CN210115769U

CN210115769U - Chamfer grinding device

Info

Publication number: CN210115769U
Application number: CN201920675542.7U
Authority: CN
Inventors: 岩濑比宇麻
Original assignee: Nakamura Tome Precision Industry Co Ltd
Current assignee: Nakamura Tome Precision Industry Co Ltd
Priority date: 2018-05-14
Filing date: 2019-05-13
Publication date: 2020-02-28
Anticipated expiration: 2029-05-13
Also published as: TWM586653U; JP7158701B2; JP2019198898A

Abstract

An object of the utility model is to provide a can the shape create for various chamfer shapes, the chamfer quality stability excellence and utilize the chamfer grinding device of abrasive belt. The utility model discloses a chamfer grinding device's characterized in that possesses: a rotary table on which a disc-shaped workpiece is placed and which controls the rotation of the workpiece; a grinding belt which is in contact with the peripheral end of the workpiece and is used for chamfering grinding; the grinding belt is mounted on a belt holding device having a conveying part and a winding part, and is protruded toward the peripheral end part of the workpiece through a supporting roller arranged on the belt holding device, and the X axis in the horizontal direction, the Z axis in the vertical direction and the C axis around the Z axis are synchronously controlled by a numerical control program relative to the relative moving track of the supporting roller and the workpiece.

Description

Chamfer grinding device

Technical Field

The present invention relates to a grinding apparatus for chamfering the peripheral end of a disc-shaped workpiece such as a single wafer used in a semiconductor device, and more particularly to a grinding apparatus using a grinding belt.

Background

A single crystal wafer used in a semiconductor device is made of a brittle material such as a silicon crystal substrate, a silicon carbide substrate, a crystal substrate, or a sapphire substrate.

These materials, if the end portion is kept sharp, may be broken or partially defective during handling.

In addition, the surface of the other single wafer may be damaged.

In such chamfering, although a rotary grindstone is used, there is a technical problem that the chamfer shape changes due to abrasion of the grindstone, and therefore,

patent documents

1 and 2 and the like disclose a technique of using a grinding tape instead of such a grindstone.

In the techniques disclosed in these patent documents, in order to bring the polishing tape into contact with the workpiece, the movable roller or the like is pressed against the workpiece using the air cylinder, and even if the peripheral end portion of the workpiece is chamfered by a degree of polishing by the profiling process in which the load is controlled, the grinding force is not provided in which the shape is created in various chamfered shapes.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2014-58038

Patent document 2: japanese patent laid-open publication No. 2011-93057

SUMMERY OF THE UTILITY MODEL

(problem to be solved by the utility model)

An object of the utility model is to provide a can the shape create for various chamfer shapes, the chamfer quality stability excellence and utilize the chamfer grinding device of abrasive belt.

(means for solving the problems)

The utility model relates to a chamfer grinding device, its characterized in that possesses: a rotary table on which a disc-shaped workpiece is placed and which controls the rotation of the workpiece; a grinding belt which is in contact with the peripheral end of the workpiece and is used for chamfering grinding; wherein the grinding belt is mounted on a belt holding device having a conveying part and a winding part, and is protruded toward the peripheral end part of the workpiece by a supporting roller arranged on the belt holding device, and the relative moving tracks of the supporting roller and the workpiece are synchronously controlled by a numerical control program for an X axis in the horizontal direction, a Z axis in the vertical direction and a C axis around the Z axis.

The grinding belt has a conveying unit such as a conveying roller and a winding unit such as a winding roller for winding the conveyed belt, and has abrasive grains adhered to the surface of the strip-shaped belt, and therefore, the belt can be conveyed from one roller and the conveyed belt can be wound by the other roller, and the grinding belt can be reciprocated by rotating the rollers in opposite directions.

In the present invention, the backup roll presses the grinding belt against the peripheral end portion of the workpiece from the back surface side, and at the same time, moves between the upper surface side and the lower surface side of the peripheral end portion, and therefore, the movement locus thereof becomes the chamfered shape of the workpiece.

Therefore, the backup roller is used to strongly press the grinding belt to such an extent that the peripheral end portion of the workpiece can be ground.

In this respect, the technique is different from the technique of pressing with a cylinder while applying minute vibration in patent document 1.

In the present invention, the work is placed on the rotary table in a state in which the peripheral end portion of the work is extended by a predetermined dimension from the outer peripheral end portion of the rotary table, and preferably, an extension amount H of the peripheral end portion of the work from the outer peripheral end portion of the rotary table is set to be within 10 times of the thickness of the work, and in this case, it is preferable that the outer peripheral radius R of the support roller is equal to or less than one-half of the extension amount H.

Used as a single chip in many cases

The single crystal wafer of (2) is used in a thickness of 200 to 800 μm depending on the size.

If the overhang H becomes large, the chamfering becomes unstable.

Therefore, the overhang H is set to be within 10 times the thickness of the workpiece, and preferably within 5 times the thickness of the workpiece.

(effects of the utility model)

In the chamfer grinding device according to the present invention, since the restriction of the relative movement of the support roller and the workpiece in the X-axis direction, the Z-axis direction, and the C-axis direction is synchronously controlled by the numerical control program, the chamfer shape of the peripheral end portion of the workpiece can be formed into various shapes, and thus the degree of freedom in setting the chamfer shape is high.

In addition, when elastic deformation occurs in the backup roller, the amount of deformation can be modified by the numerical control program.

Since the grinding belt can supply new abrasive grains to the machining point, problems such as a change in quality of the chamfered shape due to wear and replacement of the grinding stone, as in the conventional grinding stone, do not occur.

Drawings

Fig. 1(a) shows an example of the structure of the chamfer grinding device according to the present invention, and fig. 1(b) shows the movement path of the backup roller.

Fig. 2(a) and 2(b) show examples of creating the chamfered shape of the peripheral end portion of the workpiece.

Reference numerals indicate the same.

1 workpiece

2 rotating table

3 Belt holding device

3a support roller

4 grinding the belt.

Detailed Description

Fig. 1(a) and 1(b) show an example of the configuration of the chamfer grinding device according to the present invention, but the present invention is not limited to this.

As shown in fig. 1(a), a turntable 2 is provided, and the turntable is configured to place and hold a disk-shaped workpiece 1 in a centered state.

The turntable 2 is driven at a rotational speed W by a drive device not shown₁Rotation control is performed, and the workpiece 1 is held on the turntable 2 by using holding means such as a decompression suction port.

The disc-shaped workpiece 1 is placed on the turntable 2 in a state of protruding by an overhang H mm from an outer peripheral end (outer peripheral wall) 2a of the turntable 2.

The tape holding device 3 includes a feed roller 3b and a take-up roller 3c for grinding the tape 4, and a backup roller 3a for pressing the grinding tape 4 against the peripheral end portion of the workpiece 1.

In order to grind the peripheral end portion 1a of the workpiece 1 into various chamfered shapes, the backup roller 3a is provided to press the grinding belt 4 from the back side and projects from the main body portion of the belt holding device 3.

The grinding belt 4 is stretched by using a guide roller 3d, a tension roller 3e, and the like.

Thus, the support roller 3a is supported by being projected from the main body portion of the tape holding device 3 using a rigid frame member or the like.

With respect to the backup roller 3a of the tape holding device 3 and the workpiece 1 placed on the turntable 2, a movement control mechanism, not shown, is provided on one or both of the backup roller 3a and the turntable 2, and the positions of the X axis in the horizontal direction, the Z axis in the vertical direction, and the C axis around the Z axis are synchronously controlled by a numerical control program.

As shown in fig. 1(b), the backup roller 3a moves so as to grind the space between the chamfered upper surface 1b, the chamfered front end 1c, and the chamfered lower surface 1d of the peripheral end portion of the workpiece into a desired chamfered shape.

In fig. 1(b), the movement locus of the support roller 3a is indicated by a two-dot chain line, and the locus of the center of the support roller 3a is indicated by a one-dot chain line.

When the chamfered lower surface 1d of the peripheral end portion of the workpiece is created by grinding, the radius R of the backup roller 3a is set to be equal to or less than one-half of the overhang H in order to avoid interference with the outer peripheral wall 2a of the turntable 2.

In this case, although the thickness of the grinding belt 4 needs to be taken into consideration, the thickness is ignored because the grinding belt is thin.

When chamfering and grinding the peripheral end portion of the workpiece by the grinding belt 4, if the grinding belt 4 is reciprocated in the longitudinal direction or the width direction or the belt path of the roller is changed in the width direction, the discharge of the grinding chips can be promoted.

Fig. 2(a) and 2(b) show an example in which the grinding area 1e of the peripheral end portion of the workpiece is set so that the grinding margin is different between the lower surface side and the upper surface side.

This also allows the shapes of the chamfered upper surface 1b and the chamfered lower surface 1d to be freely set.

Claims

1. A chamfer grinding device is characterized by comprising:

a rotary table on which a disc-shaped workpiece is placed and which controls the rotation of the workpiece;

a grinding belt which is in contact with the peripheral end of the workpiece and is used for chamfering grinding;

wherein the grinding belt is mounted on a belt holding device having a conveying part and a winding part, and is protruded toward the peripheral end part of the workpiece through a supporting roller arranged on the belt holding device,

the relative movement locus of the backup roller and the workpiece is controlled by a numerical control program in synchronization with each other about an X-axis in a horizontal direction, a Z-axis in a vertical direction, and a C-axis around the Z-axis.

2. The chamfer grinding device according to claim 1,

the work is placed on the rotary table in a state where the peripheral end portion of the work protrudes from the outer peripheral end portion of the rotary table by a predetermined dimension

The amount of overhang (H) by which the peripheral end of the workpiece overhangs from the outer peripheral end of the rotary table is set to be within 10 times the thickness of the workpiece.

3. The chamfer grinding device according to claim 2,

the outer peripheral radius (R) of the support roller is not more than one half of the overhang (H).