖14A~14D所示,於研磨輪11a與玻璃基板GL之端面接觸時,制動機構14a進行作動,因此機械臂12a不會自由地旋動。然而,藉由彈性構件416之變形而容許機械臂12a之旋動(彈性構件變形步驟)。若機械臂12a進行旋動,則滑動軸414之於插入部中之位置產生變化。繼而,玻璃基板GL之前端部分TP於制動機構14a作動之狀態下藉由研磨輪11a而研磨(第1研磨步驟)。In this case, as shown in FIGS. 14A to 14D, when the grinding wheel 11a comes into contact with the end surface of the glass substrate GL, the brake mechanism 14a is actuated, so that the arm 12a is not freely rotated. However, the rotation of the arm 12a is allowed by the deformation of the elastic member 416 (elastic member deformation step). When the robot arm 12a is rotated, the position of the slide shaft 414 in the insertion portion changes. Then, the front end portion TP of the glass substrate GL is ground by the grinding wheel 11a in a state where the brake mechanism 14a is actuated (first polishing step).

若研磨輪11a與玻璃基板GL接觸,則立刻解除制動機構14a。機械臂12a進行旋動,以使得欲使其沿R1方向進行旋動之力與欲使其沿R2方向進行旋動之力平衡,從而研磨輪11a一面沿玻璃基板GL之傾斜一面對玻璃基板GL之端面進行研磨(第2研磨步驟)。此時,於解除位置上,不對上部接觸單元412施加任何外力F1、F2。藉此,彈性構件416恢復為原本之形狀(恢復步驟)。When the grinding wheel 11a comes into contact with the glass substrate GL, the brake mechanism 14a is immediately released. The robot arm 12a is rotated so that the force to be rotated in the R1 direction is balanced with the force to be rotated in the R2 direction, so that the grinding wheel 11a faces the glass substrate along the inclination of the glass substrate GL. The end face of GL is ground (second polishing step). At this time, in the release position, no external force F1, F2 is applied to the upper contact unit 412. Thereby, the elastic member 416 is restored to the original shape (recovery step).

若玻璃基板GL之中央部分CP之研磨結束,則制動機構14a進行作動。玻璃基板GL之後端部分EP於使制動機構14a作動之狀態下藉由研磨輪11a而研磨(第3研磨步驟)。於第3研磨步驟中,於不對彈性構件416施加外力F1、F2之狀態下制動機構14a進行作動。相對於制動機構14a作動後之玻璃基板GL之傾斜,彈性構件416根據外力F1或外力F2而產生變形。藉此,研磨輪11a於彈性構件416可變形之範圍內,追隨玻璃基板GL之端面。When the polishing of the central portion CP of the glass substrate GL is completed, the brake mechanism 14a is actuated. The rear end portion EP of the glass substrate GL is ground by the grinding wheel 11a in a state where the brake mechanism 14a is actuated (third polishing step). In the third polishing step, the brake mechanism 14a is actuated without applying the external forces F1 and F2 to the elastic member 416. The elastic member 416 is deformed in accordance with the external force F1 or the external force F2 with respect to the inclination of the glass substrate GL after the brake mechanism 14a is actuated. Thereby, the grinding wheel 11a follows the end surface of the glass substrate GL within a range in which the elastic member 416 is deformable.

於玻璃基板GL自研磨輪11a離開後,對機械臂12a僅施加有來自恆壓氣缸16a之外力F1,因此彈性構件416產生變形(彈性構件變形步驟),而滑動軸414自恰當位置向M1方向略微偏移。After the glass substrate GL is separated from the grinding wheel 11a, only the external force F1 from the constant pressure cylinder 16a is applied to the mechanical arm 12a, so that the elastic member 416 is deformed (elastic member deformation step), and the sliding shaft 414 is from the appropriate position to the M1 direction. Slightly offset.

(7) 特徵(7) Features

(7-1)(7-1)

上述實施形態之玻璃基板之製造方法係無論被搬送之玻璃基板GL之狀態如何,均可較佳地研磨玻璃基板GL之端面。In the method of manufacturing the glass substrate of the above embodiment, the end surface of the glass substrate GL can be preferably polished regardless of the state of the glass substrate GL to be conveyed.

於通常之玻璃基板之製造方法中之玻璃基板之研磨步驟中,藉由搬送裝置對連續地被搬送之玻璃基板進行研磨。此處,作為用以對玻璃基板進行研磨之研磨裝置,考慮有荷重時序控制型之研磨裝置、與待機控制型之研磨裝置。荷重時序控制型之研磨裝置係預先對研磨輪施加荷重,配合玻璃基板被搬送之時序而使研磨輪接近於玻璃基板,以研磨玻璃基板之端面。然而,荷重時序控制型之研磨裝置因機械性的動作誤差及電性控制之響應延遲等,而難以較佳地研磨玻璃基板之整個端面(即,玻璃基板之前端部分TP、中央部分CP、及後端部分EP)。尤其近年來,隨著玻璃基板之大量生產之需求,利用搬送裝置之玻璃基板之搬送速度亦不斷高速化。因玻璃基板之搬送速度之高速化,而玻璃基板之前端部分TP變得尤其容易發生遺漏研磨。又,待機控制型之研磨裝置係預先使研磨輪於與被搬送之玻璃基板接觸之位置上待機,而對已與研磨輪接觸之玻璃基板之端面進行研磨。待機控制型之研磨裝置於使研磨輪待機之位置(待機位置)為適當之位置之情形時,可防止玻璃基板之前端部分TP之遺漏研磨,但於研磨輪之待機位置不適當之情形時,玻璃基板之角部與研磨輪猛烈地接觸,而發生玻璃基板之破損及研磨輪之異常磨損,或產生未研磨部分。又,為藉由待機控制型之研磨裝置消除如上所述之不良情形,而必需使研磨裝置中所包含之驅動部之精度、或搬送裝置之搬送精度進一步提高。又,若欲採用精度更高之裝置,則成本會變高,故而欠佳。In the polishing step of the glass substrate in the usual method for producing a glass substrate, the glass substrate continuously conveyed is polished by a transfer device. Here, as a polishing apparatus for polishing a glass substrate, a polishing apparatus of a load timing control type and a polishing apparatus of a standby control type are considered. In the load timing control type polishing apparatus, a load is applied to the polishing wheel in advance, and the polishing wheel is brought close to the glass substrate in accordance with the timing at which the glass substrate is conveyed to polish the end surface of the glass substrate. However, the load timing control type polishing apparatus is difficult to preferably polish the entire end surface of the glass substrate due to mechanical operation errors and response delays of electrical control (ie, the front end portion TP of the glass substrate, the central portion CP, and Backend section EP). In particular, in recent years, with the demand for mass production of glass substrates, the transport speed of the glass substrate by the transfer device has also been increasing. Due to the increase in the transport speed of the glass substrate, the front end portion TP of the glass substrate is particularly prone to omission polishing. Further, the standby control type polishing apparatus waits for the polishing wheel to stand by at a position in contact with the glass substrate to be conveyed, and polishes the end surface of the glass substrate that has been in contact with the polishing wheel. When the polishing apparatus of the standby control type is in a position where the grinding wheel is in a standby position (standby position), the polishing of the front end portion TP of the glass substrate can be prevented, but when the standby position of the grinding wheel is inappropriate, The corner portion of the glass substrate is in violent contact with the grinding wheel, and the glass substrate is broken and the grinding wheel is abnormally worn or an unpolished portion is generated. Further, in order to eliminate the above-described problem by the standby control type polishing apparatus, it is necessary to further improve the accuracy of the driving unit included in the polishing apparatus or the conveying accuracy of the conveying apparatus. Moreover, if a device with higher precision is to be used, the cost will become higher and it is not preferable.

然而,於上述實施形態之玻璃基板之製造方法中,研磨步驟S4中所使用之研磨裝置10a、10b包含可追隨玻璃基板GL之寬度方向之變動的研磨輪11a、11b。此處,所謂玻璃基板GL之寬度方向之變動,係沿與玻璃基板GL之搬送方向交叉之方向的玻璃基板GL之變動。即,即便於因玻璃基板GL在偏向搬送裝置80之單側之狀態下被搬送,或玻璃基板GL在相對於搬送裝置80傾斜之狀態下被搬送,而自研磨輪11a、11b至玻璃基板GL之端面之距離產生變化之情形時,亦可較佳地研磨包含前端部分TP在內之玻璃基板GL之端面整體。However, in the method of manufacturing a glass substrate according to the above embodiment, the polishing apparatuses 10a and 10b used in the polishing step S4 include polishing wheels 11a and 11b that can follow the fluctuation in the width direction of the glass substrate GL. Here, the fluctuation of the width direction of the glass substrate GL is a change of the glass substrate GL in the direction which intersects the conveyance direction of the glass substrate GL. In other words, the glass substrate GL is transported in a state in which one side of the deflecting transport device 80 is transported, or the glass substrate GL is transported in a state of being inclined with respect to the transport device 80, and the self-polishing wheels 11a and 11b to the glass substrate GL are transported. When the distance between the end faces is changed, the entire end surface of the glass substrate GL including the tip end portion TP can be preferably polished.

(7-2)(7-2)

於上述實施形態之研磨裝置10a、10b中,在對玻璃基板GL之中央部分CP進行研磨時,解除制動機構14a、14b,對研磨輪11a、11b施加來自恆壓氣缸之外力F1,藉此使機械臂12a、12b自由地旋動,而使研磨輪11a、11b追隨玻璃基板GL之端面。又,若中央部分之研磨結束,則使制動機構14a、14b作動,等待接下來被搬送之玻璃基板(後續之玻璃基板)GL。此處,制動機構14a、14b作動之狀態下之研磨裝置10a、10b係將研磨輪11a、11b配置於適合研磨後續之玻璃基板GL之端面之位置。In the polishing apparatuses 10a and 10b of the above-described embodiment, when the central portion CP of the glass substrate GL is polished, the brake mechanisms 14a and 14b are released, and the external force F1 from the constant pressure cylinder is applied to the grinding wheels 11a and 11b. The robot arms 12a, 12b are freely rotated, and the grinding wheels 11a, 11b follow the end faces of the glass substrate GL. When the polishing of the central portion is completed, the brake mechanisms 14a and 14b are actuated to wait for the glass substrate (subsequent glass substrate) GL to be conveyed next. Here, in the polishing apparatuses 10a and 10b in a state where the brake mechanisms 14a and 14b are actuated, the grinding wheels 11a and 11b are disposed at positions where the end faces of the subsequent glass substrates GL are suitable for polishing.

一般而言,如上述實施形態中所使用之搬送裝置80般,於搬送裝置80包含搬送帶之情形時,會產生由搬送帶之劣化所導致之彎曲等。於此情形時,在一定之週期下玻璃基板GL被搬送之位置可能產生偏移。然而,上述實施形態中所使用之研磨裝置10a、10b係根據先行之玻璃基板GL之研磨狀態而決定適合研磨後續之玻璃基板GL之端面之位置。即,基於先行之玻璃基板GL之端面之研磨已結束之位置,而推斷後續之玻璃基板GL之較佳之研磨位置。藉此,無論搬送帶有無劣化或異常,均可適當地研磨玻璃基板GL之端面。In general, as in the case of the transport device 80 used in the above-described embodiment, when the transport device 80 includes a transport belt, bending or the like caused by deterioration of the transport belt may occur. In this case, the position at which the glass substrate GL is transported may be shifted at a certain period. However, the polishing apparatuses 10a and 10b used in the above embodiment determine the position of the end surface of the glass substrate GL suitable for polishing based on the polishing state of the preceding glass substrate GL. That is, the preferred polishing position of the subsequent glass substrate GL is estimated based on the position where the polishing of the end face of the preceding glass substrate GL has been completed. Thereby, the end surface of the glass substrate GL can be appropriately polished regardless of the deterioration or abnormality of the conveyance.

(7-3)(7-3)

又,於上述實施形態之研磨裝置10a、10b中,插入部413a-413c中容納有彈性構件416。於上部接觸單元412中,在插入部413a-413c中所容納之彈性構件416之內側插入有滑動軸414。於由研磨裝置10a、10b所推斷之後續之玻璃基板GL之較佳之研磨位置稍微產生有偏移之情形時,藉由使彈性構件416產生變形,而以研磨輪11a、11b適當地與玻璃基板GL之端面接觸之方式使機械臂12a、12b旋動。藉此,即便於後續之玻璃基板GL被搬送之位置與所推斷之較佳之研磨位置不同之情形時,亦可對研磨輪11a、11b之位置進行微調整。藉此,可確實地進行玻璃基板GL之前端部分TP之研磨。Further, in the polishing apparatuses 10a and 10b of the above embodiment, the elastic members 416 are accommodated in the insertion portions 413a to 413c. In the upper contact unit 412, a slide shaft 414 is inserted inside the elastic member 416 accommodated in the insertion portions 413a to 413c. When the preferred polishing position of the subsequent glass substrate GL inferred by the polishing apparatus 10a, 10b is slightly offset, the polishing wheel 11a, 11b is appropriately combined with the glass substrate by deforming the elastic member 416. The end faces of the GL are in contact with each other to cause the robot arms 12a, 12b to rotate. Thereby, even when the position where the subsequent glass substrate GL is conveyed is different from the estimated polishing position, the positions of the grinding wheels 11a and 11b can be finely adjusted. Thereby, the polishing of the front end portion TP of the glass substrate GL can be surely performed.

又,即便於研磨輪11a、11b待機之位置相對於玻璃基板GL之端面過近之情形時,彈性構件416亦會吸收由玻璃基板GL與研磨輪11a、11b之接觸所致之衝擊,因此可防止玻璃基板GL之破損及研磨輪11a、11b之異常磨損。Further, even when the position where the grinding wheels 11a and 11b are in standby is too close to the end surface of the glass substrate GL, the elastic member 416 absorbs the impact caused by the contact between the glass substrate GL and the grinding wheels 11a and 11b. The glass substrate GL is prevented from being damaged and the abrasive wheels 11a and 11b are abnormally worn.

(7-4)(7-4)

於上述實施形態中,在制動機構14a、14b作動之期間,如上所述,藉由根據玻璃基板GL之搬送狀態使彈性構件416產生變形,而容許機械臂12a、12b之旋動。彈性構件416藉由被滑動軸414壓縮而變形。又,於上述實施形態中,在對玻璃基板GL之中央部分CP進行研磨之期間,解除制動機構14a、14b,於解除制動機構14a、14b之期間,使彈性構件416之形狀恢復。因此,其後,制動機構14a、14b進行作動而對先行之玻璃基板GL之後端部分EP進行研磨,進而,於開始後續之玻璃基板GL之研磨時,可使彈性構件416產生大幅度變形。換言之,於研磨輪11a與後續之玻璃基板GL接觸時,彈性構件416為藉由外力F1被最大壓縮之狀態。此時,彈性構件416為可最靈活地應對外力F2之狀態(機械臂12a、12b可旋動之範圍最大之狀態)。因此,於後續之玻璃基板GL被搬送之位置與所推斷之較佳之研磨位置不同之情形時亦可靈活地應對。In the above-described embodiment, during the operation of the brake mechanisms 14a and 14b, as described above, the elastic member 416 is deformed in accordance with the conveyance state of the glass substrate GL, and the rotation of the robot arms 12a and 12b is allowed. The elastic member 416 is deformed by being compressed by the sliding shaft 414. Further, in the above-described embodiment, the brake mechanisms 14a and 14b are released while the central portion CP of the glass substrate GL is being polished, and the shape of the elastic member 416 is restored while the brake mechanisms 14a and 14b are being released. Therefore, the brake mechanisms 14a and 14b are thereafter operated to polish the rear end portion EP of the preceding glass substrate GL, and further, the elastic member 416 can be largely deformed when the subsequent polishing of the glass substrate GL is started. In other words, when the grinding wheel 11a comes into contact with the subsequent glass substrate GL, the elastic member 416 is in a state of being most compressed by the external force F1. At this time, the elastic member 416 is in a state in which the external force F2 can be most flexibly handled (the state in which the range in which the mechanical arms 12a and 12b can be rotated is the largest). Therefore, it is possible to flexibly cope with the case where the subsequent glass substrate GL is transported at a position different from the inferred better polishing position.

(7-5)(7-5)

上述實施形態之研磨裝置10a、10b係以自研磨輪11a、11b之中心至玻璃基板GL之端面之距離保持恰當距離之方式使機械臂12a、12b旋動。藉此,不僅於玻璃基板GL相對於搬送裝置80傾斜之情形及玻璃基板GL偏向搬送裝置80之寬度方向單側之情形時,而且於因研磨輪11a、11b之磨損,而研磨輪11a、11b之直徑產生有變化之情形時,亦可較佳地研磨玻璃基板GL之端面。In the polishing apparatuses 10a and 10b of the above embodiment, the robot arms 12a and 12b are rotated such that the distance from the center of the grinding wheels 11a and 11b to the end surface of the glass substrate GL is maintained at an appropriate distance. Thereby, not only when the glass substrate GL is inclined with respect to the conveying device 80 but also when the glass substrate GL is biased to one side in the width direction of the conveying device 80, and the grinding wheels 11a and 11b are worn by the grinding wheels 11a and 11b, the grinding wheels 11a and 11b are worn. When the diameter is changed, the end surface of the glass substrate GL can be preferably polished.

(7-6)(7-6)

於上述實施形態中,為大量生產玻璃基板GL,而以相對較快之速度搬送玻璃基板GL。具體而言,玻璃基板GL之搬送速度為5 m/s~15 m/s(較佳為10 m/s~15 m/s)。若玻璃基板GL以5 m/s~15 m/s(較佳為10 m/s~15 m/s)之速度與研磨輪11a、11b接觸,則於研磨輪11a、11b待機之位置不適當之情形時,玻璃基板GL易產生破損。又,於如上述實施形態中所製造之玻璃基板GL般製造厚度非常小之玻璃基板之情形時,玻璃基板GL更易產生破損。In the above embodiment, the glass substrate GL is mass-produced, and the glass substrate GL is conveyed at a relatively high speed. Specifically, the transport speed of the glass substrate GL is 5 m/s to 15 m/s (preferably 10 m/s to 15 m/s). When the glass substrate GL is in contact with the grinding wheels 11a and 11b at a speed of 5 m/s to 15 m/s (preferably 10 m/s to 15 m/s), the positions where the grinding wheels 11a and 11b stand by are not appropriate. In the case of the case, the glass substrate GL is liable to be damaged. Further, in the case of producing a glass substrate having a very small thickness as in the case of the glass substrate GL manufactured in the above embodiment, the glass substrate GL is more likely to be damaged.

然而,於上述實施形態中,在對一玻璃基板GL進行研磨之期間,使機械臂12a、12b自由地旋動,使研磨輪11a、11b移動至適合於後續之玻璃基板GL之狀態之位置。又,由於研磨裝置10a、10b包含彈性構件416,故而於所估計之後續之玻璃基板GL之搬送狀態與實際上被搬送之後續之玻璃基板GL之搬送狀態不同之情形時,使彈性構件416壓縮而容許機械臂12a、12b之旋動。However, in the above embodiment, while the glass substrate GL is being polished, the robot arms 12a and 12b are freely rotated, and the polishing wheels 11a and 11b are moved to a position suitable for the state of the subsequent glass substrate GL. Further, since the polishing apparatuses 10a and 10b include the elastic member 416, the elastic member 416 is compressed when the estimated conveyance state of the subsequent glass substrate GL is different from the conveyance state of the subsequent glass substrate GL which is actually conveyed. The rotation of the robot arms 12a, 12b is allowed.

藉此,於上述實施形態之玻璃基板之製造方法中,即便於大量生產非常薄之玻璃基板之情形時,亦可減少涉及研磨之玻璃基板之破損,而提高玻璃基板GL之生產率。As a result, in the method for producing a glass substrate of the above-described embodiment, even when a very thin glass substrate is produced in a large amount, the damage of the glass substrate to be polished can be reduced, and the productivity of the glass substrate GL can be improved.

(8) 變形例(8) Modifications

(8-1) 變形例A(8-1) Modification A

於上述實施形態中,在玻璃基板GL將要自研磨輪11a、11b離開之前制動機構14a、14b進行作動,但制動機構14a、14b亦可於玻璃基板GL之中央部分之中途作動。In the above embodiment, the brake mechanisms 14a and 14b are actuated before the glass substrate GL is to be separated from the grinding wheels 11a and 11b. However, the brake mechanisms 14a and 14b may be moved in the middle of the central portion of the glass substrate GL.

(8-2) 變形例B(8-2) Modification B

於上述實施形態中,作為搬送玻璃基板GL之機構,採用包含吸附式之搬送帶81、82之搬送裝置80,但搬送裝置80亦可具有其他構成。例如,搬送裝置80亦可於玻璃基板GL之寬度方向兩側包含夾持玻璃基板GL之正面及背面之帶。又,搬送裝置80亦可為吸附玻璃基板GL而進行搬送之台。In the above embodiment, the conveying device 80 including the suction type conveying belts 81 and 82 is used as the mechanism for conveying the glass substrate GL. However, the conveying device 80 may have another configuration. For example, the conveying device 80 may include a belt that sandwiches the front surface and the back surface of the glass substrate GL on both sides in the width direction of the glass substrate GL. Further, the conveying device 80 may be a table that transports the glass substrate GL and transports it.

(8-3) 變形例C(8-3) Modification C

於上述實施形態中,對如下構成進行了說明:以研磨輪11a之外緣位於自玻璃基板GL之端面起算為特定距離W之內側之方式使研磨輪11a與玻璃基板GL之端面接觸。此處,特定距離W係基於彈性構件416之彈性之程度、插入部之直徑之大小、彈性構件416於插入部中所占之比例、機械臂之旋動範圍、及搬送裝置80之搬送精度等而決定,並不限於上述實施形態中所記載之距離。In the above-described embodiment, the polishing wheel 11a is brought into contact with the end surface of the glass substrate GL such that the outer edge of the polishing wheel 11a is located inside the specific distance W from the end surface of the glass substrate GL. Here, the specific distance W is based on the degree of elasticity of the elastic member 416, the size of the diameter of the insertion portion, the ratio of the elastic member 416 in the insertion portion, the range of rotation of the arm, and the conveyance accuracy of the conveying device 80. The decision is not limited to the distance described in the above embodiment.

又,於上述實施形態中,說明了彈性構件416較佳為具有容許機械臂12a之特定量之旋動,且使滑動軸414及滑動軸承415自中心線C3向左右偏移0.2 mm之程度之彈性,並認為該彈性根據玻璃基板GL之種類(玻璃基板GL之組成)進行變更,但除此以外,彈性構件之彈性之程度亦可考慮利用搬送裝置80之玻璃基板GL之搬送精度、或研磨輪11a磨損之程度等而決定。又,彈性構件之彈性之程度亦可根據玻璃基板GL之搬送速度或玻璃基板GL之厚度而變更。Further, in the above embodiment, it has been described that the elastic member 416 preferably has a certain amount of rotation allowing the arm 12a, and the sliding shaft 414 and the sliding bearing 415 are shifted by 0.2 mm from the center line C3 to the left and right. The elasticity is considered to be changed according to the type of the glass substrate GL (the composition of the glass substrate GL). However, the degree of elasticity of the elastic member may be considered in consideration of the conveyance precision or polishing of the glass substrate GL by the transfer device 80. The degree of wear of the wheel 11a is determined. Further, the degree of elasticity of the elastic member may be changed depending on the transport speed of the glass substrate GL or the thickness of the glass substrate GL.

於上述實施形態中,特徵在於無論玻璃基板GL之搬送狀態為何種狀態,研磨輪11a均可於對玻璃基板GL施加有一定範圍之壓力之狀態下,對玻璃基板GL之端面進行研磨。因此,於上述制動機構14a、14b之構成中,只要設計為於與玻璃基板GL接觸時施加一定範圍之壓力,則並不限定為上述實施形態中所例示之值。In the above embodiment, the polishing wheel 11a can polish the end surface of the glass substrate GL with a certain range of pressure applied to the glass substrate GL regardless of the state of the glass substrate GL. Therefore, in the configuration of the above-described brake mechanisms 14a and 14b, the pressure is not limited to the value exemplified in the above embodiment as long as it is designed to apply a certain range of pressure when it comes into contact with the glass substrate GL.

(8-4) 變形例D(8-4) Modification D

於上述實施形態中,固定製動片417係局部地安裝於上部接觸單元412之下表面,旋轉制動片422係局部地安裝於下部接觸單元421之上表面,但固定製動片417亦可安裝於上部接觸單元412之整個下表面,旋轉制動片422亦可安裝於下部接觸單元421之整個上表面。In the above embodiment, the fixed brake pad 417 is partially attached to the lower surface of the upper contact unit 412, and the rotary brake pad 422 is partially attached to the upper surface of the lower contact unit 421, but the fixed brake pad 417 can also be mounted. On the entire lower surface of the upper contact unit 412, the rotary brake pad 422 may also be mounted on the entire upper surface of the lower contact unit 421.

10a...研磨裝置10a. . . Grinding device

10b...研磨裝置10b. . . Grinding device

11a...研磨輪11a. . . Grinding wheel

11b...研磨輪11b. . . Grinding wheel

12a...機械臂12a. . . Robotic arm

12b...機械臂12b. . . Robotic arm

13a...基板13a. . . Substrate

13b...基板13b. . . Substrate

14a...制動機構14a. . . Brake mechanism

14b...制動機構14b. . . Brake mechanism

15a...擋止部15a. . . Stop

16a...恆壓氣缸16a. . . Constant pressure cylinder

16b...恆壓氣缸16b. . . Constant pressure cylinder

17a...馬達17a. . . motor

41...上部機構41. . . Upper mechanism

42...下部機構42. . . Lower mechanism

120a...機械臂旋動軸120a. . . Robot arm rotation axis

411...制動用氣缸411. . . Brake cylinder

411a...板411a. . . board

411b...螺釘411b. . . Screw

411c...推拉桿411c. . . Push rod

412...上部接觸單元412. . . Upper contact unit

413a...插入部413a. . . Insertion

413b...插入部413b. . . Insertion

413c...插入部413c. . . Insertion

414...滑動軸414. . . Sliding shaft

415...滑動軸承415. . . Sliding bearing

416...彈性構件416. . . Elastic member

417...固定製動片417. . . Fixed brake pad

421...下部接觸單元421. . . Lower contact unit

422...旋轉制動片422. . . Rotary brake pad

h1...貫通孔H1. . . Through hole

圖1係表示玻璃基板之製造方法中所包含之步驟之概略之圖。Fig. 1 is a schematic view showing a procedure included in a method of manufacturing a glass substrate.

圖2係表示本實施形態中所使用之搬送裝置、與研削輪及研磨輪相對於玻璃基板之配置之圖。Fig. 2 is a view showing the arrangement of the conveying device and the grinding wheel and the grinding wheel used in the embodiment with respect to the glass substrate.

圖3係表示玻璃基板之端面(前端部分、中央部分、後端部分)之圖。Fig. 3 is a view showing an end surface (a front end portion, a central portion, and a rear end portion) of the glass substrate.

圖4A係研磨裝置之概略平面圖。4A is a schematic plan view of a polishing apparatus.

圖4B係研磨裝置之概略側視圖。Fig. 4B is a schematic side view of the polishing apparatus.

圖5係表示安裝於機械臂之研磨輪及制動機構之圖。Fig. 5 is a view showing a grinding wheel and a brake mechanism attached to a robot arm.

圖6係表示控制區塊之圖。Figure 6 is a diagram showing a control block.

圖7A係表示與機械臂之旋動相對應之滑動軸之位置之變化的圖。Fig. 7A is a view showing a change in the position of the slide shaft corresponding to the rotation of the robot arm.

圖7B係表示與機械臂之旋動相對應之滑動軸之位置之變化的圖。Fig. 7B is a view showing a change in the position of the slide shaft corresponding to the rotation of the robot arm.

圖8A係表示滑動軸之恰當位置之圖。Fig. 8A is a view showing the proper position of the slide shaft.

圖8B係表示滑動軸自恰當位置偏移之狀態之圖。Fig. 8B is a view showing a state in which the slide shaft is displaced from the proper position.

圖8C係表示滑動軸自恰當位置偏移之狀態之圖。Fig. 8C is a view showing a state in which the slide shaft is shifted from the proper position.

圖9係表示研磨步驟中之研磨裝置之動作之流程圖。Fig. 9 is a flow chart showing the operation of the polishing apparatus in the polishing step.

圖10係表示研磨輪與玻璃基板之位置關係之圖。Fig. 10 is a view showing the positional relationship between the grinding wheel and the glass substrate.

圖11A係表示於研磨輪與玻璃基板接觸時研磨輪與玻璃基板為恰當距離之例(研磨輪與玻璃基板接觸之前)之圖。Fig. 11A is a view showing an example in which the grinding wheel and the glass substrate are at an appropriate distance (before the grinding wheel comes into contact with the glass substrate) when the grinding wheel is in contact with the glass substrate.

圖11B係表示圖11A中所示之狀態之後且研磨輪對玻璃基板之中央部分進行研磨之狀態之圖。Fig. 11B is a view showing a state in which the grinding wheel rotates the central portion of the glass substrate after the state shown in Fig. 11A.

圖11C係表示圖11B中所示之狀態之後且研磨輪對玻璃基板之後端部分進行研磨之狀態之圖。Fig. 11C is a view showing a state after the state shown in Fig. 11B and the grinding wheel grinds the rear end portion of the glass substrate.

圖12A係表示圖11A中之外力及滑動軸之狀態之圖。Fig. 12A is a view showing the state of the external force and the sliding shaft in Fig. 11A.

圖12B係表示圖12A中所示之狀態之後且研磨輪與玻璃基板接觸時(對玻璃基板之前端部分進行研磨時)之外力及滑動軸之狀態之圖。Fig. 12B is a view showing the state of the external force and the sliding axis after the state shown in Fig. 12A and the grinding wheel is in contact with the glass substrate (when the front end portion of the glass substrate is polished).

圖12C係表示圖11B中之外力及滑動軸之狀態之圖。Fig. 12C is a view showing the state of the external force and the sliding axis in Fig. 11B.

圖12D係表示圖11C中之外力及滑動軸之狀態之圖。Fig. 12D is a view showing the state of the external force and the sliding axis in Fig. 11C.

圖13A係表示於研磨輪與玻璃基板接觸時研磨輪與玻璃基板不為恰當距離之例(研磨輪與玻璃基板接觸之前)之圖。Fig. 13A is a view showing an example in which the grinding wheel and the glass substrate are not at an appropriate distance (before the grinding wheel comes into contact with the glass substrate) when the grinding wheel is in contact with the glass substrate.

圖13B係表示圖13A中所示之狀態之後且研磨輪對玻璃基板之中央部分進行研磨之狀態之圖。Fig. 13B is a view showing a state in which the grinding wheel rotates the central portion of the glass substrate after the state shown in Fig. 13A.

圖13C係表示圖13B中所示之狀態之後且研磨輪對玻璃基板之後端部分進行研磨之狀態之圖。Fig. 13C is a view showing a state after the state shown in Fig. 13B and the grinding wheel grinds the rear end portion of the glass substrate.

圖14A係表示圖13A(研磨輪與玻璃基板之距離較近之情形)中之外力及滑動軸之狀態之圖。Fig. 14A is a view showing the state of the external force and the sliding axis in Fig. 13A (when the distance between the grinding wheel and the glass substrate is relatively close).

圖14B係表示圖14A中所示之狀態之後且研磨輪與玻璃基板接觸時(對玻璃基板之前端部分進行研磨時)之外力及滑動軸之狀態之圖。Fig. 14B is a view showing the state of the external force and the sliding axis after the state shown in Fig. 14A and the grinding wheel is in contact with the glass substrate (when the front end portion of the glass substrate is polished).

圖14C係表示圖13B中之外力及滑動軸之狀態之圖。Fig. 14C is a view showing the state of the external force and the sliding axis in Fig. 13B.

圖14D係表示圖13C中之外力及滑動軸之狀態之圖。Fig. 14D is a view showing the state of the external force and the sliding axis in Fig. 13C.

圖15A係表示圖13A(研磨輪與玻璃基板之距離較遠之情形)中之外力及滑動軸之狀態之圖。Fig. 15A is a view showing the state of the external force and the sliding axis in Fig. 13A (when the distance between the grinding wheel and the glass substrate is far).

圖15B係表示圖15A中所示之狀態之後且研磨輪與玻璃基板接觸時(對玻璃基板之前端部分進行研磨時)之外力及滑動軸之狀態之圖。Fig. 15B is a view showing the state of the external force and the sliding axis after the state shown in Fig. 15A and the grinding wheel is in contact with the glass substrate (when the front end portion of the glass substrate is polished).

圖15C係表示圖13B中之外力及滑動軸之狀態之圖。Fig. 15C is a view showing the state of the external force and the sliding axis in Fig. 13B.

圖15D係表示圖13C中之外力及滑動軸之狀態之圖。Fig. 15D is a view showing the state of the external force and the sliding axis in Fig. 13C.

圖16A係表示於研磨輪與玻璃基板之接觸時研磨輪與玻璃基板不為恰當距離之另一例(研磨輪與玻璃基板接觸之前)之圖。Fig. 16A is a view showing another example in which the grinding wheel and the glass substrate are not at an appropriate distance (before the grinding wheel comes into contact with the glass substrate) when the grinding wheel is in contact with the glass substrate.

圖16B係表示圖16A中所示之狀態之後且研磨輪對玻璃基板之中央部分進行研磨之狀態之圖。Fig. 16B is a view showing a state in which the grinding wheel rotates the central portion of the glass substrate after the state shown in Fig. 16A.

圖16C係表示圖16B中所示之狀態之後且研磨輪對玻璃基板之後端部分進行研磨之狀態之圖。Fig. 16C is a view showing a state after the state shown in Fig. 16B and the grinding wheel grinds the rear end portion of the glass substrate.

11a...研磨輪11a. . . Grinding wheel

12a...機械臂12a. . . Robotic arm

14a...制動機構14a. . . Brake mechanism

41...上部機構41. . . Upper mechanism

42...下部機構42. . . Lower mechanism

120a...機械臂旋動軸120a. . . Robot arm rotation axis

411...制動用氣缸411. . . Brake cylinder

411a...板411a. . . board

411b...螺釘411b. . . Screw

411c...推拉桿411c. . . Push rod

412...上部接觸單元412. . . Upper contact unit

413a...插入部413a. . . Insertion

413b...插入部413b. . . Insertion

413c...插入部413c. . . Insertion

414...滑動軸414. . . Sliding shaft

415...滑動軸承415. . . Sliding bearing

416...彈性構件416. . . Elastic member

417...固定製動片417. . . Fixed brake pad

421...下部接觸單元421. . . Lower contact unit

422...旋轉制動片422. . . Rotary brake pad

h1...貫通孔H1. . . Through hole

Claims (7)

一種玻璃基板之製造方法,其係包括對所搬送之玻璃基板之兩端面進行研磨的研磨步驟者,其特徵在於:對上述兩端面進行研磨之一對研磨磨石係藉由旋動自如之機械臂被保持,並且藉由向上述玻璃基板方向對上述機械臂賦予第1力而使機械臂旋動,且被保持為相對於上述玻璃基板之寬度方向之變動可追隨於上述兩端面;上述一對研磨磨石係於上述研磨步驟中之上述玻璃基板之搬入時及搬出時,藉由制動機構,於以規制上述機械臂之旋動之方式對上述機械臂賦予第2力之狀態下,研磨上述玻璃基板之前端部分及後端部分。 A method for producing a glass substrate, comprising: a polishing step of polishing both end faces of the glass substrate to be conveyed, wherein the polishing of the both end faces is performed by grinding the grindstone by means of a spinning machine The arm is held, and the mechanical arm is rotated by applying a first force to the mechanical arm in the direction of the glass substrate, and is maintained to be in contact with the both end faces with respect to the width direction of the glass substrate; In the case where the polishing stone is carried in and out of the glass substrate in the polishing step, the brake mechanism is used to apply the second force to the arm by regulating the rotation of the arm. The front end portion and the rear end portion of the above glass substrate. 如請求項1之製造方法,其中於上述研磨步驟中自上述玻璃基板之搬出時、至後續之上述玻璃基板之搬入時之期間,藉由上述制動機構,對上述機械臂賦予上述第2力。 The manufacturing method of claim 1, wherein the second arm is applied to the robot arm by the brake mechanism during the polishing step from the time when the glass substrate is unloaded to the subsequent movement of the glass substrate. 如請求項1或2之製造方法,其中於上述研磨步驟中上述玻璃基板之搬入時及搬出時,藉由彈性構件之變形而容許藉由上述第2力所規制之上述機械臂之旋動。 The manufacturing method according to claim 1 or 2, wherein in the polishing step, during the loading and unloading of the glass substrate, the rotation of the elastic member allows the rotation of the robot arm regulated by the second force. 如請求項3之製造方法,其中於藉由上述制動機構對上述機械臂賦予上述第2力之期間,藉由上述彈性構件吸收因上述玻璃基板與上述研磨磨石之接觸而引起之衝擊。 The manufacturing method of claim 3, wherein the elastic member absorbs an impact caused by contact between the glass substrate and the polishing stone while the second arm is applied to the mechanical arm by the brake mechanism. 如請求項1或2之製造方法,其中上述一對研磨磨石係於 上述玻璃基板之上述研磨步驟中之搬入時及搬出時,突出至較上述玻璃基板之兩端更內側而配置,且使上述研磨磨石之周緣部抵接於上述玻璃基板之前端部分,隨著上述玻璃基板之搬送使上述周緣部退避而對上述玻璃基板進行研磨。 The manufacturing method of claim 1 or 2, wherein the pair of abrasive grindstones are attached to In the polishing step of the glass substrate, during the loading and the unloading, the glass substrate is protruded further inside than the both ends of the glass substrate, and the peripheral edge portion of the polishing stone is brought into contact with the front end portion of the glass substrate. The glass substrate is conveyed so that the peripheral portion is retracted and the glass substrate is polished. 如請求項1或2之製造方法,其中上述制動機構包含上下移動之上部機構、及連結於上述機械臂之下部機構;於上述上部機構位於與上述下部機構接觸之位置時,對上述機械臂賦予上述第2力,且於上述上部機構位於遠離上述下部機構之位置時,不對上述機械臂賦予上述第2力。 The manufacturing method of claim 1 or 2, wherein the brake mechanism includes a vertical movement upper mechanism and a lower mechanical mechanism; and the mechanical mechanism is provided when the upper mechanism is in contact with the lower mechanism The second force does not apply the second force to the robot arm when the upper mechanism is located away from the lower mechanism. 一種玻璃基板之製造裝置,其係對所搬送之玻璃基板之兩端面進行研磨者,且包含:旋動自如之機械臂;藉由上述機械臂被保持並研磨上述兩端面之一對研磨磨石;及制動機構;上述一對研磨磨石係藉由向上述玻璃基板方向對上述機械臂賦予第1力而使機械臂旋動,而被保持為相對於上述玻璃基板之寬度方向之變動可追隨於上述兩端面;且上述一對研磨磨石係於上述玻璃基板之搬入時及搬出時,藉由制動機構,於以規制上述機械臂之旋動之方式對上述機械臂賦予第2力之狀態下,研磨上述玻璃基板之前端部分及後端部分。 A glass substrate manufacturing apparatus for polishing both end faces of a glass substrate to be conveyed, comprising: a rotatable robot arm; and holding and polishing one of the both end faces to the grinding grindstone by the mechanical arm And a pair of grinding stones; the pair of grinding stones are rotated by a first force applied to the arm in the direction of the glass substrate, and the arm is rotated to maintain a change with respect to a width direction of the glass substrate And the pair of polishing stones are in a state in which the second force is applied to the robot arm by the brake mechanism during the loading and unloading of the glass substrate by the brake mechanism Next, the front end portion and the rear end portion of the glass substrate are ground.
TW100149337A 2010-12-29 2011-12-28 A method for manufacturing a glass substrate, and a manufacturing apparatus for a glass substrate TWI409140B (en)

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